CN111403327A - Silicon wafer conveying equipment on sputtering platform and using method - Google Patents
Silicon wafer conveying equipment on sputtering platform and using method Download PDFInfo
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- CN111403327A CN111403327A CN202010232461.7A CN202010232461A CN111403327A CN 111403327 A CN111403327 A CN 111403327A CN 202010232461 A CN202010232461 A CN 202010232461A CN 111403327 A CN111403327 A CN 111403327A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 175
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 175
- 239000010703 silicon Substances 0.000 title claims abstract description 175
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 13
- 235000012431 wafers Nutrition 0.000 claims description 124
- 230000007306 turnover Effects 0.000 claims description 12
- 230000009471 action Effects 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 description 19
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 206010024796 Logorrhoea Diseases 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/203—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses silicon wafer conveying equipment on a sputtering platform, and relates to the technical field of silicon wafer processing. In this application, a silicon wafer conveying apparatus on a sputtering table includes: the machine body is arranged on a plane, a conveying wheel is arranged inside the machine body, and the conveying wheel is fixedly connected with the machine body; the placer sets up in one side of organism, and the placer is connected with the organism, and the placer includes: the shell is arranged above the machine body, the shell is matched and connected with the machine body, and the interior of the shell is hollow; the placing plates are arranged in the shell, and gaps are arranged among the placing plates; the setting of guiding device is in the inside of organism, guiding device and organism fixed connection, and guiding device includes: the leading-out plate is arranged in the machine body, the leading-out plate is matched with the gap of the placing plate, and the leading-out plate can be inserted into the gap of the placing plate; the driving device is arranged inside the machine body. The silicon wafer conveying device is used for solving the problem that in the prior art, the silicon wafer can collide with the conveying device in the conveying process, so that the silicon wafer is damaged easily, and the processing efficiency of the silicon wafer cannot be effectively improved.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing, in particular to silicon wafer conveying equipment on a sputtering table and a using method thereof.
Background
At present, solar energy has become a renewable energy source widely used by human beings, and a solar cell is a main tool for utilizing the solar energy and has the function of directly converting the solar energy into electric energy.
The conversion efficiency of a solar cell is the ratio of the generated power of the cell to the incident light power. Silicon wafers are the main material of solar cells, and in order to improve the conversion efficiency of solar cells, the silicon wafers need to be subjected to multiple processes or processed.
In the production process of the solar silicon wafer, the silicon wafers are usually stored in a silicon wafer rack, and are taken out one by one during production so as to be matched with the subsequent production and manufacturing steps of a sputtering table. In the prior art, the silicon wafer is generally taken out manually, namely, a worker takes a simple sucker to suck the silicon wafer, the operation is slow in wafer taking efficiency, inconvenient to operate, prone to unstable adsorption damage of the silicon wafer and unsuitable for mass processing production, collision between the silicon wafer and a feeding device can occur even if automatic equipment is adopted for feeding, the silicon wafer can collide with the device when the silicon wafer does not move along a fixed track of the feeding device, the silicon wafer is finally and directly broken, the damage rate is increased, and therefore the existing feeding device needs to be improved.
Disclosure of Invention
The invention aims to provide silicon wafer conveying equipment on a sputtering table, which is used for solving the problem that in the prior art, silicon wafers are easy to damage due to collision with a conveying device in the conveying process, and the processing efficiency of the silicon wafers cannot be effectively improved.
In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions: a silicon wafer conveying apparatus on a sputtering table, comprising: the machine body is arranged on a plane, and a conveying wheel is arranged inside the machine body and fixedly connected with the machine body; placer, this placer sets up the one side at this organism, and this placer is connected with this organism, and this placer includes: the shell is arranged above the machine body, the shell is connected with the machine body in a matching way, and the interior of the shell is hollow; the placing plates are arranged inside the shell, gaps are formed among the placing plates, and the gaps of the placing plates are used for storing silicon wafers; the guiding device, this guiding device sets up in the inside of this organism, this guiding device and this organism fixed connection, and this guiding device includes: the guiding plate is arranged inside the machine body and matched with the gap of the placing plate, and the guiding plate can be inserted into the gap of the placing plate; and the driving device is arranged in the machine body and is fixedly connected with the machine body.
In above-mentioned technical scheme, this application adopts placer, the eduction gear, drive arrangement, can reduce when the silicon chip material loading that the manual work caused the damaged operating efficiency of silicon chip when getting the silicon chip to put easily slow, arrange the silicon chip through the placer through the first processing earlier, then when the conveyer belt through placer and eduction gear's cooperation is in the coplanar at placer and organism, the eduction gear exports the inside silicon chip of placer through drive arrangement, carry out automatic silicon chip ejection of compact, and also can reduce the damaged condition of silicon chip and need not to adopt the sucking disc to carry out taking out of silicon chip in the ejection of compact of silicon chip, the damaged waste of resources that reduces of silicon chip that the condition that sucking disc and silicon chip do not adsorb completely has been prevented.
