TW201533626A - Electronic equipment, laminated film, touch panel and method for producing laminated film - Google Patents

Electronic equipment, laminated film, touch panel and method for producing laminated film Download PDF

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TW201533626A
TW201533626A TW103136775A TW103136775A TW201533626A TW 201533626 A TW201533626 A TW 201533626A TW 103136775 A TW103136775 A TW 103136775A TW 103136775 A TW103136775 A TW 103136775A TW 201533626 A TW201533626 A TW 201533626A
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film
touch panel
flexible substrate
conductive film
electronic device
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TW103136775A
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Chinese (zh)
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Akihiro Hashimoto
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Fujifilm Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/048—Indexing scheme relating to G06F3/048
    • G06F2203/04808—Several contacts: gestures triggering a specific function, e.g. scrolling, zooming, right-click, when the user establishes several contacts with the surface simultaneously; e.g. using several fingers or a combination of fingers and pen

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

Provided are electronic equipment, laminated film, touch panel and method for producing laminated film, which can be embodied in making at least two surfaces of housing of electronic equipment comprise thinner touch panel and reduce volume of exterior thereof. The invention is not only provided with a purpose of user friendly, but also makes the designer have more choices to design the electronic equipment with various and innovative ideas. The electronic equipment is disclosed herein to comprise the housing with multiple surfaces and touch panel, and at least two surfaces of the housing are equipped with touch panels respectively. Besides, each touch panel is provided with multiple induction electrodes, and at least one of induction electrodes is shared on at least two of touch panels.

Description

電子設備、層疊膜、觸控面板和層疊膜的製造方法Electronic device, laminated film, touch panel, and method for manufacturing laminated film

本發明涉及具備觸控面板的電子設備、層疊膜、觸控面板和層疊膜的製造方法。The present invention relates to an electronic device including a touch panel, a laminated film, a touch panel, and a method of manufacturing a laminated film.

近來，作為具備觸控面板的電子設備，在市場上供給有智慧手機等多功能行動電話、可擕式遊戲機等。Recently, as an electronic device including a touch panel, a multi-function mobile phone such as a smart phone or a portable game machine is provided on the market.

現有的觸控面板例如專利文獻1所示那樣，使用ITO（氧化錫銦）膜作為感應電極。In the conventional touch panel, as shown in Patent Document 1, an ITO (Indium Tin Oxide) film is used as the sensing electrode.

並且，在過去，公開有具有將平面的端部彎折的形狀的觸控面板（參照專利文獻2）。而且，還公開有一種立方體形狀的資訊處理裝置，其在移動終端裝置的正面和4個側面分別設置有靜電式觸控感測器（參照專利文獻3）。並且，在過去，公開有一種製造方法，其包括以下工序：觸控面板膜成型工序，對在透明或半透明膜上形成有第1和第2導電性圖案的觸控面板用膜材料實施成型加工來形成第1中間觸控面板膜；以及觸控面板膜修整工序，對第1中間觸控面板膜實施修整加工（參照專利文獻4）。Further, in the past, a touch panel having a shape in which an end portion of a flat surface is bent has been disclosed (see Patent Document 2). Further, a cube-shaped information processing device is disclosed in which an electrostatic touch sensor is provided on each of the front surface and the four side surfaces of the mobile terminal device (see Patent Document 3). Further, in the past, there has been disclosed a manufacturing method including the following steps: a touch panel film forming step of forming a film material for a touch panel in which first and second conductive patterns are formed on a transparent or semi-transparent film. The first intermediate touch panel film is processed to form a touch panel film trimming process, and the first intermediate touch panel film is trimmed (see Patent Document 4).

現有技術文獻Prior art literature

專利文獻1：日本特開2009-259003號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-259003

專利文獻2：日本特開2001-154592號公報Patent Document 2: Japanese Laid-Open Patent Publication No. 2001-154592

專利文獻3：日本特開2010-262557號公報Patent Document 3: Japanese Laid-Open Patent Publication No. 2010-262557

專利文獻4：國際公開第2013/018698號小冊子Patent Document 4: International Publication No. 2013/018698

關於現有的觸控面板，在製造能夠對二個面以上的觸控位置進行檢測的觸控面板的情況下，想出了以下述方式進行製作。即，如專利文獻3所示那樣，與設置觸控面板的電子設備的結構面（例如正面和4個側面）對應地分別準備觸控面板，將所述觸控面板貼附在電子設備的結構面上。也就是說，想出了這樣的技術：分別準備與電子設備的結構面、特別是要安裝觸控面板的結構面的數量對應的個數的觸控面板，並貼附在電子設備上。In the case of manufacturing a touch panel capable of detecting two or more touch positions, a conventional touch panel has been developed in the following manner. In other words, as shown in Patent Document 3, a touch panel is prepared corresponding to a structural surface (for example, a front surface and four side surfaces) of an electronic device in which a touch panel is provided, and the touch panel is attached to an electronic device. On the surface. That is to say, a technique has been conceived in which a number of touch panels corresponding to the number of structural faces of the electronic device, in particular, the number of structural faces on which the touch panel is to be mounted, are prepared and attached to the electronic device.

在這樣的結構中，需要將各觸控面板的配線區域配置在對應的結構面上，並且，控制觸控面板的控制電路也需要與各觸控面板對應地進行安裝。In such a configuration, it is necessary to arrange the wiring areas of the touch panels on the corresponding structural surfaces, and the control circuit for controlling the touch panels also needs to be mounted corresponding to the respective touch panels.

其結果是，具備能夠對二個面以上的觸控位置進行檢測的觸控面板的多功能行動電話等電子設備的尺寸大型化。對於這樣的電子設備，從使用便利性的角度和設計性的角度出發，實現了薄型化、外周的配線區域（一般稱為邊框）的狹小化等，但在上述的結構中，存在物理方面的極限。As a result, an electronic device such as a multi-function mobile phone including a touch panel capable of detecting two or more touch positions can be increased in size. In such an electronic device, from the viewpoint of usability and design, a thinned and outer peripheral wiring region (generally referred to as a frame) is narrowed, but in the above configuration, there is a physical aspect. limit.

並且，對於專利文獻4，在實際製造時可知，通常的電極會產生以下這樣的問題。Further, in Patent Document 4, it is known at the time of actual production that the following problems occur in a normal electrode.

即，當使用ITO作為透明電極材料時，由於具有針對彎曲會破裂這樣的特性（沒有撓性），所以無法進行成型。當使用銀奈米線作為透明電極材料時，由於成型時的250～300℃的加熱（實際的基板溫度為150～200℃），存在銀奈米線不能保持線形狀而成為球狀的粒子，從而導電性消失這樣的問題。當使用導電性高分子作為透明電極材料時，原始的電阻值高達500歐姆/sq.以上，無法在靜電容方式的觸控面板中使用。That is, when ITO is used as the transparent electrode material, since it has characteristics (no flexibility) that it is broken for bending, molding cannot be performed. When a silver nanowire is used as the transparent electrode material, the heating is performed at 250 to 300 ° C during the molding (the actual substrate temperature is 150 to 200 ° C), and the silver nanowire cannot be held in a linear shape and becomes spherical particles. Therefore, the problem that the conductivity disappears. When a conductive polymer is used as the transparent electrode material, the original resistance value is as high as 500 ohm/sq. or more, and it cannot be used in a capacitive touch panel.

本發明的目的在於提供層疊膜、觸控面板、採用該觸控面板的電子設備和層疊膜的製造方法，能夠以簡單的方式使電子設備的二個面以上具備觸控面板，而且能夠實現薄型化和外周區域的狹小化，能夠實現電子設備的使用便利性的改善、各式各樣的設計的創新和設計的自由度的提高。An object of the present invention is to provide a laminated film, a touch panel, an electronic device using the touch panel, and a method of manufacturing a laminated film, which can provide a touch panel with two or more surfaces of an electronic device in a simple manner, and can realize a thin shape. The narrowing of the area and the peripheral area enables the improvement of the usability of electronic devices, the innovation of various designs, and the freedom of design.

［1］本發明的電子設備具有殼體和觸控面板，所述殼體具有多個面，所述電子設備的特徵在於：在構成殼體的多個面中的至少二個以上的面分別設置有觸控面板，各觸控面板分別具有多個感應電極，多個感應電極中的至少一個在各觸控面板中的至少二個觸控面板上是共用的，感應電極具有由金屬細線構成的網格圖案，金屬細線的線寬為1μm以上且5μm以下。另外，金屬細線的“線寬”是指，從觸控面板的面上觀察時與金屬細線的延伸方向垂直的方向的金屬細線的寬度。[1] The electronic device of the present invention has a casing and a touch panel, the casing having a plurality of faces, and the electronic device is characterized in that at least two of the plurality of faces constituting the casing are respectively Each of the touch panels has a plurality of sensing electrodes, and at least one of the plurality of sensing electrodes is shared by at least two of the touch panels, and the sensing electrodes are formed of thin metal wires. The mesh pattern has a line width of 1 μm or more and 5 μm or less. In addition, the "line width" of the thin metal wire refers to the width of the thin metal wire in the direction perpendicular to the extending direction of the thin metal wire when viewed from the surface of the touch panel.

［2］在本發明之電子設備中，也可以是，在各觸控面板中的至少二個觸控面板上共用的感應電極的端子部，在各觸控面板中的至少二個觸控面板上是共用的。[2] In the electronic device of the present invention, at least two touch panels in each of the touch panels may be used in the terminal portions of the sensing electrodes shared by the at least two touch panels in each of the touch panels. The top is shared.

［3］在本發明之電子設備中，也可以是，至少二個以上的面中，至少一個面是殼體的主面，其他至少一個面是與主面鄰接的側面。[3] In the electronic device of the present invention, at least one of the at least one surface may be a main surface of the casing, and the other at least one surface may be a side surface adjacent to the main surface.

［4］在該情況下，也可以是，在側面形成有彎曲狀的凹部或凸部。[4] In this case, a curved concave portion or a convex portion may be formed on the side surface.

［5］在本發明之電子設備中，也可以是，至少二個以上的面中，至少一個面具有顯示面板，與該一個面對應的觸控面板設置在顯示面板之上。[5] In the electronic device of the present invention, at least one of the at least one of the faces may have a display panel, and the touch panel corresponding to the one face may be disposed on the display panel.

［6］在該情況下，也可以是，與至少二個以上的面中的其他至少一個面對應的觸控面板執行與觸控位置相應的開關功能。[6] In this case, the touch panel corresponding to at least one of the other two or more surfaces may perform a switching function corresponding to the touch position.

［7］在本發明之電子設備中，也可以是，所述電子設備具有在至少二個以上的面延伸的撓性基板，在撓性基板上形成有感應電極。[7] In the electronic device of the present invention, the electronic device may include a flexible substrate extending over at least two surfaces, and the sensing electrode may be formed on the flexible substrate.

［8］在該情況下，也可以是，形成有感應電極的撓性基板一體成型於殼體。[8] In this case, the flexible substrate on which the induction electrode is formed may be integrally formed in the casing.

［9］在［7］或［8］中，也可以是，形成有感應電極的撓性基板在撓性基板上具有二個以上的第1感應電極和二個以上的第2感應電極，第1感應電極和第2感應電極中的至少一方是組合分別由金屬細線形成的多個單元而構成的。[9] In [7] or [8], the flexible substrate on which the sensing electrode is formed may have two or more first sensing electrodes and two or more second sensing electrodes on the flexible substrate. At least one of the sensing electrode and the second sensing electrode is configured by combining a plurality of cells each formed of a thin metal wire.

［10］在該情況下，也可以是，金屬細線至少包含金屬粒子和粘合劑。[10] In this case, the metal thin wires may contain at least metal particles and a binder.

［11］本發明的層疊膜的特徵在於：其具有外罩層，其具有三維形狀並且構成電子設備的殼體；以及觸控面板用的導電性膜，其一體地設置於外罩層的一個表面，導電性膜具有撓性基板和形成於撓性基板的感應電極，外罩層設置在構成殼體的多個面中的至少二個以上的面，撓性基板具有在外罩層的至少二個以上的面延伸的三維形狀，多個感應電極中的至少一個在至少二個以上的面上是共用的。[11] The laminated film of the present invention is characterized in that it has a cover layer having a three-dimensional shape and constituting a casing of an electronic device, and a conductive film for a touch panel integrally provided on one surface of the cover layer, The conductive film has a flexible substrate and an induction electrode formed on the flexible substrate, and the cover layer is provided on at least two or more surfaces of the plurality of surfaces constituting the case, and the flexible substrate has at least two or more layers on the cover layer. The three-dimensional shape of the surface extension, at least one of the plurality of sensing electrodes is common to at least two or more faces.

［12］在本發明中，也可以是，外罩層具有：膜，其形成於表面；以及樹脂層，其介於膜和導電性膜之間，[12] In the present invention, the outer cover layer may have: a film formed on the surface; and a resin layer interposed between the film and the conductive film,

［13］在該情況下，也可以是，樹脂層是通過注塑成型注入的熔融樹脂固化而形成的。[13] In this case, the resin layer may be formed by curing a molten resin injected by injection molding.

［14］本發明的觸控面板的特徵在於：其具有在電子設備的多個面中的至少二個以上的面分別設置的多個觸控面板，各觸控面板分別具有多個感應電極，多個感應電極中的至少一個在各觸控面板中的至少二個觸控面板上是共用的。[14] The touch panel of the present invention is characterized in that it has a plurality of touch panels respectively disposed on at least two of the plurality of faces of the electronic device, and each of the touch panels has a plurality of sensing electrodes. At least one of the plurality of sensing electrodes is common to at least two of the touch panels.

［15］在本發明的觸控面板中，也可以是，在各觸控面板中的至少二個觸控面板上共用的所述感應電極的端子部，在各觸控面板中的至少二個觸控面板上是共用的。[15] In the touch panel of the present invention, the terminal portions of the sensing electrodes shared by at least two of the touch panels may be at least two of the touch panels. The touch panel is shared.

［16］在本發明的觸控面板中，也可以是，所述電子設備具有在至少二個以上的面延伸的撓性基板，在撓性基板上形成有感應電極。[16] In the touch panel of the present invention, the electronic device may include a flexible substrate extending on at least two surfaces, and the sensing electrode may be formed on the flexible substrate.

［17］在該情況下，也可以是，形成有感應電極的撓性基板一體成型於電子設備的殼體。[17] In this case, the flexible substrate on which the sensing electrodes are formed may be integrally formed in the casing of the electronic device.

［18］在［16］或［17］中，也可以是，形成有感應電極的撓性基板在撓性基板上具有二個以上的第一感應電極和二個以上的第2感應電極，第1感應電極和第2感應電極中的至少一方是組合分別由金屬細線形成的多個單元而構成的。[18] In [16] or [17], the flexible substrate on which the sensing electrode is formed may have two or more first sensing electrodes and two or more second sensing electrodes on the flexible substrate. At least one of the sensing electrode and the second sensing electrode is configured by combining a plurality of cells each formed of a thin metal wire.

［19］在該情況下，也可以是，金屬細線至少包含金屬粒子和粘合劑。[19] In this case, the metal thin wires may contain at least metal particles and a binder.

［20］關於本發明的層疊膜的製造方法，所述層疊膜具有：外罩層，其具有三維形狀並且構成電子設備的殼體；以及觸控面板用的導電性膜，其一體地設置於外罩層的一個面，所述層疊膜的製造方法的特徵在於，具有以下工序：在撓性基板上形成感應電極來製作導電性膜的工序；使導電性膜與殼體的形狀對應地成型為三維形狀的成型工序；將成型為三維形狀的導電性膜設置在注塑成型模具內的設置工序；以及向注塑成型模具內注射熔融樹脂的注射工序，將熔融樹脂固化，製作出具有外罩層和導電性膜的三維形狀的層疊膜。[20] In the method for producing a laminated film of the present invention, the laminated film has an outer cover layer having a three-dimensional shape and constituting a casing of an electronic device, and a conductive film for a touch panel integrally provided on the outer cover In one surface of the layer, the method for producing a laminated film is characterized by the steps of: forming a conductive electrode on a flexible substrate to form a conductive film; and forming the conductive film into a three-dimensional shape corresponding to the shape of the casing. a molding process of a shape; a step of disposing a conductive film formed into a three-dimensional shape in an injection molding die; and an injection process of injecting a molten resin into the injection molding die to cure the molten resin to have an outer cover layer and conductivity A laminated film of a three-dimensional shape of a film.

［21］在本發明的層疊膜的製造方法中，也可以是，外罩層具有：膜，其形成於表面；以及樹脂層，其介於膜和導電性膜之間，層疊膜的製造方法還具有使膜與所述殼體的形狀對應地成型為三維形狀的第二成型工序，在設置工序中，將成型為三維形狀的導電性膜和膜設置在注塑成型模具內，在注射工序中，將熔融樹脂注射到注塑成型模具內的、導電性膜和膜之間。[21] In the method for producing a laminated film of the present invention, the outer cover layer may have a film formed on the surface, and a resin layer interposed between the film and the conductive film, and the method for producing the laminated film may be further a second molding step of molding the film into a three-dimensional shape corresponding to the shape of the casing, and in the setting step, the conductive film and the film formed into a three-dimensional shape are placed in the injection molding die, and in the injection process, The molten resin is injected between the conductive film and the film in the injection molding mold.

本發明之優點為：根據本發明，在殼體的二個以上的面具備觸控面板的電子設備中，能夠實現薄型化和外周區域的狹小化，能夠實現使用便利性的改善、各式各樣的設計的創新和設計的自由度的提高。According to the present invention, in an electronic device including a touch panel on two or more surfaces of a casing, it is possible to reduce the thickness and narrow the outer peripheral region, and it is possible to improve the usability and various types of the devices. Innovation in design and freedom of design.

