CN109266299A - A kind of flame retardant type organic silicon potting adhesive - Google Patents
A kind of flame retardant type organic silicon potting adhesive Download PDFInfo
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- CN109266299A CN109266299A CN201811011655.3A CN201811011655A CN109266299A CN 109266299 A CN109266299 A CN 109266299A CN 201811011655 A CN201811011655 A CN 201811011655A CN 109266299 A CN109266299 A CN 109266299A
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- zeolite
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of flame retardant type organic silicon potting adhesives, belong to technical field of polymer materials.Zeolite ball milling is crossed the sieve of 100 mesh, obtains refinement zeolite by the present invention；Refinement zeolite is stirred with copper chloride solution 1:5~1:10 in mass ratio, is concentrated under reduced pressure, it is dry, obtain pretreatment zeolite, pretreatment zeolite is stirred with chitosan liquid 1:10~1:20 in mass ratio, is filtered, washing, it is dry, it carbonizes to get modified zeolite, by organic siliconresin, modified zeolite, low-melting alloy, curing agent, curing accelerator, retarder, diluent, defoaming agent and phosphatide are stirred to get flame retardant type organic silicon potting adhesive.Flame retardant type organic silicon potting adhesive provided by the invention has excellent flame retardant property and mechanical property.
Description
Technical field
The invention discloses a kind of flame retardant type organic silicon potting adhesives, belong to technical field of polymer materials.
Background technique
As more powerful function is constantly integrated into smaller component by electronic equipment, resistance of the electronic component to casting glue
More stringent requirements are proposed for combustion property and thermal conductivity.No coupling product discharges when add-on type liquid silicon rubber has crosslinking, shrinking percentage is small,
The features such as crosslink density and curingprocess rate easy to control is the desired matrix material of electronic apparatus casting glue.However, add-on type silicon rubber
Glue is since molecule itself is in nonpolarity, and cementability is poor, as electronics encapsulating, coating material in use, moisture can pass through rubber
Device inside is penetrated into gap between substrate leads to corrosion and failure of insulation.Being handled using silane coupling agent substrate surface can
Improve the cementability of additional organosilicon material and a variety of materials；But such a process increases production processes and production time, make
The solvent volatilization of used time causes unnecessary environmental pollution again.Carbonic ester has excellent insulating properties, good flame retardancy and ruler
Very little stability is widely used in electronic apparatus as shell, body and timbering material.Condensed type liquid silastic is commonly each
Kind amino silane has preferable cementability to PC, but has poisoning effect to add-on type liquid silicon rubber and cannot use.
In recent years, as the high-tech areas such as electronic component, power circuitry module, large-scale integrated circuit board, LED are into one
Step realizes high-performance, high reliability and miniaturization, and working environment is harsher, it is desirable that embedding part must low temperature and high temperature it
Between, run under the conditions of high speed rotation etc., this requires Embedding Material not only need to have excellent mobility, high and low temperature resistance,
Mechanical property, electrical insulation capability etc., and need to have good flame retardant property.
At present for the thermally conductive and flame-retardant modified predominantly addition filler and auxiliary agent of organic silicon rubber, addition Al2O3 can be with
It is effectively improved the thermal conductivity of resin, adds Al(OH) 3 resins fire retardant rank can be improved.But the filler and resin of addition are in power
Incompatible on, if additive amount is few, thermally conductive and flame retardant effect is unobvious, if additive amount is excessive, and will affect the mechanics of casting glue
Performance, and colloid viscosity will increase, and influence operability.
Therefore, it assigns that organic silicon potting adhesive is thermally conductive and flame retarding function, while keeping its preferable mechanical property and bonding strong
Degree, is of great significance for the development of modern electronics industry.
