CN111417666B - 用于粘附到聚合物阻隔基材的双组分无溶剂粘着剂组合物 - Google Patents
用于粘附到聚合物阻隔基材的双组分无溶剂粘着剂组合物 Download PDFInfo
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Abstract
公开双组分无溶剂聚氨基甲酸酯粘着剂组合物,其包括:异氰酸酯组分,所述异氰酸酯组分包括异氰酸酯掺合物;和多元醇组分,所述多元醇组分包括:胺引发的多元醇,所述胺引发的多元醇包括两个或更多个伯羟基和并有叔胺的主链,其中所述胺引发的多元醇包括2到12的官能度、5到1,830的羟基数目和500mPa‑s到20,000mPa‑s的40℃下的粘度;和基于聚硅氧的添加剂(例如,消泡剂和/或湿润剂)。所述粘着剂组合物被调配成使得所述异氰酸酯组分和所述多元醇组分可以在混合之前涂覆于单独的基材。还公开层压结构,其包括所述所公开的粘着剂组合物且进一步包括聚合物阻隔基材。
Description
相关申请案的参考
本申请案要求2017年12月27日提交的意大利申请案第102017000149966号的权利。
技术领域
本发明涉及无溶剂粘着剂组合物。所公开的粘着剂组合物包括胺引发的多元醇,其提供具有改良的转化效率的层压结构,特别是当用于其中具有聚合物阻隔基材的层压结构中时,例如,聚乙烯(“PE”)膜、聚酰胺(“PA”)膜、乙烯乙烯醇(“EVOH”)膜等。
在一些实施例中,粘着剂组合物包括异氰酸酯组分和多元醇组分,其调配成分别涂覆两个基材,接着使所述两个基材结合在一起以使粘着剂组合物的组分混合且反应。具体地说,粘着剂组合物的一种组分被配置成均匀地涂覆于第一基材的表面,且粘着剂组合物的另一组分被配置成涂覆于第二基材的表面。随后使第一与第二基材结合在一起,由此混合两种组分且使其反应,以在第一与第二基材之间形成粘着剂。以此方式,可以随后固化粘着剂,由此粘合第一基材与第二基材。
所公开的粘着剂组合物包含:异氰酸酯组分中的异氰酸酯掺合物,其在层压复卷期间减少与产生CO2相关联的问题;和多元醇组分中的基于聚硅氧的添加剂(例如消泡剂、湿润剂等),其以较高层压速度改良聚合物障壁的光学特性。
背景技术
粘着剂组合物适用于多种目的。举例来说,粘着剂组合物用于将基材粘合在一起以形成复合膜,即,层压物,所述基材如聚乙烯、聚丙烯、聚酯、聚酰胺、金属、金属化物、纸或塞璐芬(cellophane)。粘着剂在不同的最终用途应用中的用途通常是已知的。举例来说,粘着剂可以用于制造用于包装行业中,尤其用于食品包装的膜/膜和膜/箔层压物。用于层压应用中的粘着剂或“层压粘着剂”一般可以分为三种类别:溶剂型、水基型和无溶剂型。粘着剂的性能视应用粘着剂的类别和应用而改变。
可以涂覆高达100%固体且无有机溶剂或水性载剂的无溶剂层压粘着剂。因为在应用时不需要从粘着剂干燥有机溶剂或水,所以这些粘着剂可以较高的生产线速度运作且在需要快速粘着剂涂覆的应用中是优选的。基于溶剂和基于水的层压粘着剂受到在涂覆粘着剂后可以有效干燥且从层压结构中去除溶剂或水的速率的限制。出于环境、健康和安全原因,层压粘着剂优选含水或无溶剂。
在无溶剂层压粘着剂的类别内,存在许多种类。一种具体种类包含预混合双组分基于聚氨基甲酸酯的层压粘着剂。通常,双组分基于聚胺甲酸酯的层压粘着剂包含:第一组分,其包括含异氰酸酯的预聚物和/或聚异氰酸酯;和第二组分,其包括多元醇。预聚物可以通过使过量异氰酸酯与每分子含有两个或更多个羟基的聚醚和/或聚酯反应而获得。第二组分包括通过每分子两个或更多个羟基引发的聚醚和/或聚酯。两种组分以预定比例组合或“预混合”,且随后将其涂覆于第一基材(“载体幅材”)上。随后,使第一基材与第二基材结合在一起以形成层压结构。
可以将额外基材层添加到结构中,其中额外粘着剂组合物层位于各连续基材之间。随后,在室温或高温下固化粘着剂,进而使基材粘合在一起。