為令本發明所運用之技術內容、發明目的及其達成之功效有更完整且清楚的揭露，茲於下詳細說明之，並請一併參閱所揭之圖式及圖號：For a more complete and clear disclosure of the technical content, the purpose of the invention and the effects thereof achieved by the present invention, it is explained in detail below, and please refer to the drawings and drawings:

參照第一圖～第十六圖對本發明的電子設備、觸控面板、層疊膜和層疊膜的製造方法的實施方式例進行說明。本發明不限定於以下的實施方式。另外，本說明書中表示數值範圍的“～”是以下述含義使用的：將其前後記載的數值作為下限值和上限值而包括這兩個值。An embodiment of the electronic device, the touch panel, the laminated film, and the method for producing a laminated film of the present invention will be described with reference to the first to the sixteenth aspects. The present invention is not limited to the following embodiments. In addition, the "~" which shows the numerical range in this specification is used in the following meaning, and the numerical value of the above-mentioned before and after is mentioned as the lower-

如第一圖所示，本實施方式的電子設備10具有設備主體12和保護設備主體12的殼體14。As shown in the first figure, the electronic device 10 of the present embodiment has a device body 12 and a housing 14 that protects the device body 12.

如第二圖所示，設備主體12具有至少顯示圖像、文字等的顯示面板16，該顯示面板16的顯示面構成設備主體12的一個面（正面18a）。作為顯示面板16，例如能夠列舉液晶顯示器、有機EL顯示器（Organic Electro-Luminescence）等。並且，設備主體12在顯示面板16的背面側設置有電路基板22，在電路基板22上安裝有進行顯示面板16的控制、後述的觸控面板20的控制、以及資料通信的控制等的電子電路。As shown in the second figure, the apparatus main body 12 has a display panel 16 that displays at least an image, a character, and the like, and the display surface of the display panel 16 constitutes one surface (front surface 18a) of the apparatus main body 12. Examples of the display panel 16 include a liquid crystal display, an organic EL display (Organic Electro-Luminescence), and the like. Further, the device body 12 is provided with a circuit board 22 on the back side of the display panel 16, and an electronic circuit for controlling the display panel 16, control of the touch panel 20 to be described later, and control of data communication, and the like are mounted on the circuit board 22. .

殼體14利用具有透明性和撓性的外罩層24構成，例如對設備主體12的至少主面（例如正面18a）以及與正面18a鄰接的二個側面（第1側面26a和第2側面26b）進行保護。第1側面26a和第2側面26b相互對置。外罩層24例如由樹脂層28和硬質塗層膜30層疊而構成。當然，外罩層24也可以只是樹脂層28。或者，也可以是3層以上的層疊體。The casing 14 is formed of an outer cover layer 24 having transparency and flexibility, for example, at least a main surface (for example, a front surface 18a) of the apparatus main body 12 and two side surfaces (a first side surface 26a and a second side surface 26b) adjacent to the front surface 18a. Protect. The first side face 26a and the second side face 26b face each other. The cover layer 24 is formed by laminating, for example, a resin layer 28 and a hard coat film 30. Of course, the outer cover layer 24 may also be only the resin layer 28. Alternatively, it may be a laminate of three or more layers.

另外，可以利用殼體14保護設備主體12的正面18a、第3側面26c和第4側面26d（參照圖1）的一部分，也可以利用殼體14保護設備主體12的正面18a和所有側面（第1側面26a～第4側面26d）。或者，也可以利用殼體14保護設備主體12的正面18a和一個側面（第1側面26a～第4側面26d中的任意一個側面）。或者，也可以利用殼體14保護設備主體12的正面18a、一個側面和背面18b。也可以利用殼體14保護背面18b的一部分或者全部。Further, a part of the front surface 18a, the third side surface 26c, and the fourth side surface 26d (see FIG. 1) of the apparatus main body 12 may be protected by the casing 14, and the front surface 18a and all the side surfaces of the apparatus main body 12 may be protected by the casing 14. 1 side surface 26a to fourth side surface 26d). Alternatively, the front surface 18a of the apparatus main body 12 and one side surface (any one of the first side surface 26a to the fourth side surface 26d) may be protected by the casing 14. Alternatively, the front surface 18a, one side surface and the back surface 18b of the apparatus body 12 may be protected by the housing 14. It is also possible to protect a part or all of the back surface 18b by the casing 14.

並且，該電子設備10設置有觸控面板20。如第二圖所示，觸控面板20具有作為感測器主體的導電性膜32和控制電路34（由IC電路等構成，參照第二圖）。控制電路34安裝於電路基板22。導電性膜32在殼體14的內表面、即與設備主體12對置的部分，以沿著殼體14的形狀的方式成型為三維形狀。Moreover, the electronic device 10 is provided with a touch panel 20. As shown in the second figure, the touch panel 20 has a conductive film 32 as a sensor main body and a control circuit 34 (constructed by an IC circuit or the like, see FIG. 2). The control circuit 34 is mounted on the circuit substrate 22. The conductive film 32 is formed into a three-dimensional shape on the inner surface of the casing 14, that is, a portion opposed to the apparatus main body 12 so as to be along the shape of the casing 14.

也就是說，如第三圖所示那樣，優選利用殼體14的外罩層24（樹脂層28和硬質塗層膜30）與觸控面板20的導電性膜32的層疊構造來構成具有三維形狀的一個層疊膜35，該層疊膜35兼用作殼體14。That is, as shown in the third figure, it is preferable to form a three-dimensional shape by the laminated structure of the outer cover layer 24 (the resin layer 28 and the hard coat film 30) of the casing 14 and the conductive film 32 of the touch panel 20. One laminated film 35 which also serves as the casing 14.

如第四圖和第五圖所示，導電性膜32具有：基板（下文中記作撓性基板36），其具有透明性和撓性；多個第1感應電極38A，它們形成於撓性基板36的一個面（例如正面36a）；以及多個第2感應電極38B，它們形成於撓性基板36的另一個面（例如背面36b）。另外，第四圖和第五圖示出了將成型為三維形狀的導電性膜32呈平面狀展開的狀態。As shown in the fourth and fifth figures, the conductive film 32 has a substrate (hereinafter referred to as a flexible substrate 36) having transparency and flexibility, and a plurality of first sensing electrodes 38A formed in flexibility. One surface of the substrate 36 (for example, the front surface 36a) and a plurality of second sensing electrodes 38B are formed on the other surface of the flexible substrate 36 (for example, the back surface 36b). In addition, the fourth figure and the fifth figure show a state in which the conductive film 32 formed into a three-dimensional shape is developed in a planar shape.

如第五圖所示，導電性膜32具有：感測器區域40，在該感測器區域40形成有第1感應電極38A和第2感應電極38B；第1端子配線區域44A，在該第1端子配線區域44A形成有來自第1感應電極38A的第1端子配線部42A；以及第2端子配線區域44B，在該第2端子配線區域44B形成有來自第2感應電極38B的第2端子配線部42B。As shown in FIG. 5, the conductive film 32 has a sensor region 40 in which a first sensing electrode 38A and a second sensing electrode 38B are formed, and a first terminal wiring region 44A. The first terminal wiring portion 42A from the first sensing electrode 38A and the second terminal wiring region 44B are formed in the first terminal wiring region 44A, and the second terminal wiring from the second sensing electrode 38B is formed in the second terminal wiring region 44B. Part 42B.

導電性膜32的感測器區域40形成為從與殼體14的第1側面46a（參照第一圖和第二圖）對應的部分經由與殼體14的正面48a對應的部分到與殼體14的第2側面46b對應的部分連續地延伸，並且感測器區域40的一部分形成為彎曲成三維形狀。殼體14的第1側面46a與設備主體12的第1側面26a對置，殼體14的第2側面46b與設備主體12的第2側面26b對置。並且，殼體14的正面48a與設備主體12的正面18a對置。在第二圖的例子中，殼體14的正面48a由平坦面形成，第1側面46a和第2側面46b分別形成為彎曲面，因此，導電性膜32的感測器區域40也是同樣地，與殼體14的正面48a對應的部分由平坦面形成，與第1側面46a和第2側面46b對應的部分分別形成為彎曲面。The sensor region 40 of the conductive film 32 is formed from a portion corresponding to the first side face 46a of the case 14 (refer to the first view and the second figure) via a portion corresponding to the front face 48a of the case 14 to the case A portion corresponding to the second side face 46b of 14 extends continuously, and a portion of the sensor region 40 is formed to be curved into a three-dimensional shape. The first side surface 46a of the casing 14 faces the first side surface 26a of the apparatus body 12, and the second side surface 46b of the casing 14 faces the second side surface 26b of the apparatus body 12. Further, the front surface 48a of the casing 14 faces the front surface 18a of the apparatus main body 12. In the example of the second figure, the front surface 48a of the casing 14 is formed of a flat surface, and the first side surface 46a and the second side surface 46b are formed as curved surfaces, respectively. Therefore, the sensor region 40 of the conductive film 32 is also the same. A portion corresponding to the front surface 48a of the casing 14 is formed by a flat surface, and portions corresponding to the first side surface 46a and the second side surface 46b are formed as curved surfaces, respectively.

感測器區域40中，在撓性基板36的正面36a形成有例如由利用金屬細線構成的透明導電層形成的多個第1感應電極38A。在該情況下，雖然各自分離，但相對於殼體14的正面48a、第1側面46a和第2側面46b分別形成有第1感應電極38A。第1感應電極38A具有組合大量的單元50而構成的網格圖案52，第1感應電極38A在第1方向（y方向）上延伸，並且在與第1方向垂直的第2方向（x方向）上排列。這裡，“單元”是指利用多個金屬細線二維地劃分出的形狀。由利用金屬細線構成的網格圖案52形成的透明導電膜與ITO等金屬氧化物薄膜相比，即使成型時進行彎曲也不易破裂，容易在另一個面形成電極，因此優選作為本發明的透明導電膜。In the sensor region 40, a plurality of first sensing electrodes 38A formed of, for example, a transparent conductive layer made of thin metal wires are formed on the front surface 36a of the flexible substrate 36. In this case, the first sensing electrode 38A is formed on the front surface 48a, the first side surface 46a, and the second side surface 46b of the casing 14, respectively. The first sensing electrode 38A has a mesh pattern 52 formed by combining a large number of cells 50, and the first sensing electrode 38A extends in the first direction (y direction) and in the second direction (x direction) perpendicular to the first direction. Arranged on top. Here, the "unit" refers to a shape that is two-dimensionally divided by a plurality of thin metal wires. The transparent conductive film formed of the mesh pattern 52 made of a thin metal wire is more likely to be broken than the metal oxide film such as ITO, even if it is bent at the time of molding, and it is easy to form an electrode on the other surface. Therefore, it is preferable as the transparent conductive material of the present invention. membrane.

並且，在撓性基板36的正面36a的第1端子配線區域44A電連接有第1端子配線部42A，該第1端子配線部42A是由分別經由第1結線部54A而與各第1感應電極38A的端部連接的金屬細線形成的。從各第1結線部54A匯出的第1端子配線部42A繞到撓性基板36的一個邊（在第1方向上對置的二個邊中的一個）的大致中央部，並分別與對應的第1端子部56A電連接。Further, the first terminal wiring portion 42A is electrically connected to the first terminal wiring region 44A of the front surface 36a of the flexible substrate 36, and the first terminal wiring portion 42A is connected to each of the first sensing electrodes via the first junction portion 54A. The end of the 38A is formed by a thin metal wire. The first terminal wiring portion 42A that is led out from each of the first junction portions 54A is wound around a substantially central portion of one side (one of the two sides facing each other in the first direction) of the flexible substrate 36, and corresponds to each other. The first terminal portion 56A is electrically connected.

另一方面，在撓性基板36的背面36b的感測器區域40形成有由利用金屬細線構成的透明導電層形成的多個第2感應電極38B。也就是說，對於殼體14的正面48a、第1側面46a和第2側面46b（參照第二圖）共用地形成有多個第2感應電極38B。第2感應電極38B也具有組合大量的單元50而構成的網格圖案52，第2感應電極38B在第2方向（x方向）上延伸，並且在與第2方向垂直的第1方向（y方向）上排列。On the other hand, a plurality of second sensing electrodes 38B formed of a transparent conductive layer made of thin metal wires are formed in the sensor region 40 of the back surface 36b of the flexible substrate 36. In other words, a plurality of second sensing electrodes 38B are formed in common on the front surface 48a of the casing 14, the first side surface 46a, and the second side surface 46b (see the second drawing). The second sensing electrode 38B also has a mesh pattern 52 formed by combining a large number of cells 50. The second sensing electrode 38B extends in the second direction (x direction) and is in the first direction (y direction) perpendicular to the second direction. ) arranged on top.

並且，在撓性基板36的背面36b的第2端子配線區域44B電連接有第2端子配線部42B，該第2端子配線部42B是由分別經由第2結線部54B而與各第2感應電極38B的端部連接的金屬細線形成的。從各第2結線部54B匯出的第2端子配線部42B繞到撓性基板36的一個邊（在第2方向上對置的二個邊中的一個）的大致中央部，並分別與對應的第2端子部56B電連接。另外，雖未圖示，但可以在撓性基板36的正面36a、或者背面36b、或者正面36a和背面36b形成有以遮罩效果為目的的地線。Further, the second terminal wiring portion 42B is electrically connected to the second terminal wiring region 44B on the back surface 36b of the flexible substrate 36, and the second terminal wiring portion 42B is connected to each of the second sensing electrodes via the second connection portion 54B. The end of the 38B is formed by a thin metal wire. The second terminal wiring portion 42B that is discharged from each of the second junction portions 54B is wound around a substantially central portion of one side (one of the two sides facing each other in the second direction) of the flexible substrate 36, and corresponds to each other. The second terminal portion 56B is electrically connected. Further, although not shown, a ground line for the purpose of masking effect may be formed on the front surface 36a or the back surface 36b of the flexible substrate 36 or the front surface 36a and the back surface 36b.

因此，在本實施方式中，在殼體14的內表面設置一個導電性膜32並使一部分彎曲，由此如第一圖所示，成為這樣的形態：設置有位於殼體14的正面48a的第1觸控面板20A、位於第1側面46a的第2觸控面板20B、以及位於第2側面46b的第3觸控面板20C。並且，多個第2感應電極38B在第1觸控面板20A～第三觸控面板20C上是共用的。第2端子部56B也成為在第1觸控面板20A～第3觸控面板20C上共用地形成的形態。多個第1感應電極38A雖然各自分離，但分別形成於第1觸控面板20A～第3觸控面板20C。Therefore, in the present embodiment, one conductive film 32 is provided on the inner surface of the casing 14 and a part is bent, whereby as shown in the first figure, a form is provided in which the front surface 48a of the casing 14 is provided. The first touch panel 20A, the second touch panel 20B on the first side surface 46a, and the third touch panel 20C on the second side surface 46b. Further, the plurality of second sensing electrodes 38B are shared by the first touch panel 20A to the third touch panel 20C. The second terminal portion 56B is also formed integrally with the first touch panel 20A to the third touch panel 20C. The plurality of first sensing electrodes 38A are formed separately from the first touch panel 20A to the third touch panel 20C.

並且，如第一圖和第二圖所示，通過將設置有導電性膜32的殼體14安裝到設備主體12，從而第1端子配線區域44A和第2端子配線區域44B位於設備主體12的背面18b側、即電路基板22側。因此，能夠將導電性膜32的至少第1端子部56A和第2端子部56B（參照第五圖）例如通過連接器與控制電路34（參照第二圖）電連接。也就是說，能夠將來自三個觸控面板20A～20C的配線簡單地彙集成1個，從而不需要複雜的配線。由此，能夠實現在多個面上設有觸控面板的電子設備的薄型化和窄邊框化。Further, as shown in the first and second figures, by mounting the casing 14 provided with the conductive film 32 to the apparatus body 12, the first terminal wiring region 44A and the second terminal wiring region 44B are located in the apparatus body 12. The back surface 18b side, that is, the circuit board 22 side. Therefore, at least the first terminal portion 56A and the second terminal portion 56B (see FIG. 5) of the conductive film 32 can be electrically connected to the control circuit 34 (see FIG. 2) via a connector, for example. In other words, the wirings from the three touch panels 20A to 20C can be easily integrated into one, so that complicated wiring is not required. Thereby, it is possible to reduce the thickness and the narrow frame of the electronic device in which the touch panel is provided on a plurality of surfaces.

構成殼體14的外罩層24和觸控面板20的導電性膜32被一體化。即，從設備主體12的正面18a到殼體14的正面48a，依次層疊有導電性膜32、樹脂層28、硬質塗層膜30並成為一體。對於該製造方法在後面敘述。The outer cover layer 24 constituting the casing 14 and the conductive film 32 of the touch panel 20 are integrated. In other words, the conductive film 32, the resin layer 28, and the hard coat film 30 are laminated in this order from the front surface 18a of the apparatus main body 12 to the front surface 48a of the casing 14. This manufacturing method will be described later.

另外，如第二圖所示，可以在導電性膜32的正面中與殼體14的第1側面46a和第2側面46b對應的部位，粘貼以遮擋為目的的不透明的膜、例如裝飾膜58。裝飾膜58例如在正面實施了凹版印刷等，並在背面塗布有粘接劑。由此，能夠提高殼體14的第1側面46a和第2側面46b的設計性，例如如第一圖所示，能夠設計出在殼體14的正面48a的一部分形成有貫通至顯示面板16的開口60的形態。Further, as shown in the second figure, an opaque film for shielding, for example, a decorative film 58 may be attached to a portion of the front surface of the conductive film 32 corresponding to the first side surface 46a and the second side surface 46b of the casing 14. . The decorative film 58 is, for example, gravure printed on the front surface, and has an adhesive applied to the back surface. Thereby, the design of the first side surface 46a and the second side surface 46b of the casing 14 can be improved. For example, as shown in the first figure, it is possible to design a part of the front surface 48a of the casing 14 to be formed to penetrate the display panel 16. The shape of the opening 60.

