CN111402757B - Display module, electronic equipment and manufacturing method of display module - Google Patents
Display module, electronic equipment and manufacturing method of display module Download PDFInfo
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- CN111402757B CN111402757B CN202010209139.2A CN202010209139A CN111402757B CN 111402757 B CN111402757 B CN 111402757B CN 202010209139 A CN202010209139 A CN 202010209139A CN 111402757 B CN111402757 B CN 111402757B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/37—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
- G09F9/372—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the positions of the elements being controlled by the application of an electric field
Abstract
The invention discloses a display module, electronic equipment and a manufacturing method of the display module, wherein the display module comprises the following components: a substrate; the display layer is arranged on one side of the substrate and is electrically connected with the substrate, and the projection of the display layer is positioned in the projection of the substrate in a plane parallel to the substrate; the protective layer is arranged on one side, far away from the substrate, of the display layer, at least part of the protective layer exceeds the peripheral wall of the substrate, and the projection of the display layer is positioned in the projection of the protective layer in a plane parallel to the substrate; and a sealing layer including a first sealing portion and a second sealing portion connected to each other, the first sealing portion being provided on a portion of the protective layer which exceeds the outer peripheral wall of the substrate, and the second sealing portion being provided between the substrate and the protective layer and located at the outer periphery of the display layer. According to the display module, the protective layer can play a certain protective role on the substrate, so that the substrate is not easy to crack and damage due to collision.
Description
Technical Field
The invention relates to the field of display, in particular to a display module, electronic equipment and a manufacturing method of the display module.
Background
In the display module assembly that some electronic paper show among the correlation technique in manufacturing processing or product test, the periphery wall of base plate receives very easily to collide with and takes place the phenomenon of fracture damage, and the defective rate of product is higher. In addition, waterproof glue is coated on the substrate, and only a small part of the waterproof glue is positioned between the substrate and the protective layer, so that the effective water-blocking width of the waterproof glue is small, and the effect of the waterproof glue for preventing external water vapor and the like from entering the display layer is not ideal.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, a first object of the present invention is to provide a display module, in which the substrate is not easily damaged by bumping and the waterproof performance of the product is good.
The second objective of the present invention is to provide an electronic device including the display module.
The third objective of the present invention is to provide a method for manufacturing the display module.
The display module according to the embodiment of the invention comprises: a substrate; the display layer is arranged on one side of the substrate and is electrically connected with the substrate, and the projection of the display layer is positioned in the projection of the substrate in a plane parallel to the substrate; the protective layer is arranged on one side, far away from the substrate, of the display layer, at least part of the protective layer exceeds the peripheral wall of the substrate, and in a plane parallel to the substrate, the projection of the display layer is located in the projection of the protective layer; and the sealing layer comprises a first sealing part and a second sealing part which are connected, the first sealing part is arranged on the part of the protective layer, which exceeds the peripheral wall of the substrate, and the second sealing part is arranged between the substrate and the protective layer and is positioned on the periphery of the display layer.
According to the display module provided by the embodiment of the invention, at least part of the protective layer exceeds the peripheral wall of the substrate, so that the part of the protective layer exceeding the substrate can play a certain protection role on the substrate, and the peripheral wall of the substrate is not easy to collide and damage in the manufacturing process or product test (such as drop test or vibration test) of the display module.
In some embodiments of the present invention, the second sealing portion is provided around the display layer in an entire circumferential direction of the display layer and is connected to an outer circumferential wall of the display layer.
In some embodiments of the present invention, portions of the protective layer that exceed the outer peripheral wall of the substrate are each provided with the first sealing portion that is connected to the outer peripheral wall of the substrate.
In some embodiments of the invention, the outer peripheral wall of the protective layer is formed with an avoidance notch, a projection of a part of the substrate is located in a projection of the avoidance notch, a projection of the rest of the substrate is located in a projection of the protective layer, and the first sealing portion is disposed between the outer peripheral wall of the rest of the substrate and the outer peripheral wall of the protective layer.