Summary of the invention
The present invention solves the technical problem of: for traditional flame retardant type organic silicon potting adhesive flame retardant property and mechanical property
The bad problem of energy, provides a kind of flame retardant type organic silicon potting adhesive
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that:
A kind of flame retardant type organic silicon potting adhesive, is made of the raw material of following parts by weight:
40~60 parts of organic siliconresin
10~20 parts of modified zeolite
8~10 parts of low-melting alloy
5~8 parts of curing agent
3~5 parts of curing accelerator
3~5 parts of retarder
3~5 parts of diluent
3~5 parts of defoaming agent
Phosphatidase 3~5 part
The process for preparation of the flame retardant type organic silicon potting adhesive are as follows: each raw material is weighed by raw material composition, it is modified by organic siliconresin
Zeolite, low-melting alloy, curing agent, curing accelerator, retarder, diluent, defoaming agent and phosphatide are stirred to get fire-retardant
Type organic silicon potting adhesive.
The organic siliconresin is methylsiloxane resin, any one in ethyl organic siliconresin or aryl organic siliconresin
Kind.
The preparation process of the modified zeolite are as follows: by zeolite ball milling, cross the sieve of 100 mesh, obtain refinement zeolite；Zeolite will be refined
It is stirred, is concentrated under reduced pressure with copper chloride solution 1:5~1:10 in mass ratio, it is dry, pretreatment zeolite is obtained, zeolite will be pre-processed
It is stirred, filters with chitosan liquid 1:10~1:20 in mass ratio, wash, it is dry, it carbonizes to get modified zeolite.
The low-melting alloy is bismuth tin alloy, and wherein bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for
11%(ω).
The curing agent is diethylenetriamine, any one in triethylene tetramine or dipropylenetriamine.
The curing accelerator is resorcinol, any one in dimethyl benzylamine or 2-ethyl-4-methylimidazole.
The retarder is potassium tartrate, any one in calgon or hydroxyl hydrochloric acid.
The diluent is diethanol diglycidyl ether, o-tolyl glycidol ether or neopentyl glycol 2-glycidyl
Any one in ether.
The defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxyethylene polyoxy propyl alcohol amidogen ether or polyoxypropylene
Any one in glycerin ether.
The beneficial effects of the present invention are:
The present invention is by addition modified zeolite and low-melting alloy, during the preparation process, firstly, refinement zeolite and copper chloride is molten
Liquid mixing, and be concentrated under reduced pressure, so that copper chloride is deposited in zeolite, then, pretreatment zeolite is mixed with chitosan liquid, it is pre- to locate
Manage the copper chloride dissolution in zeolite, copper ion make it is chitosan crosslinked, zeolite surface and it is internal form cross-linked network, it is then logical
Charing is crossed, so that zeolite surface and the charing of the chitosan of inside, meanwhile, the carbonaceous in system makes copper ion be reduced into simple substance
Copper since low-melting alloy has lower fusing point, has just melted, alloy before resin is fully cured in use
It good can be dispersed in around elemental copper after ion fusing, after alloy graining, so that metallurgical bonding is formed between modified zeolite, so that
The mechanical property of system gets a promotion, and under the conditions of high temperature fire, alloy melting in system, the alloy after thawing is in system table
Surface current is dynamic, can press the part flame that goes out, play good flame retardant effect, meanwhile, so that the elemental copper of internal package is able to cruelly
Dew, the silane key of organic siliconresin, which is broken, to be decomposed, and remaining silicon oxygen bond can form silicon in conjunction with the elemental copper in modified zeolite
Oxygen copper alloy, silicon oxygen copper alloy has the effect of good heat-insulated, resistance oxygen, so that the flame retardant property of system is further mentioned
It rises.