Further, in an embodiment of the present invention, the body includes: the conveying belt is arranged in the machine body and is matched and connected with the conveying wheels, a plurality of conveying wheels are arranged, the conveying wheels are distributed in the machine body at uniform intervals, and the conveying wheels are connected in series by the conveying belt; the falling channel is arranged inside the machine body and integrally formed with the machine body, and the falling channel is arranged in a groove inside the machine body; the turnover block is arranged inside the machine body, is connected with the falling channel and is arranged on the upper surface of the falling channel; the feeding channel is arranged in the machine body and integrally formed with the machine body, and the feeding channel is arranged in the machine body in a groove mode.
Further, in the embodiment of the present invention, the turnover blocks are provided in plurality, and the turnover blocks are arranged on the upper surface of the falling-back channel at uniform intervals; the feeding channel is matched with the falling channel, one end of the feeding channel is butted with one end of the falling channel, and the feeding channel and the falling channel form a complete through groove.
Further, in an embodiment of the present invention, the deriving means includes: the guide-out wheel is arranged below the guide-out plate and matched with the guide-out plate; the reset spring is arranged above the guide-out plate and fixedly connected with the guide-out plate, one end of the reset spring is connected with the guide-out plate, and the other end of the reset spring is connected with the machine body.
Further, in the embodiment of the invention, a groove is arranged inside the guiding-out plate, the groove of the guiding-out plate is arranged in an arc shape, and the arc-shaped groove of the guiding-out plate is matched with the guiding-out wheel; rectangular plates are arranged on the periphery of the guide-out wheel, the rectangular plates of the guide-out wheel are matched with the arc-shaped grooves of the guide-out plate, and a plurality of rectangular plates are arranged on the periphery of the guide-out wheel; the rectangular plate of a plurality of these leading-out wheel peripheries becomes evenly distributed in the periphery of this leading-out wheel, and the arc recess that the rectangular plate contact this leading-out plate of this leading-out wheel when this leading-out wheel rotates promotes this leading-out plate to this space of placing the board and removes.
Further, in an embodiment of the present invention, the driving device includes: the rotating wheel is arranged inside the machine body, is matched and connected with the leading-out device and forms the same circle center with the leading-out device; the first clamping plate is arranged on the periphery of the rotating wheel and matched with the rotating wheel; the second clamping plate is arranged on the periphery of the rotating wheel and matched with the rotating wheel, the second clamping plate corresponds to the first clamping plate, and one end of the second clamping plate is connected with one end of the first clamping plate; the first connecting rod is arranged on one side of the first clamping plate, and the other end of the first clamping plate is connected with one end of the first connecting rod; the second connecting rod is arranged on one side of the second clamping plate, and the other end of the second clamping plate is connected with one end of the second connecting rod; the limiting spring is arranged on the outer side of the rotating wheel, one end of the limiting spring is connected with the second clamping plate, and the other end of the limiting spring is connected with the first clamping plate; the third connecting rod is arranged on one side of the rotating wheel, one end of the third connecting rod is connected with the rotating wheel in a matched mode, the other end of the third connecting rod is provided with a binding plate, and the binding plate is connected with the bottom surface of the silicon wafer.
Further, in the embodiment of the present invention, the other end of the first connecting rod and the other end of the second connecting rod are respectively connected to a driven rod, the driven rods are arranged in a Y shape, the two upper ends of the driven rods are respectively connected to the first connecting rod and the second connecting rod, and the lower ends of the driven rods are connected to a control motor.
Further, in the embodiment of the present invention, a wall surface of the first clamping plate contacting with the rotating wheel is arranged in an arc shape, and the arc-shaped surface of the first clamping plate matches with the outer periphery of the rotating wheel; the wall surface of the second clamping plate, which is contacted with the rotating wheel, is arranged in an arc shape, and the arc-shaped surface of the second clamping plate is matched with the periphery of the rotating wheel; the first clamping plate and the second clamping plate are controlled by the driven rod, the driven rod moves leftwards to drive the second connecting rod and the first connecting rod to move, and the second connecting rod and the first connecting rod respectively drive the second clamping plate and the first viewing plate to lean against the periphery of the rotating wheel.
Further, in the embodiment of the present invention, when the rotating wheel rotates, the third connecting rod and the rotating wheel rotate eccentrically, the third connecting rod pushes the attachment plate to translate, and the attachment plate drives the silicon wafer to translate.
