CN111405776B - Method for repairing solder mask of printed circuit board - Google Patents
Method for repairing solder mask of printed circuit board Download PDFInfo
- Publication number
- CN111405776B CN111405776B CN202010114925.4A CN202010114925A CN111405776B CN 111405776 B CN111405776 B CN 111405776B CN 202010114925 A CN202010114925 A CN 202010114925A CN 111405776 B CN111405776 B CN 111405776B
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- circuit board
- printed circuit
- area
- solder mask
- negative film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for repairing a solder mask of a printed circuit board, which comprises the following steps: step 1, searching a bad area, and searching and identifying the bad area of the solder mask of the printed circuit board; step 2, drawing a negative film, correspondingly drawing the poor area of the solder mask of the printed circuit board on the negative film, and forming a poor simulation area on the negative film; step 3, processing the negative film, removing the bad simulation area of the negative film, and forming a hollow area on the negative film; step 4, positioning, namely fixing the relative position of the negative and the printed circuit board; step 5, repairing, namely spraying ink to the hollow area of the negative; and 6, post-processing, namely removing the negative plate and drying the repaired printed circuit board. The method for repairing the poor area of the solder mask of the printed circuit board can avoid scrapping of the poor printed circuit board and integral reworking of the solder mask of the poor printed circuit board, saves production cost, and has better and more accurate appearance effect and higher production efficiency after repair.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for repairing a solder mask of a printed circuit board.
Background
With the rapid development of the electronic information industry in China, the circuit board industry also obtains a wider development space, and becomes one of the key development fields of the electronic information industry in China. Generally, a printed circuit board is mainly composed of a base material, wiring, a solder resist, electronic components, and the like. The solder mask mainly has the functions of protecting the circuit board and insulating, and the coating of the solder mask is an important link for manufacturing the printed circuit board. Some flaws sometimes exist in the solder resist coating process, such as: the incomplete solder mask coverage causes the exposure of copper surfaces or substrates, and the ink at the hole plugging hole edges is too thin to cause the exposure of copper colors. To the flaw problem that above-mentioned solder mask appears in the coating process, adopt artifical prosthetic mode among the prior art more, pick out the printed circuit board that solder mask coating was problematic promptly the manual work, the mode of manual use printing ink again and repair, this kind of manual repair mode precision is difficult to guarantee, very easily causes printed circuit board's outward appearance problem. In addition, in the prior art, when the problem of the coating defect of the solder mask is solved, the solder mask of the problem board is completely reworked and even the whole problem board is directly scrapped, so that the appearance problem caused by manual repair can be avoided, the waste of manpower, material resources and time is caused, the production efficiency is reduced, and the production cost is increased.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a solder mask repairing method for a printed circuit board, which can effectively reduce the appearance problem after the solder mask is repaired, improve the production efficiency and reduce the production cost.
The method for repairing the solder mask of the printed circuit board comprises the following steps of: step 1, searching a bad area, and searching and identifying the bad area of the solder mask of the printed circuit board; step 2, drawing a negative film, correspondingly drawing the poor area of the solder mask of the printed circuit board on the negative film, and forming a poor simulation area on the negative film; step 3, processing the negative film, removing the bad simulation area of the negative film, and forming a hollow area on the negative film; step 4, positioning, namely fixing the relative position of the negative and the printed circuit board; step 5, repairing, namely spraying ink to the hollow area of the negative; and 6, post-processing, namely removing the negative plate and drying the repaired printed circuit board.
The method has the following beneficial effects: the method comprises the steps of drawing a poor region of the printed circuit board on a negative plate, forming a poor simulation region on the negative plate, hollowing out the poor simulation region, fixing the negative plate and the poor printed circuit board, filling ink in the poor region, and performing post-treatment to repair the poor region of the solder mask of the printed circuit board. The method for repairing the poor solder mask area of the printed circuit board can avoid scrapping of the poor printed circuit board and integral reworking of the poor printed circuit board solder mask, and save production cost. And the steps of drawing the bad area and hollowing out are completed through computer control in the process, so that compared with the step of manually repairing the bad area of the solder mask, the method is more accurate, the appearance effect after repairing is better, and the production efficiency is higher.
According to some embodiments of the invention, step 2 specifically comprises the steps of: 2.1, drawing the outline of the poor solder mask area of the printed circuit board by using a CAM tool; and 2.2, correspondingly drawing the poor solder mask area of the printed circuit board drawn in the step 2.1 on a negative film by using a photoplotter, wherein the size of the negative film is consistent with that of the printed circuit board.