层压结构的进一步加工是视粘着剂的固化速度而定。粘着剂的固化速度由层压基材之间的机械粘合变得足以容许进一步加工所花费的时间指示,且层压物符合适用规定(例如食品接触规定)。缓慢固化速度导致较低转化效率。相比于传统含溶剂的粘着剂,预混合双组分无溶剂层压粘着剂呈现较弱初始粘合和缓慢固化速度。转化工业中的一般趋势朝向较快固化层压粘着剂。较快固化改良转化器的操作效率。具体地说,将成品快速搬离仓库提高生产能力和处理最后时刻订单的灵活性(例如,零售商促销活动)。为了提高操作效率,应使用反应性远高于现有粘着剂组合物的粘着剂组合物来形成层压物。然而,这类粘着剂组合物在用于包括聚合物阻隔基材的层压结构中时证明了局限性。在相对较高生产线速度(例如,超过250m/min)下,可以在视觉上观察到所生产的层压物的缺陷。这些缺陷即使在较慢生产线速度(例如,小于150m/min)下也是明显的,尽管不太严重。所述缺陷可尤其归因于层压制程期间的润湿性故障和空气夹带,以及复卷层压物时产生CO2。
因此,需要具有改良的粘合强度、较快固化速度和与聚合物阻隔基材的增强的粘附性的双组分无溶剂基于聚氨基甲酸酯的层压粘着剂组合物。
发明内容
公开双组分无溶剂聚氨基甲酸酯粘着剂组合物。所公开的粘着剂组合物尤其适合用于包括聚合物阻隔基材的层压结构中。在一些实施例中,无溶剂粘着剂组合物包含异氰酸酯组分,所述异氰酸酯组分包含异氰酸酯掺合物。异氰酸酯掺合物可以包含选自由以下组成的组的至少两个:芳香族异氰酸酯、脂族异氰酸酯、环脂族异氰酸酯和其组合。无溶剂粘着剂组合物进一步包含多元醇组分,所述多元醇组分包含高反应性胺引发的多元醇和基于聚硅氧的添加剂。胺引发的多元醇可进一步包括约2到约12的官能度、约5到约1,830的羟基数目和约500到约20,000的分子量。基于聚硅氧的添加剂可以是消泡剂、湿润剂或其组合。
所公开的粘着剂组合物在用于包含聚合物阻隔基材的层压结构中时相对于现有双组分无溶剂粘着剂组合物展现快速固化速率。因为所公开的粘着剂组合物被调配成变得比现有粘着剂组合物具有更高反应性且呈现较快固化速率,所以其并不理想地适于与现有粘着剂涂覆设备一起使用。这是因为两种组分反应极快,促使粘着剂胶化且不适于涂覆于基材。出于这一原因,所公开的粘着剂组合物被调配成使异氰酸酯和多元醇组分分别涂覆于两种不同基材上,而非使其预混合且涂覆于载体幅材上。
具体地说,所公开的粘着剂组合物被调配成使得异氰酸酯组分可以均一地涂覆于第一基材的表面且多元醇组分可涂覆于第二基材的表面。随后使第一基材的表面与第二基材的表面接触以使两种组分混合且反应,由此形成层压物。粘着剂组合物随后可固化。
具体实施方式
根据本发明的双组分无溶剂粘着剂组合物包括异氰酸酯组分和多元醇组分,如上文所讨论。
异氰酸酯组分
在一些实施例中,异氰酸酯组分包括异氰酸酯掺合物,其包含掺合在一起的两种或更多种异氰酸酯。异氰酸酯可以选自由以下组成的组:异氰酸酯预聚物、异氰酸酯单体、聚异氰酸酯(例如二聚体、三聚体等)和其中两种或更多种的组合。如本文中所使用,“聚异氰酸酯”是含有两个或更多个异氰酸酯基团的任何化合物。异氰酸酯预聚物是包括异氰酸酯和多元醇的反应物的反应产物。如本文中所使用,“异氰酸酯预聚物”可以是聚异氰酸酯本身。
在一些实施例中,异氰酸酯组分包括从1.5到10或从1.8到5或从2到3的官能度。如关于异氰酸酯组分所使用,“官能度”是指每分子羟基反应性位点的数目。如异氰酸酯组分的具有异氰酸酯基团的化合物可以由参数“%NCO”表征,所述参数是按化合物重量计异氰酸酯基团的量(按重量计)。参数%NCO通过ASTM D 2572-97(2010)的方法测量。所公开的异氰酸酯组分的%NCO是至少3%、或至少6%、或至少10%。在一些实施例中,异氰酸酯组分的%NCO不超过25%、或18%、或14%。
此外,异氰酸酯掺合物所包括的游离单体含量是0%到50%、或5%到40%、或10%到30%。此外,异氰酸酯掺合物所包括的分子量是200g/mol到3,000g/mol、或300g/mol到2,000g/mol,或500g/mol到1,000g/mol。甚至进一步,如通过ASTM D2196的方法所测量,在25℃下异氰酸酯组分的粘度是300mPa-s到40,000mPa-s、或500mPa-s到20,000mPa-s、或1,000mPa-s到10,000mPa-s。