In some embodiments of the present invention, the outer peripheral wall of the protective layer is formed with an avoidance gap, and in a plane parallel to the substrate, a projection of a portion of the substrate is located in a projection of the avoidance gap, and a projection of the remaining portion of the substrate is located in a projection of the protective layer, the display module includes: the chip is arranged on the substrate and located at the avoidance notch, and the part of the substrate opposite to the avoidance notch is electrically connected with the flexible circuit board.
In some embodiments of the present invention, the substrate and the display layer are connected by a conductive adhesive.
In some embodiments of the invention, the sealing layer is a waterproof glue.
In some embodiments of the present invention, the substrate is a glass substrate or a plastic substrate, the display layer is an electronic ink film layer, and the protective layer is a protective film layer or a glass layer.
The electronic equipment comprises the display module.
According to the electronic device provided by the embodiment of the invention, at least part of the protective layer of the display module exceeds the peripheral wall of the substrate, so that the part of the protective layer exceeding the substrate can play a certain protection role on the substrate, and the peripheral wall of the substrate is not easy to be collided and damaged in the manufacturing process of the display module or product test (such as drop test or vibration test).
The manufacturing method of the display module is characterized in that the display module is the display module, and the manufacturing method comprises the following steps: processing the display layer, the substrate and the protective layer respectively; adhering the display layer to the substrate; the protective layer is pasted on the surface of one side, which is far away from the substrate, of the display layer; coating waterproof glue on the protective layer; curing the waterproof glue to form the sealing layer.
According to the manufacturing method of the display module, the waterproof glue is coated on the protective layer, so that the structural form requirement of the sealing layer in the display module can be better met, and the coating method is simple and convenient to realize.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a top view of a display module according to the related art;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is an enlarged view of the area encircled at B in FIG. 2;
FIG. 4 is a schematic view of the effective water blocking width of the waterproof adhesive of FIG. 1;
FIG. 5 is a top view of a display module according to an embodiment of the invention;
FIG. 6 is a cross-sectional view taken along line C-C of FIG. 5;
FIG. 7 is an enlarged view of the area encircled at D in FIG. 6;
FIG. 8 is a bottom view of a display module according to an embodiment of the invention;
FIG. 9 is a schematic view of the effective water blocking width of the waterproof glue of FIG. 8;
FIG. 10 is a method for manufacturing a display module according to an embodiment of the invention.
Reference numerals:
a display module 100;
a substrate 1;
a display layer 2; a display area 21; a picture region 211; a border area 212; a non-display area 22;
a protective layer 3; avoiding the notch 31;
a sealing layer 4; the first seal portion 41; the second seal portion 42;
a chip 5; a flexible circuit board 6; a conductive adhesive 7; RTV glue 8.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The display module 100, the electronic device and the method for manufacturing the display module 100 according to the embodiment of the invention are described below with reference to the drawings, where the display module 100 may be, for example, a display module 100 for electronic paper display, which is a new display technology and has the characteristics of ultra-thinness, rewritability, portability, ultra-low power consumption, capability of maintaining display even in power-off, and the like. The technology for realizing the electronic paper display is various, the common technology is an E-Ink microcapsule (Micro-capsules) type electrophoresis technology, the specific principle is that charged white titanium oxide particles and black carbon powder particles are encapsulated in a microcapsule, the microcapsule and electrolyte are encapsulated between two parallel conductive plates with the distance of 10-100 mm, and black and white images are drawn by utilizing the characteristic that the charged particles move towards electrodes with opposite electrical property under the action of an electric field.
As shown in fig. 5 and 8, the display module 100 according to the embodiment of the invention includes a substrate 1, a display layer 2, a protective layer 3, and a sealing layer 4.