如第三圖所示，兼用作殼體14的三維形狀的層疊膜35中，正面48a為平坦面，第1側面46a和第2側面46b為彎曲面。因此，在將殼體14與觸控面板20的導電性膜32一起安裝到設備主體12的情況下，能夠以下述方式進行。即，使第1側面46a和第2側面46b向相互打開的方向彈性變形，在第1側面46a和第2側面46b之間***設備主體12，之後，使第1側面46a和第2側面46b彈性恢復，由此能夠將設備主體12把持固定在殼體14內。另外，可以使空氣層介於導電性膜32的背面和設備主體12的正面18a之間，也可以介入有透明粘接劑。As shown in the third figure, in the laminated film 35 which also serves as the three-dimensional shape of the casing 14, the front surface 48a is a flat surface, and the first side surface 46a and the second side surface 46b are curved surfaces. Therefore, in the case where the casing 14 is attached to the apparatus main body 12 together with the conductive film 32 of the touch panel 20, it can be performed in the following manner. In other words, the first side surface 46a and the second side surface 46b are elastically deformed in a direction in which they are opened to each other, and the apparatus main body 12 is inserted between the first side surface 46a and the second side surface 46b, and then the first side surface 46a and the second side surface 46b are elasticized. Recovery, whereby the device body 12 can be held in the housing 14 by being held. Further, the air layer may be interposed between the back surface of the conductive film 32 and the front surface 18a of the apparatus main body 12, or a transparent adhesive may be interposed.

這裡，參照第四圖和第六圖對觸控面板20的觸控位置的檢測方式進行說明。作為觸控位置的檢測方式，能夠優選採用自電容方式和互電容方式。Here, the manner of detecting the touch position of the touch panel 20 will be described with reference to the fourth and sixth figures. As a method of detecting the touch position, a self-capacitance method and a mutual capacitance method can be preferably used.

如第四圖所示，在自電容方式中，從控制電路34向第1端子配線部42A按順序供給用於檢測觸控位置的第1脈衝信號P1，並從控制電路34向第2端子配線部42B按順序供給用於檢測觸控位置的第2脈衝信號P2。As shown in the fourth figure, in the self-capacitance mode, the first pulse signal P1 for detecting the touch position is sequentially supplied from the control circuit 34 to the first terminal wiring portion 42A, and is wired from the control circuit 34 to the second terminal. The portion 42B sequentially supplies the second pulse signal P2 for detecting the touch position.

通過使指尖接觸或接近殼體14，與觸控位置對置的第1感應電極38A和GND（地線）之間的電容、以及第2感應電極38B和GND之間的電容增加，因此，來自該第1感應電極38A和第2感應電極38B的傳遞信號的波形成為與來自其他第1感應電極38A和第2感應電極38B的傳遞信號的波形不同的波形。因此，在控制電路34中，根據來自該第1感應電極38A和第2感應電極38B的傳遞信號運算出觸控位置。By bringing the fingertip into contact with or approaching the casing 14, the capacitance between the first sensing electrode 38A and the GND (ground) opposite to the touch position, and the capacitance between the second sensing electrode 38B and GND are increased. The waveform of the transmission signal from the first induction electrode 38A and the second induction electrode 38B is a waveform different from the waveform of the transmission signal from the other first induction electrode 38A and the second induction electrode 38B. Therefore, in the control circuit 34, the touch position is calculated based on the transfer signals from the first sense electrode 38A and the second sense electrode 38B.

另一方面，如第六圖所示，互電容方式下，從控制電路34向第2感應電極38B按順序施加用於檢測觸控位置的電壓信號S2，並按順序對第1感應電極38A進行傳感（傳遞信號S1的檢測）。通過使指尖接觸或接近殼體14，對與觸控位置對置的第1感應電極38A和第2感應電極38B之間的寄生電容（初始的靜電容）並聯地施加了手指的雜散電容，因此，來自與觸控位置對應的第1感應電極38A的傳遞信號S1的波形成為與來自其他第1感應電極38A的傳遞信號S1的波形不同的波形。因此，在控制電路34中，根據供給電壓信號S2的第2感應電極38B的順序、和被供給的來自第1感應電極38A的傳遞信號S1對觸控位置進行運算。On the other hand, as shown in the sixth figure, in the mutual capacitance mode, the voltage signal S2 for detecting the touch position is sequentially applied from the control circuit 34 to the second sensing electrode 38B, and the first sensing electrode 38A is sequentially performed. Sensing (detection of the transmitted signal S1). By contacting the fingertip or approaching the casing 14, the stray capacitance of the finger is applied in parallel to the parasitic capacitance (initial electrostatic capacitance) between the first sensing electrode 38A and the second sensing electrode 38B opposed to the touch position. Therefore, the waveform of the transmission signal S1 from the first sensing electrode 38A corresponding to the touch position is a waveform different from the waveform of the transmission signal S1 from the other first sensing electrode 38A. Therefore, in the control circuit 34, the touch position is calculated based on the order of the second sensing electrode 38B to which the voltage signal S2 is supplied and the supplied signal S1 from the first sensing electrode 38A.

通過採用這樣的自電容方式或互電容方式的觸控位置的檢測方法，即使同時使2個指尖接觸或接近殼體14，也能夠檢測各觸控位置。在本發明中，在多個面設置觸控面板，並利用共用的電極對它們進行驅動，因此，優選採用同時能夠檢測2個部位以上的接觸的方式。由此，能夠應對複雜的輸入操作，因而是優選的。By adopting such a self-capacitance method or a mutual capacitance type touch position detecting method, even if two fingertips are simultaneously brought into contact with or approaching the casing 14, the respective touch positions can be detected. In the present invention, since the touch panels are provided on a plurality of surfaces and they are driven by the common electrodes, it is preferable to use a method in which contacts of two or more locations can be detected at the same time. Thereby, it is possible to cope with complicated input operations, and thus it is preferable.

另外，作為與投影型靜電容方式的檢測電路相關的現有技術文獻，已有美國專利第4582955號說明書、美國專利第4686332號說明書、美國專利第4733222號說明書、美國專利第5374787號說明書、美國專利第5543588號說明書、美國專利第7030860號說明書、美國專利申請公開第2004/0155871號說明書等。In addition, as a prior art document relating to a projection type electrostatic capacitance type detection circuit, there are a specification of U.S. Patent No. 4,582,955, a specification of U.S. Patent No. 4,863,332, a specification of U.S. Patent No. 4,732,222, a specification of U.S. Patent No. 5,374,787, and a U.S. patent. The specification of No. 5,543,588, the specification of U.S. Patent No. 7,030,860, the specification of U.S. Patent Application Publication No. 2004/0155871, and the like.

特別地，在本實施方式中，除了相對於殼體14的正面48a的觸控位置以外，還能夠檢測相對於第1側面46a和第2側面46b的觸控位置。當然，以往，已有這樣的技術：將機械開關設置在殼體的側面，使其具有與開關的旋轉角度或打開／關閉對應的功能。但是，在希望變更功能的情況下，需要機械開關的更換或者全面的設計變更。與此相對，在本實施方式中，沒有使用機械開關，只通過軟體的變更，除了與相對於正面48a的觸控位置對應的功能（按鍵選擇、捲軸功能等）以外，還能夠具有與在第1側面46a和第2側面46b上的觸控位置對應的功能（開關功能等）。而且，還能夠具有使相對於正面48a的觸控位置和在第1側面46a和第2側面46b上的觸控位置聯攜的功能。例如在動態圖像錄影中想要找到變焦功能或快門功能的情況下，若根據在正面48a的觸控位置進行的話，顯示畫面會被手指遮擋，因而使用便利性差。但是，在本實施方式中，只通過軟體的變更，就能夠根據在第1側面46a或者第2側面46b上的觸控位置找到動態圖像錄影中的變焦功能或快門功能，因此，顯示畫面不會被手指遮擋，從而使用便利性得以改善。並且，例如在切換左手持拍、右手持拍的情況下，能夠通過設定來容易地變更開關位置，使用便利性得以改善。In particular, in the present embodiment, in addition to the touch position with respect to the front surface 48a of the casing 14, the touch position with respect to the first side surface 46a and the second side surface 46b can be detected. Of course, in the past, there has been a technique in which a mechanical switch is provided on the side of the casing so as to have a function corresponding to the rotation angle or opening/closing of the switch. However, when it is desired to change the function, a mechanical switch replacement or a comprehensive design change is required. On the other hand, in the present embodiment, the mechanical switch is not used, and only the function corresponding to the touch position with respect to the front surface 48a (key selection, reel function, etc.) can be used only by the change of the soft body. A function (switch function, etc.) corresponding to the touch position on the side surface 46a and the second side surface 46b. Further, it is also possible to have a function of connecting the touch position with respect to the front surface 48a and the touch position on the first side surface 46a and the second side surface 46b. For example, in the case of a moving image recording in which a zoom function or a shutter function is to be found, if the display is performed on the front side 48a, the display screen is blocked by the finger, and the usability is poor. However, in the present embodiment, the zoom function or the shutter function in the moving image recording can be found based on the touch position on the first side surface 46a or the second side surface 46b only by the change of the software. Therefore, the display screen is not displayed. It will be blocked by your fingers, which will improve the usability. Further, for example, when the left hand grip and the right hand grip are switched, the switch position can be easily changed by setting, and the usability is improved.

而且，在本實施方式中，只將一個導電性膜32安裝到設備主體12，就能夠構成在設備主體12的正面18a和二個側面26a和26b分別具備觸控面板20A～20C的電子設備10。在該情況下，能夠使配線區域（第1端子配線區域44A和第2端子配線區域44B）彙集在設備主體12的背面18b側，因此，不需要在各觸控面板20A～20C配置外周的配線區域（所謂的邊框）。這關係到檢測觸控位置的區域的擴大，也關係到使用便利性的提高和設計性的提高。而且，由於能夠使配線區域彙集在設備主體12的背面18b側，因此，能夠簡化配線的引繞，實現用於配線的空間的縮小化和配線作業的簡單化。並且，不需要在各觸控面板20A～20C安裝控制電路34，只安裝一個控制電路34即可，因此，能夠實現電路基板22的縮小化，進而還能夠實現電子設備10的小型化。Further, in the present embodiment, only one conductive film 32 is attached to the apparatus main body 12, and the electronic device 10 including the touch panels 20A to 20C on the front surface 18a and the two side surfaces 26a and 26b of the apparatus main body 12 can be formed. . In this case, since the wiring region (the first terminal wiring region 44A and the second terminal wiring region 44B) can be collected on the back surface 18b side of the device body 12, it is not necessary to arrange the wiring on the outer circumference of each of the touch panels 20A to 20C. Area (the so-called border). This is related to the enlargement of the area where the touch position is detected, and also relates to the improvement in usability and the improvement in design. In addition, since the wiring area can be collected on the back surface 18b side of the apparatus main body 12, the wiring can be simplified, and the space for wiring can be reduced and the wiring operation can be simplified. Further, since it is not necessary to mount the control circuit 34 on each of the touch panels 20A to 20C, only one control circuit 34 can be mounted. Therefore, the circuit board 22 can be downsized, and the electronic device 10 can be downsized.

而且，在本實施方式中，構成殼體14的外罩層24和觸控面板20的導電性膜32被一體化。即依次層疊導電性膜32、樹脂層28和硬質塗層膜30並成為一體。因此，不需要在構成殼體14的正面部和側面部分別單獨地貼附觸控面板，只將殼體14安裝到設備主體12，就能夠構成在設備主體12的正面18a和二個側面26a和26b分別具備觸控面板20A～20C的電子設備10。這關係到組裝的簡單化，有利於成本的降低化。Further, in the present embodiment, the outer cover layer 24 constituting the casing 14 and the conductive film 32 of the touch panel 20 are integrated. That is, the conductive film 32, the resin layer 28, and the hard coat film 30 are laminated in this order and integrated. Therefore, it is not necessary to separately attach the touch panel to the front and side portions constituting the casing 14, and only the casing 14 is attached to the apparatus main body 12, so that the front surface 18a and the two side faces 26a of the apparatus main body 12 can be formed. The electronic device 10 of the touch panels 20A to 20C is provided separately from the 26b. This is related to the simplification of assembly and is conducive to cost reduction.

並且，與導電性膜32成為一體的殼體14，通過準備各種各樣的形態和配色，能夠實現將用戶喜歡的殼體14安裝到設備主體12來使用等、重視設計性的電子設備10。能夠構建單獨地售賣設備主體12和殼體14（帶觸控面板的殼體）的商業形態，會使對顧客的吸引力增大。In addition, the housing 14 which is integrated with the conductive film 32 can be used in various forms and colors, and the electronic device 10 which is designed to be attached to the apparatus main body 12 and used, etc., can be realized. It is possible to construct a commercial form in which the apparatus main body 12 and the casing 14 (the casing with the touch panel) are separately sold, and the attraction to the customer is increased.

接下來，參照第七圖～第十圖對具有導電性膜32的殼體14的製造方法進行說明。Next, a method of manufacturing the casing 14 having the conductive film 32 will be described with reference to FIGS. 7 to 10 .

首先，在第七圖的步驟S1中，製作例如如第四圖和第五圖所示的導電性膜32。即，製作在撓性基板36的正面36a形成有多個第1感應電極38A和多個第1端子配線部42A、且在撓性基板36的背面36b形成有第2感應電極38B和多個第2端子配線部42B的導電性膜32。之後，可以在導電性膜32的表面中與殼體14的第1側面46a和第2側面46b對應的部分分別粘貼裝飾膜58。另外，對於導電性膜32的具體的製造方法，在後面敘述。First, in step S1 of the seventh drawing, for example, the conductive film 32 as shown in the fourth and fifth figures is produced. In other words, a plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A are formed on the front surface 36a of the flexible substrate 36, and a second sensing electrode 38B and a plurality of the first surface are formed on the back surface 36b of the flexible substrate 36. The conductive film 32 of the 2-terminal wiring portion 42B. Thereafter, the decorative film 58 may be attached to a portion of the surface of the conductive film 32 corresponding to the first side surface 46a and the second side surface 46b of the casing 14, respectively. In addition, a specific manufacturing method of the conductive film 32 will be described later.

之後，在第七圖的步驟S2中，如第八圖(A)和(B)所示，將導電性膜32真空成型為順著殼體14的正面48a、第1側面46a和第2側面46b的三維形狀。在該情況下，使用具有與注塑成型模具62［參照第十圖(A)和(B)］的第1模具62A大致相同尺寸的第1成型用模具64A進行真空成型，該注塑成型模具62是在嵌件注塑成型或者嵌件注塑壓縮成型殼體14的樹脂層28時使用的。在使完成後的導電性膜32具有例如三維形狀時，如第八圖(A)所示，在第1成型用模具64A形成有與完成後的導電性膜32的背面同樣的平坦面66a和曲面66b，而且形成有大量的抽吸孔68。Thereafter, in step S2 of the seventh diagram, as shown in the eighth (A) and (B), the conductive film 32 is vacuum-formed so as to follow the front surface 48a, the first side surface 46a, and the second side of the casing 14. The three-dimensional shape of 46b. In this case, vacuum molding is performed using the first molding die 64A having substantially the same size as the first die 62A of the injection molding die 62 [refer to the tenth drawings (A) and (B)], and the injection molding die 62 is It is used when insert molding or insert molding compression molding the resin layer 28 of the casing 14. When the completed conductive film 32 has a three-dimensional shape, for example, as shown in FIG. 8(A), a flat surface 66a similar to the back surface of the completed conductive film 32 is formed in the first molding die 64A. The curved surface 66b is formed with a large number of suction holes 68.

然後，使用了第1成型用模具64A的導電性膜32的真空成型可以這樣進行：例如如第八圖(A)所示，在將導電性膜32預熱到140～210℃之後，如第八圖(B)所示地將導電性膜32按壓到第1成型用模具64A的平坦面66a和曲面66b上，從第1成型用模具64A經由抽吸孔68抽吸成真空，並從導電性膜32側施加0.1～2MPa的大氣壓力。該成型是一邊將導電性膜32加熱到溫度250～300℃（撓性基板36的溫度150～200℃）一邊進行的。利用該真空成型，完成構成觸控面板20的三維形狀的導電性膜32。Then, vacuum forming of the conductive film 32 using the first molding die 64A can be performed by, for example, as shown in FIG. 8(A), after the conductive film 32 is preheated to 140 to 210 ° C, as described in The conductive film 32 is pressed against the flat surface 66a and the curved surface 66b of the first molding die 64A as shown in Fig. 8 (B), and is sucked into a vacuum from the first molding die 64A via the suction hole 68, and is electrically conductive. An atmospheric pressure of 0.1 to 2 MPa was applied to the side of the film 32. This molding is performed while heating the conductive film 32 to a temperature of 250 to 300 ° C (the temperature of the flexible substrate 36 is 150 to 200 ° C). With this vacuum forming, the conductive film 32 constituting the three-dimensional shape of the touch panel 20 is completed.

接下來，在第七圖的步驟S3中，如第九圖(A)和(B)所示，將硬質塗層膜30真空成型為順著殼體14的正面48a、第1側面46a和第2側面46b的三維形狀。在該情況下，使用具有與注塑成型模具62［參照第十圖(A)和(B)］的第2模具62B大致相同的尺寸的第2成型用模具64B進行真空成型。在使完成後的硬質塗層膜30具有例如三維形狀時，如第九圖(A)所示，在第2成型用模具64B也形成有與完成後的硬質塗層膜30的表面（外側的面）同樣的平坦面70a和曲面70b，而且形成有大量的抽吸孔72。Next, in step S3 of the seventh diagram, as shown in the ninth drawings (A) and (B), the hard coat film 30 is vacuum-formed so as to follow the front surface 48a, the first side surface 46a, and the first portion of the casing 14. 2 three-dimensional shape of the side 46b. In this case, vacuum molding is performed using the second molding die 64B having substantially the same size as the second die 62B of the injection molding die 62 [refer to the tenth drawings (A) and (B)]. When the completed hard coat film 30 has, for example, a three-dimensional shape, as shown in FIG. 9(A), the second molding die 64B is also formed with the surface of the completed hard coat film 30 (outside The same flat surface 70a and curved surface 70b are formed with a large number of suction holes 72.