在一些实施例中,异氰酸酯掺合物的异氰酸酯包括选自由以下组成的组的至少两种:芳香族异氰酸酯、脂族异氰酸酯、环脂族异氰酸酯和其组合。“芳香族聚异氰酸酯”是含有一个或多个芳环的异氰酸酯。“脂族聚异氰酸酯”不含芳环。“环脂族聚异氰酸酯”是脂族聚异氰酸酯的子集,其中化学链是环结构。
根据本发明的适于使用的合适芳香族异氰酸酯的实例包含(但不限于):亚甲基二苯基二异氰酸酯(“MDI”)的异构体,如4,4′-MDI、2,2′-MDI和2,4′-MDI;甲苯-二异氰酸酯(“TDI”)的异构体,如2,4-TDI、2,6-TDI;萘-二异氰酸酯(NDI)的异构体,如1,5-NDI,和其中两种或更多种的组合。优选是MDI的异构体,尤其是4,4′-MDI和2,4′-MDI(即,液体MDI)或4,4′-MDI(即,固体MDI)的混合物。
根据本发明的适于使用的合适脂族和环脂族异氰酸酯的实例包含(但不限于):二异氰酸己二酯(“HDI”)的异构体、异佛酮二异氰酸酯(“IPDI”)的异构体、二甲苯二异氰酸酯(“XDI”)的异构体、降冰片烷二异氰酸酯(“NBDI”)的异构体、四甲基亚二甲苯基二异氰酸酯(“TMXDI”)的异构体,和其组合。
在一些实施例中,异氰酸酯掺合物包含亚甲基二苯基二异氰酸酯和六亚甲基二异氰酸酯的异构体。在一些实施例中,异氰酸酯掺合物包含亚甲基二苯基二异氰酸酯、六亚甲基二异氰酸酯和甲苯二异氰酸酯的异构体。在其它实施例中,异氰酸酯掺合物可以包含本文中所描述的异氰酸酯中的两种或更多种的任何组合。
按粘着剂组合物的重量(即异氰酸酯组分和多元醇组分的总重量)计,粘着剂组合物中的异氰酸酯掺合物的量按重量计是至少5wt%、或至少10wt%,或至少20wt%。按粘着剂组合物的重量计,粘着剂组合物中的异氰酸酯掺合物的量按重量计不超过100wt%、或不超过95wt%、或不超过90wt%。
异氰酸酯组分可以进一步包括所属领域的一般技术人员通常已知的其它成分。
多元醇组分
在一些实施例中,多元醇组分包括高反应性胺引发的多元醇和基于聚硅氧的添加剂。
胺引发的多元醇
相比于用于现有双组分无溶剂粘着剂组合物中的传统多元醇,在多元醇组分中包含胺引发的多元醇提供较高反应性和较快固化。胺引发的多元醇包括伯羟基和并有至少一个叔胺的主链。在一些实施例中,多元醇组分也可以包括另一类型的多元醇,即非胺引发的多元醇。各多元醇类型可以包含一种多元醇。或者,各多元醇类型可以包含不同种类的多元醇的混合物。在一些实施例中,一个多元醇类型可以是一种类别的多元醇,而另一多元醇类型可以是不同类别的多元醇的混合物。
胺引发的多元醇包括伯羟基和并有至少一个叔胺的主链。在一些实施例中,胺引发的多元醇具有以下化学结构I:
其中R1、R2和R3各自独立地是直链或支链烷基。举例来说,可以各自独立地是C1-C6直链或支链烷基。在一些实施例中,胺引发的多元醇包括叔胺和二级胺。
胺引发的多元醇包括2到12、或3到10、或4到8的官能度。如关于多元醇组分所使用,“官能度”是指每分子异氰酸酯反应性位点的数目。此外,胺引发的多元醇所包括的羟基数目是5到1,830、或20到100、或31到40。如关于多元醇组分所使用,“羟基数目”是可以用于反应的反应性羟基的量的量度。这一数目以湿式分析法确定且报道为等效于一克样品中发现的羟基的氢氧化钾的毫克数。确定羟基数目的最常用的方法描述于ASTM D 4274 D中。此外,胺引发的多元醇所包括的粘度在25℃下是500mPa-s到20,000mPa-s、或1,000mPa-s到15,000mPa-s,或1,500mPa-s到10,000mPa-s。
根据本发明的适于使用的胺引发的多元醇通过用一种或多种环氧烷使一种或多种胺引发剂烷氧基化而制得。