As shown in fig. 5, 6 and 7, the display layer 2 is disposed on one side of the substrate 1 (for example, on the upper side of the substrate 1 in the figure) and is electrically connected to the substrate 1, so that the display layer 2 can be driven to display after the substrate 1 is powered on. In a plane parallel to the substrate 1, the projection of the display layer 2 is located within the projection of the substrate 1, so that the display layer 2 does not exceed the substrate 1, and the normal display of the display layer 2 is prevented from being affected.
As shown in fig. 5, 7 and 8, the protective layer 3 is disposed on a side of the display layer 2 (e.g., an upper side of the display layer 2 in the figure) away from the substrate 1, and the protective layer 3 can protect the display layer 2, for example, can prevent external moisture, dust, etc. from contacting the display layer 2 to affect normal display of the display layer 2, and can also prevent the display layer 2 from being damaged due to scratching of the display layer 2 by hard objects, etc. At least part of protective layer 3 surpasss the periphery wall of base plate 1, specifically speaking, for example, can be that the part of certain side edge of protective layer 3 surpasss the corresponding edge of base plate 1, or the whole edge of certain side of protective layer 3 surpasss the corresponding edge of base plate 1, also can be that all edges of protective layer 3 all surpass the corresponding edge of base plate 1, make the part that surpasss base plate 1 of protective layer 3 still can play certain guard action to base plate 1, thereby in display module assembly 100's manufacturing process or product test (for example drop test or vibrations test), the periphery wall of base plate 1 just is difficult to receive the phenomenon that collides with and take place the damage. The projection of the display layer 2 lies within the projection of the protective layer 3 in a plane parallel to the substrate 1, whereby the protective layer 3 can completely cover the display layer 2, so that a better protection of the display layer 2 is achieved.
Specifically, for example, referring to fig. 5 and 8, the substrate 1 is substantially square-shaped, the display layer 2 is located above the substrate 1, the protective layer 3 is located above the display layer 2, the peripheral edge of the substrate 1 exceeds the peripheral edge of the display layer 2, the front-side edge of the protective layer 3 exceeds the front-side edge of the substrate 1, the rear-side edge of the protective layer 3 exceeds the rear-side edge of the substrate 1, a portion of the left-side edge of the protective layer 3 exceeds the left-side edge of the substrate 1, and the right-side edge of the protective layer 3 exceeds the right-side edge of the substrate 1.
As shown in fig. 7, 8 and 9, the sealing layer 4 includes a first sealing portion 41 and a second sealing portion 42 connected to each other, the first sealing portion 41 is disposed on a portion of the protective layer 3 beyond the outer peripheral wall of the substrate 1, and the second sealing portion 42 is disposed between the substrate 1 and the protective layer 3 and located at the periphery of the display layer 2, so that the sealing layer 4 can perform a sealing function, and can prevent external moisture and the like from entering the display layer 2 to adversely affect the display layer 2, and for the display layer 2, the second sealing portion 42 located between the substrate 1 and the protective layer 3 is the sealing layer 4 which mainly performs a water blocking effect, so that the sealing layer 4 has a large effective water blocking width and a good water blocking effect.
In practical application, the sealing layer 4 is usually waterproof glue, and in the manufacturing production of electronic paper products, the waterproof glue is EC glue, has strong viscosity and good fluidity, and can conveniently and quickly penetrate between the protective layer 3 and the substrate 1 and diffuse to the edge of the display layer 2.
Some electronic paper show among the correlation technique display module assembly 100's approximate structure is shown in fig. 1 and fig. 2, be equipped with display layer 2 on the base plate 1, be equipped with protective layer 3 on the display layer 2, the peripheral edge of base plate 1 surpasss the peripheral edge of protective layer 3, the peripheral edge of protective layer 3 surpasss the peripheral edge of display layer 2, this kind of structural style's display module assembly 100 is in manufacturing and processing or product test, the periphery wall of base plate 1 receives the phenomenon that breaks down and takes place for the collision very easily, the defective rate of product is higher. In addition, as shown in fig. 1, 3 and 4, the substrate 1 is coated with the waterproof adhesive (i.e., the sealing layer 4), and only a small portion of the waterproof adhesive is located between the substrate 1 and the protective layer 3, so that the effective water blocking width of the waterproof adhesive is small, and the waterproof adhesive has an undesirable effect of blocking external moisture and the like from entering the display layer 2.