The embodiment of the invention also discloses a using method of the silicon wafer conveying equipment on the sputtering platform, which comprises the following steps:
starting the placing device, arranging the placing device on the left side of the machine body, enabling a discharge port of the placing device to be flush with a conveying wheel of the machine body, and starting the guiding device after the placing device is matched with the machine body;
the rotating wheel of the driving device rotates to drive the guide-out wheel to rotate, the rectangular plate on the periphery of the guide-out wheel is attached to the guide-out plate while the guide-out wheel rotates, the rectangular plate on the periphery of the guide-out wheel pushes the guide-out plate to move to a gap of the placing plate, the rectangular plate on the periphery of the guide-out wheel pushes the silicon wafer in the gap of the placing plate to move to the conveying belt, and the silicon wafer is fed through the conveying belt;
when the leading-out plate pushes the silicon wafer to move, a third connecting rod connected with the leading-out plate pushes the attaching plate to move, the attaching plate drives the silicon wafer to move towards the conveying belt, and after the silicon wafer moves to the conveying belt, the placing plate adjusts the distance;
the placing plate moves up and down through a lifting connecting rod arranged on the side surface, after the silicon wafers in the placing plate are completely separated, the placing plate adjusts the internal space through the lifting connecting rod, and the first clamping plate and the second clamping plate move when the internal space is adjusted by the placing plate;
the first clamping plate and the second clamping plate are provided with a swing motor through the inside of the machine body to drive a driven rod to rotate, a second connecting rod and the first connecting rod move in a relative direction through the rotation of the driven rod, the second connecting rod and the first connecting rod move in a relative direction to drive the second clamping plate and the first clamping plate to approach a rotating wheel, the periphery of the rotating wheel is attached to the arc-shaped wall surfaces of the second clamping plate and the first clamping plate to pause the rotating wheel to drive a guide-out wheel to rotate, and the plates are placed to adjust the internal space when the guide-out wheel is paused to rotate;
after the adjustment of the internal space of the placing plate is completed, another layer of silicon wafer placed inside the placing plate and the leading-out plate are located on the same plane, the swing motor resets when another layer of silicon wafer placed inside the placing plate and the leading-out plate are located on the same plane, so that the driven rod loses the action on the second connecting rod and the first connecting rod, then the second clamping plate and the first clamping plate are in contact with the rotating wheel to be fixed, the leading-out wheel rotates again to drive the leading-out plate to continue leading out the silicon wafer, meanwhile, the third connecting rod also continues to move, and the steps are repeated.
The invention has the beneficial effects that: firstly, the silicon wafer conveying equipment on the sputtering platform can be more conveniently taken out from the interior of a device for placing the silicon wafer when the silicon wafer is processed by multiple working procedures, so that the silicon wafer processing efficiency is improved, and the damage condition of the silicon wafer is reduced. Firstly, deposit the silicon chip that has processed through placer, when the silicon chip was deposited through placer, the inside place plate surface of placer set up the production that the sponge layer reduced silicon chip surface mar, put into simultaneously at the silicon chip and place the board after, thereby the multilayer is placed and can be adjusted through the lifting connecting rod between the board and make and be in the silicon chip of placing inboard can not take place the corner that the displacement leads to the silicon chip and jump garrulous. Second, if can't get when taking out through the manual work in order to reduce the silicon chip when the silicon chip carries out secondary operation and put the silicon chip and reduced machining efficiency if getting fast, and the manual work is got and is put the silicon chip and cause the silicon chip corner to collide the device and cause the corner to jump garrulous easily, through adopting the eduction gear, a drive arrangement, the placer cooperation, when the silicon chip in the placer is in the coplanar with the conveyer belt of organism, the eduction gear passes through drive arrangement's swiveling wheel rotation, it rotates to drive the leading-out wheel when the swiveling wheel rotates, and the rectangular plate of leading-out wheel periphery can laminate with the arcwall face of leading-out plate mutually in leading-out wheel pivoted, after the rectangular plate of leading-out wheel periphery is laminated with the leading-out plate, the leading-out plate can be to placing the silicon chip removal in the board, the silicon chip can shift out to the conveyer belt removal when the leading-out plate removes to the silicon chip, thereby realize the automatic shifting out of The piece shifts out the direction skew and causes the silicon chip to collide conveyer belt or external device and cause the silicon chip corner to jump garrulous, and through placer and eduction gear complex use, after eduction gear exports first silicon chip, eduction gear can lock through drive arrangement's first cardboard and second cardboard, the silicon chip that has shifted out after the locking can not take place the laminating because of not yet moving the conveyer belt completely and jam with the silicon chip at rear to improve the continuity that the silicon chip carried.
Drawings
The present application is further described below with reference to the drawings and examples.
FIG. 1 is a front view of a silicon wafer transfer apparatus on a sputtering station according to an embodiment of the present invention.
FIG. 2 is a schematic structural diagram of a lead-out device of the silicon wafer conveying equipment on the sputtering table according to the embodiment of the invention.
FIG. 3 is a schematic structural diagram of a driving device of a silicon wafer conveying apparatus on a sputtering table according to an embodiment of the present invention.
FIG. 4 is a schematic diagram of the internal structure of the substrate of the silicon wafer conveying device on the sputtering table according to the embodiment of the invention.
FIG. 5 is a schematic structural diagram of a cover removing device of a silicon wafer conveying apparatus on a sputtering table according to an embodiment of the present invention.
FIG. 6 is a schematic structural diagram of an adjusting device of a silicon wafer conveying apparatus on a sputtering table according to an embodiment of the present invention.
FIG. 7 is a schematic diagram of the operation process of the silicon wafer conveying device on the sputtering platform according to the embodiment of the invention.