按粘着剂组合物的重量(即异氰酸酯组分和多元醇组分的总重量)计,粘着剂组合物中的胺引发的多元醇的量按重量计是至少2wt%、或至少10wt%,或至少20wt%。按粘着剂组合物的重量计,粘着剂组合物中至少一种胺引发的多元醇的量按重量计不超过100wt%、或不超过95wt%、或不超过90wt%。
基于聚硅氧的添加剂
在一些实施例中,多元醇组分进一步包括基于聚硅氧的添加剂。在一些实施例中,基于聚硅氧的添加剂是消泡剂或去泡剂。在一些实施例中,基于聚硅氧的添加剂是湿润剂。在一些实施例中,多元醇组分仅包括消泡剂。在一些实施例中,多元醇组分仅包括湿润剂。在一些实施例中,多元醇组分包括消泡剂和湿润剂两者。认为包含基于聚硅氧的添加剂增强润湿性且减少传统无溶剂层压粘着剂遇到的空气滞留问题。
按多元醇组分的重量计,粘着剂组合物中的基于聚硅氧的添加剂的量按重量计是至少0.05wt%、或至少0.1wt%,或至少0.2wt%。按多元醇组分的重量计,粘着剂组合物中的基于聚硅氧的添加剂的量按重量计不超过1wt%、或不超过0.5wt%,或不超过0.3wt%。
根据本发明的适于使用的基于聚硅氧的添加剂的市售实例包含来自迈图(Momentive)的AF9000 NETM、SAG 100TM、SAG 5693TM、来自BYKAdditives and Instruments的BYK 307TM,以及来自道康宁(Dow Corning)的DC 163TM、ACP 1500TM、DC 71TM和DC 74TM。
任选地选用的添加剂
在一些实施例中,非胺引发的多元醇可以任选地包含于粘着剂组合物中,例如,包含于多元醇组分中。非胺引发的多元醇的实例包含(但不限于)聚酯多元醇、聚醚多元醇、聚碳酸酯多元醇、聚丙烯酸酯多元醇、聚己内酯多元醇、聚烯烃多元醇、天然油多元醇和其中两种或更多种的组合。优选地,非胺引发的多元醇在25℃下的粘度是30mPa-s到40,000mPa-s、或50mPa-s到30,000mPa-s、或70mPa-s到20,000mPa-s,如通过ASTM D2196的方法测量。优选地,如通过ASTM D2196的方法所测量,非胺引发的多元醇在25℃下的粘度是100mPa-s到10,000mPa-s。
粘着剂组合物中的非胺引发的多元醇的量是至少0wt%、或至少5wt%,或至少10wt%。粘着剂组合物中的非胺引发的多元醇的量不超过98wt%、或不超过90wt%,或不超过80wt%。
在一些实施例中,添加剂可以任选地包含于粘着剂组合物中。这类添加剂的实例包含(但不限于)增粘剂、塑化剂、流变改质剂、助粘剂、抗氧化剂、填充剂、着色剂、表面活性剂、溶剂和其中两种或更多种的组合。
层压物形成
预期分别调配所公开的无溶剂粘着剂组合物的异氰酸酯组分和多元醇组分且储存直到期望形成层压结构。优选地,异氰酸酯组分和多元醇组分在25℃下呈液态。即使组分在25℃下是固体,但可接受视需要加热组分以使其呈液态。因为粘着剂组合物的适用期与固化制程无关,故组分可以无限期地储存。
包括所公开的粘着剂组合物的层压物可以通过将粘着剂组合物的异氰酸酯和多元醇组分分别涂覆到两个不同基材(如两个膜)而形成。如本文中所使用,“膜”是在一个维度中是0.5mm或更小且在其它两个维度中是1cm或更大的任何结构。“聚合物膜”是由聚合物或聚合物的混合物制成的膜。聚合物膜的组成通常是80wt%或更大的一种或多种聚合物。
举例来说,异氰酸酯组分的层涂覆于第一基材的表面。优选地,第一基材上异氰酸酯组分的层的厚度是0.5μm到2.5μm。多元醇组分的层涂覆于第二基材的表面。优选地,第二基材上多元醇组分的层的厚度是0.5μm到2.5μm。通过控制涂覆于各基材的层的厚度,组分的比率可得到控制。在一些实施例中,最终粘着剂组合物中异氰酸酯组分与多元醇组分的混合比可以是100∶100或100∶90或100∶80。所公开粘着剂组合物比传统粘着剂更加宽容且可以接受一定涂布重量误差(例如,最多约10%涂布重量误差)。