According to the display module 100 of the embodiment of the invention, at least part of the protective layer 3 exceeds the peripheral wall of the substrate 1, so that the part of the protective layer 3 exceeding the substrate 1 can play a certain protective role on the substrate 1, and thus, in the manufacturing process or product test (for example, drop test or vibration test) of the display module 100, the peripheral wall of the substrate 1 is not easily damaged by collision, and in addition, since the sealing layer 4 comprises the first sealing part 41 and the second sealing part 42 which are connected, the first sealing part 41 is arranged on the part of the protective layer 3 exceeding the peripheral wall of the substrate 1, and the second sealing part 42 is arranged between the substrate 1 and the protective layer 3 and is positioned at the periphery of the display layer 2, the sealing layer 4 has a larger effective water blocking width, and the water blocking effect is better.
In some embodiments of the present invention, as shown in fig. 9, the second seal portion 42 is provided around the display layer 2 in the entire circumferential direction of the display layer 2 and is connected to the outer circumferential wall of the display layer 2, whereby the water blocking effect of the seal layer 4 can be further improved.
In some embodiments of the present invention, as shown in fig. 8 and 9, the portions of the protective layer 3 beyond the outer peripheral wall of the substrate 1 are each provided with the first sealing portion 41, and the first sealing portion 41 is connected to the outer peripheral wall of the substrate 1, thereby not only facilitating the rapid penetration of the waterproof adhesive between the protective layer 3 and the substrate 1 and the diffusion to the entire outer peripheral edge of the display layer 2 during the manufacturing process, but also when the waterproof adhesive is cured, the first sealing portion 41 adhered to the portion of the protective layer 3 beyond the outer peripheral wall of the substrate 1 can improve the deformation resistance of the protective layer 3 in this area to some extent, thereby improving the protective effect of the protective layer 3 on the substrate 1.
In some embodiments of the present invention, as shown in fig. 5 and 8, the outer peripheral wall of the protective layer 3 (e.g. the left side wall of the protective layer 3 in the drawings) is formed with relief notches 31, in a plane parallel to the substrate 1, a projection of a portion of the substrate 1 is located within a projection of the relief notch 31, a projection of the remaining portion of the substrate 1 is located within a projection of the protective layer 3, and a first sealing portion 41 is provided between the outer peripheral wall of the remaining portion of the substrate 1 and the outer peripheral wall of the protective layer 3, that is, the substrate 1 is not provided with the first sealing portion 41 in the region of the substrate 1 located in the relief notch 31, but the relief notch 31 is provided to prevent the protective layer 3 from interfering with other components of the display module 100, and the first sealing portion 41 is provided only between the outer peripheral wall of the remaining portion of the substrate 1 and the outer peripheral wall of the protective layer 3, thereby facilitating the application of the sealing layer 4.
In some embodiments of the present invention, as shown in fig. 5, the peripheral wall of the protective layer 3 is formed with an avoiding notch 31, in a plane parallel to the substrate 1, a projection of a part of the substrate 1 is located in a projection of the avoiding notch 31, and a projection of the rest of the substrate 1 is located in a projection of the protective layer 3, the display module 100 includes a chip 5 and a flexible circuit board 6, the chip 5 is disposed on the substrate 1 and located at the avoiding notch 31, and a portion of the substrate 1 opposite to the avoiding notch 31 is electrically connected to the flexible circuit board 6, so that after the avoiding notch 31 is disposed, the protective layer 3 can be prevented from interfering with the chip 5 and the flexible circuit board 6 bonded to the substrate 1.
