CN111394031B - Preparation method of underfill with high electrical insulation performance - Google Patents
Preparation method of underfill with high electrical insulation performance Download PDFInfo
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- CN111394031B CN111394031B CN202010277651.0A CN202010277651A CN111394031B CN 111394031 B CN111394031 B CN 111394031B CN 202010277651 A CN202010277651 A CN 202010277651A CN 111394031 B CN111394031 B CN 111394031B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a high-electrical insulation bottom filling adhesive which is prepared from the following raw materials: 25-35 parts of self-synthesized diamino diphenyl sulfone modified epoxy resin, 15-20 parts of low-viscosity epoxy resin, 25-35 parts of biphenyl epoxy resin, 0.1-0.4 part of black pigment and 15-20 parts of curing agent. The underfill prepared by the invention has the advantages of high volume resistivity, high glass transition temperature, low water absorption, good electrical insulation performance after aging in a damp-heat environment and the like, and is suitable for packaging semiconductor electronic components mounted on various bare chips.
Description
Technical Field
The invention relates to a preparation method of an underfill adhesive with high electrical insulation performance, and belongs to the field of adhesives.
Background
With the miniaturization, weight reduction, and high performance of electronic devices, semiconductor packaging materials are required to be adapted to the trend toward high integration and thinning of electronic devices. In recent years, surface mounting type packaging has been the preferred choice, and semiconductor packaging materials are subjected to a high temperature solder bath during mounting, during which solder cracking of electronic devices occurs due to vaporization and expansion of moisture-absorbing water molecules. In order to solve this problem, the underfill encapsulant material is required to have good heat resistance and low water absorption.
The heat resistance and the moisture absorption of the universal underfill packaging material can not meet the technical requirements of the current electronic packaging material, and the problem that the electrical insulation performance is seriously attenuated after damp-heat aging exists. The method is far from meeting the requirement that the wiring pitch of the current packaging technology is smaller and smaller (below 25 mu m), and the short-circuit failure of components is easy to occur after high voltage is applied.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a preparation method of underfill with high electrical insulation performance.
The technical scheme for solving the technical problems is as follows: a preparation method of underfill with high electrical insulation performance comprises the following steps:
a. the weight portion of the material is as follows: adding 83-84 parts of bisphenol F type epoxy resin into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 16-17 parts of diamino diphenyl sulfone into the reaction kettle when the temperature in the reaction kettle is heated to be 180-190 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 2-3 hours; cooling the temperature in the reaction kettle to 150-160 ℃, adding 0.5-0.6 part of accelerator boron trifluoride-monoethylamine complex, and continuously stirring for 1-2 hours in a nitrogen protection environment to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: the self-synthesis diaminodiphenyl sulfone modified epoxy resin 30-35 parts, the low-viscosity epoxy resin 15-20 parts, the biphenyl epoxy resin 25-30 parts, the black pigment 0.1-0.4 part and the curing agent 20-25 parts are sequentially put into a stirring kettle, the rotating speed is set to 35RPM under the vacuum condition, and the stirring is carried out for 3-4 hours, so that the underfill disclosed by the invention is prepared.
The invention has the beneficial effects that: the underfill prepared by the invention has the advantages of high volume resistivity, high glass transition temperature, low water absorption, good electrical insulation performance after aging in a damp-heat environment and the like, and is suitable for packaging semiconductor electronic components mounted on various bare chips. The bad phenomenon that the electronic components are cracked due to gasification and expansion of water molecules or short circuit occurs due to the fact that high voltage is applied after the space between the wires is reduced in design is effectively guaranteed.
On the basis of the technical scheme, the invention is further improved as follows.
Further, the synthesis mechanism of the self-synthesized diamino diphenyl sulfone modified epoxy resin is that secondary amine in the molecular structure of the diamino diphenyl sulfone and epoxy group in bisphenol F epoxy resin generate ring-opening addition reaction to generate terminal hydroxyl group, the terminal hydroxyl group continuously reacts with the epoxy group, and further generates crosslinking reaction under the acceleration action of boron trifluoride-monoethylamine complex.
The further scheme has the beneficial effects that the epoxy group in the self-synthesized diamino diphenyl sulfone modified epoxy resin can participate in further curing and crosslinking; the sulfone group in the molecular structure has good damp and heat resistant effect.
Further, bisphenol F type epoxy resin is NPEF-170 manufactured by epoxy resin Co., Ltd, south Taiwan Asia.
The beneficial effect of adopting the further scheme is that the bisphenol F type epoxy resin has excellent electric insulation performance and low viscosity, and the electric insulation performance of the self-synthesized resin can be further improved.