According to some embodiments of the invention, step 4 specifically comprises the steps of: step 4.1, aligning the negative film with the printed circuit board; and 4.2, fixing the bottom sheet and the printed circuit board by using an adhesive tape with viscosity.
According to some embodiments of the invention, step 6 comprises in particular the steps of: 6.1, loosening and taking down the adhesive tape for fixing the bottom sheet and the printed circuit board; step 6.2, lifting the bottom plate upwards in parallel with the surface of the printed circuit board; and 6.3, drying and curing the repaired printed circuit board.
According to some embodiments of the invention, step 5 is embodied as spraying the ink onto the hollowed-out area of the backsheet using a spray gun.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flow chart of a method in an embodiment of the invention.
Detailed Description
The embodiments of the invention will be described in detail hereinafter, examples of which are illustrated in the accompanying drawings, and the embodiments described hereinafter with reference to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless otherwise explicitly defined, terms such as fixing, removing, drawing and the like should be broadly understood, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, the present application provides a method for repairing a solder mask of a printed circuit board, including the steps of:
step 1, searching a bad area, and searching and identifying the bad area of the solder mask of the printed circuit board;
step 2, drawing a negative film, correspondingly drawing the poor area of the solder mask of the printed circuit board on the negative film, and forming a poor simulation area on the negative film;
step 3, processing the negative film, removing the bad simulation area of the negative film, and forming a hollow area on the negative film;
step 4, positioning, namely fixing the relative position of the negative and the printed circuit board;
step 5, repairing, namely spraying ink to the hollow area of the negative;
and 6, post-processing, namely removing the negative plate and drying the repaired printed circuit board.
The method can be understood that the method realizes the repair of the poor area of the solder mask of the printed circuit board by drawing the poor area of the printed circuit board on the negative plate, forming the poor simulation area on the negative plate, hollowing out the poor simulation area, fixing the negative plate and the poor printed circuit board, filling ink into the poor area and then carrying out post-treatment. The method for repairing the poor solder mask area of the printed circuit board can avoid scrapping of the poor printed circuit board and integral reworking of the poor printed circuit board solder mask, and save production cost. And the steps of drawing the bad area and hollowing out are completed through computer control in the process, so that compared with the step of manually repairing the bad area of the solder mask, the method is more accurate, the appearance effect after repairing is better, and the production efficiency is higher.
In some embodiments of the present invention, step 2 specifically includes the following steps: 2.1, drawing the outline of the poor solder mask area of the printed circuit board by using a CAM tool; and 2.2, correspondingly drawing the poor area of the solder mask of the printed circuit board drawn in the step 2.1 on a negative film by using a photo-drawing machine, wherein the size of the negative film is consistent with that of the printed circuit board. The poor solder mask area of the printed circuit board is drawn in the corresponding area of the negative film by the CAM and the optical drawing machine, so that the outline of the poor area can be drawn more accurately, and errors are reduced.
In some embodiments of the present invention, the apparatus used in step 3 for removing the defective simulation area on the negative may be a laser cutting machine, a wire cutting machine, or the like, and the use of this apparatus can make the removal of the defective area on the negative more accurate.
In some embodiments of the present invention, step 4 specifically includes the following steps: step 4.1, aligning the negative film with the printed circuit board; and 4.2, fixing the bottom sheet and the printed circuit board by using an adhesive tape with viscosity. The adhesive tape is used for fixing the bottom sheet and the printed circuit board more quickly, the operation is simpler and more convenient, and the cost is lower.
In some embodiments of the invention, step 5 is embodied as spraying the ink onto the hollowed-out area of the backsheet using a spray gun. The step 6 specifically comprises the following steps: 6.1, loosening and taking down the adhesive tape for fixing the bottom sheet and the printed circuit board; step 6.2, lifting the bottom plate upwards in parallel with the surface of the printed circuit board; and 6.3, drying and curing the repaired printed circuit board. The film is lifted upwards in parallel with the surface of the printed circuit board, so that the friction between the film and the repaired solder mask of the printed circuit board can be reduced, and the repaired solder mask can be better ensured not to be damaged in appearance.