第一和第二基材的表面随后穿过用于向第一和第二基材施加外部压力的装置,如夹压卷筒。使异氰酸酯组分与多元醇组分结合在一起形成可固化粘着剂混合物层。当使第一和第二基材的表面结合在一起时,可固化粘着剂混合物层的厚度是1μm到5μm。当使第一与第二基材结合在一起且使组分彼此接触时,异氰酸酯组分与多元醇组分开始混合且反应。这标志着固化制程的开始。
当第一和第二基材穿过各种其它卷筒且最终到达重绕辊时,实现进一步混合和反应。因为基材各自比穿过各卷筒的其它基材采取更长或更短路径,所以进一步混合和反应在第一和第二基材穿过卷筒时进行。以这种方式,两个基材相对于彼此移动,使各别基材上的组分混合。涂覆装置中这类卷筒的配置通常是所属领域中已知的。可固化混合物随后固化或允许其固化。
层压结构中的合适基材包含如聚合物障壁膜的膜,所述聚合物障壁膜包含(但不限于)基于聚乙烯的膜、基于聚酰胺的膜和基于乙烯乙烯醇的膜。一些膜任选地具有如下表面,影像通过墨印刷在所述表面上,所述墨可以与粘着剂组合物接触。基材被分层以形成层压结构,其中根据本发明的粘着剂组合物将基材中的一个或多个粘附在一起。
本发明的实例
现将通过描述说明所公开的粘着剂组合物和现有粘着剂组合物的实例(说明性实例“IE”、比较实例“CE”,统称为“实例”)来进一步详细解释本发明。然而,本发明的范围当然不限于所述实例。
使用表1中识别的原材料制备实例。
表1:原材料
包括表2中所描述的粘着剂***的层压结构在具有以下机器参数的Nordmeccanica DUPLEX ONE-SHOTTM上制备:45℃的配料间隙温度;55℃的涂覆卷筒温度;55℃的夹压卷筒温度;3巴的夹持压;1巴的施加压力;150N的复卷拉力;90肖氏的夹压卷筒硬度。如表2中所指示,在使基材结合在一起以用于层压之前,OH组分(即多元醇组分)涂覆于层压物OH部分,且NCO组分(即异氰酸酯组分)涂覆于层压物NCO部分。
表2:用PE-EVOH基材制备的实例
如表2中所指示,包括异氰酸酯掺合物的异氰酸酯组分(即,MDI、TDI和/或HDI)与包括消泡剂的多元醇的组合允许在使用PE-EVOH/PET结构时的层压速度自小于150m/min增加直到250m/min。
包括表3中所描述的粘着剂***的层压结构在具有以下机器参数的Nordmeccanica SUPERCOMBITM 3000常规层压机上制备:40℃的配料间隙温度;40℃的涂覆卷筒温度;50℃的夹压卷筒温度;3巴的夹持压;1.5巴的施加压;150N的复卷拉力;85肖氏的夹压卷筒硬度。
表3:在习知的层压机上制备的实例
表3中所识别的实例展现层压物的外观未通过使用异氰酸酯掺合物或通过并有基于聚二甲基硅氧烷的湿润剂或消泡剂而得以改良。实际上,CE4、CE5和CE6中所产生的层压物比CE3层压物具有较差外观。
当使用Nordmeccanica ONE-SHOTTM层压机时,使用包括异氰酸酯掺合物的异氰酸酯组分连同使用多元醇组分中的基于聚硅氧的添加剂即使在相对较高层压速度(例如,高达250m/min)下也提供关于包括聚合物阻隔基材的层压物的增强的光学特性。
除了上文所描述的实施例以外,具体组合的许多实施例也在本发明的范围内,下文描述其中一些实施例:
实施例1.一种双组分无溶剂粘着剂组合物,其包括:
异氰酸酯组分,其包括异氰酸酯掺合物;和
多元醇组分,其包括:
胺引发的多元醇,其包括两个或更多个伯羟基和并有叔胺的主链,其中所述胺引发的多元醇包括2到12的官能度、5到1,830的羟基数目和500mPa-s到20,000mPa-s的40℃下的粘度;和
基于聚硅氧的添加剂。
实施例2.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯掺合物包括选自由以下组成的组的至少两个:亚甲基二苯基二异氰酸酯、甲苯二异氰酸酯、六亚甲基二异氰酸酯,和其组合。
实施例3.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯掺合物包括亚甲基二苯基二异氰酸酯和六亚甲基二异氰酸酯。