FIG. 8 is a schematic diagram of the operation process of the silicon wafer conveying device on the sputtering platform according to the embodiment of the invention
10. Body 101, conveyor belt 102, and conveyor wheel
103. A falling channel 104, a protective cover 105 and a turnover block
106. Feeding channel 20, placing device 201 and shell
202. Placing plate 30, cover removing device 301 and cover removing disc
40. Adjusting device 401, adjusting wheel 402, and adaptive wheel
403. Guide inner wheel 50, silicon chip 60 and inductor
70. Lead-out device 701, lead-out wheel 702, lead-out plate
703. Return spring 80, driving device 801, and rotary wheel
802. First cardboard 803, second cardboard 804, first connecting rod
805. A second connecting rod 806, a limit spring 807 and a third connecting rod
90. Cover opening device 901, control wheel 902 and extension bar
903. Jacking plate
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
The first embodiment is as follows:
as shown in fig. 1 and 2, the present embodiment discloses a silicon wafer 50 conveying device, which includes: the device comprises a machine body 10, a placing device 20, a shell 201, a leading-out device 70, a leading-out plate 702 and a driving device 80, wherein the machine body 10 is arranged on a plane, a conveying wheel 102 is arranged inside the machine body 10, and the conveying wheel 102 is fixedly connected with the machine body 10; placer 20, placer 20 sets up in one side of organism 10, and placer 20 is connected with organism 10, and placer 20 includes: the shell 201 is arranged above the machine body 10, the shell 201 is matched and connected with the machine body 10, and the interior of the shell 201 is hollow; the placing plates 202, the placing plates 202 are arranged inside the shell 201, gaps are arranged among the placing plates 202, and the gaps of the placing plates 202 are used for storing the silicon wafers 50; the guiding device 70, guiding device 70 sets up in the inside of organism 10, and guiding device 70 and organism 10 fixed connection, guiding device 70 includes: a guiding-out plate 702, wherein the guiding-out plate 702 is arranged inside the machine body 10, the guiding-out plate 702 is matched with the gap of the placing plate 202, and the guiding-out plate 702 can be inserted into the gap of the placing plate 202; and the driving device 80, the driving device 80 being arranged inside the machine body 10, the driving device 80 being fixedly connected with the machine body 10. The inductor 60 is arranged on the outer side of the machine body 10, the inductor 60 is an infrared inductor, whether the silicon wafer 50 is completely separated from the placing plate 202 is monitored through the infrared inductor, and if the silicon wafer 50 is completely separated from the placing plate 202, the driving device 80 locks the leading-out device 70 to prevent the follow-up silicon wafer from being repeatedly attached to the front silicon wafer.
By adopting the placing device 20, the leading-out device 70 and the driving device 80, the problem that the operation efficiency of damaging the silicon wafer 50 is low when the silicon wafer 50 is taken and placed manually can be reduced when the silicon wafer 50 is fed, the placing device 20 arranges the primarily processed silicon wafer 50 firstly, then the placing device 20 is matched with the leading-out device 70 when the placing device 20 is in the same plane with the conveyer belt 101 of the machine body 10, the leading-out device 70 leads out the silicon wafer 50 inside the placing device 20 through the driving device 80 to carry out automatic silicon wafer 50 discharging, the condition that the silicon wafer 50 is damaged can be reduced when the silicon wafer 50 is discharged, the silicon wafer 50 is not required to be taken out by adopting a sucker, the condition that the sucker and the silicon wafer 50 are not completely adsorbed is prevented, and the waste of resources is reduced.
Deposit the silicon chip 50 that has processed through placer 20, when silicon chip 50 deposited through placer 20, the inside board 202 surface of placing of placer 20 set up the sponge layer and reduces the production of silicon chip 50 surface mar, and simultaneously after placing board 202 is put into to silicon chip 50, thereby can adjust through the lifting link between the board 202 is placed to the multilayer thereby make be in place the inside silicon chip 50 of board 202 and can not take place the displacement thereby lead to the corner of silicon chip 50 to jump garrulous.
As shown in fig. 4, specifically, the body 10 includes: the automatic feeding machine comprises a conveying belt 101, a falling channel 103, a turnover block 105 and a feeding channel 106, wherein the conveying belt 101 is arranged inside a machine body 10, the conveying belt 101 is connected with a plurality of conveying wheels 102 in a matched mode, the plurality of conveying wheels 102 are distributed inside the machine body 10 at uniform intervals, the conveying wheels 102 are connected in series through the conveying belt 101, and 5 conveying wheels 102 are arranged; the falling back channel 103 is arranged inside the machine body 10, the falling back channel 103 and the machine body 10 are integrally formed, and the falling back channel 103 is arranged in a groove inside the machine body 10; the turning block 105 is arranged inside the machine body 10, the turning block 105 is connected with the falling back channel 103, and the turning block 105 is arranged on the upper surface of the falling back channel 103; the feeding passage 106 is disposed inside the machine body 10, the feeding passage 106 is integrally formed with the machine body 10, and the feeding passage 106 is recessed inside the machine body 10.
Specifically, a plurality of turnover blocks 105 are arranged, the turnover blocks 105 are arranged on the upper surface of the falling back channel 103 at uniform intervals, and 4 turnover blocks 105 are arranged; the feeding channel 106 is matched with the falling channel 103, one end of the feeding channel 106 is butted with one end of the falling channel 103, and the feeding channel 106 and the falling channel 103 form a complete through groove.
Specifically, the derivation means 70 includes: the device comprises a guide-out wheel 701 and a return spring 703, wherein the guide-out wheel 701 is arranged below a guide-out plate 702, and the guide-out wheel 701 is matched with the guide-out plate 702; the return spring 703 is disposed above the guiding plate 702, the return spring 703 is fixedly connected to the guiding plate 702, one end of the return spring 703 is connected to the guiding plate 702, and the other end of the return spring 703 is connected to the machine body 10.