In some embodiments of the present invention, the present application provides a method for repairing a solder mask of a printed circuit board, comprising the steps of:
step 1, searching a bad area, and searching and identifying the bad area of the solder mask of the printed circuit board;
step 2, drawing the outline of the poor solder mask area of the printed circuit board by using a CAM tool;
step 3, correspondingly drawing the poor area of the solder mask of the printed circuit board drawn in the step 2.1 on a negative film by using a photoplotter, wherein the size of the negative film is consistent with that of the printed circuit board;
step 4, processing the negative plate, removing the bad simulation area of the negative plate by using a laser cutting machine, and forming a hollow area on the negative plate;
step 5, aligning the negative film with the printed circuit board;
step 6, fixing the bottom sheet and the printed circuit board by using an adhesive tape with viscosity;
step 7, repairing, namely spraying ink to the hollowed-out area of the negative film by using a spray gun;
step 8, loosening and taking down the adhesive tape for fixing the bottom sheet and the printed circuit board;
step 9, lifting the bottom plate upwards parallel to the surface of the printed circuit board;
and step 10, drying and curing the repaired printed circuit board.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (5)
1. A method for repairing a solder mask of a printed circuit board is characterized by comprising the following steps:
step 1, searching a bad area, and searching and identifying the bad area of the solder mask of the printed circuit board;
step 2, drawing a negative film, correspondingly drawing the poor area of the solder mask of the printed circuit board on the negative film, and forming a poor simulation area on the negative film;
step 3, processing the negative film, removing the bad simulation area of the negative film, and forming a hollow area on the negative film;
step 4, positioning, namely fixing the relative position of the negative and the printed circuit board;
step 5, repairing, namely spraying ink to the hollow area of the negative;
and 6, post-processing, namely removing the negative plate and drying the repaired printed circuit board.
2. The method for repairing the solder mask of the printed circuit board according to claim 1, wherein the step 2 specifically comprises the following steps:
2.1, drawing the outline of the poor solder mask area of the printed circuit board by using a CAM tool;
and 2.2, correspondingly drawing the poor area of the solder mask of the printed circuit board drawn in the step 2.1 on a negative film by using a photo-drawing machine, wherein the size of the negative film is consistent with that of the printed circuit board.
3. The method for repairing the solder mask of the printed circuit board according to claim 1, wherein the step 4 specifically comprises the following steps:
step 4.1, aligning the negative film with the printed circuit board;
and 4.2, fixing the bottom sheet and the printed circuit board by using an adhesive tape with viscosity.
4. The method for repairing a solder mask of a printed circuit board according to claim 3, wherein the step 6 specifically comprises the following steps:
6.1, loosening and taking down the adhesive tape for fixing the bottom sheet and the printed circuit board;
step 6.2, lifting the bottom plate upwards in parallel with the surface of the printed circuit board;
and 6.3, drying and curing the repaired printed circuit board.
5. The method for repairing solder mask of PCB as claimed in claim 1, wherein step 5 is performed by spraying ink onto the hollowed area of the substrate by using a spray gun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010114925.4A CN111405776B (en) | 2020-02-25 | 2020-02-25 | Method for repairing solder mask of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010114925.4A CN111405776B (en) | 2020-02-25 | 2020-02-25 | Method for repairing solder mask of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111405776A CN111405776A (en) | 2020-07-10 |
| CN111405776B true CN111405776B (en) | 2021-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010114925.4A Active CN111405776B (en) | 2020-02-25 | 2020-02-25 | Method for repairing solder mask of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113784534A (en) * | 2021-08-13 | 2021-12-10 | 苏州科韵激光科技有限公司 | Open circuit repairing method and open circuit repairing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080005718A (en) * | 2006-07-10 | 2008-01-15 | 주식회사 하이닉스반도체 | Method for repairing defect of patterns of reticle |
| CN102576405B (en) * | 2009-07-06 | 2014-09-17 | 卡姆特有限公司 | A system and a method for solder mask inspection |
| CN203400825U (en) * | 2013-05-13 | 2014-01-22 | 昱鑫科技(苏州)有限公司 | Solder mask ink filling machine for PCB (printed circuit board) |
| CN108668440B (en) * | 2017-03-29 | 2021-02-26 | 博敏电子股份有限公司 | Reworking method for poor solder mask plug hole of finished circuit board |
| CN106982512A (en) * | 2017-05-22 | 2017-07-25 | 博敏电子股份有限公司 | A kind of bad reworking method of circuit board finished product welding resistance consent |
| CN107708322B (en) * | 2017-10-30 | 2021-06-15 | 大连崇达电路有限公司 | Rework repairing method for solder resisting bridge falling |
| CN110678003B (en) * | 2019-10-18 | 2020-07-21 | 深圳劲鑫科技有限公司 | PCB solder mask detection and repair integrated machine and process method |
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