实施例4.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是消泡剂。
实施例5.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述消泡剂包括高达100重量%的聚硅氧/二氧化硅。
实施例6.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是湿润剂。
实施例7.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述湿润剂包括聚醚改性的聚二甲基硅氧烷。
实施例8.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是选自由以下组成的组:消泡剂、湿润剂,和其组合。
实施例9.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯组分适于涂覆于第一基材且所述多元醇组分适于涂覆于第二基材。
实施例10.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述粘着剂组合物在混合所述异氰酸酯组分与多元醇组分的10分钟内包括大于10,000mPa-s的粘度(在40℃下)。
实施例11.一种双组分无溶剂粘着剂组合物,其包括:
异氰酸酯组分,其包括异氰酸酯掺合物;和
多元醇组分,其包括:
胺引发的多元醇,其包括两个或更多个伯羟基和并有叔胺的主链,其中所述胺引发的多元醇包括2到12的官能度、5到1,830的羟基数目和500mPa-s到20,000mPa-s的40℃下的粘度;和
消泡剂。
实施例12.一种双组分无溶剂粘着剂组合物,其包括:
异氰酸酯组分,其包括异氰酸酯掺合物;和
多元醇组分,其包括:
胺引发的多元醇,其包括两个或更多个伯羟基和并有叔胺的主链,其中所述胺引发的多元醇包括2到12的官能度、5到1,830的羟基数目和500mPa-s到20,000mPa-s的40℃下的粘度;和
湿润剂。
实施例13.一种双组分无溶剂粘着剂组合物,其包括:
异氰酸酯组分,其包括异氰酸酯掺合物;和
多元醇组分,其包括:
胺引发的多元醇,其包括两个或更多个伯羟基和并有叔胺的主链,其中所述胺引发的多元醇包括2到12的官能度、5到1,830的羟基数目和500mPa-s到20,000mPa-s的40℃下的粘度;
消泡剂;和
湿润剂。
实施例14.一种双组分无溶剂粘着剂组合物,其包括:
异氰酸酯组分,其适于涂覆于第一基材且包括异氰酸酯掺合物;和
多元醇组分,其适于涂覆于第二基材且包括:
胺引发的多元醇,其包括伯羟基和并有叔胺的主链;和
基于聚硅氧的添加剂。
实施例15.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述胺引发的多元醇具有结构I:
其中R1、R2和R3独立地是直链或支链烷基。
实施例16.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述胺引发的多元醇包括4的官能度。
实施例17.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述胺引发的多元醇包括37的羟基数目。
实施例18.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述胺引发的多元醇包括约1,200mPa-s的25℃下的粘度。
实施例19.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述胺引发的多元醇包括约6,000g/mol的分子量。
实施例20.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中异氰酸酯组分与多元醇组分的重量比是0.5∶1到1.5∶1。
实施例21.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯组分包括低于约50%的单体含量。
