CN111403996A - Solid laser packaging structure and preparation method thereof - Google Patents

Solid laser packaging structure and preparation method thereof Download PDF

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Publication number
CN111403996A
CN111403996A CN202010187874.8A CN202010187874A CN111403996A CN 111403996 A CN111403996 A CN 111403996A CN 202010187874 A CN202010187874 A CN 202010187874A CN 111403996 A CN111403996 A CN 111403996A
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CN
China
Prior art keywords
crystal module
light source
excitation light
boss
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010187874.8A
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Chinese (zh)
Inventor
冯新凯
梁万国
古克义
陈怀熹
张新彬
李广伟
黄玉宝
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Fujian Institute of Research on the Structure of Matter of CAS
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Fujian Institute of Research on the Structure of Matter of CAS
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Application filed by Fujian Institute of Research on the Structure of Matter of CAS filed Critical Fujian Institute of Research on the Structure of Matter of CAS
Priority to CN202010187874.8A priority Critical patent/CN111403996A/en
Publication of CN111403996A publication Critical patent/CN111403996A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)

Abstract

The invention discloses a packaging structure of a solid laser and a preparation method thereof, belongs to the technical field of lasers, and can solve the problems that the existing packaging structure needs a positioning process and the working precision of laser components is reduced. The structure includes: the crystal module is positioned on an emergent light path of the excitation light source; the heat sink is provided with a positioning structure, and the excitation light source and the crystal module are arranged on the positioning structure. The invention is used for packaging the solid laser.