Specifically, a groove is formed in the guide-out plate 702, the groove of the guide-out plate 702 is arranged in an arc shape, and the arc-shaped groove of the guide-out plate 702 is matched with the guide-out wheel 701; rectangular plates are arranged on the periphery of the leading-out wheel 701, the rectangular plates of the leading-out wheel 701 are matched with the arc-shaped grooves of the leading-out plate 702, and a plurality of rectangular plates are arranged on the periphery of the leading-out wheel 701; the rectangular plates on the periphery of the plurality of leading-out wheels 701 are uniformly distributed on the periphery of the leading-out wheels 701, and when the leading-out wheels 701 rotate, the rectangular plates of the leading-out wheels 701 contact the arc-shaped grooves of the leading-out plates 702 to push the leading-out plates 702 to move towards the gaps of the placing plates 202.
As shown in fig. 1 and 3, specifically, the driving device 80 includes: the rotating wheel 801, the first clamping plate 802, the second clamping plate 803, the first connecting rod 804, the second connecting rod 805, the limiting spring 806 and the third connecting rod 807 are arranged inside the machine body 10, the rotating wheel 801 is connected with the guiding device 70 in a matching manner, and the rotating wheel 801 and the guiding device 70 form the same circle center; the first clamping plate 802 is arranged on the periphery of the rotating wheel 801, and the first clamping plate 802 is matched with the rotating wheel 801; the second clamping plate 803 is arranged on the periphery of the rotating wheel 801, the second clamping plate 803 is matched with the rotating wheel 801, the second clamping plate 803 corresponds to the first clamping plate 802, and one end of the second clamping plate 803 is connected with one end of the first clamping plate 802; the first connecting rod 804 is arranged on one side of the first clamping plate 802, and the other end of the first clamping plate 802 is connected with one end of the first connecting rod 804; the second connecting rod 805 is arranged at one side of the second clamping plate 803, and the other end of the second clamping plate 803 is connected with one end of the second connecting rod 805; a limiting spring 806 is arranged on the outer side of the rotating wheel 801, one end of the limiting spring 806 is connected with the second clamping plate 803, and the other end of the limiting spring 806 is connected with the first clamping plate 802; the third link 807 is disposed at one side of the rotation wheel 801, one end of the third link 807 is connected to the rotation wheel 801 in a matching manner, and the other end of the third link 807 is provided with a bonding plate connected to the bottom surface of the silicon wafer 50.
Specifically, the other end of the first link 804 and the other end of the second link 805 are respectively connected to a driven rod, the driven rod is arranged in a Y shape, the first link 804 and the second link 805 are respectively connected to two ends above the driven rod, and the lower end of the driven rod is connected to a control motor.
Specifically, the wall surface of the first clamping plate 802 contacting with the rotating wheel 801 is arranged in an arc shape, and the arc-shaped surface of the first clamping plate 802 is matched with the periphery of the rotating wheel 801; the wall surface of the second clamping plate 803 contacted with the rotating wheel 801 is arranged in an arc shape, and the arc-shaped surface of the second clamping plate 803 is matched with the periphery of the rotating wheel 801; the first clamping plate 802 and the second clamping plate 803 are controlled by the driven rods, the driven rods move leftwards to drive the second connecting rods 805 and the first connecting rods 804 to displace, and the displacements of the second connecting rods 805 and the first connecting rods 804 respectively drive the second clamping plate 803 and the first viewing plate to lean against the periphery of the rotating wheel 801.
Specifically, when the rotating wheel 801 rotates, the third connecting rod 807 and the rotating wheel 801 rotate eccentrically, the third connecting rod 807 pushes the attachment plate to translate, and the attachment plate drives the silicon wafer 50 to translate.
In order to reduce the processing efficiency that the silicon wafer 50 cannot be taken out and placed quickly when the silicon wafer 50 is taken out manually during the secondary processing of the silicon wafer 50, and the silicon wafer 50 is taken out manually, the corners of the silicon wafer 50 are easy to collide with the device to cause the corners to break, the guiding device 70, the driving device 80 and the placing device 20 are matched, when the silicon wafer 50 in the placing device 20 is in the same plane with the conveying belt 101 of the machine body 10, the guiding device 70 rotates through the rotating wheel 801 of the driving device 80, the guiding wheel 701 is driven to rotate while the rotating wheel 801 rotates, the rectangular plate at the periphery of the guiding wheel 701 is attached to the arc-shaped surface of the guiding plate 702 while the guiding wheel 701 rotates, after the rectangular plate at the periphery of the guiding wheel 701 is attached to the guiding plate 702, the guiding plate 702 moves towards the silicon wafer 50 in the placing plate 202, and when the guiding plate 702 moves towards the silicon wafer 50, the silicon wafer 50 moves out towards the, therefore, the silicon wafer 50 is automatically moved out, when the silicon wafer 50 is moved out, the silicon wafer 50 is guided to a certain extent through the jointing plate of the third connecting rod 807, so that the silicon wafer 50 is prevented from colliding with the conveying belt 101 or being broken at the corners of the silicon wafer 50 due to the fact that the silicon wafer 50 collides with the conveying belt 101 or an external device due to the deviation of the moving-out direction of the silicon wafer 50, through the use of the placement device 20 matched with the guiding-out device 70, after the guiding-out device 70 guides out the first silicon wafer 50, the guiding-out device 70 can be locked through the first clamping plate 802 and the second clamping plate 803 of the driving device 80, the silicon wafer 50 which is moved out after being locked cannot be adhered and blocked with the silicon wafer 50 at the rear part due to.