Further, the diamino diphenyl sulfone is DDS produced by new material GmbH of Zhengfeng, Hubei.
The further scheme has the beneficial effect that the diaminodiphenyl sulfone has excellent water resistance and higher curing crosslinking density, so that the wet heat resistance of the self-synthesized resin can be further improved.
Further, the accelerator boron trifluoride-monoethylamine complex is BF produced by Shanghai Banghong chemical industry Co., Ltd3-MEA。
The further scheme has the beneficial effects that the boron trifluoride-monoethylamine complex is rapidly decomposed into boron trifluoride and ethylamine under the heating condition, the ethylamine plays a role in further curing and crosslinking, the boron trifluoride has a good accelerating effect, the crosslinking accelerating effect is played in the synthesis process, the molecular weight of the self-synthesized modified epoxy resin is maximized, and the moisture and heat resistance is facilitated.
Further, the low viscosity epoxy resin is any one of EXA-830LVP or EXA-835LV manufactured by DIC corporation of Japan.
The further scheme has the beneficial effects that the low-viscosity epoxy resin has a benzene ring and a flexible fat long chain in the molecular structure, so that the system can be kept to have better temperature resistance; meanwhile, the viscosity of the system is reduced, and the requirements of an electronic packaging process are met.
Further, the biphenyl type epoxy resin is any one of NC-3000, NC-3000P or NC-3000FH manufactured by Nippon chemical company.
The special epoxy resin has the beneficial effects that the planar network structure of the benzene ring in the molecular structure of the special epoxy resin reduces the free volume, and is beneficial to reducing the water absorption. On the other hand, the system has heat resistance through the heat-resistant skeleton of the naphthalene ring. Particularly for electronic packaging.
Further, the curing agent is any one of PN-H, PN-31J or PN-40J, manufactured by Nippon monosodium salt Co.
The further scheme has the advantages that the curing agent has the characteristics of good storage stability, high curing crosslinking density and high glass transition temperature after being mixed with the epoxy resin, and can effectively improve the moisture and heat resistance of a system.
Detailed Description
The principles and features of this invention are described below in conjunction with examples which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
Example 1
a. The weight portion of the material is as follows: adding 830g of bisphenol F epoxy resin NPEF-170F into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 170g of diamino diphenyl sulfone DDS into the reaction kettle when the temperature in the reaction kettle is heated to 190 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 3 hours; the temperature in the reaction kettle is reduced to 160 ℃, and an accelerant boron trifluoride-monoethylamine complex BF is added35g of MEA, and stirring for 2 hours in the environment of nitrogen protection to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: 350g of self-synthesized diamino diphenyl sulfone modified epoxy resin, 150g of low-viscosity epoxy resin EXA-830LVP, NC-3000300 g of biphenyl type epoxy resin, 10g of black pigment and 200g of curing agent PN-40J are sequentially put into a stirring kettle, the rotating speed is set to be 35RPM under the condition of vacuumizing, and the stirring is carried out for 3 hours, so as to prepare the underfill adhesive disclosed by the invention.
Example 2
a. The weight portion of the material is as follows: adding 830g of bisphenol F epoxy resin NPEF-170F into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 170g of diamino diphenyl sulfone DDS into the reaction kettle when the temperature in the reaction kettle is heated to 180 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 3 hours; the temperature in the reaction kettle is reduced to 150 ℃, and an accelerant boron trifluoride-monoethylamine complex BF is added35g of MEA, and stirring for 2 hours in the environment of nitrogen protection to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: 350g of self-synthesized diamino diphenyl sulfone modified epoxy resin, 150g of low-viscosity epoxy resin EXA-835LV, 10g of biphenyl type epoxy resin NC-3000300 g, 10g of black pigment and 200g of curing agent PN-H are sequentially put into a stirring kettle, the rotating speed is set to be 35RPM under the vacuum condition, and the stirring is carried out for 3.5 hours, so as to prepare the underfill adhesive.
Example 3
a. The weight portion of the material is as follows: adding 830g of bisphenol F epoxy resin NPEF-170F into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 170g of diamino diphenyl sulfone DDS into the reaction kettle when the temperature in the reaction kettle is heated to 190 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 3 hours; the temperature in the reaction kettle is reduced to 160 ℃, and an accelerant boron trifluoride-monoethylamine complex BF is added35g of MEA, and stirring for 2 hours in the environment of nitrogen protection to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: 350g of self-synthesized diamino diphenyl sulfone modified epoxy resin, 200g of low-viscosity epoxy resin EXA-830LVP, 300g of biphenyl type epoxy resin NC-3000FH, 10g of black pigment and 200g of curing agent PN-31J are sequentially put into a stirring kettle, the rotating speed is set to be 35RPM under the condition of vacuumizing, and the mixture is stirred for 4 hours to prepare the underfill adhesive disclosed by the invention.