然後，使用了第2成型用模具64B的硬質塗層膜30的真空成型可以這樣進行：例如如第九圖(A)所示，在將硬質塗層膜30預熱到140～210℃之後，如第九圖(B)所示地將硬質塗層膜30按壓到第2成型用模具64B的平坦面70a和曲面70b上，從第2成型用模具64B經由抽吸孔72抽吸成真空，並從硬質塗層膜30側施加0.1～2MPa的大氣壓力。利用該真空成型，完成構成殼體14的三維形狀的硬質塗層膜30。Then, vacuum forming of the hard coat film 30 using the second molding die 64B can be performed by, for example, as shown in FIG. 9(A), after preheating the hard coat film 30 to 140 to 210 ° C, The hard coat film 30 is pressed against the flat surface 70a and the curved surface 70b of the second molding die 64B as shown in the ninth figure (B), and is sucked into a vacuum from the second molding die 64B via the suction hole 72. An atmospheric pressure of 0.1 to 2 MPa is applied from the side of the hard coat film 30. By this vacuum forming, the hard coat film 30 constituting the three-dimensional shape of the casing 14 is completed.

之後，在第七圖的步驟S4中，將如上述那樣得到的具有三維形狀的導電性膜32和硬質塗層膜30設置在注塑成型模具62內。如第十圖(A)和(B)所示，注塑成型模具62具有這樣的結構：供導電性膜32設置的第1模具62A與供硬質塗層膜30設置的第2模具62B以將腔體74夾在它們之間的方式對置。並且，在第1模具62A的腔體74側的面設置導電性膜32，在第2模具62B的腔體74側的面設置硬質塗層膜30。Thereafter, in step S4 of the seventh embodiment, the conductive film 32 having a three-dimensional shape and the hard coat film 30 obtained as described above are placed in the injection molding die 62. As shown in the tenth (A) and (B), the injection molding die 62 has a structure in which the first die 62A provided for the conductive film 32 and the second die 62B provided with the hard coat film 30 are used to hold the cavity. The body 74 is opposed to each other in a manner sandwiched between them. Further, a conductive film 32 is provided on the surface of the first mold 62A on the cavity 74 side, and a hard coat film 30 is provided on the surface of the second mold 62B on the cavity 74 side.

之後，在第七圖的步驟S5中，如第十圖(A)和(B)所示，在注塑成型模具62的腔體74內注入熔融樹脂，固化而成為樹脂層28，由此，依次層疊導電性膜32、樹脂層28和硬質塗層膜30並一體化而成的層疊膜35、即與導電性膜32成為一體的殼體14得以完成。即，形成有第1感應電極38A和第2感應電極38B的撓性基板36一體成型於殼體14。Thereafter, in step S5 of the seventh embodiment, as shown in the tenth drawings (A) and (B), molten resin is injected into the cavity 74 of the injection molding die 62, and solidified to become the resin layer 28, thereby sequentially The laminated film 35 in which the conductive film 32, the resin layer 28, and the hard coat film 30 are laminated and integrated, that is, the case 14 integrated with the conductive film 32 is completed. In other words, the flexible substrate 36 on which the first induction electrode 38A and the second induction electrode 38B are formed is integrally formed in the casing 14.

通常，在將溫度高的熔融樹脂注塑成型到由冷注塑成型模具62包圍成的腔體74時，熔融樹脂的熱迅速傳遞到模具，熔融樹脂的固化加快。為了在腔體74填充熔融樹脂，必須增加腔體74的厚度以使熔融樹脂遍佈腔體74。在該情況下，由固化的熔融樹脂構成的樹脂層28的厚度增加，從而存在樹脂層28的薄壁成型存在極限這樣的問題。In general, when a molten resin having a high temperature is injection-molded into a cavity 74 surrounded by a cold injection molding die 62, heat of the molten resin is quickly transferred to the mold, and solidification of the molten resin is accelerated. In order to fill the cavity 74 with molten resin, the thickness of the cavity 74 must be increased to allow the molten resin to spread throughout the cavity 74. In this case, the thickness of the resin layer 28 composed of the cured molten resin increases, and there is a problem that the thin-wall molding of the resin layer 28 has a limit.

另一方面，在本實施方式中，在冷注塑成型模具62和溫度高的熔融樹脂之間夾有導電性膜32和硬質塗層膜30等膜，因此，熔融樹脂的熱不易傳遞到注塑成型模具62。即熱傳遞率低下。因此，相比於未夾有膜的情況下的樹脂層28的薄壁成型極限，能夠成型出更薄的樹脂層28。特別地，在本實施方式中，由於是在腔體74的兩面設置膜來進行嵌件成型，因此，樹脂層28的厚度進一步變薄，能夠穩定地製作薄壁的層疊膜35（硬質塗層膜30、樹脂層28和導電性膜32的層疊體）。On the other hand, in the present embodiment, a film such as the conductive film 32 and the hard coat film 30 is interposed between the cold injection molding die 62 and the molten resin having a high temperature, and therefore, the heat of the molten resin is not easily transmitted to the injection molding. Mold 62. That is, the heat transfer rate is low. Therefore, a thinner resin layer 28 can be formed than the thin wall molding limit of the resin layer 28 in the case where the film is not sandwiched. In particular, in the present embodiment, since the film is formed on both surfaces of the cavity 74 to perform insert molding, the thickness of the resin layer 28 is further reduced, and the thin laminated film 35 (hard coating) can be stably produced. A film 30, a laminate of the resin layer 28 and the conductive film 32).

在上述的實施方式中，使用了與導電性膜32成為一體的殼體14，但也可以進一步組合具有撓性的偏光板等來形成為一體。當然，也可以使殼體14和導電性膜32分體地構成。在該情況下，可以借助透明粘接劑等使殼體14的樹脂層28和導電性膜32粘合。In the above-described embodiment, the case 14 integrated with the conductive film 32 is used. However, a flexible polarizing plate or the like may be further combined to form the case. Of course, the casing 14 and the conductive film 32 may be formed separately. In this case, the resin layer 28 of the case 14 and the conductive film 32 can be bonded by a transparent adhesive or the like.

並且，如第十一圖所示，也可以在殼體14中的第1側面46a的一部分或第2側面46b的一部分呈彎曲狀地形成凹部76和凸部78。利用軟體的變更，使凹部76和凸部78作為快門按鍵或具有變焦功能的操作部發揮功能，由此使用者容易認識到操作哪一部分為宜，從而能夠使使用便利性良好。Further, as shown in the eleventh diagram, the concave portion 76 and the convex portion 78 may be formed in a curved shape in a part of the first side surface 46a or a part of the second side surface 46b of the casing 14. By the change of the software, the concave portion 76 and the convex portion 78 function as a shutter button or an operation portion having a zoom function, whereby the user can easily recognize which portion of the operation is appropriate, and the usability can be improved.

接下來，下面對本實施方式的導電性膜32的優選的方式進行說明。Next, a preferred embodiment of the conductive film 32 of the present embodiment will be described below.

各單元50由多邊形構成。作為多邊形，能夠列舉三角形、四邊形（正方形、長方形、平行四邊形、菱形等）、五邊形、六邊形、任意多邊形等。並且，構成多邊形的邊的一部分可以由曲線構成。優選單元50的一邊的長度為50～500μm。若一邊的長度過短，則存在開口率和透過率低，隨之透明性劣化這樣的問題。相反地，若一邊的長度過長，則有可能容易目視到金屬細線。Each unit 50 is composed of a polygon. Examples of the polygon include a triangle, a quadrangle (square, rectangle, parallelogram, rhombus, etc.), a pentagon, a hexagon, an arbitrary polygon, and the like. Further, a part of the side constituting the polygon may be constituted by a curved line. The length of one side of the unit 50 is preferably 50 to 500 μm. If the length of one side is too short, there is a problem that the aperture ratio and the transmittance are low, and the transparency is deteriorated. Conversely, if the length of one side is too long, it may be easy to visually see the fine metal wires.

金屬細線的線寬優選為1μm以上且5μm以下，進一步優選為2μm以上且5μm以下。第1感應電極38A和第2感應電極38B的表面電阻優選處於0.1～100歐姆/sq.的範圍。下限值優選為1歐姆/sq.以上、3歐姆/sq.以上、5歐姆/sq.以上、以及10歐姆/sq.以上。上限值優選為70歐姆/sq.以下、以及50歐姆/sq.以下。The line width of the fine metal wires is preferably 1 μm or more and 5 μm or less, and more preferably 2 μm or more and 5 μm or less. The surface resistance of the first induction electrode 38A and the second induction electrode 38B is preferably in the range of 0.1 to 100 ohms/sq. The lower limit value is preferably 1 ohm/sq. or more, 3 ohm/sq. or more, 5 ohm/sq. or more, and 10 ohm/sq. or more. The upper limit is preferably 70 ohm/sq. or less and 50 ohm/sq. or less.

優選構成上述第1端子配線部42A、第2端子配線部42B、第1端子部56A、第2端子部56B等的金屬配線、以及構成第1感應電極38A和第2感應電極38B的金屬細線分別由單一的導電性材料構成。優選單一的導電性材料為由銀、銅、鋁中的一種構成的金屬、或者由含有它們中的至少一種的合金構成。Preferably, the metal wirings constituting the first terminal wiring portion 42A, the second terminal wiring portion 42B, the first terminal portion 56A, and the second terminal portion 56B, and the metal thin wires constituting the first sensing electrode 38A and the second sensing electrode 38B are respectively It consists of a single conductive material. Preferably, the single conductive material is a metal composed of one of silver, copper, and aluminum, or an alloy containing at least one of them.

從可見光透過率這方面考慮，本實施方式中的導電性膜32優選至少感測器區域40的開口率為85%以上，進一步優選為90%以上，最優選為95%以上。所謂開口率，是指除了金屬細線以外的透光性部分占整體的比率，通過以下的計算式，例如線寬為6μm、細線間距為240μm的正方形的格子狀的開口率為95%。From the viewpoint of the visible light transmittance, the conductive film 32 in the present embodiment preferably has an aperture ratio of at least 85% or more, more preferably 90% or more, and most preferably 95% or more. The aperture ratio is a ratio of the translucent portion other than the fine metal wires to the whole, and the square lattice-like aperture ratio of the line width of 6 μm and the fine line pitch of 240 μm is 95% by the following calculation formula.

開口率= Opening ratio =

在上述的導電性膜32中，例如如第四圖和第六圖所示，在撓性基板36的正面36a形成了多個第1感應電極38A和多個第1端子配線部42A，在撓性基板36的背面36b形成了多個第2感應電極38B和多個第2端子配線部42B，但除此以外，也可以如第十二圖所示地形成為粘合二個撓性基板（第1撓性基板36A和第2撓性基板36B）的類型的導電性膜32。關於該導電性膜32，在第1撓性基板36A的正面形成多個第1感應電極38A和多個第1端子配線部42A，在第2撓性基板36B的正面形成多個第2感應電極38B和多個第2端子配線部42B。並且，在第1撓性基板36A的背面和第2撓性基板36B的正面之間例如夾有透明粘接劑80而進行層疊。In the above-described conductive film 32, for example, as shown in FIG. 4 and FIG. 6, a plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A are formed on the front surface 36a of the flexible substrate 36, and are scratched. The plurality of second sensing electrodes 38B and the plurality of second terminal wiring portions 42B are formed on the back surface 36b of the substrate 36. Alternatively, as shown in Fig. 12, two flexible substrates may be bonded to each other. A conductive film 32 of the type of the flexible substrate 36A and the second flexible substrate 36B). In the conductive film 32, a plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A are formed on the front surface of the first flexible substrate 36A, and a plurality of second sensing electrodes are formed on the front surface of the second flexible substrate 36B. 38B and a plurality of second terminal wiring portions 42B. Further, a transparent adhesive 80 is interposed between the back surface of the first flexible substrate 36A and the front surface of the second flexible substrate 36B, for example, and laminated.

在上述的例子中，示出了將導電性膜32應用於投影型靜電容方式的觸控面板20的例子，但除此以外，也能夠應用於表面型靜電容方式的觸控面板和電阻膜式的觸控面板。In the above example, the conductive film 32 is applied to the projection type capacitive touch panel 20. However, the conductive film 32 can be applied to the surface capacitive type touch panel and the resistive film. Touch panel.

另外，關於上述的與導電性膜32成為一體的殼體14，除了電子設備10的觸控面板20以外，也能夠作為顯示裝置的電磁波遮罩膜、和在顯示裝置的顯示面板上設置的驅動電極而利用。作為顯示裝置，能夠列舉液晶顯示器、等離子顯示器、有機EL、無機EL等。Further, the housing 14 integrated with the conductive film 32 described above can be used as an electromagnetic wave mask film of a display device and a driving device provided on a display panel of the display device in addition to the touch panel 20 of the electronic device 10. Use with electrodes. Examples of the display device include a liquid crystal display, a plasma display, an organic EL, an inorganic EL, and the like.

接下來，對導電性膜32的製造方法進行說明。Next, a method of manufacturing the conductive film 32 will be described.

首先，在第十三圖的步驟S11中，製作長條的感光材料100。如第十四圖(A)所示，感光材料100具有：撓性基板36；感光性鹵化銀乳劑層（下面，稱為第1感光層102a），其形成於該撓性基板36的一個主面（例如正面36a）；以及感光性鹵化銀乳劑層（下面，稱為第2感光層102b），其形成於撓性基板36的另一個主面（例如背面36b）。First, in step S11 of the thirteenth diagram, a long photosensitive material 100 is produced. As shown in FIG. 14(A), the photosensitive material 100 has a flexible substrate 36 and a photosensitive silver halide emulsion layer (hereinafter referred to as a first photosensitive layer 102a) formed on one main surface of the flexible substrate 36. A surface (for example, the front surface 36a) and a photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 102b) are formed on the other main surface of the flexible substrate 36 (for example, the back surface 36b).

在第十三圖的步驟S12中，對感光材料100進行曝光。在該曝光處理中，進行第1曝光處理和第2曝光處理，在第1曝光處理中，對第1感光層102a朝向撓性基板36照射光而使第1感光層102a沿著第1曝光圖案曝光，在第2曝光處理中，對第2感光層102b朝向撓性基板36照射光而使第2感光層102b沿著第2曝光圖案曝光（兩面同時曝光）。在第十四圖(B)的例子中，一邊將長條的感光材料100向一個方向搬送，一邊隔著第1光掩模106a向第1感光層102a照射第1光104a（平行光），並且隔著第2光掩模106b向第2感光層102b照射第2光104b（平行光）。第1光104a是利用中途的第1准直透鏡110a將從第1光源108a射出的光變換成平行光而得到的，第2光104b是利用中途的第2准直透鏡110b將從第2光源108b射出的光變換成平行光而得到的。在第十四圖(B)的例子中，示出了使用二個光源（第1光源108a和第2光源108b）的情況，但也可以藉助光學系統將從一個光源射出的光分割，並作為第1光104a和第2光104b照射向第1感光層102a和第2感光層102b。In step S12 of the thirteenth diagram, the photosensitive material 100 is exposed. In the exposure processing, the first exposure processing and the second exposure processing are performed, and in the first exposure processing, the first photosensitive layer 102a is irradiated with light toward the flexible substrate 36, and the first photosensitive layer 102a is placed along the first exposure pattern. In the second exposure process, the second photosensitive layer 102b is irradiated with light toward the flexible substrate 36, and the second photosensitive layer 102b is exposed along the second exposure pattern (both surfaces are simultaneously exposed). In the example of the fourteenth image (B), the first photosensitive material 100 is irradiated in one direction, and the first light 104a (parallel light) is irradiated to the first photosensitive layer 102a via the first photomask 106a. Further, the second light 104b (parallel light) is irradiated to the second photosensitive layer 102b via the second photomask 106b. The first light 104a is obtained by converting the light emitted from the first light source 108a into parallel light by the first collimator lens 110a in the middle, and the second light 104b is the second light source from the second light source using the second collimator lens 110b in the middle. The light emitted from 108b is converted into parallel light. In the example of the fourteenth diagram (B), the case where two light sources (the first light source 108a and the second light source 108b) are used is shown, but the light emitted from one light source may be divided by the optical system and used as The first light 104a and the second light 104b are irradiated to the first photosensitive layer 102a and the second photosensitive layer 102b.

然後，在第十三圖的步驟S13中，對曝光後的感光材料100進行顯影處理，由此例如如第四圖所示地製作出導電性膜32。導電性膜32具有：撓性基板36；在該撓性基板36的正面36a形成的沿著第1曝光圖案的第1感應電極38A等；以及在撓性基板36的背面36b形成的沿著第2曝光圖案的第2感應電極38B等。Then, in step S13 of the thirteenth diagram, the exposed photosensitive material 100 is subjected to development processing, whereby the conductive film 32 is produced, for example, as shown in the fourth figure. The conductive film 32 has a flexible substrate 36, a first sensing electrode 38A along the first exposure pattern formed on the front surface 36a of the flexible substrate 36, and the like, and a step along the back surface 36b of the flexible substrate 36. 2 The second sensing electrode 38B of the exposure pattern or the like.