Specifically, the chip 5 and the flexible circuit board 6 are electrically connected to the tft array on the substrate 1, the chip 5 is used for controlling the display of the display layer 2 through the tft array, and the flexible circuit board 6 is used for connecting to a printed circuit board, and related processes and principles of the chip 5 and the flexible circuit board 6 for controlling the display of the display layer 2 through the tft array are well known to those skilled in the art and will not be described herein again.
In addition, during the manufacturing process, an ultraviolet curing glue (i.e., UV glue) is coated at the bending part of the flexible circuit board 6 to prevent the flexible circuit board 6 from being torn during the use process, and a room temperature vulcanized silicone rubber glue (i.e., RTV glue 8) is coated on the chip 5 and around the chip 5 to protect the chip 5.
In some embodiments of the present invention, the substrate 1 is a glass substrate 1, or in some flexible electronic paper products, the substrate 1 may also be a plastic substrate 1, and in the manufacturing process of the display module 100, a Thin Film Transistor (TFT) array is further fabricated on the glass substrate 1 or the plastic substrate 1 for driving the display layer 2 to display. Of course, the material of the substrate 1 is not limited to glass or plastic, and may be other materials, such as ceramic or flexible fiber cloth, and the like, and may be specifically selected according to the type of the electronic paper product or the processing requirement.
In some embodiments of the present invention, the display layer 2 is an electronic ink thin film layer. In the related art, an electronic ink film layer is generally formed by coating an electronic ink made of microcapsules or microcups, etc. enclosing liquid and charged particles on a plastic film, and then attaching the electronic ink film layer to the substrate 1. The type of the electronic ink is not limited, for example, the electronic ink may be an electronic ink capable of displaying only black and white colors, or an electronic ink capable of displaying color colors, and the electronic ink may be specifically selected according to the type of the electronic paper product or processing requirements.
In some embodiments of the present invention, the protective layer 3 is a protective film layer, and in particular, in order to enable the protective layer 3 to have a better protective effect on the display layer 2 and enable the protective layer 3 to have superior performance, the protective layer 3 may be a protective film layer formed by compounding a plurality of film structures. For example, the protection layer 3 may include a water-blocking film and an optical film, wherein the water-blocking film is located on the display layer 2 and may contact the display layer 2, and the optical film is located on the water-blocking film. The water blocking film is used to block moisture from entering the display layer 22, and may be made of an inorganic ceramic material, an organic polymer material, or an organic-inorganic composite material, such as silicon oxide (SiOx), silicon nitride (SiNx), Parylene (Parylene), Polypropylene (Polypropylene), amorphous silicon/Parylene composite (aSi/Parylene), or Polypropylene/polyacrylate/aluminum composite (polyacrylate/Al): the optical film has a function of absorbing ultraviolet light, for example, the optical film may be a non-interference type cut-off filter that absorbs ultraviolet light, or an interference type cut-off filter that interferes ultraviolet light, and when the optical film is an interference type cut-off filter, the function of blocking ultraviolet light may be achieved by an interference effect, and the interference type cut-off filter may include a plurality of refractive films having refractive index variations, and the refractive films may be made of magnesium tetrafluoride (MgF4), zirconium dioxide (ZrO2), cerium trifluoride (CeF3), or the like.
Of course, the protective layer 3 is not limited to the above materials, for example, in some embodiments, the protective layer 3 may also be a glass layer, and in a specific application, the type of the protective layer 3 may be selected according to the type of the electronic paper product or the processing requirement. In some electronic paper products, such as flexible electronic paper, the protective layer 3 is further provided with electrodes according to product characteristics, so that the protective layer 3 can be integrally formed as an electrode layer, and thus the electrode layer can drive the display layer 2 together with the thin film transistor array on the substrate 1.
In some embodiments of the present invention, as shown in fig. 5, the display layer 2 includes a display area 21 and a non-display area 22, where the display area 21 is an area of the display layer 2 that can be displayed, for example, contents such as text, image, or color can be displayed, the non-display area 22 is an area of the display layer 2 that is not displayed, the display area 21 includes a screen area 211 and a frame area 212, and the frame area 212 is located between the screen area 211 and the non-display area 22.