Example 4
a. The weight portion of the material is as follows: adding 840g of bisphenol F epoxy resin NPEF-170F into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 160g of diamino diphenyl sulfone DDS into the reaction kettle when the temperature in the reaction kettle is heated to 190 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 3 hours; the temperature in the reaction kettle is reduced to 160 ℃, and an accelerant boron trifluoride-monoethylamine complex BF is added36g of MEA, and stirring for 2 hours in the environment of nitrogen protection to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: the self-synthesis diaminodiphenyl sulfone modified epoxy resin 330g, the low-viscosity epoxy resin EXA-830LVP 180g, the biphenyl type epoxy resin NC-3000270 g, the black pigment 20g and the curing agent PN-40J 220g are sequentially put into a stirring kettle, the set rotating speed is 35RPM under the vacuum condition, and the stirring is carried out for 3 hours, thus obtaining the underfill adhesive of the invention.
Example 5
a. The weight portion of the material is as follows: adding bisphenol F type epoxy resin NPEF-170F 840g into a reaction kettle, heating and starting stirring, setting the rotation speedThe speed is 10RPM, when the temperature in the reaction kettle is heated to 190 ℃, 160g of diamino diphenyl sulfone DDS is added into the reaction kettle, the temperature in the reaction kettle is kept, the rotating speed is set to be 25RPM under the condition of vacuumizing, and the stirring is carried out for 3 hours; the temperature in the reaction kettle is reduced to 160 ℃, and an accelerant boron trifluoride-monoethylamine complex BF is added36g of MEA, and stirring for 2 hours in the environment of nitrogen protection to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: the self-synthesis diaminodiphenyl sulfone modified epoxy resin 300g, the low-viscosity epoxy resin EXA-835LV 200g, the biphenyl type epoxy resin NC-3000P 250g, the black pigment 20g and the curing agent PN-H250 g are sequentially put into a stirring kettle, the set rotating speed is 35RPM under the vacuum condition, and the stirring is carried out for 3 hours, so that the underfill disclosed by the invention is prepared.
Comparative example 1
The weight portion of the material is as follows: 350g of self-synthesized diamino diphenyl sulfone modified epoxy resin, 150g of low-viscosity epoxy resin EXA-830LVP, NC-3000300 g of biphenyl type epoxy resin, 10g of black pigment and 200g of curing agent PN-40J. And sequentially putting the mixture into a stirring kettle, setting the rotating speed to be 35RPM under the condition of vacuumizing, and stirring for 3 hours to obtain the underfill adhesive.
Comparative example 2
The formula of the common underfill is as follows: 500g of bisphenol A epoxy resin 850CRP, 830320 g of bisphenol F epoxy resin, KH-5606 g of silane coupling agent, 4g of black pigment and 80g of curing agent Japanese monosodium glutamate MY-25180 are sequentially put into a stirring kettle, the rotating speed is set to 35RPM under the condition of vacuum pumping, and stirring is carried out for 4 hours, so as to prepare the common underfill adhesive.
Specific test examples
The properties of the underfill according to the above examples 1-5 of the present invention and comparative examples 1,2 were tested by the following tests. Wherein the electrical insulation properties are characterized by a surface insulation resistance; the temperature resistance is characterized by the glass transition temperature; the moisture resistance is characterized by the water absorption; the resistance to wet heat aging is characterized by the SIR result of the electrical performance of the functional sample after the double 85 test box.
Test example 1 Electrical insulation Performance test
After the underfill was cured, the surface insulation resistance resistivity was measured in ohms (Ω) using an insulation resistance tester.
Test example 2 temperature resistance test
The underfill was cured into a 10mm × 10mm × 3mm sample block, and the glass transition temperature was measured using TMA (thermo mechanical analyzer) in degrees celsius (° c).
Test example 3 moisture resistance test
The underfill was cured to 10mm × 10mm × 2mm sample blocks and the original weight W was measured using an analytical balance0Putting the mixture into water at 25 ℃ for 24h, taking out the mixture, wiping the surface moisture, and testing the weight W by using an analytical balance1According to (W)1- W0）/ W0The water absorption is calculated in percent (%).