並且，如第十四圖(B)所示，本實施方式的製造方法中，在第1曝光處理中，在第1感光層102a上例如緊貼配置第1光掩模106a，從與該第1光掩模106a對置配置的第1光源108a朝向第1光掩模106a照射第1光104a，由此對第1感光層102a進行曝光。如第十五圖所示，第1光掩模106a是利用由透明的鹼性玻璃形成的玻璃基板和在該玻璃基板上形成的掩模圖案（第1曝光圖案112a）構成。因此，通過該第1曝光處理，第1感光層102a中沿著形成於第1光掩模106a的第1曝光圖案112a的部分被曝光。也可以在第1感光層102a和第1光掩模106a之間設置大約2～10μm的間隙。In the manufacturing method of the present embodiment, as shown in FIG. 14(B), in the first exposure processing, for example, the first photomask 106a is placed in close contact with the first photosensitive layer 102a. The first light source 108a, which is disposed opposite to the photomask 106a, is irradiated with the first light 104a toward the first photomask 106a, thereby exposing the first photosensitive layer 102a. As shown in the fifteenth diagram, the first photomask 106a is composed of a glass substrate formed of transparent alkali glass and a mask pattern (first exposure pattern 112a) formed on the glass substrate. Therefore, in the first exposure process, a portion of the first photosensitive layer 102a along the first exposure pattern 112a formed on the first photomask 106a is exposed. A gap of about 2 to 10 μm may be provided between the first photosensitive layer 102a and the first photomask 106a.

同樣地，如第十四圖(B)所示，在第2曝光處理中，在第2感光層102b上例如緊貼配置第2光掩模106b，從與該第2光掩模106b對置配置的第2光源108b朝向第2光掩模106b照射第2光104b，由此對第2感光層102b進行曝光。如第十五圖所示，第2光掩模106b與第1光掩模106a一樣，是利用由透明的鹼性玻璃形成的玻璃基板和在該玻璃基板上形成的掩模圖案（第2曝光圖案112b）構成的。因此，通過該第2曝光處理，第2感光層102b中沿著形成於第2光掩模106b的第2曝光圖案112b的部分被曝光。在該情況下，也可以在第2感光層102b和第2光掩模106b之間設置大約2～10μm的間隙。Similarly, as shown in FIG. 14(B), in the second exposure processing, for example, the second photomask 106b is placed in close contact with the second photosensitive layer 102b, and is opposed to the second photomask 106b. The second light source 108b disposed is irradiated with the second light 104b toward the second photomask 106b, thereby exposing the second photosensitive layer 102b. As shown in the fifteenth figure, the second photomask 106b is a glass substrate formed of transparent alkali glass and a mask pattern formed on the glass substrate (second exposure) like the first photomask 106a. The pattern 112b) is constructed. Therefore, in the second exposure processing, a portion of the second photosensitive layer 102b along the second exposure pattern 112b formed on the second photomask 106b is exposed. In this case, a gap of about 2 to 10 μm may be provided between the second photosensitive layer 102b and the second photomask 106b.

在第1曝光處理和第2曝光處理中，來自第1光源108a的第1光104a的射出時機和來自第2光源108b的第2光104b的射出時機可以相同，也可以不同。若相同的話，能夠通過一次曝光處理同時對第1感光層102a和第2感光層102b進行曝光，能夠實現處理時間的短縮化。In the first exposure processing and the second exposure processing, the timing of emitting the first light 104a from the first light source 108a and the timing of emitting the second light 104b from the second light source 108b may be the same or different. If it is the same, the first photosensitive layer 102a and the second photosensitive layer 102b can be simultaneously exposed by one exposure process, and the processing time can be shortened.

不過，在第1感光層102a和第2感光層102b都沒有分光敏化的情況下，若從兩側對感光材料100進行曝光，則來自單側的曝光會對另一側（背側）的圖像形成造成影響。However, in the case where the first photosensitive layer 102a and the second photosensitive layer 102b are not separately photosensitized, if the photosensitive material 100 is exposed from both sides, the exposure from one side will be on the other side (back side). Image formation has an impact.

即，到達第1感光層102a的來自第1光源108a的第1光104a由於第1感光層102a中的鹵化銀粒子而散射，作為散射光透過撓性基板36，其一部分到達第2感光層102b。這樣的話，第2感光層102b與撓性基板36的邊界部分在較大範圍被曝光，形成潛影。因此，在第2感光層102b中，進行了基於來自第2光源108b的第2光104b的曝光和基於來自第1光源108a的第1光104a的曝光，在通過之後的顯影處理而形成了導電性膜32的情況下，在基於第2曝光圖案112b形成的導電圖案（第2感應電極38B等）的基礎上，會在該第2感應電極38B之間形成基於來自第1光源108a的第1光104a形成的薄的導電層，從而無法得到期望的圖案（沿著第2曝光圖案112b的圖案）。這在第1感光層102a中也是同樣的。In other words, the first light 104a from the first light source 108a that has reached the first photosensitive layer 102a is scattered by the silver halide particles in the first photosensitive layer 102a, and the scattered light passes through the flexible substrate 36, and a part thereof reaches the second photosensitive layer 102b. . In this case, the boundary portion between the second photosensitive layer 102b and the flexible substrate 36 is exposed to a large extent to form a latent image. Therefore, in the second photosensitive layer 102b, exposure by the second light 104b from the second light source 108b and exposure by the first light 104a from the first light source 108a are performed, and conductivity is formed by the subsequent development processing. In the case of the conductive film 32, in addition to the conductive pattern (the second sensing electrode 38B or the like) formed by the second exposure pattern 112b, the first light source 108a is formed between the second sensing electrodes 38B. The thin conductive layer formed by the light 104a cannot obtain a desired pattern (a pattern along the second exposure pattern 112b). This is also the same in the first photosensitive layer 102a.

為了避免該情況，通過將第1感光層102a和第2感光層102b的厚度設定在特定的範圍，或規定第1感光層102a和第2感光層102b的銀塗布量，從而鹵化銀自身吸收光，能夠限制光向背面透過。在本實施方式中，能夠將第1感光層102a和第2感光層102b的厚度設定在1μm以上且4μm以下。上限值優選為2.5μm。並且，優選第1感光層102a和第2感光層102b的銀塗布量為5～20g/m2 。In order to avoid this, by setting the thicknesses of the first photosensitive layer 102a and the second photosensitive layer 102b to a specific range, or by specifying the amount of silver coating of the first photosensitive layer 102a and the second photosensitive layer 102b, the silver halide itself absorbs light. Can limit the transmission of light to the back. In the present embodiment, the thickness of the first photosensitive layer 102a and the second photosensitive layer 102b can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Further, it is preferable that the amount of silver applied to the first photosensitive layer 102a and the second photosensitive layer 102b is 5 to 20 g/m 2 .

這樣，在使用了上述的兩面同時曝光的製造方法中，能夠得到兼顧了導電性和兩面曝光的適當性的第1感光層102a和第2感光層102b，並且，通過對1個撓性基板36的曝光處理，能夠在撓性基板36的兩面上任意地形成相同的圖案或不同的圖案，由此，能夠容易地形成觸控面板20的導電性膜32，而且能夠實現導電性膜32的薄型化（低高度化）As described above, in the above-described two-sided simultaneous exposure manufacturing method, the first photosensitive layer 102a and the second photosensitive layer 102b which are compatible with the conductivity and the both-side exposure can be obtained, and the one flexible substrate 36 can be obtained. In the exposure process, the same pattern or a different pattern can be arbitrarily formed on both surfaces of the flexible substrate 36, whereby the conductive film 32 of the touch panel 20 can be easily formed, and the thin film of the conductive film 32 can be realized. (lower height)

作為其他例子，特別以第1撓性基板36A為主體簡單地對製造第十二圖所示的粘合類型的導電性膜32的方法進行說明。對於第2撓性基板36B也同樣。As another example, a method of manufacturing the adhesion type conductive film 32 shown in Fig. 12 will be briefly described, specifically, from the first flexible substrate 36A. The same applies to the second flexible substrate 36B.

首先，對在第1撓性基板36A的正面具有含有感光性鹵化銀鹽的乳劑層的感光材料進行曝光，實施顯影處理，從而在第1撓性基板36A的正面形成多個第1感應電極38A和多個第1端子配線部42A。First, a photosensitive material having an emulsion layer containing a photosensitive silver halide salt on the front surface of the first flexible substrate 36A is exposed, and development processing is performed to form a plurality of first sensing electrodes 38A on the front surface of the first flexible substrate 36A. And a plurality of first terminal wiring portions 42A.

或者，也可以使用鍍敷前處理材料在第1撓性基板36A的正面形成感光性被鍍敷層，之後，在曝光、顯影處理之後實施鍍敷處理，從而在第1撓性基板36A的正面形成多個第1感應電極38A和多個第1端子配線部42A。Alternatively, a photosensitive plating layer may be formed on the front surface of the first flexible substrate 36A by using a plating pretreatment material, and then a plating treatment may be performed after exposure and development processing to form a front surface of the first flexible substrate 36A. A plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A are formed.

作為使用鍍敷前處理材料的方法的進一步優選的方式，能夠列舉如下二種方式。另外，下述的更具體的內容在日本特開2003-213437號公報、日本特開2006-64923號公報、日本特開2006-58797號公報、日本特開2006-135271號公報等中公開。As a further preferable aspect of the method of using a pre-plating material, the following two methods are mentioned. In addition, the following is disclosed in JP-A-2003-213437, JP-A-2006-64923, JP-A-2006-58797, JP-A-2006-135271, and the like.

方式（a）：在第1撓性基板36A上塗布含有鍍敷催化劑或與其前驅體相互作用的官能團的被鍍敷層，之後，在曝光和顯影之後進行鍍敷處理而在被鍍敷材料上形成金屬部。(a): a plated layer containing a plating catalyst or a functional group that interacts with a precursor thereof is applied onto the first flexible substrate 36A, and then subjected to a plating treatment after exposure and development to be applied to the material to be plated. A metal portion is formed.

方式（b）：在第1撓性基板36A上依次層疊含有聚合物和金屬氧化物的基底層、以及含有鍍敷催化劑或與其前驅體相互作用的官能團的被鍍敷層，之後，在曝光和顯影之後進行鍍敷處理而在被鍍敷材料上形成金屬部。(b): a base layer containing a polymer and a metal oxide, and a plated layer containing a plating catalyst or a functional group that interacts with the precursor thereof are sequentially laminated on the first flexible substrate 36A, and then exposed and exposed After the development, a plating treatment is performed to form a metal portion on the material to be plated.

作為其他方法，也可以對在第1撓性基板36A上形成的金屬箔上的光致抗蝕膜進行曝光，進行顯影處理而形成抗蝕圖案，對從抗蝕圖案中露出的金屬箔進行蝕刻，從而在第1撓性基板36A的正面形成多個第1感應電極38A和多個第1端子配線部42A。As another method, the photoresist film on the metal foil formed on the first flexible substrate 36A may be exposed to a development process to form a resist pattern, and the metal foil exposed from the resist pattern may be etched. A plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A are formed on the front surface of the first flexible substrate 36A.

或者，也可以在第1撓性基板36A上印刷含有金屬粒子的糊漿（paste），在糊漿上進行金屬鍍敷，從而在第1撓性基板36A的正面形成多個第1感應電極38A和多個第1端子配線部42A。Alternatively, a paste containing metal particles may be printed on the first flexible substrate 36A, and metal plating may be performed on the paste to form a plurality of first sensing electrodes 38A on the front surface of the first flexible substrate 36A. And a plurality of first terminal wiring portions 42A.

或者，也可以在第1撓性基板36A的正面，通過網版印刷版或凹版印刷版來印刷形成多個第1感應電極38A和多個第1端子配線部42A。Alternatively, a plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A may be printed on the front surface of the first flexible substrate 36A by a screen printing plate or a gravure printing plate.

或者，也可以在第1撓性基板36A的正面，通過噴墨來形成多個第1感應電極38A和多個第1端子配線部42A。Alternatively, a plurality of first sensing electrodes 38A and a plurality of first terminal wiring portions 42A may be formed by inkjet on the front surface of the first flexible substrate 36A.

接下來，對於本實施方式的導電性膜32，以作為特別優選的方式的使用鹵化銀照相感光材料的方法為中心進行記述。這對於粘合類型的導電性膜32也是同樣的。Next, the conductive film 32 of the present embodiment is described centering on a method of using a silver halide photographic light-sensitive material as a particularly preferable embodiment. This is also the same for the adhesive type conductive film 32.

本實施方式的導電性膜32的製造方法根據感光材料和顯影處理的方式而包括如下3種方式。The method for producing the conductive film 32 of the present embodiment includes the following three methods depending on the method of the photosensitive material and the development processing.

方式（1）：對不含有物理顯影核的感光性鹵化銀黑白感光材料進行化學顯影或熱顯影，從而在該感光材料上形成金屬銀部。Mode (1): Chemically developing or thermally developing a photosensitive silver halide black-and-white photosensitive material not containing a physical developing core to form a metallic silver portion on the photosensitive material.

方式（2）：對在鹵化銀乳劑層中含有物理顯影核的感光性鹵化銀黑白感光材料進行溶解物理顯影，從而在該感光材料上形成金屬銀部。Mode (2): Dissolving physical development of a photosensitive silver halide black-and-white photosensitive material containing a physical development core in a silver halide emulsion layer to form a metallic silver portion on the photosensitive material.

方式（3）：使不含有物理顯影核的感光性鹵化銀黑白感光材料、與具有含有物理顯影核的非感光性層的顯影片重合並進行擴散轉印顯影，從而在非感光性顯影片上形成金屬銀部。(3): a photosensitive silver halide black-and-white photosensitive material not containing a physical development core, and a developing sheet having a non-photosensitive layer containing a physical development core are combined and subjected to diffusion transfer development to be on a non-photosensitive developing sheet Forming a metal silver part.

上述方式（1）是一體型黑白顯影類型，在感光材料上形成有光透射性導電性膜等透光性導電性膜。得到的顯影銀是化學顯影銀或熱顯影銀，是高比表面積的纖絲（Filament），因此在後續的鍍敷或物理顯影過程中活性高。The above aspect (1) is an integrated type of black and white development, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or thermally developed silver, which is a high specific surface area fibrate, and thus has high activity in subsequent plating or physical development.

上述方式（2）是在曝光部，使物理顯影核附近的鹵化銀粒子溶解並沉積在顯影核上，從而在感光材料上形成光透射性導電性膜等透光性導電性膜。這也是一體型黑白顯影類型。顯影作用由於是在物理顯影核上的析出，所以是高活性的，但顯影銀為比表面積小的球形。In the above aspect (2), in the exposure portion, silver halide particles in the vicinity of the physical development nucleus are dissolved and deposited on the developing nucleus to form a light-transmitting conductive film such as a light-transmitting conductive film on the photosensitive material. This is also an integrated black and white development type. The developing action is highly active because it is precipitated on the physical developing core, but the developing silver has a spherical shape with a small specific surface area.

上述方式（3）是在未曝光部使鹵化銀粒子溶解、擴散並沉積在顯影片上的顯影核上，從而在顯影片上形成光透射性導電性膜等透光性導電性膜。是所謂的獨立類型，是將顯影片從感光材料剝離來使用的方式。In the above-described aspect (3), the silver halide particles are dissolved, diffused, and deposited on the developing core on the developing sheet in the unexposed portion, whereby a light-transmitting conductive film such as a light-transmitting conductive film is formed on the developing sheet. It is a so-called independent type and is a method of peeling off a developing film from a photosensitive material.

任意一種方式都能夠選擇負片型顯影處理和反轉顯影處理中的任何一種顯影（擴散轉印方式的情況下，能夠使用直接陽圖感光（autopositive）型感光材料作為感光材料進行負片型顯影處理）。Any one of the negative development processing and the reverse development processing can be selected in any of the modes (in the case of the diffusion transfer method, a direct positive photosensitive material can be used as a photosensitive material for negative development processing) .

這裡所說的化學顯影、熱顯影、溶解物理顯影和擴散轉印顯影是在本領域通常使用的用語的意思，在照相化學的一般教科書、例如菊地真一著“寫真化學”（共立出版社、1955年刊行）、C.E.K.Mees編“The Theory of Photographic Processes、4thed. ”（Mcmillan社、1977年刊行）中進行了解說。本案是液處理相關的發明，但作為其他顯影方式而應用熱顯影方式的技術也可以作為參考。例如，能夠應用在日本特開2004-184693號、日本特開2004-334077號、日本特開2005-010752號的各公報、以及日本特願2004-244080號、日本特願2004-085655號的各說明書中記載的技術。The chemical development, thermal development, dissolved physical development, and diffusion transfer development referred to herein are the meanings commonly used in the art, and in general textbooks of photographic chemistry, such as Kikuchi, "Photo Chemistry" (Kyoritsu Press, 1955) The annual issue, CEK Mees, "The Theory of Photographic Processes, 4thed." (Mcmillan, 1977). This case is an invention related to liquid processing, but a technique of applying a thermal development method as another development method can also be referred to. For example, each of the publications of JP-A-2004-184693, JP-A-2004-334077, JP-A-2005-010752, and JP-A-2004-244080, and JP-A-2004-085655 The technology described in the manual.

這裡，下面對本實施方式的導電性膜32的各層的結構進行詳細說明。這對於粘合類型的導電性膜32也是同樣的。Here, the structure of each layer of the conductive film 32 of the present embodiment will be described in detail below. This is also the same for the adhesive type conductive film 32.