Description

Solid laser packaging structure and preparation method thereof
Technical Field
The invention relates to a solid laser packaging structure and a preparation method thereof, belonging to the technical field of lasers.
Background
Laser light is another important invention of human beings since the 20 th century, and has attracted extensive attention as soon as it appears. The solid laser has the advantages of small volume, convenient use, large output power and the like, and has great application in the fields of military affairs, processing, medical treatment and scientific research. The packaging of the solid laser determines the performance of a laser, and the good packaging enables the laser to work more stably, so the packaging of the solid laser is still a research hotspot.
In the existing laser packaging structure, when each part of a laser is fixed, the position of each part needs to be manually determined, the process is time-consuming and labor-consuming, the packaging yield is often influenced due to low measurement precision, the part is fixed on a heat sink by adopting an overall heating mode in the existing packaging structure preparation method, and the problem of reduction of precision of the laser part due to overhigh local temperature exists in the fixing mode.
Disclosure of Invention
The invention provides a packaging structure of a solid laser, which can solve the problems that the existing packaging structure needs a positioning process and the working precision of laser parts is reduced.
One aspect of the present invention provides a solid laser package structure, where the package structure includes: the device comprises a closed cavity, a heat sink, an excitation light source and a crystal module, wherein the heat sink, the excitation light source and the crystal module are arranged in the closed cavity; the heat sink is provided with a positioning structure, and the excitation light source and the crystal module are arranged on the positioning structure.
Optionally, the locating feature is a boss.
Optionally, the structure further comprises: the heat conducting block is provided with a groove; the groove of the heat conduction block is fixedly connected with the boss; the excitation light source and the crystal module are arranged on the surface of the heat conduction block far away from the boss.
Optionally, the crystal module comprises: the first excitation crystal is fixed on the heat conduction block.
Optionally, the crystal module further comprises: a second excitation crystal and a metal substrate; the first excitation crystal and the second excitation crystal are both fixed on the metal substrate; the metal substrate is connected with the heat conduction block.
Optionally, the enclosed cavity comprises: a housing, a first end cap and a second end cap; the first end cover and the second end cover are respectively connected with the shell in a matching way; the surface of the heat sink far away from the positioning structure is in contact connection with the inner surface of the shell.
Optionally, a countersunk hole is formed in the first end cover, and the countersunk hole is used for mounting a lens; the central axes of the excitation light source, the excitation crystal and the counter sink are all coincident.
The invention also provides a preparation method of the solid laser packaging structure, which comprises the following steps: a boss is arranged on the heat sink, and a groove is arranged on the heat conducting block; fixedly connecting the groove with the boss; arranging a crystal module on an emergent light path of an excitation light source, and fixing the excitation light source and the crystal module on the surface of the heat-conducting block far away from the boss; and encapsulating the heat sink, the excitation light source and the crystal module in a closed cavity.
Optionally, the fixedly connecting the groove and the boss includes: placing a soldering lug at the joint of the boss and the groove; and connecting the heat sink and the heat conducting block with a constant current power supply for welding.
Optionally, the welding current is 10-20A, and the welding time is 1-20 s.
The invention can produce the beneficial effects that:
the application provides a laser instrument packaging structure, through seting up location structure on the surface at heat sink, and set up excitation light source and crystal module on location structure, at last with heat sink, excitation light source and crystal module set up in the closed cavity, realize solid laser's encapsulation, wherein, through seting up location structure on heat sink, can realize excitation light source and crystal module's location, compare in prior art, the packaging structure of this application, need not to carry out the process of part location again, and fix a position accurately, simple easy operation, this very big improvement laser instrument packaging efficiency and the yields of encapsulation.
Drawings
Fig. 1 is a block diagram of a solid state laser package provided for an embodiment of the present invention;
FIG. 2 is a block diagram of a crystal module provided for an embodiment of the present invention;
FIG. 3 is a block diagram of an enclosed cavity provided for an embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing a solid laser package structure according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.
As shown in fig. 1, a solid laser package structure provided in an embodiment of the present invention includes: the device comprises a closed cavity, a heat sink 1, an excitation light source 2 and a crystal module 3, wherein the heat sink 1, the excitation light source 2 and the crystal module 3 are arranged in the closed cavity, and the crystal module 3 is positioned on an emergent light path of the excitation light source 2; the heat sink 1 is provided with a positioning structure, and the excitation light source 2 and the crystal module 3 are arranged on the positioning structure.
Among them, the heat sink 1 is generally a high thermal conductive material; the excitation light source 2 may be a laser diode; the positioning structure may be a bump or a groove opened on the surface of the heat sink 1. Specifically, when the positioning structure is a bump, the bump can be in a cuboid shape, and the height of the bump is 0.5-2 mm; when the location structure is the recess, the recess can be the cuboid shape, and the degree of depth of recess is 0.5 ~ 2 mm.