Specifically, for example, referring to fig. 5, the screen region 211 is substantially square, the frame region 212 is substantially square ring, the frame region 212 is located between the screen region 211 and the non-display region 22, and the frame region 212 is disposed around the screen region 211, and for an electronic paper display, the frame region 212 may serve as a transition region between the screen region 211 and the non-display region 22.
In some embodiments of the present invention, the substrate 1 and the display layer 2 are connected by the conductive adhesive 7, so that the display layer 2 can be controlled by the thin film transistor array on the substrate 1 to realize the display function.
Specifically, for example, referring to fig. 5, the display layer 2 is provided with two conductive paste applying points located in the non-display region 22, the conductive paste applying points are distributed on two sides of the avoidance gap 31, the conductive paste 7 is applied at the conductive paste applying points, and the conductive paste 7 is located between the display layer 2 and the substrate 1 to conduct the display layer 2 and the substrate 1.
In practical applications, the conductive adhesive 7 is usually silver adhesive, which is a kind of adhesive that combines conductive particles together through the adhesive effect of the matrix resin to form a conductive path, so as to realize the conductive connection of the adhered material, and is widely used in the display field.
The electronic device according to the embodiment of the invention includes the display module 100.
According to the electronic device of the embodiment of the invention, since at least part of the protective layer 3 of the display module 100 exceeds the peripheral wall of the substrate 1, the part of the protective layer 3 exceeding the substrate 1 can play a certain role in protecting the substrate 1, so that the peripheral wall of the substrate 1 is not easily damaged by collision in the manufacturing process or product test (such as drop test or vibration test) of the display module 100, in addition, since the sealing layer 4 comprises the first sealing part 41 and the second sealing part 42 which are connected, the first sealing part 41 is arranged on the part of the protective layer 3 exceeding the peripheral wall of the substrate 1, the second sealing part 42 is arranged between the substrate 1 and the protective layer 3 and is positioned at the periphery of the display layer 2, the sealing layer 4 has a larger effective water blocking width, and the water blocking effect is better.
As shown in fig. 10, according to the manufacturing method of the display module 100 of the embodiment of the invention, the display module 100 is the display module 100, and the manufacturing method includes:
the display layer 2, the substrate 1 and the protective layer 3 are processed separately. Here, the display layer 2, the substrate 1, and the protective layer 3 may be processed simultaneously or sequentially, for example, the display layer 2 is processed first, then the substrate 1 is processed, and finally the protective layer 3 is processed. Of course, in other examples, the substrate 1 may be processed first, and then the display layer 2 and the protective layer 3 may be processed at the same time. The processing sequence for the display layer 2, the substrate 1 and the protective layer 3 may be defined according to actual production needs.
Adhering the display layer 2 to the substrate 1;
adhering a protective layer 3 on the surface of one side of the display layer 2, which is far away from the substrate 1;
coating waterproof glue on the protective layer 3;
the waterproofing glue is cured to form the sealing layer 4.
Specifically, when manufacturing the display module 100, the display layer 2 is usually attached to the substrate 1, the protection layer 3 is then attached to the display layer 2, and the waterproof adhesive is coated on the protection layer 3 along the peripheral edge of the protection layer 3, so that the waterproof adhesive can penetrate between the protection layer 3 and the substrate 1 until the waterproof adhesive spreads to the edge of the display layer 2 due to the gap between the protection layer 3 and the substrate 1. Compared with the mode of coating the waterproof glue on the substrate 1 in the prior art, the coating method of the waterproof glue is simple and convenient to realize, and can better meet the structural form requirement of the sealing layer 4 in the display module 100.