［撓性基板36］[Flexible Substrate 36]

作為撓性基板36，例如能夠任意選擇作為光碟的基板材料使用的各種材料來使用。具體地說，能夠列舉聚碳酸酯、聚甲基丙烯酸甲酯等丙烯酸樹脂；聚氯乙烯、氯乙烯共聚物等氯乙烯系樹脂；環氧樹脂；非晶聚烯烴；聚酯；COC（環烯烴共聚物）；COP（環烯烴聚合物）等，也可以根據期望來將它們並用。在這些材料中，從耐濕性、尺寸穩定性和低價格等方面出發，優選非晶聚烯烴、聚碳酸酯等熱塑性樹脂。並且，例如在通過嵌件成型來製作撓性基板36的情況下，優選聚碳酸酯、COC、COP等，在它們之中，特別優選有利於薄壁形成的流動性高的聚碳酸酯。As the flexible substrate 36, for example, various materials used as a substrate material of the optical disk can be arbitrarily selected and used. Specific examples thereof include acrylic resins such as polycarbonate and polymethyl methacrylate; vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymer; epoxy resins; amorphous polyolefins; polyesters; and COCs (cycloolefins). Copolymer); COP (cycloolefin polymer), etc., may also be used in combination as desired. Among these materials, thermoplastic resins such as amorphous polyolefin and polycarbonate are preferred from the viewpoints of moisture resistance, dimensional stability, and low cost. Further, for example, in the case of producing the flexible substrate 36 by insert molding, polycarbonate, COC, COP or the like is preferable, and among them, a polycarbonate having high fluidity which is advantageous for thin wall formation is particularly preferable.

［銀鹽乳劑層］[Silver Salt Emulsion Layer]

成為導電性膜32的金屬細線的銀鹽乳劑層除了銀鹽和粘合劑以外，還含有溶劑、染料等添加劑。The silver salt emulsion layer which becomes the metal thin wire of the conductive film 32 contains an additive, such as a solvent and a dye, in addition to a silver salt and a binder.

作為本實施方式中使用的銀鹽，能夠列舉有鹵化銀等無機銀鹽和乙酸銀等有機銀鹽。在本實施方式中，優選使用作為光感測器的特性優異的鹵化銀。The silver salt used in the present embodiment may, for example, be an inorganic silver salt such as silver halide or an organic silver salt such as silver acetate. In the present embodiment, it is preferable to use silver halide which is excellent in characteristics as a photosensor.

銀鹽乳劑層的銀塗布量（銀鹽的塗布量）換算成銀的話，優選為1～30g/m2 ，更優選為1～25g/m2 ，進一步優選為5～20g/m2 。通過使該銀塗布量處於上述範圍，能夠在成為了導電性膜32的情況下得到期望的表面電阻。The silver coating amount (coating amount of the silver salt) of the silver salt emulsion layer is preferably 1 to 30 g/m 2 , more preferably 1 to 25 g/m 2 , and still more preferably 5 to 20 g/m 2 in terms of silver. When the amount of silver coating is in the above range, a desired surface resistance can be obtained when the conductive film 32 is formed.

作為本實施方式中使用的粘合劑，例如能夠列舉明膠、聚乙烯醇（PVA）、聚乙烯吡咯烷酮（PVP）、澱粉等多糖類、纖維素及其誘導體、聚氧化乙烯、聚乙烯、殼聚糖、多聚賴氨酸、聚丙烯酸、聚海藻(polyalginic)酸、聚透明質(polyhyaluronic)酸和羧基纖維素等。這些粘合劑根據官能團的離子性而顯示出中性、陰離子性或陽離子性的性質。Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and its inducer, polyethylene oxide, polyethylene, and shell. Glycan, polylysine, polyacrylic acid, polyalginic acid, polyhyaluronic acid, and carboxyl cellulose. These binders exhibit neutral, anionic or cationic properties depending on the ionicity of the functional group.

本實施方式的銀鹽乳劑層中含有的粘合劑的含有量不特別限定，能夠在可獲得擴散性和緊貼性的範圍內適當確定。銀鹽乳劑層中的粘合劑的含有量優選為銀/粘合劑體積比在1/4以上，更優選為1/2以上。銀/粘合劑體積比優選為100/1以下，更優選為50/1以下。並且，銀/粘合劑體積比進一步優選為1/1～4/1。最優選為1/1～3/1。通過使銀鹽乳劑層中的銀/粘合劑體積比處於該範圍，即使在調節了銀塗布量的情況下也能夠抑制電阻值的變動，從而得到具有均一的表面電阻的導電性膜32。另外，銀/粘合劑體積比能夠通過將原料的鹵化銀量/粘合劑量（重量比）變換成銀量/粘合劑量（重量比），再將銀量/粘合劑量（重量比）變換成銀量/粘合劑量（體積比）來求得。The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range in which diffusibility and adhesion can be obtained. The content of the binder in the silver salt emulsion layer is preferably a silver/binder volume ratio of 1/4 or more, more preferably 1/2 or more. The silver/binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. Further, the silver/binder volume ratio is more preferably from 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. When the silver/binder volume ratio in the silver salt emulsion layer is in this range, even when the amount of silver coating is adjusted, the variation in the resistance value can be suppressed, and the conductive film 32 having a uniform surface resistance can be obtained. In addition, the silver/binder volume ratio can be converted into a silver amount/binder amount (weight ratio) by converting the amount of silver halide/binder (weight ratio) of the raw material, and then the amount of silver/binder (weight ratio) It is obtained by converting into a silver amount/binder amount (volume ratio).

＜溶劑＞<solvent>

對用於形成銀鹽乳劑層的溶劑不特別限定，例如能夠列舉水、有機溶劑（例如，甲醇等醇類、丙酮等酮類、甲醯胺等醯胺類、二甲基亞碸等亞碸類、乙酸乙酯等酯類、醚類等）、離子性液體、以及它們的混合溶劑。The solvent for forming the silver salt emulsion layer is not particularly limited, and examples thereof include water and an organic solvent (for example, an alcohol such as methanol, a ketone such as acetone, a guanamine such as formamide, or an amidene such as dimethyl hydrazine. An ester such as ethyl acetate or the like, an ether or the like, an ionic liquid, and a mixed solvent thereof.

＜其他添加劑＞<Other additives>

關於本實施方式中使用的各種添加劑，沒有特別限制，可以優選使用公知的添加劑。The various additives used in the present embodiment are not particularly limited, and known additives can be preferably used.

［其他的層結構］[other layer structure]

也可以在銀鹽乳劑層之上設置未圖示的保護層。並且，還能夠在銀鹽乳劑層之下設置例如下塗層。A protective layer (not shown) may be provided on the silver salt emulsion layer. Further, it is also possible to provide, for example, an undercoat layer under the silver salt emulsion layer.

接下來，對導電性膜32的製作方法的各工序進行說明。Next, each step of the method of producing the conductive film 32 will be described.

［曝光］[exposure]

在本實施方式中，包括通過印刷方式來實施第1感應電極38A等的情況，但除了印刷方式以外，可以利用曝光和顯影等來形成第1感應電極38A等。即，對具有在撓性基板36上設置的銀鹽含有層的感光材料或塗裝了光刻用感光聚合物的感光材料進行曝光。曝光能夠使用電磁波進行。作為電磁波，例如能夠列舉可見光線、紫外線等光、X射線等放射線等。而且，在曝光中可以使用具有波長分佈的光源，也可以使用特定的波長的光源。In the present embodiment, the first induction electrode 38A or the like is implemented by a printing method. However, in addition to the printing method, the first sensing electrode 38A or the like can be formed by exposure, development, or the like. That is, the photosensitive material having the silver salt-containing layer provided on the flexible substrate 36 or the photosensitive material coated with the photopolymer for photolithography is exposed. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include visible light, ultraviolet light, and the like, and radiation such as X-ray. Further, a light source having a wavelength distribution may be used in the exposure, and a light source having a specific wavelength may be used.

［顯影處理］[development processing]

在本實施方式中，在對乳劑層進行了曝光之後再進行顯影處理。顯影處理能夠採用用於銀鹽照相膜、相紙、印刷製版用膜、光掩模用乳化掩模等的通常的顯影處理的技術。本發明的顯影處理能夠包括出於去除未曝光部分的銀鹽而使其穩定化的目的進行的定影處理。本發明的定影處理能夠採用銀鹽照相膜、相紙、印刷製版用膜、光掩模用乳化掩模等中使用的定影處理的技術。In the present embodiment, the development process is performed after the emulsion layer is exposed. The development processing can employ a technique for usual development processing such as a silver salt photographic film, a photographic paper, a film for printing plate, or an emulsion mask for a photomask. The development treatment of the present invention can include a fixing treatment for the purpose of stabilizing the silver salt of the unexposed portion. The fixing process of the present invention can employ a technique of fixing treatment used in a silver salt photographic film, a photographic paper, a film for printing plate, an emulsification mask for a photomask, or the like.

實施了顯影、定影處理的感光材料優選實施水洗處理或穩定化處理。The photosensitive material subjected to the development and fixing treatment is preferably subjected to a water washing treatment or a stabilization treatment.

顯影處理後的曝光部中包含的金屬部的品質相對於曝光前的曝光部中包含的金屬的品質的含有率以品質計優選為50%以上，進一步優選為80品質%以上。若曝光部中含有的金屬的品質相對於曝光前的曝光部中含有的金屬的品質以品質計為50%以上，則能夠得到高導電性，因此是優選的。The content of the metal portion contained in the exposed portion after the development treatment is preferably 50% or more, and more preferably 80% by mass or more, based on the quality of the metal contained in the exposed portion. When the quality of the metal contained in the exposed portion is 50% or more in terms of the quality of the metal contained in the exposed portion before the exposure, high conductivity can be obtained, which is preferable.

經過以上的工序得到了導電性膜32。對於顯影處理後的導電性膜32，還可以進一步進行砑光處理，通過砑光處理能夠將各透明導電層的表面電阻調節為期望的表面電阻（0.1～100歐姆/sq.的範圍）。Through the above steps, the conductive film 32 was obtained. Further, the conductive film 32 after the development treatment may be further subjected to a calender treatment, and the surface resistance of each of the transparent conductive layers can be adjusted to a desired surface resistance (a range of 0.1 to 100 ohms/sq.) by calendering.

［物理顯影和鍍敷處理］[Physical development and plating treatment]

在本實施方式中，出於提高通過所述曝光和顯影處理形成的金屬部的導電性的目的，可以進行用於使導電性金屬粒子保持在所述金屬部的物理顯影和/或鍍敷處理。在本發明中，可以只利用物理顯影和鍍敷處理中的任一種使導電性金屬粒子保持於金屬銀部，也可以組合物理顯影和鍍敷處理來使導電性金屬粒子保持於金屬部。另外，包括在金屬部實施了物理顯影和/或鍍敷處理而成的結構在內，稱為“導電性金屬部”。In the present embodiment, for the purpose of improving the conductivity of the metal portion formed by the exposure and development processing, physical development and/or plating treatment for holding the conductive metal particles in the metal portion may be performed. . In the present invention, the conductive metal particles may be held in the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles may be held in the metal portion by a combination of physical development and plating treatment. Further, it is referred to as a "conductive metal portion" including a structure in which a metal portion is subjected to physical development and/or plating treatment.

本實施方式的“物理顯影”是指在金屬或金屬化合物的核上利用還原劑還原銀離子等金屬離子而使金屬粒子析出。該物理現象在即顯B＆W膜、即顯幻燈膠片、印刷版製造等中所使用，本發明能夠使用該技術。並且，物理顯影可以與曝光後的顯影處理同時進行，也可以在顯影處理後另外進行。The "physical development" in the present embodiment means that metal ions such as silver ions are reduced by a reducing agent on a core of a metal or a metal compound to precipitate metal particles. This physical phenomenon is used in a B&W film, that is, a slide film, a printing plate manufacturing or the like, and the present invention can use this technique. Further, the physical development may be performed simultaneously with the development processing after the exposure, or may be performed separately after the development processing.

在本實施方式中，鍍敷處理能夠使用非電解鍍（化學還原鍍或置換鍍）、電解鍍、或非電解鍍和電解鍍雙方。本實施方式中的非電解鍍能夠使用公知的非電解鍍技術，例如能夠使用在印刷配線板等中使用的非電解鍍技術，非電解鍍優選為非電解鍍銅。In the present embodiment, the plating treatment can be performed by electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. The electroless plating in the present embodiment can use a known electroless plating technique. For example, an electroless plating technique used for a printed wiring board or the like can be used, and electroless plating is preferably electroless copper plating.

［氧化處理］[Oxidation treatment]

在本實施方式中，優選在顯影處理後的金屬部以及通過物理顯影和/或鍍敷處理形成的導電性金屬部實施氧化處理。通過進行氧化處理，例如在透光性部稍微沉積有金屬的情況下，能夠將該金屬去除，使透光性部的透過性為大致100%。In the present embodiment, it is preferable that the metal portion after the development treatment and the conductive metal portion formed by the physical development and/or the plating treatment are subjected to an oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light-transmitting portion, the metal can be removed, and the transmittance of the light-transmitting portion is approximately 100%.

［撓性基板等的厚度］[Thickness of flexible substrate, etc.]

本實施方式的導電性膜32的撓性基板36的厚度優選為5～350μm，進一步優選為30～150μm。若處於5～350μm的範圍，則能夠得到期望的可見光的透過率，而且處理也容易。The thickness of the flexible substrate 36 of the conductive film 32 of the present embodiment is preferably 5 to 350 μm, and more preferably 30 to 150 μm. When it is in the range of 5 to 350 μm, a desired transmittance of visible light can be obtained, and handling is also easy.

在撓性基板36上設置的金屬部（金屬細線等）的厚度能夠根據在撓性基板36上塗布的銀鹽含有層用塗料的塗布厚度適當確定。金屬部的厚度能夠從0.01～200μm中選擇，但優選為30μm以下，更優選為20μm以下，進一步優選為0.01～9μm，最優選為0.05～5μm。並且，金屬部優選為圖案狀。金屬部可以是一層，也可以是二層以上的重疊結構。The thickness of the metal portion (metal thin wire or the like) provided on the flexible substrate 36 can be appropriately determined according to the coating thickness of the coating material for the silver salt-containing layer applied on the flexible substrate 36. The thickness of the metal portion can be selected from 0.01 to 200 μm, but is preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. Further, the metal portion is preferably in the form of a pattern. The metal portion may be one layer or a superposed structure of two or more layers.

在本實施方式的導電性膜32的製造方法中，不必一定要進行鍍敷等工序。這是因為：在本實施方式的導電性膜32的製造方法中，通過對銀鹽乳劑層的銀塗布量、銀/粘合劑體積比進行調節，能夠得到期望的表面電阻。另外，也可以根據需要進行砑光處理等。並且，也可以在成為金屬細線之後，使該金屬細線至少包含金屬粒子和粘合劑。在該情況下，能夠使利用金屬細線構成的第1感應電極和第2感應電極以追隨撓性基板的三維形狀的方式變形，而幾乎不會引起金屬細線的斷線。In the method of manufacturing the conductive film 32 of the present embodiment, it is not necessary to perform a step such as plating. This is because, in the method for producing the conductive film 32 of the present embodiment, the desired surface resistance can be obtained by adjusting the silver coating amount and the silver/binder volume ratio of the silver salt emulsion layer. Further, calendering treatment or the like may be performed as needed. Further, after the metal thin wires are formed, the metal thin wires may contain at least metal particles and a binder. In this case, the first induction electrode and the second induction electrode which are formed of thin metal wires can be deformed so as to follow the three-dimensional shape of the flexible substrate, and the metal thin wires are hardly broken.

［顯影處理後的膜固化處理］[Film curing treatment after development treatment]

優選在對銀鹽乳劑層進行了顯影處理之後，浸漬於膜固化劑進行膜固化處理。作為膜固化劑，例如能夠列舉戊二醛、己二醛、2，3-二羥基-1，4-二惡烷等醛類和硼酸等日本特開平2-141279號公報中記載的膜固化劑。Preferably, after the silver salt emulsion layer is subjected to development treatment, it is immersed in a film curing agent to perform film curing treatment. Examples of the film curing agent include aldehydes such as glutaraldehyde, adipaldehyde, and 2,3-dihydroxy-1,4-dioxane, and film curing agents described in JP-A-2-141279. .

也可以對本實施方式的導電性膜32賦予反射防止層等功能層。A functional layer such as an antireflection layer may be provided to the conductive film 32 of the present embodiment.

［砑光處理］[砑光处理]

也可以對金屬部實施砑光處理來進行平滑化。由此金屬部的導電性顯著增大。砑光處理能夠利用砑光輥進行。砑光輥優選為由通常的一對輥構成的形態。It is also possible to perform smoothing on the metal portion by calendering. Thereby, the conductivity of the metal portion is remarkably increased. The calendering process can be carried out using a calender roll. The calender roll is preferably in the form of a pair of normal rolls.

作為在砑光處理中使用的輥，適宜使用環氧樹脂、聚醯亞胺、聚醯胺、聚醯亞胺醯胺等的塑膠輥或金屬輥。特別地，在兩面具有乳劑層的情況下，優選利用金屬輥進行處理。在單面具有乳劑層的情況下，從防止褶皺的角度出發，也能夠使金屬輥和塑膠輥組合。線壓力的上限值為1960N/cm（200kgf/cm，換算成面壓力為699.4kgf/cm2 ）以上，進一步優選為2940N/cm（300kgf/cm，換算成面壓力為935.8kgf/cm2 ）以上。線壓力的上限值為6880N/cm（700kgf/cm）以下。As the roll used in the calendering treatment, a plastic roll or a metal roll such as an epoxy resin, a polyimide, a polyamide or a polyamide. In particular, in the case where the emulsion layer is provided on both sides, it is preferably treated by a metal roll. In the case where the emulsion layer is provided on one side, the metal roll and the plastic roll can be combined from the viewpoint of preventing wrinkles. The upper limit of the line pressure is 1960 N/cm (200 kgf/cm, converted to a surface pressure of 699.4 kgf/cm 2 ) or more, and more preferably 2940 N/cm (300 kgf/cm, and the surface pressure is 935.8 kgf/cm 2 ). the above. The upper limit of the line pressure is 6880 N/cm (700 kgf/cm) or less.