In practical application, set up location structure on heat sink 1's surface, and set up excitation light source 2 and crystal module 3 on location structure, at last with heat sink 1, excitation light source 2 and crystal module 3 set up in the closed cavity, form solid laser's packaging structure, this application is through setting up location structure on heat sink 1, fix a position excitation light source 2 and crystal module 3's fixed position, compare in prior art, the packaging structure of this application, need not to carry out the process of part location again, and fix a position accurately, simple easy operation, this very big improvement the yields of laser instrument encapsulation efficiency and encapsulation.
The packaging structure provided by the embodiment of the invention also comprises: the heat conducting block 4 is provided with a groove; the groove and the boss of the heat conduction block 4 are fixedly connected; the excitation light source 2 and the crystal module 3 are arranged on the surface of the heat conducting block 4 far away from the boss.
The heat conducting block 4 may be made of a high thermal conductivity material such as copper, which is not limited in this application. In addition, when the positioning structure is a groove, the heat conducting block 4 can be provided with a boss matched with the groove.
In practical application, the heat conducting block 4 is provided with a groove matched with a boss on the heat sink 1, the heat conducting block 4 is fixed on the heat sink through the connection of the groove and the boss, and the excitation light source 2 and the crystal module 3 are arranged on the surface of the heat conducting block 4 far away from the boss. The heat conducting block 4 can make the excitation light source 2 and the crystal module 3 at the same height, so as to improve the excitation efficiency of the laser.
In the package structure provided by the embodiment of the present invention, the crystal module 3 includes the first excitation crystal 8, and the first excitation crystal 8 is fixed on the heat conduction block 4. The crystal module further includes: a second excitation crystal 9 and a metal base 11; the first excitation crystal 8 and the second excitation crystal 9 are both fixed on a metal substrate 11; the metal base 11 is connected to the heat conductive block 4.
As shown in fig. 2, the crystal module 3 may include a single excitation crystal to generate laser, and optionally, the crystal module 3 may further include two or more crystals, where two or more lasers are disposed, and may include crystals with different functions, such as a frequency doubling crystal, and the like, and may tune the laser to obtain lasers with different bands, and furthermore, if the crystal module employs multiple lasers, the multiple lasers may be fixed on the metal base 11 by bonding or the like, and the upper end is covered with the metal sheet 10 to form an integral crystal module, so as to facilitate assembly and disassembly.
In the solid laser package structure provided in the embodiment of the present invention, the sealed cavity includes: a housing 6, a first end cap 7 and a second end cap 12; the first end cover 7 and the second end cover 12 are respectively matched and connected with the shell 6; the surface of the heat sink 1 remote from the positioning structure is in contact connection with the inner surface of the housing 6.
As shown in fig. 3, the inside of the housing 6 is provided with an internal thread, and the outer shape of the housing 6 may be a cylinder or a rectangular parallelepiped, which is not limited by the present invention. The first end cap 7 and the second end cap 12 may be threadedly fitted between the housings and sealed with a gasket. The heat sink 1 is provided with an external thread matched with the shell 6 on the surface far away from the positioning structure, and the heat sink 1 and the shell 6 can be connected through the thread.
Further, a sealing plug is disposed on the second end cap 12 for connecting two electrodes of the excitation light source 2. Specifically, the sealing insert may be a sealing aviation plug, or may be a pin made of glass sealing or sealant.
In the solid laser packaging structure provided by the embodiment of the invention, the first end cover 7 is provided with a countersunk hole for mounting a lens; the central axes of the excitation light source 2, the crystal module 3 and the counter sink are all coincident.
In practical application, the first end cap 7 is provided with a countersunk hole, the lens 5 can be fixed on the countersunk hole by glue, and the central axis of the countersunk hole coincides with the central axes of the excitation light source 2 and the crystal module 3, and is used for the penetration of laser.
On the other hand, an embodiment of the present invention provides a method for manufacturing a solid laser package structure, as shown in fig. 4, including:
step S100: a boss is arranged on the heat sink 1, a groove is arranged on the heat conducting block 4, and the groove is fixedly connected with the boss;
step S200: arranging the crystal module 3 on an emergent light path of the excitation light source 2, and fixing the excitation light source 2 and the crystal module 3 on the surface of the heat-conducting block 4 far away from the boss;
step S300: the heat sink 1, the excitation light source 2 and the crystal module 3 are packaged in a closed cavity.
Wherein, with recess and boss fixed connection, specifically do: and (3) placing a soldering lug with the thickness of 0.03-0.06 mm at the joint of the boss and the groove, then respectively adding the heat sink 1 and the heat conducting block 4 to the positive electrode and the negative electrode (without positive and negative parts) of the constant current source, setting the current of the constant current source to be 10-20A, and turning on the power supply for 1-20 s to complete welding. Compare in prior art through the fixed mode that adopts whole heating melting, this application reaches fixed connection's effect through the welded mode, can avoid whole heating to have local high temperature to influence the work precision of each part of laser instrument.
The above embodiments are described in detail, and although the present invention has been described with reference to preferred embodiments, it should be understood that the present invention is not limited thereto, and various changes and modifications can be made by those skilled in the art without departing from the scope of the present invention.