According to the manufacturing method of the display module 100 of the embodiment of the invention, the waterproof glue is coated on the protective layer 3, so that the structural form requirement of the sealing layer 4 in the display module 100 can be better met, and the coating method is simple and convenient to realize.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "circumferential" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the terms "some embodiments," "alternative embodiments," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. A display module, comprising:
a substrate;
the display layer is arranged on one side of the substrate and is electrically connected with the substrate, and the projection of the display layer is positioned in the projection of the substrate in a plane parallel to the substrate;
the protective layer is arranged on one side, far away from the substrate, of the display layer, at least part of the protective layer exceeds the peripheral wall of the substrate, and in a plane parallel to the substrate, the projection of the display layer is located in the projection of the protective layer;
a sealing layer including a first sealing portion and a second sealing portion connected, the first sealing portion being provided on a portion of the protective layer that exceeds the outer peripheral wall of the substrate, the second sealing portion being provided between the substrate and the protective layer and at an outer periphery of the display layer, and the first sealing portion not being in contact with the outer peripheral wall of the substrate; an avoidance notch is formed in the peripheral wall of the protective layer, in a plane parallel to the substrate, the projection of one part of the substrate is located in the projection of the avoidance notch, the projections of the other parts of the substrate are located in the projection of the protective layer, the parts of the protective layer except the avoidance notch all exceed the peripheral wall of the substrate, the first sealing part is arranged between the peripheral wall of the other parts of the substrate and the peripheral wall of the protective layer, and the first sealing part is not arranged in the area of the substrate located in the avoidance notch;
the chip is arranged on the substrate and located at the avoidance notch, the part of the substrate right opposite to the avoidance notch is electrically connected with the flexible circuit board, and the bending part of the flexible circuit board is coated with ultraviolet curing glue to prevent the flexible circuit board from being torn in the using process.
2. The display module according to claim 1, wherein the second sealing portion is provided around the display layer in an entire circumferential direction of the display layer and is connected to an outer circumferential wall of the display layer.
3. The display module according to claim 1, wherein the portions of the protective layer that exceed the peripheral wall of the substrate are each provided with the first sealing portion, and the first sealing portion is connected to the peripheral wall of the substrate.
4. The display module of claim 1, wherein the substrate is connected to the display layer by a conductive adhesive.
5. The display module of claim 1, wherein the sealing layer is a waterproof adhesive.
6. The display module according to any one of claims 1 to 5, wherein the substrate is a glass substrate or a plastic substrate, the display layer is an electronic ink film layer, and the protective layer is a protective film layer or a glass layer.
7. An electronic device, comprising the display module according to any one of claims 1-6.
8. A manufacturing method of a display module, wherein the display module is the display module according to any one of claims 1-6, the manufacturing method comprising:
processing the display layer, the substrate and the protective layer respectively;
adhering the display layer to the substrate;
the protective layer is pasted on the surface of one side, which is far away from the substrate, of the display layer;
coating waterproof glue on the protective layer;
curing the waterproof glue to form the sealing layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010209139.2A CN111402757B (en) | 2020-03-23 | 2020-03-23 | Display module, electronic equipment and manufacturing method of display module |
| PCT/CN2020/140826 WO2021190040A1 (en) | 2020-03-23 | 2020-12-29 | Display module, electronic device and method for manufacturing the display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010209139.2A CN111402757B (en) | 2020-03-23 | 2020-03-23 | Display module, electronic equipment and manufacturing method of display module |
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| Publication Number | Publication Date |
|---|---|
| CN111402757A CN111402757A (en) | 2020-07-10 |
| CN111402757B true CN111402757B (en) | 2022-02-18 |
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| CN202010209139.2A Active CN111402757B (en) | 2020-03-23 | 2020-03-23 | Display module, electronic equipment and manufacturing method of display module |
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| CN111402757B (en) * | 2020-03-23 | 2022-02-18 | 重庆京东方智慧电子***有限公司 | Display module, electronic equipment and manufacturing method of display module |
| CN113448134A (en) * | 2021-06-11 | 2021-09-28 | 江西兴泰科技有限公司 | Method for manufacturing electronic paper module |
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| WO2021190040A1 (en) | 2021-09-30 |
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