As shown in fig. 5 and 6, an adjusting device 40 is disposed inside the machine body 10, the adjusting device 40 is disposed at one side end of the falling back channel 103, the adjusting device 40 is movably connected to the machine body 10, and the adjusting device 40 includes: an adjusting wheel 401, an adapting wheel 402 and a guiding inner wheel 403, wherein the adapting wheel 402 is arranged at the outermost periphery, the adjusting wheel 401 is arranged inside the adapting wheel 402, the guiding inner wheel 403 is arranged inside the adjusting wheel 401, two rectangular groove plates are arranged at the periphery of the adapting wheel 402 and are used for guiding the protective cover 104, the adjusting wheel 401 is provided with two rectangular grooves which are vertically intersected, rectangular convex blocks are arranged on the same surface of the rectangular grooves which are vertically intersected and are matched with the protective cover 104, one of the rectangular groove plates at the periphery of the adapting wheel 402 is provided with a notch which is matched with one side end of the falling channel 103 to receive the protective cover 104 inside the falling channel 103, the turning block 105 inside the falling channel 103 is used for adjusting the position of the protective cover 104 inside the falling channel 103, so that the protective cover 104 inside the adjusting wheel 401 can be mostly positioned in a required direction, the arranged guide inner wheel 403 can directly move to the feeding channel 106 through the guide inner wheel 403 after the protective cover 104 is adjusted to a required direction, so that the period in the adjusting wheel 401 is reduced, the adjusting efficiency is improved, the cover lifting device 90 is arranged at one side end of the feeding channel 106, the protective cover 104 in the feeding channel 106 is attached to the surface of the feeding channel 106 at the notched side, the control wheel 901 of the cover lifting device 90 controls the extension strip 902 to move upwards through an external rotating device after the protective cover 104 moves to the left side end of the feeding channel 106, so that the lifting plate 903 moves upwards, the lifting plate 903 is fixedly connected with the extension strip 902, the protective cover 104 separated from the silicon wafer 50 can be repeatedly sleeved through the extension strip 902 and the lifting plate 903, the phenomenon that the corner of the silicon wafer 50 is broken is reduced, when the protective cover 104 moves to the same height as the silicon wafer 50 through the lifting plate 903, the silicon wafer 50 can be buckled with the groove of the protective cover 104 by moving the conveyer belt 101 rightwards, so that the phenomenon that the corners of the silicon wafer 50 are broken due to collision of the corners of the silicon wafer 50 and the protective cover 104 can be reduced when the silicon wafer 50 moves through the conveyer belt 101 after the silicon wafer 50 is buckled with the protective cover 104, the buckled protective cover 104 needs to be taken down when the silicon wafer 50 moves to the right side of the base body for secondary processing, the protective cover 104 is separated from the silicon wafer 50 by the cover-releasing device 30 arranged on the right side of the machine body 10 and is attached to the protective cover 104 of the silicon wafer 50 through the cover-releasing disc 301, the protective cover 104 is moved to the right side through the falling channel 103, the position of the protective cover 104 with the notch side is collected and adjusted, and the silicon wafer 50 can be accurately buckled with the corners of the silicon wafer 50 during subsequent silicon.
As shown in fig. 7 and 8, finally, a method for using the silicon wafer conveying device on the sputtering platform is provided, which comprises the following steps:
starting the placing device 20, arranging the placing device 20 on the left side of the machine body 10, enabling a discharge hole of the placing device 20 to be flush with the conveying wheel 102 of the machine body 10, and starting the guiding device 70 after the placing device 20 is matched with the machine body 10;
the rotating wheel 801 of the driving device 80 rotates to drive the leading-out wheel 701 to rotate, the rectangular plate on the periphery of the leading-out wheel 701 is attached to the leading-out plate 702 while the leading-out wheel 701 rotates, the rectangular plate on the periphery of the leading-out wheel 701 pushes the leading-out plate 702 to move towards the gap of the placing plate 202, the rectangular plate on the periphery of the leading-out wheel 701 pushes the silicon wafer 50 in the gap of the placing plate 202 to move towards the conveying belt 101, and the silicon wafer 50 is fed through the conveying belt 101;
when the leading-out plate 702 pushes the silicon chip 50 to move, the third connecting rod 807 connected with the leading-out plate 702 pushes the attaching plate to move, the attaching plate drives the silicon chip 50 to move towards the conveying belt 101, and after the silicon chip 50 moves to the conveying belt 101, the placing plate 202 adjusts the distance;
the placing plate 202 moves up and down through a lifting connecting rod arranged on the side surface, after the silicon wafer 50 in the placing plate 202 is completely separated, the placing plate 202 adjusts the internal space through the lifting connecting rod, and the first clamping plate 802 and the second clamping plate 803 move when the placing plate 202 adjusts the internal space;
the first clamping plate 802 and the second clamping plate 803 are provided with a swing motor inside the machine body 10 to drive a driven rod to rotate, the second connecting rod 805 and the first connecting rod 804 move in a relative direction through the rotation of the driven rod, the second connecting rod 805 and the first connecting rod 804 move in a relative direction to drive the second clamping plate 803 and the first clamping plate 802 to approach the rotating wheel 801, the rotating wheel 801 is suspended to drive the guiding wheel 701 to rotate by the fact that the arc-shaped wall surfaces of the second clamping plate 803 and the first clamping plate 802 are attached to the periphery of the rotating wheel 801, and the plate 202 is placed to adjust the internal spacing when the guiding wheel 701 rotates;
after the adjustment of the internal space of the placing plate 202 is completed, the other layer of silicon wafer 50 inside the placing plate 202 and the guiding plate 702 are in the same plane, when the other layer of silicon wafer 50 inside the placing plate 202 and the guiding plate 702 are in the same plane, the swing motor resets to make the driven rod lose the action on the second connecting rod 805 and the first connecting rod 804, then the second clamping plate 803 and the first clamping plate 802 contact and fix the rotating wheel 801, the guiding wheel 701 rotates again to drive the guiding plate 702 to continuously guide out the silicon wafer 50, and meanwhile, the third connecting rod 807 continues to move, and the above steps are repeated.