利用砑光輥執行的平滑化處理的適用溫度優選為10℃（無溫度調控）～100℃，更優選的溫度因金屬網格圖案、金屬配線圖案的畫線密度和形狀、粘合劑種類而不同，但大約處於10℃（無溫度調控）～50℃的範圍。The applicable temperature of the smoothing treatment performed by the calender roll is preferably 10 ° C (without temperature regulation) to 100 ° C, and more preferably the temperature is due to the metal mesh pattern, the line density and shape of the metal wiring pattern, and the type of the adhesive. Different, but about 10 ° C (no temperature regulation) ~ 50 ° C range.

另外，本發明能夠與下面的表1和表2中記載的公開公報以及國際公開小冊子的技術適當組合來使用。省略“日本特開”、“號公報”、“號小冊子”等標記。Further, the present invention can be used in appropriate combination with the techniques disclosed in Tables 1 and 2 below and the technology of the international publication booklet. Marks such as "Japanese Special", "No. Bulletin", and "No. Booklet" are omitted.

表1 Table 1

表2 Table 2

＜實施例＞<Example>

將形成有金屬細線構成的網格圖案的導電性膜沿著觸控面板的殼體進行三維成型，結果可知，需要一邊加熱至250～300℃一邊進行成型，並且，根據位置的不同而產生了伸長倍率為1.3～1.4倍的部位。The conductive film in which the mesh pattern of the metal thin wires was formed was three-dimensionally formed along the casing of the touch panel. As a result, it was found that it was molded while being heated to 250 to 300 ° C, and it was generated depending on the position. The elongation ratio is 1.3 to 1.4 times.

因此，對於試樣1～9，通過實驗確認了導電性膜的辨識性（金屬細線的辨識難易度）、和針對三維成型時的伸長率的金屬細線的斷線極限，特別地確認了伸長倍率為1.3～1.4倍時的最佳的金屬細線的線寬。Therefore, in the samples 1 to 9, the visibility of the conductive film (the ease of identification of the fine metal wires) and the breaking limit of the fine metal wires for the elongation at the time of three-dimensional molding were confirmed by experiments, and the elongation ratio was specifically confirmed. The line width of the optimum metal thin wire at 1.3 to 1.4 times.

［試樣1］[Sample 1]

（鹵化銀感光材料）(silver halide photosensitive material)

調製出相對于水介質中的Ag150g含有明膠10.0g的、含有球形當量直徑平均為0.1μm的碘溴化銀粒子（I＝0.2摩爾%、Br＝40摩爾%）的乳劑。An emulsion containing 10.0 g of gelatin in an aqueous medium containing silver iodobromide particles having an average spherical equivalent diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared.

並且，在該乳劑中添加K3 Rh2 Br9 和K2 IrCl6 以使濃度為10-7 （摩爾/摩爾銀），在溴化銀粒子中摻入Rh離子和Ir離子。在該乳劑中添加Na2 PdCl4 ，並使用氯金酸和硫代硫酸鈉進行金-硫敏化之後，以銀的塗布量為10g/m2 的方式與明膠膜固化劑（硬膜劑）一起塗布到透明基體（這裡，均為聚對苯二甲酸乙二酯（PET））上。這時，Ag/明膠體積比為2/1。Further, K 3 Rh 2 Br 9 and K 2 IrCl 6 were added to the emulsion to have a concentration of 10 -7 (mol/mol of silver), and Rh ions and Ir ions were doped into the silver bromide particles. After adding Na 2 PdCl 4 to the emulsion and performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, the coating amount of silver was 10 g/m 2 and the gelatin film curing agent (hard film agent). They were applied together to a transparent substrate (here, both of polyethylene terephthalate (PET)). At this time, the Ag/gelatin volume ratio was 2/1.

在寬度為30cm的透明基體以25cm的寬度塗布20m，以留下塗布的中央部24cm的方式將兩端各切掉3cm而得到卷狀的鹵化銀感光材料。A transparent substrate having a width of 30 cm was coated with a width of 25 cm for 20 m, and both ends were cut by 3 cm so as to leave the center portion of the coating at 24 cm to obtain a rolled silver halide photosensitive material.

（曝光）(exposure)

曝光的圖案為網格圖案，在A4尺寸（210mm×297mm）的鹵化銀感光材料上進行。曝光是隔著上述網格圖案的光掩模使用以高壓水銀燈為光源的平行光進行曝光。The exposed pattern was a grid pattern on an A4 size (210 mm x 297 mm) silver halide photographic material. The exposure is performed by using a photomask having the above-described grid pattern and using parallel light using a high pressure mercury lamp as a light source.

（顯影處理）(development processing)

・顯影液1L配方・Developing solution 1L formula

對苯二酚　　　　　　　　　　　　20　gHydroquinone 20 g

亞硫酸鈉　　　　　　　　　　　　50　gSodium sulfite 50 g

碳酸鉀　　　　　　　　　　　　　40　gPotassium carbonate 40 g

乙二胺・四乙酸　　　　　　　　　 2　gEthylenediamine, tetraacetic acid 2 g

溴化鉀　　　　　　　　　　　　　 3　gPotassium bromide 3 g

聚乙二醇2000　　　　　　　　　   1　gPolyethylene glycol 2000 1 g

氫氧化鉀　　　　　　　　　　　　 4　gPotassium hydroxide 4 g

pH　　　　　　　　　　　  調節為10.3pH adjustment to 10.3

・定影液1L配方・Fixing solution 1L formula

硫代硫酸銨液（75%）　　　　　　300　mlAmmonium thiosulfate solution (75%) 300 ml

一水亞硫酸銨鹽　　　　　　　　　 25　gAmmonium sulphate monohydrate 25 g

1、3-二氨基丙烷・四乙酸　　　　    8　g1, 3-diaminopropane, tetraacetic acid 8 g

乙酸　　　　　　　　　　　　　　  5　gAcetic acid 5 g

氨水（27%）　　　　　　　　　　  1　gAmmonia (27%) 1 g

pH　　　　　　　　　　　   調節為6.2pH adjustment to 6.2

對使用上述處理劑曝光完的感光材料，使用富士膠片社製自動顯影機FG-710PTS在處理條件：顯影35℃30秒、定影34℃23秒、流水沖洗（5L/分）下進行20秒處理。For the photosensitive material exposed by the above-mentioned treating agent, an automatic developing machine FG-710PTS manufactured by Fujifilm Co., Ltd. was used for processing for 20 seconds under the conditions of development: development at 35 ° C for 30 seconds, fixing at 34 ° C for 23 seconds, and running water rinse (5 L / minute). .

如上述那樣進行曝光和顯影處理，製作出金屬細線的線寬為1μm、單元的一邊的長度為240μm的試樣1的導電性膜。這裡，金屬細線的線寬是這樣測量出的：使用數位顯微鏡［株式會社キーエンス製、VHX-200（VHX：註冊商標）、倍率3000倍］，在透過模式下對傳感器區域的指定的10個部位的線寬進行觀察並算出平均值。The exposure and development treatments were carried out as described above, and a conductive film of the sample 1 having a metal thin wire having a line width of 1 μm and a length of one side of the unit of 240 μm was produced. Here, the line width of the thin metal wire is measured by using a digital microscope [manufactured by キーエンス, VHX-200 (VHX: registered trademark), magnification 3000 times], and 10 parts of the sensor area are specified in the transmission mode. The line width was observed and the average value was calculated.

［試樣2～9］[Sample 2 to 9]

試樣2～9除了金屬細線的線寬為2μm、3μm、4μm、5μm、7μm、10μm、15μm和30μm以外，與試樣1同樣地製作試樣2～9的導電性膜。In the samples 2 to 9, the conductive films of the samples 2 to 9 were produced in the same manner as in the sample 1 except that the line width of the fine metal wires was 2 μm, 3 μm, 4 μm, 5 μm, 7 μm, 10 μm, 15 μm, and 30 μm.

＜辨識性的評價＞<Identification evaluation>

對於試樣1～9，分別將導電性膜貼附在顯示裝置的顯示面板上，在驅動顯示裝置顯示白色時，用肉眼確認有無粗線或黑斑點、以及電極圖案（網格圖案）是否顯眼。In the samples 1 to 9, the conductive film was attached to the display panel of the display device, and when the display device was driven to display white, it was visually confirmed whether or not there were thick lines or black spots, and whether the electrode pattern (mesh pattern) was conspicuous. .

並且，將粗線或黑斑點、以及導電圖案的邊界不顯眼的情況作為“A”，將粗線、黑斑點和導電圖案的邊界中任一個顯眼的情況作為“B”，將粗線、黑斑點和導電圖案的邊界中的任二個顯眼的情況作為“C”，將粗線、黑斑點和導電圖案的邊界都顯眼的情況作為“D”，將粗線、黑斑點和導電圖案的邊界都明顯地顯眼的情況作為“E”。“D”、“E”是使用上存在問題的級別。Further, a case where a thick line or a black spot and a boundary of a conductive pattern are inconspicuous is referred to as "A", and a case where a boundary between a thick line, a black spot, and a conductive pattern is conspicuous is referred to as "B", and a thick line or a black line is used. Any two conspicuous cases of the boundary between the spot and the conductive pattern are referred to as "C", and the boundary of the thick line, the black spot, and the conductive pattern is conspicuous as "D", and the boundary of the thick line, the black spot, and the conductive pattern is set. Both are clearly conspicuous as "E". "D", "E" are the levels at which problems exist.

＜斷線極限的評價＞<Evaluation of the disconnection limit>

在該斷線極限的評價中，例如如第十六圖所示，使用了具有基座120、和固定於該基座120的柱狀的樑122的實驗裝置124。樑122具有上表面的曲率半徑為4mm的彎曲形狀。In the evaluation of the disconnection limit, for example, as shown in Fig. 16, an experimental device 124 having a susceptor 120 and a columnar beam 122 fixed to the susceptor 120 is used. The beam 122 has a curved shape with an upper surface having a radius of curvature of 4 mm.

並且，將長條的試樣1～9分別掛在樑122上，將氣氛溫度設定在250～300℃（試樣撓性膜的溫度為150～200℃），對試樣1～9的兩個端部126a和126b施加負荷，確認伸長倍率為×1.3、×1.4時的斷線率。Further, the long samples 1 to 9 were hung on the beam 122, and the atmosphere temperature was set at 250 to 300 ° C (the temperature of the sample flexible film was 150 to 200 ° C), and the two samples 1 to 9 were used. Loads were applied to the end portions 126a and 126b, and the breaking ratio at the time of the stretching ratio of ×1.3 and ×1.4 was confirmed.

斷線率是在設樑的上表面上存在的網格圖案的單元的邊的數量為m條、斷線的邊的數量為n條時，計算（m/n）×100（%）而求得的。並且，將斷線率不足1%評價為“A”，將1%以上且不足3%評價為“B”，將3%以上且不足5%評價為“C”，將5%以上且不足7%評價為“D”，將7%以上評價為“E”。“D”、“E”是使用上存在問題的級別。The line breakage rate is obtained by calculating (m/n) × 100 (%) when the number of sides of the cell pattern of the mesh pattern existing on the upper surface of the beam is m and the number of sides of the broken line is n. Got it. In addition, the disconnection rate is less than 1%, and it is evaluated as "A", 1% or more and less than 3% is evaluated as "B", and 3% or more and less than 5% is evaluated as "C", and 5% or more and less than 7 % was evaluated as "D", and 7% or more was evaluated as "E". "D", "E" are the levels at which problems exist.

＜評價結果＞<evaluation result>

下面的表3中示出評價結果。The evaluation results are shown in Table 3 below.

表3<TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> 試樣 </td><td> 線寬（μm） </td><td> 辨識性 </td><td> 斷線極限（伸長倍率） </td></tr><tr><td> ×1.3 </td><td> ×1.4 </td></tr><tr><td> 1 </td><td> 1 </td><td> A </td><td> C </td><td> C </td></tr><tr><td> 2 </td><td> 2 </td><td> A </td><td> B </td><td> B </td></tr><tr><td> 3 </td><td> 3 </td><td> A </td><td> A </td><td> B </td></tr><tr><td> 4 </td><td> 4 </td><td> B </td><td> A </td><td> A </td></tr><tr><td> 5 </td><td> 5 </td><td> C </td><td> A </td><td> A </td></tr><tr><td> 6 </td><td> 7 </td><td> D </td><td> A </td><td> A </td></tr><tr><td> 7 </td><td> 10 </td><td> E </td><td> A </td><td> A </td></tr><tr><td> 8 </td><td> 15 </td><td> E </td><td> A </td><td> A </td></tr><tr><td> 9 </td><td> 30 </td><td> E </td><td> A </td><td> A </td></tr></TBODY></TABLE>Table 3 <TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> sample </td><td> line width (μm) </td>< Td> identification</td><td> breaking limit (elongation ratio) </td></tr><tr><td> ×1.3 </td><td> ×1.4 </td></tr ><tr><td> 1 </td><td> 1 </td><td> A </td><td> C </td><td> C </td></tr><tr ><td> 2 </td><td> 2 </td><td> A </td><td> B </td><td> B </td></tr><tr><td > 3 </td><td> 3 </td><td> A </td><td> A </td><td> B </td></tr><tr><td> 4 < /td><td> 4 </td><td> B </td><td> A </td><td> A </td></tr><tr><td> 5 </td> <td> 5 </td><td> C </td><td> A </td><td> A </td></tr><tr><td> 6 </td><td> 7 </td><td> D </td><td> A </td><td> A </td></tr><tr><td> 7 </td><td> 10 </ Td><td> E </td><td> A </td><td> A </td></tr><tr><td> 8 </td><td> 15 </td>< Td> E </td><td> A </td><td> A </td></tr><tr><td> 9 </td><td> 30 </td><td> E </td><td> A </td><td> A </td></tr></TBODY></TABLE>

從表3可知，在不產生伸長的部分，即使金屬細線較細也沒有發生問題，但在伸長率為1.3～1.4倍的部位，根據線寬的不同會發生斷線。即，可知，在將具有網格圖案的電極圖案應用於具有三維形狀的觸控面板的電極圖案的情況下，需要採用兼顧不發生斷線、以及不對辨識性造成不良影響的線寬。As is clear from Table 3, in the portion where elongation does not occur, there is no problem even if the fine metal wires are fine. However, in the portion where the elongation is 1.3 to 1.4 times, the wire breakage occurs depending on the line width. In other words, when the electrode pattern having the mesh pattern is applied to the electrode pattern of the touch panel having the three-dimensional shape, it is necessary to adopt a line width that does not cause disconnection and does not adversely affect the visibility.

因此，從表3的結果可知，能夠兼顧導電性膜的辨識性（金屬細線的辨識難易度）和斷線率的金屬細線的線寬優選為1～5μm，進一步優選為2～5μm。Therefore, it is understood that the line width of the metal thin wire which can distinguish both the visibility of the conductive film (the ease of identification of the fine metal wires) and the wire breakage ratio is preferably 1 to 5 μm, and more preferably 2 to 5 μm.

另外，在撓性基板上形成了基於ITO（氧化錫銦）膜的電極圖案的情況下，由於ITO膜是陶瓷電極，所以沒有撓性。因此，無法成型為本實施方式這樣的三維形狀。Further, in the case where an electrode pattern based on an ITO (indium tin oxide) film is formed on a flexible substrate, since the ITO film is a ceramic electrode, there is no flexibility. Therefore, the three-dimensional shape as in the present embodiment cannot be formed.

並且，作為透明電極材料，在使用了銀奈米線的情況下，參照日本特開2013-084571號公報的記載，製造由試樣序號3的銀奈米線（短軸徑17nm、長軸徑8μm）形成的銀奈米線分散膜，本實施方式的製造方法例如如第八圖(A)和(B)所示，在將銀奈米線分散膜成型為了三維形狀時，通過加熱，電極圖案所到之處銀奈米線捲曲，導電性大幅降低。In the case of using a silver nanowire as a transparent electrode material, a silver nanowire of sample No. 3 (short axis diameter: 17 nm, long axis diameter) was produced by referring to the description of JP-A-2013-084571. The silver nanowire-dispersed film formed by 8 μm), the manufacturing method of the present embodiment, for example, as shown in the eighth (A) and (B), when the silver nanowire-dispersed film is molded into a three-dimensional shape, the electrode is heated. When the pattern goes, the silver nanowire is curled and the conductivity is greatly reduced.

另外，本發明的電子設備、層疊膜、觸控面板和層疊膜的製造方法當然不限於上述的實施方式，在不脫離本發明的要旨的情況下，能夠採用各種各樣的結構。In addition, the manufacturing method of the electronic device, the laminated film, the touch panel, and the laminated film of the present invention is of course not limited to the above-described embodiment, and various configurations can be employed without departing from the gist of the present invention.

以上所舉者僅係本發明之部份實施例，並非用以限制本發明，致依本發明之創意精神及特徵，稍加變化修飾而成者，亦應包括在本專利範圍之內。The above is only a part of the embodiments of the present invention, and is not intended to limit the present invention. It is intended to be included in the scope of the present invention.

綜上所述，本發明實施例確能達到所預期之使用功效，又其所揭露之具體技術手段，不僅未曾見諸於同類產品中，亦未曾公開於申請前，誠已完全符合專利法之規定與要求，爰依法提出發明專利之申請，懇請惠予審查，並賜准專利，則實感德便。In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific technical means disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have completely complied with the patent law. The regulations and requirements, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible.