Claims (10)

1. A solid state laser package, comprising: the device comprises a closed cavity, a heat sink, an excitation light source and a crystal module, wherein the heat sink, the excitation light source and the crystal module are arranged in the closed cavity;
the heat sink is provided with a positioning structure, and the excitation light source and the crystal module are arranged on the positioning structure.
2. The package structure of claim 1, wherein the positioning structure is a boss.
3. The package structure of claim 2, wherein the structure further comprises: the heat conducting block is provided with a groove;
the groove of the heat conduction block is fixedly connected with the boss;
the excitation light source and the crystal module are arranged on the surface of the heat conduction block far away from the boss.
4. The package structure of claim 3, wherein the crystal module comprises: the first excitation crystal is fixed on the heat conduction block.
5. The package structure of claim 4, wherein the crystal module further comprises: a second excitation crystal and a metal substrate;
the first excitation crystal and the second excitation crystal are both fixed on the metal substrate;
the metal substrate is connected with the heat conduction block.
6. The package structure of claim 1, wherein the enclosed cavity comprises: a housing, a first end cap and a second end cap;
the first end cover and the second end cover are respectively connected with the shell in a matching way;
the surface of the heat sink far away from the positioning structure is in contact connection with the inner surface of the shell.
7. The package structure according to claim 6, wherein the first end cap is provided with a counter bore for mounting a lens;
the central axes of the excitation light source, the crystal module and the counter sink are all coincident.
8. A method for preparing a solid laser packaging structure is characterized by comprising the following steps:
arranging a boss on the heat sink, arranging a groove on the heat conducting block, and fixedly connecting the groove with the boss;
arranging a crystal module on an emergent light path of an excitation light source, and fixing the excitation light source and the crystal module on the surface of the heat-conducting block far away from the boss;
and encapsulating the heat sink, the excitation light source and the crystal module in a closed cavity.
9. The method of claim 8, wherein the fixedly connecting the groove with the boss comprises:
placing a soldering lug at the joint of the boss and the groove;
and connecting the heat sink and the heat conducting block with a constant current power supply for welding.
10. The method for preparing the alloy material according to claim 9, wherein the welding current is 10-20A, and the welding time is 1-20 s.
CN202010187874.8A 2020-03-17 2020-03-17 Solid laser packaging structure and preparation method thereof Pending CN111403996A (en)

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Application Number Priority Date Filing Date Title
CN202010187874.8A CN111403996A (en) 2020-03-17 2020-03-17 Solid laser packaging structure and preparation method thereof

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Application Number Priority Date Filing Date Title
CN202010187874.8A CN111403996A (en) 2020-03-17 2020-03-17 Solid laser packaging structure and preparation method thereof

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CN111403996A true CN111403996A (en) 2020-07-10

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546478A (en) * 1980-06-17 1985-10-08 Matsushita Electric Industrial Co., Ltd. Semiconductor laser
US4914667A (en) * 1987-01-21 1990-04-03 American Telephone And Telegraph Company, At&T Bell Laboratories Hybrid laser for optical communications, and transmitter, system, and method
US5185752A (en) * 1992-02-18 1993-02-09 Spectra Diode Laboratories, Inc. Coupling arrangements for frequency-doubled diode lasers
US5357536A (en) * 1993-05-07 1994-10-18 Xerox Corporation Method and apparatus for the positioning of laser diodes
US6240113B1 (en) * 1998-02-27 2001-05-29 Litton Systems, Inc. Microlaser-based electro-optic system and associated fabrication method
CN104538838A (en) * 2014-11-25 2015-04-22 青岛镭创光电技术有限公司 Mintype packaging self-frequency-doubling laser
CN109378692A (en) * 2018-12-29 2019-02-22 福建中科晶创光电科技有限公司 A kind of miniaturization high efficiency green light crystal conversion module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546478A (en) * 1980-06-17 1985-10-08 Matsushita Electric Industrial Co., Ltd. Semiconductor laser
US4914667A (en) * 1987-01-21 1990-04-03 American Telephone And Telegraph Company, At&T Bell Laboratories Hybrid laser for optical communications, and transmitter, system, and method
US5185752A (en) * 1992-02-18 1993-02-09 Spectra Diode Laboratories, Inc. Coupling arrangements for frequency-doubled diode lasers
US5357536A (en) * 1993-05-07 1994-10-18 Xerox Corporation Method and apparatus for the positioning of laser diodes
US6240113B1 (en) * 1998-02-27 2001-05-29 Litton Systems, Inc. Microlaser-based electro-optic system and associated fabrication method
CN104538838A (en) * 2014-11-25 2015-04-22 青岛镭创光电技术有限公司 Mintype packaging self-frequency-doubling laser
CN109378692A (en) * 2018-12-29 2019-02-22 福建中科晶创光电科技有限公司 A kind of miniaturization high efficiency green light crystal conversion module

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