实施例22.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯组分包括500mPa-s到10,000mPa-s的40℃下的粘度。
实施例23.一种层压结构,其包括根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物。
实施例24.一种层压结构,其包括:
根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物;和
基材,其包括聚合物阻隔基材。
实施例25.一种层压结构,其包括:
根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物;和
基材,其包括聚乙烯膜、基于聚酰胺的膜和基于乙烯乙烯醇的膜。
实施例26.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中按所述多元醇组分的重量计,所述基于聚硅氧的添加剂按重量计呈0.05重量%到1重量%。
实施例27.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中按所述多元醇组分的重量计,所述基于聚硅氧的添加剂按重量计呈0.1重量%到0.5重量%。
实施例28.根据任何前述或后续实施例所述的双组分无溶剂粘着剂组合物,其中按所述多元醇组分的重量计,所述基于聚硅氧的添加剂按重量计呈0.2重量%到0.3重量%。
Claims (10)
2.根据权利要求1所述的双组分无溶剂粘着剂组合物,其中所述异氰酸酯掺合物包括以下组分中的至少两个:亚甲基二苯基二异氰酸酯、甲苯二异氰酸酯、六亚甲基二异氰酸酯、二甲苯二异氰酸酯和其组合。
3.根据权利要求1所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是消泡剂。
4.根据权利要求3所述的双组分无溶剂粘着剂组合物,其中所述消泡剂包括高达100重量%的聚硅氧/二氧化硅。
5.根据权利要求1所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是湿润剂。
6.根据权利要求5所述的双组分无溶剂粘着剂组合物,其中所述湿润剂包括聚醚改性的聚二甲基硅氧烷。
7.根据权利要求1所述的双组分无溶剂粘着剂组合物,其中所述基于聚硅氧的添加剂是选自由以下组成的组:消泡剂、湿润剂,和其组合。
9.一种层压结构,其包括根据权利要求1所述的双组分无溶剂粘着剂组合物。
10.根据权利要求9所述的层压结构,其进一步包括聚合物阻隔基材。
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WO2019133121A1 (en) | 2019-07-04 |
EP3732222A1 (en) | 2020-11-04 |
AR113677A1 (es) | 2020-05-27 |
CN111417666A (zh) | 2020-07-14 |
BR112020011151A2 (pt) | 2020-11-17 |
RU2020120892A (ru) | 2021-12-24 |
US20210009876A1 (en) | 2021-01-14 |
TWI788485B (zh) | 2023-01-01 |
EP3732222B1 (en) | 2022-08-17 |
TW201934711A (zh) | 2019-09-01 |
JP2021509415A (ja) | 2021-03-25 |
JP7223002B2 (ja) | 2023-02-15 |
MX2020005752A (es) | 2020-08-20 |
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