Test example 4 resistance to Damp-Heat aging test
And (3) using a damp-heat aging test box, setting the temperature to be 85 ℃ and the humidity to be 85%, putting the functional sample filled with the underfill into the box for 1000h, and testing the surface insulation resistance of the functional sample subjected to damp-heat aging in ohm (omega) unit by using an insulation resistance tester after a 5V direct-current power supply is electrified.
The test results are shown in table 1 below.
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Comparative example 1 | Comparative example 2 | |
| Surface insulation resistance (omega) | 3.42*109 | 3.67*109 | 4.42*109 | 2.97*109 | 2.35*109 | 5.6*108 | 2. 4*108 |
| Water absorption (%) | 0.12 | 0.15 | 0.14 | 0.12 | 0.13 | 0.21 | 0.35 |
| Glass transition temperature (. degree. C.) | 138 | 141 | 140 | 137 | 135 | 90 | 85 |
| Surface insulation resistance (omega) | 7.54*108 | 5.84*108 | 6.54*108 | 5.67*108 | 7.16*108 | 7.85*106 | 2.66*105 |
TABLE 1 comparison of test Properties of samples prepared in examples 1 to 5 with those of comparative examples 1 and 2
As can be seen from the data in Table 1, the underfill prepared by the present invention has the advantages of high volume resistivity, high glass transition temperature, low water absorption, good electrical insulation performance after aging especially in a damp-heat environment, etc., and is suitable for packaging semiconductor electronic components mounted on various bare chips.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (2)
1. The preparation method of the underfill with high electrical insulation performance is characterized by comprising the following steps:
a. the weight portion of the material is as follows: adding 83-84 parts of bisphenol F type epoxy resin into a reaction kettle, heating and starting stirring, setting the rotating speed to be 10RPM, adding 16-17 parts of diamino diphenyl sulfone into the reaction kettle when the temperature in the reaction kettle is heated to be 180-190 ℃, keeping the temperature in the reaction kettle, setting the rotating speed to be 25RPM under the condition of vacuumizing, and stirring for 2-3 hours; reducing the temperature in the reaction kettle to 150-160 ℃, adding 0.5-0.6 part of accelerator, and continuously stirring for 1-2 hours in a nitrogen protection environment to prepare the self-synthesized diamino diphenyl sulfone modified epoxy resin;
b. the weight portion of the material is as follows: self-synthesis of 30-35 parts of diamino diphenyl sulfone modified epoxy resin, 15-20 parts of low-viscosity epoxy resin, 25-30 parts of biphenyl epoxy resin, 0.1-0.4 part of black pigment and 20-25 parts of curing agent, sequentially putting the materials into a stirring kettle, setting the rotating speed to be 35RPM under the vacuum condition, and stirring for 3-4 hours to prepare the underfill;
the accelerant is a boron trifluoride-monoethylamine complex; the low-viscosity epoxy resin is any one of EXA-830LVP or EXA-835LV manufactured by NIPPIC company; the biphenyl epoxy resin is any one of NC-3000, NC-3000P or NC-3000FH produced by Nippon chemical company; the curing agent is any one of PN-H, PN-31J or PN-40J produced by Nippon monosodium glutamate.
2. The method according to claim 1, wherein the bisphenol F type epoxy resin is NPEF-170 produced by south Taiwan Asia epoxy resin Co., Ltd, the diaminodiphenyl sulfone is DDS produced by New Material Co., Ltd, Zhengfeng, Hubei, and the accelerator boron trifluoride monoethylamine complex is BF produced by chemical engineering Co., Ltd, Shanghai Bang3-MEA。
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200508316A (en) * | 2003-08-04 | 2005-03-01 | Hitachi Chemical Co Ltd | Epoxy resin composition for sealing and electronic part device |
| CN106471035A (en) * | 2014-07-02 | 2017-03-01 | Dic株式会社 | Electronic material composition epoxy resin, its solidfied material and electronic component |
| CN106633631A (en) * | 2016-10-09 | 2017-05-10 | 连云港华海诚科电子材料有限公司 | Bottom filling rubber for high-density encapsulation and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200508316A (en) * | 2003-08-04 | 2005-03-01 | Hitachi Chemical Co Ltd | Epoxy resin composition for sealing and electronic part device |
| CN106471035A (en) * | 2014-07-02 | 2017-03-01 | Dic株式会社 | Electronic material composition epoxy resin, its solidfied material and electronic component |
| CN106633631A (en) * | 2016-10-09 | 2017-05-10 | 连云港华海诚科电子材料有限公司 | Bottom filling rubber for high-density encapsulation and preparation method thereof |
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