10‧‧‧電子設備10‧‧‧Electronic equipment

12‧‧‧設備主體12‧‧‧Device body

14‧‧‧殼體14‧‧‧Shell

16‧‧‧顯示面板16‧‧‧ display panel

18a、18b‧‧‧設備主體的正面、背面18a, 18b‧‧‧ front and back of the main body of the device

20‧‧‧觸控面板20‧‧‧Touch panel

22‧‧‧電路基板22‧‧‧ circuit board

24‧‧‧外罩層24‧‧‧ outer cover

26a～26d‧‧‧設備主體的第1側面～第4側面26a～26d‧‧‧1st to 4th side of the main body of the equipment

28‧‧‧樹脂層28‧‧‧ resin layer

30‧‧‧硬質塗層膜30‧‧‧hard coating film

32‧‧‧導電性膜32‧‧‧ Conductive film

34‧‧‧控制電路34‧‧‧Control circuit

35‧‧‧層疊膜35‧‧‧Laminated film

36‧‧‧撓性基板36‧‧‧Flexible substrate

38A‧‧‧第1感應電極38A‧‧‧1st induction electrode

38B‧‧‧第2感應電極38B‧‧‧2nd sensing electrode

42A‧‧‧第1端子配線部42A‧‧‧1st terminal wiring section

42B‧‧‧第2端子配線部42B‧‧‧2nd terminal wiring section

46a、46b‧‧‧殼體的第1側面、第2側面46a, 46b‧‧‧1st side and 2nd side of the casing

48a‧‧‧殼體的正面48a‧‧‧ front of the casing

50‧‧‧單元50‧‧‧ unit

52‧‧‧網格圖案52‧‧‧ grid pattern

56A‧‧‧第1端子部56A‧‧‧1st terminal part

56B‧‧‧第2端子部56B‧‧‧2nd terminal section

58‧‧‧裝飾膜58‧‧‧Decorative film

62‧‧‧注塑成型模具62‧‧‧Injection Molding

62A‧‧‧第1模具62A‧‧‧1st mould

62B‧‧‧第2模具62B‧‧‧2nd mould

64A‧‧‧第1成型用模具64A‧‧‧1st molding die

64B‧‧‧第2成型用模具64B‧‧‧2nd molding die

74‧‧‧腔體74‧‧‧ cavity

76‧‧‧凹部76‧‧‧ recess

78‧‧‧凸部78‧‧‧ convex

20A‧‧‧第1觸控面板20A‧‧‧1st touch panel

20B‧‧‧第2觸控面板20B‧‧‧2nd touch panel

20C‧‧‧第3觸控面板20C‧‧‧3rd touch panel

第一圖：是示出本發明的電子設備的立體圖First drawing: is a perspective view showing an electronic device of the present invention

第二圖：是沿第一圖中的II-II線的剖視圖Second picture: is a cross-sectional view along line II-II in the first figure

第三圖：是示出具有三維形狀的殼體的立體圖Third figure: is a perspective view showing a housing having a three-dimensional shape

第四圖：是示出導電性膜的截面構造的一例和控制系統（自電容方式）的一例的說明圖FIG. 4 is an explanatory diagram showing an example of a cross-sectional structure of a conductive film and an example of a control system (self-capacitance method)

第五圖：是以從上方觀察的方式示出導電性膜的主要部分的俯視圖Fifth drawing: a plan view showing a main portion of the conductive film in a manner as viewed from above

第六圖：是示出導電性膜的截面構造的一例和控制系統（互電容方式）的一例的說明圖Fig. 6 is an explanatory view showing an example of a cross-sectional structure of a conductive film and an example of a control system (mutual capacitance method)

第七圖：是示出層疊膜（與導電性膜成為一體的殼體）的製造方法的流程圖Fig. 7 is a flow chart showing a method of manufacturing a laminated film (a casing integrated with a conductive film)

第八圖：(A)是局部省略地示出用於真空成型導電性膜的第1成型用模具的剖視圖；(B)是示出將導電性膜壓靠於第1成型用模具而成型為三維形狀的狀態的剖視圖(A) is a cross-sectional view showing a first molding die for vacuum forming a conductive film in a partially omitted manner, and (B) is a molding in which a conductive film is pressed against a first molding die to form Sectional view of the state of the three-dimensional shape

第九圖：(A)是局部省略地示出用於真空成型硬質塗層膜的第2成型用模具的剖視圖；(B)是示出將硬質塗層膜壓靠於第2成型用模具而成型為三維形狀的狀態的剖視圖Ninth view: (A) is a cross-sectional view showing a second molding die for vacuum forming a hard coat film, and (B) is a view showing that the hard coat film is pressed against the second molding die. Cutaway view of a state formed into a three-dimensional shape

第十圖：(A)是示出在注塑成型模具內設置有導電性膜和硬質塗層膜的狀態的剖視圖；(B)是示出使注入到腔體內的熔融樹脂固化而成為樹脂層的狀態的剖視圖(A) is a cross-sectional view showing a state in which a conductive film and a hard coat film are provided in an injection molding die, and (B) is a view showing that a molten resin injected into a cavity is solidified to form a resin layer. Sectional view of the state

第十一圖：是示出本發明的電子設備的其他例（在殼體的側面形成有凹部、凸部的例子）的立體圖。11 is a perspective view showing another example of the electronic device of the present invention (an example in which a concave portion and a convex portion are formed on a side surface of the casing).

第十二圖：是示出粘合類型的導電性膜的剖視圖Twelfth Diagram: is a cross-sectional view showing a conductive film of a bonding type

第十三圖：是示出導電性膜的製作方法（基於兩面同時曝光的製作方法）的流程圖Thirteenth Graph: Flowchart showing a method for producing a conductive film (manufacturing method based on simultaneous exposure of both sides)

第十四圖：(A)是局部省略地示出製作出的感光材料的剖視圖；(B) 是對感光材料進行的兩面同時曝光的說明圖Figure 14: (A) is a partially omitted view showing a photosensitive material produced; (B) is an explanatory view of simultaneous exposure of both surfaces of the photosensitive material

第十五圖：是示出以照射到第1感光層的光不到達第2感光層、且照射到第2感光層的光不到達第1感光層的方式進行第1曝光處理和第2曝光處理的狀態的說明圖In the fifteenth diagram, the first exposure process and the second exposure are performed such that the light that has been irradiated onto the first photosensitive layer does not reach the second photosensitive layer and the light that has been irradiated onto the second photosensitive layer does not reach the first photosensitive layer. Description of the status of the processing

第十六圖：是示出確認斷線極限時使用的實驗裝置的說明圖Figure 16 is an explanatory diagram showing an experimental device used to confirm the disconnection limit

10‧‧‧電子設備 10‧‧‧Electronic equipment

12‧‧‧設備主體 12‧‧‧Device body

14‧‧‧殼體 14‧‧‧Shell

16‧‧‧顯示面板 16‧‧‧ display panel

18a、18b‧‧‧設備主體的正面、背面 18a, 18b‧‧‧ front and back of the main body of the device

20‧‧‧觸控面板 20‧‧‧Touch panel

20A‧‧‧第1觸控面板 20A‧‧‧1st touch panel

20B‧‧‧第2觸控面板 20B‧‧‧2nd touch panel

20C‧‧‧第3觸控面板 20C‧‧‧3rd touch panel

22‧‧‧電路基板 22‧‧‧ circuit board

24‧‧‧外罩層 24‧‧‧ outer cover

26a、26b‧‧‧設備主體的第1側面、第二側面 26a, 26b‧‧‧1st side and second side of the main body of the device

28‧‧‧樹脂層 28‧‧‧ resin layer

30‧‧‧硬質塗層膜 30‧‧‧hard coating film

32‧‧‧導電性膜 32‧‧‧ Conductive film

34‧‧‧控制電路 34‧‧‧Control circuit

36‧‧‧撓性基板 36‧‧‧Flexible substrate

46a、46b‧‧‧殼體的第1側面、第二側面 46a, 46b‧‧‧1st side and second side of the casing

48a‧‧‧殼體的正面 48a‧‧‧ front of the casing

58‧‧‧裝飾膜 58‧‧‧Decorative film

Claims (21)

一種電子設備，其具有殼體和觸控面板，所述殼體具有多個面，所述電子設備的特徵在於： 在構成所述殼體的多個面中的至少二個以上的面分別設置有所述觸控面板， 各所述觸控面板分別具有多個感應電極， 所述多個感應電極中的至少一個在各所述觸控面板中的至少二個觸控面板上是共用的， 所述感應電極具有由金屬細線構成的網格圖案， 所述金屬細線的線寬為1μm以上且5μm以下。An electronic device having a housing and a touch panel, the housing having a plurality of faces, wherein the electronic device is characterized by: respectively arranging at least two of the plurality of faces constituting the housing Each of the touch panels has a plurality of sensing electrodes, and at least one of the plurality of sensing electrodes is shared by at least two of the touch panels. The sensing electrode has a mesh pattern composed of thin metal wires, and the metal thin wires have a line width of 1 μm or more and 5 μm or less. 如申請專利範圍第1項所述之電子設備，其中，在各所述觸控面板中的至少二個觸控面板上共用的所述感應電極的端子部，在各所述觸控面板中的至少二個觸控面板上是共用的。The electronic device of claim 1, wherein the terminal portions of the sensing electrodes shared by at least two of the touch panels are in each of the touch panels. At least two touch panels are shared. 如申請專利範圍第1項所述之電子設備，其中，至少所述二個以上的面中，至少一個面是所述殼體的主面，其他至少一個面是與所述主面鄰接的側面。The electronic device of claim 1, wherein at least one of the at least one of the two or more faces is a main face of the housing, and the other at least one face is a side adjacent to the main face . 如申請專利範圍第3項所述之電子設備，其中，在所述側面形成有彎曲狀的凹部或凸部。The electronic device according to claim 3, wherein a curved concave portion or a convex portion is formed on the side surface. 如申請專利範圍第1～4項中的任一項所述的電子設備，其中，至少所述二個以上的面中，至少一個面具有顯示面板，與該一個面對應的觸控面板設置在所述顯示面板之上。The electronic device according to any one of claims 1 to 4, wherein at least one of the at least one of the two or more surfaces has a display panel, and the touch panel corresponding to the one surface is disposed at Above the display panel. 如申請專利範圍第5項所述的電子設備，其中，與至少所述二個以上的面中的其他至少一個面對應的觸控面板執行與觸控位置相應的開關功能。The electronic device of claim 5, wherein the touch panel corresponding to at least one of the at least one of the two or more faces performs a switching function corresponding to the touch position. 如申請專利範圍第1～4項中的任一項所述的電子設備，其中，所述電子設備具有在至少所述二個以上的面延伸的撓性基板，在所述撓性基板上形成有所述感應電極。The electronic device according to any one of claims 1 to 4, wherein the electronic device has a flexible substrate extending on at least the two or more surfaces, and is formed on the flexible substrate There is the sensing electrode. 如申請專利範圍第7項所述的電子設備，其中，形成有所述感應電極的撓性基板一體成型於所述殼體。The electronic device according to claim 7, wherein the flexible substrate on which the sensing electrode is formed is integrally formed in the casing. 如申請專利範圍第7項所述的電子設備，其中，形成有所述感應電極的撓性基板在該撓性基板上具有二個以上的第1感應電極和2個以上的第2感應電極，所述第1感應電極和所述第2感應電極中的至少一方是組合分別由金屬細線形成的多個單元而構成的。The electronic device according to claim 7, wherein the flexible substrate on which the sensing electrode is formed has two or more first sensing electrodes and two or more second sensing electrodes on the flexible substrate. At least one of the first induction electrode and the second induction electrode is configured by combining a plurality of cells each formed of a thin metal wire. 如申請專利範圍第9項所述的電子設備，其中，所述金屬細線至少包含金屬粒子和粘合劑。The electronic device of claim 9, wherein the metal thin wire comprises at least metal particles and a binder. 一種層疊膜，其具有：外罩層，其具有三維形狀並且構成電子設備的殼體；以及觸控面板用的導電性膜，其一體地設置於所述外罩層的一個表面，所述導電性膜具有撓性基板和形成於該撓性基板的感應電極，所述外罩層設置在構成所述殼體的多個面中的至少二個以上的面上，所述撓性基板具有在所述外罩層的至少二個以上的面延伸的三維形狀，所述多個感應電極中的至少一個在至少二個以上的面上是共用的。A laminated film having: an outer cover layer having a three-dimensional shape and constituting a casing of an electronic device; and a conductive film for a touch panel integrally provided on one surface of the outer cover layer, the conductive film a flexible substrate having at least two or more surfaces of the plurality of faces constituting the casing, and a sensing electrode formed on the flexible substrate having the outer cover The three-dimensional shape in which at least two or more faces of the layer extend, at least one of the plurality of sensing electrodes is common to at least two or more faces. 如申請專利範圍第11項所述的層疊膜，其中，所述外罩層具有：膜，其形成於表面；以及樹脂層，其介於所述膜和所述導電性膜之間。The laminated film according to claim 11, wherein the outer cover layer has a film formed on the surface, and a resin layer interposed between the film and the conductive film. 如申請專利範圍第12項所述的層疊膜，其中，所述樹脂層是通過注塑成型注入的熔融樹脂固化而形成的。The laminated film according to claim 12, wherein the resin layer is formed by curing a molten resin injected by injection molding. 一種觸控面板，其具有在電子設備的多個面中的至少二個以上的面分別設置的多個觸控面板，各所述觸控面板分別具有多個感應電極，所述多個感應電極中的至少一個在各所述觸控面板中的至少二個觸控面板上是共用的。A touch panel having a plurality of touch panels respectively disposed on at least two of the plurality of faces of the electronic device, each of the touch panels having a plurality of sensing electrodes, the plurality of sensing electrodes At least one of the at least one of the touch panels is common to at least two of the touch panels. 如申請專利範圍第14項所述的觸控面板，其中，在各所述觸控面板中的至少二個觸控面板上共用的所述感應電極的端子部，在各所述觸控面板中的至少二個觸控面板上是共用的。The touch panel of claim 14, wherein the terminal portions of the sensing electrodes shared by at least two of the touch panels are in each of the touch panels. At least two touch panels are shared. 如申請專利範圍第14或15項所述的觸控面板，其中，具有在至少所述二個以上的面延伸的撓性基板，在所述撓性基板上形成有所述感應電極。The touch panel according to claim 14 or 15, wherein the touch panel has a flexible substrate extending on at least the two or more surfaces, and the sensing electrode is formed on the flexible substrate. 如申請專利範圍第16項所述的觸控面板，其中，形成有所述感應電極的撓性基板一體成型於所述電子設備的殼體。The touch panel of claim 16, wherein the flexible substrate on which the sensing electrode is formed is integrally formed on a casing of the electronic device. 如申請專利範圍第16項所述的觸控面板，其中，形成有所述感應電極的撓性基板在該撓性基板上具有二個以上的第1感應電極和2個以上的第2感應電極，所述第1感應電極和所述第2感應電極中的至少一方是組合分別由金屬細線形成的多個單元而構成的。The touch panel according to claim 16, wherein the flexible substrate on which the sensing electrode is formed has two or more first sensing electrodes and two or more second sensing electrodes on the flexible substrate. At least one of the first sensing electrode and the second sensing electrode is configured by combining a plurality of cells each formed of a thin metal wire. 如申請專利範圍第18項所述的觸控面板，其中，所述金屬細線至少包含金屬粒子和粘合劑。The touch panel of claim 18, wherein the metal thin wires comprise at least metal particles and a binder. 一種層疊膜的製造方法，所述層疊膜具有：外罩層，其具有三維形狀並且構成電子設備的殼體；以及觸控面板用的導電性膜，其一體地設置於所述外罩層的一個面，所述層疊膜的製造方法的特徵在於，具有以下工序：在撓性基板上形成感應電極來製作所述導電性膜的工序；使所述導電性膜與所述殼體的形狀對應地成型為三維形狀的成型工序；將成型為三維形狀的所述導電性膜設置在注塑成型模具內的設置工序；以及向所述注塑成型模具內注射熔融樹脂的注射工序，將所述熔融樹脂固化，製作出具有所述外罩層和所述導電性膜的三維形狀的層疊膜。A method of manufacturing a laminated film, comprising: an outer cover layer having a three-dimensional shape and constituting a casing of an electronic device; and a conductive film for a touch panel integrally provided on one side of the outer cover layer The method for producing a laminated film is characterized by the steps of: forming a conductive electrode on a flexible substrate to form the conductive film; and forming the conductive film in accordance with a shape of the case a molding process of a three-dimensional shape; an installation step of disposing the conductive film formed into a three-dimensional shape in an injection molding die; and an injection process of injecting a molten resin into the injection molding die to cure the molten resin A laminated film having the three-dimensional shape of the outer cover layer and the conductive film was produced. 如申請專利範圍第20項所述的層疊膜的製造方法，其中，所述外罩層具有：膜，其形成於表面；以及樹脂層，其介於所述膜和所述導電性膜之間，所述層疊膜的製造方法還具有使所述膜與所述殼體的形狀對應地成型為三維形狀的第二成型工序，在所述設置工序中，將成型為三維形狀的所述導電性膜和所述膜設置在所述注塑成型模具內，在所述注射工序中，將熔融樹脂注射到所述注塑成型模具內的、所述導電性膜和所述膜之間。The method for producing a laminated film according to claim 20, wherein the outer cover layer has a film formed on a surface, and a resin layer interposed between the film and the conductive film, The method for producing a laminated film further includes a second molding step of molding the film into a three-dimensional shape corresponding to the shape of the casing, and in the setting step, the conductive film formed into a three-dimensional shape is formed. And the film is disposed in the injection molding die, and in the injection process, molten resin is injected between the conductive film and the film in the injection molding die.
TW103136775A 2014-02-19 2014-10-24 Electronic equipment, laminated film, touch panel and method for producing laminated film TW201533626A (en)

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