Although the illustrative embodiments of the present application have been described above to enable those skilled in the art to understand the present application, the present application is not limited to the scope of the embodiments, and various modifications within the spirit and scope of the present application defined and determined by the appended claims will be apparent to those skilled in the art from this disclosure.
Claims (10)
1. A silicon wafer conveying apparatus on a sputtering table, comprising:
the machine body is arranged on a plane, and a conveying wheel is arranged inside the machine body and fixedly connected with the machine body;
a placement device, the placement device is disposed on one side of the body, the placement device with the body is connected, the placement device includes:
the shell is arranged above the machine body, the shell is connected with the machine body in a matching way, and the interior of the shell is hollow;
the placing plates are arranged inside the shell, gaps are formed among the placing plates, and the gaps of the placing plates are used for storing silicon wafers;
the guiding device, the guiding device sets up the inside of organism, the guiding device with organism fixed connection, the guiding device includes:
the guide-out plate is arranged inside the machine body, the guide-out plate is matched with the gap of the placing plate, and the guide-out plate can be inserted into the gap of the placing plate;
the driving device is arranged inside the machine body and is fixedly connected with the machine body.
2. The silicon wafer conveying apparatus on a sputtering station as claimed in claim 1, wherein the body comprises:
the conveying belt is arranged inside the machine body and is connected with the conveying wheels in a matching manner, a plurality of conveying wheels are arranged and distributed inside the machine body at uniform intervals, and the conveying wheels are connected in series by the conveying belt;
the falling channel is arranged inside the machine body and integrally formed with the machine body, and the falling channel is arranged in a groove inside the machine body;
the turnover block is arranged inside the machine body and connected with the falling channel, and the turnover block is arranged on the upper surface of the falling channel;
the feeding channel is arranged inside the machine body and integrally formed with the machine body, and the feeding channel is arranged in the machine body in a groove mode.
3. The silicon wafer conveying device on the sputtering table as claimed in claim 2, wherein the turnover blocks are provided in plurality, and the turnover blocks are arranged on the upper surface of the falling channel at uniform intervals;
the feeding channel is matched with the falling channel, one end of the feeding channel is butted with one end of the falling channel, and the feeding channel and the falling channel form a complete through groove.
4. The silicon wafer conveying apparatus on a sputtering table as claimed in claim 1, wherein the lead-out means comprises:
the guide-out wheel is arranged below the guide-out plate and matched with the guide-out plate;
the reset spring is arranged above the guide-out plate and fixedly connected with the guide-out plate, one end of the reset spring is connected with the guide-out plate, and the other end of the reset spring is connected with the machine body.
5. The silicon wafer conveying device on the sputtering table as claimed in claim 4, wherein the inside of the leading-out plate is provided with a groove, the groove of the leading-out plate is arranged in an arc shape, and the arc-shaped groove of the leading-out plate is matched with the leading-out wheel;
rectangular plates are arranged on the periphery of the guide-out wheel, the rectangular plates of the guide-out wheel are matched with the arc-shaped grooves of the guide-out plate, and a plurality of rectangular plates are arranged on the periphery of the guide-out wheel;
the rectangular plates on the periphery of the guide-out wheel are uniformly distributed on the periphery of the guide-out wheel, and when the guide-out wheel rotates, the rectangular plates of the guide-out wheel contact the arc-shaped grooves of the guide-out plate to push the guide-out plate to move towards the gap of the placing plate.
6. The silicon wafer conveying apparatus on a sputtering table as claimed in claim 1, wherein the driving means comprises:
the rotating wheel is arranged inside the machine body and is matched and connected with the leading-out device, and the rotating wheel and the leading-out device form the same circle center;
the first clamping plate is arranged on the periphery of the rotating wheel and matched with the rotating wheel;
the second clamping plate is arranged on the periphery of the rotating wheel and matched with the rotating wheel, the second clamping plate corresponds to the first clamping plate, and one end of the second clamping plate is connected with one end of the first clamping plate;
the first connecting rod is arranged on one side of the first clamping plate, and the other end of the first clamping plate is connected with one end of the first connecting rod;
the second connecting rod is arranged on one side of the second clamping plate, and the other end of the second clamping plate is connected with one end of the second connecting rod;
the limiting spring is arranged on the outer side of the rotating wheel, one end of the limiting spring is connected with the second clamping plate, and the other end of the limiting spring is connected with the first clamping plate;
the third connecting rod sets up one side of swiveling wheel, third connecting rod one end with the swiveling wheel cooperation is connected, the other end of third connecting rod is provided with the attaching plate, the attaching plate with the bottom surface of silicon chip links to each other.
7. The silicon wafer conveying apparatus on a sputtering table as claimed in claim 6, wherein the other end of the first link and the other end of the second link are respectively connected with driven rods, the driven rods are arranged in a Y shape, the upper two ends of the driven rods are respectively connected with the first link and the second link, and the lower ends of the driven rods are connected with a control motor.
8. The silicon wafer conveying device on the sputtering table according to claim 7, wherein the wall surface of the first clamping plate contacting with the rotating wheel is arranged in an arc shape, and the arc surface of the first clamping plate is matched with the periphery of the rotating wheel;
the wall surface of the second clamping plate, which is in contact with the rotating wheel, is arranged in an arc shape, and the arc-shaped surface of the second clamping plate is matched with the periphery of the rotating wheel;
the first clamping plate and the second clamping plate are controlled by the driven rod, the driven rod moves leftwards to drive the second connecting rod and the first connecting rod to displace, and the second connecting rod and the first connecting rod respectively drive the second clamping plate and the first viewing plate to lean against the periphery of the rotating wheel.
9. The silicon wafer conveying device on the sputtering table as claimed in claim 8, wherein the rotating wheel rotates while the third link and the rotating wheel rotate eccentrically, the third link pushes the engaging plate to translate, and the engaging plate drives the silicon wafer to translate.
10. The use method of the silicon wafer conveying equipment on the sputtering table comprises the following steps:
starting the placing device, arranging the placing device on the left side of the machine body, enabling a discharge port of the placing device to be flush with a conveying wheel of the machine body, and starting the guiding device after the placing device is matched with the machine body;
the rotating wheel of the driving device rotates to drive the guide-out wheel to rotate, the rectangular plate on the periphery of the guide-out wheel is attached to the guide-out plate while the guide-out wheel rotates, the rectangular plate on the periphery of the guide-out wheel pushes the guide-out plate to move to a gap of the placing plate, the rectangular plate on the periphery of the guide-out wheel pushes the silicon wafer in the gap of the placing plate to move to the conveying belt, and the silicon wafer is fed through the conveying belt;
when the leading-out plate pushes the silicon wafer to move, a third connecting rod connected with the leading-out plate pushes the attaching plate to move, the attaching plate drives the silicon wafer to move towards the conveying belt, and after the silicon wafer moves to the conveying belt, the placing plate adjusts the distance;
the placing plate moves up and down through a lifting connecting rod arranged on the side surface, after the silicon wafers in the placing plate are completely separated, the placing plate adjusts the internal space through the lifting connecting rod, and the first clamping plate and the second clamping plate move when the internal space is adjusted by the placing plate;
the first clamping plate and the second clamping plate are provided with a swing motor through the inside of the machine body to drive a driven rod to rotate, a second connecting rod and the first connecting rod move in a relative direction through the rotation of the driven rod, the second connecting rod and the first connecting rod move in a relative direction to drive the second clamping plate and the first clamping plate to approach a rotating wheel, the periphery of the rotating wheel is attached to the arc-shaped wall surfaces of the second clamping plate and the first clamping plate to pause the rotating wheel to drive a guide-out wheel to rotate, and the plates are placed to adjust the internal space when the guide-out wheel is paused to rotate;
after the adjustment of the internal space of the placing plate is completed, another layer of silicon wafer placed inside the placing plate and the leading-out plate are located on the same plane, the swing motor resets when another layer of silicon wafer placed inside the placing plate and the leading-out plate are located on the same plane, so that the driven rod loses the action on the second connecting rod and the first connecting rod, then the second clamping plate and the first clamping plate are in contact with the rotating wheel to be fixed, the leading-out wheel rotates again to drive the leading-out plate to continue leading out the silicon wafer, meanwhile, the third connecting rod also continues to move, and the steps are repeated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010232461.7A CN111403327A (en) | 2020-03-28 | 2020-03-28 | Silicon wafer conveying equipment on sputtering platform and using method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010232461.7A CN111403327A (en) | 2020-03-28 | 2020-03-28 | Silicon wafer conveying equipment on sputtering platform and using method |
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| CN111403327A true CN111403327A (en) | 2020-07-10 |
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| CN202010232461.7A Pending CN111403327A (en) | 2020-03-28 | 2020-03-28 | Silicon wafer conveying equipment on sputtering platform and using method |
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| CN116646291A (en) * | 2023-07-26 | 2023-08-25 | 无锡市爱维丝科技有限公司 | Turnover mechanism for degumming photovoltaic silicon wafer |
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