Specific embodiment
Chitosan and water 1:50~1:100 in mass ratio are placed in a beaker, 10~20min is stirred with glass bar, stands
It after being swollen 3~5h, placing the beaker digital display and tests the speed in constant temperature blender with magnetic force, be 80~85 DEG C in temperature, revolving speed is 300~
Under the conditions of 500r/min, heating stirring dissolves 40~60min, obtains chitosan liquid；By zeolite ball milling, the sieve of 100 mesh is crossed, must be refined
Zeolite；Copper chloride solution 1:5~1:10 in mass ratio that zeolite and mass fraction are 10~20% will be refined and be placed in single-necked flask
In, under the conditions of revolving speed is 300~500r/min, it is stirred 40~60min, obtains mixed liquor, mixed liquor is placed in rotation and is steamed
It sends out in instrument, is 60~75 DEG C in temperature, under the conditions of pressure is 500~800Pa, 40~60min is concentrated under reduced pressure, obtains concentrate, connects
Concentrate is placed in baking oven, it is dry to constant weight under the conditions of temperature is 105~110 DEG C, obtain pretreatment zeolite, will locate in advance
Reason zeolite and chitosan liquid 1:10~1:20 in mass ratio are placed in three-necked flask, under the conditions of revolving speed is 400~600r/min,
It is stirred 40~60min, mixed serum is obtained, then mixed serum is filtered, obtains filter cake, then with deionized water by Washing of Filter Cake
3~5 times, then filter cake will be obtained after washing and be placed in drying box, it is dry to constant weight under the conditions of temperature is 105~110 DEG C, it obtains
Dry cake is then placed in retort by dry cake, and nitrogen, Yu Wen are filled with into furnace with 100~120mL/min rate
Under the conditions of degree is 550~750 DEG C, 1~2h is carbonized to get modified zeolite；According to parts by weight, by 40~60 parts of organosilicon trees
Rouge, 10~20 parts of modified zeolites, 8~10 parts of low-melting alloys, 5~8 parts of curing agent, 3~5 parts of curing accelerators, 3~5 parts slow
Solidifying agent, 3~5 parts of diluents, 3~5 parts of defoaming agents and 3~5 parts of phosphatide are placed in batch mixer, in revolving speed be 1000~1200r/
Under the conditions of min, high-speed stirred mixes 40~60min to get flame retardant type organic silicon potting adhesive.The organic siliconresin has for methyl
Any one in machine silicone resin, ethyl organic siliconresin or aryl organic siliconresin.The low-melting alloy is bismuth tin alloy,
Middle bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).The curing agent is diethylenetriamine, three second
Any one in alkene tetramine or dipropylenetriamine.The curing accelerator is resorcinol, dimethyl benzylamine or 2- ethyl -4-
Any one in methylimidazole.The retarder is potassium tartrate, any one in calgon or hydroxyl hydrochloric acid.Institute
Stating diluent is diethanol diglycidyl ether, any in o-tolyl glycidol ether or neopentylglycol diglycidyl ether
It is a kind of.The defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether, and polyoxyethylene polyoxy propyl alcohol amidogen ether or polyoxypropylene are sweet
Any one in oily ether.The phosphatide is soybean lecithin, any one in milk phosphatide or yolk phospholipid.
Chitosan and water 1:100 in mass ratio are placed in a beaker, stir 20min with glass bar, it, will after standing swelling 5h
Beaker is placed in digital display and tests the speed in constant temperature blender with magnetic force, is 85 DEG C in temperature, under the conditions of revolving speed is 500r/min, heating stirring is molten
60min is solved, chitosan liquid is obtained；By zeolite ball milling, the sieve of 100 mesh is crossed, refinement zeolite is obtained；It is with mass fraction by refinement zeolite
20% copper chloride solution 1:10 in mass ratio is placed in single-necked flask, under the conditions of revolving speed is 500r/min, is stirred
60min obtains mixed liquor, and mixed liquor is placed in Rotary Evaporators, is 75 DEG C in temperature, under the conditions of pressure is 800Pa, depressurizes dense
Contracting 60min obtains concentrate, then concentrate is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains pre- place
Manage zeolite, will pretreatment zeolite and chitosan liquid 1:20 in mass ratio be placed in three-necked flask, in revolving speed be 600r/min condition
Under, it is stirred 60min, mixed serum is obtained, then mixed serum is filtered, obtains filter cake, then with deionized water by Washing of Filter Cake 5
It is secondary, then filter cake will be obtained after washing be placed in drying box, under the conditions of temperature is 110 DEG C, drying to constant weight obtains dry cake,
Then dry cake is placed in retort, and nitrogen is filled with into furnace with 120mL/min rate, in temperature be 750 DEG C of conditions
Under, 2h is carbonized to get modified zeolite；According to parts by weight, by 60 parts of organic siliconresins, 20 parts of modified zeolites, 10 parts of low melting points
Alloy, 8 parts of curing agent, 5 parts of curing accelerators, 5 parts of retarder, 5 parts of diluents, 5 parts of defoaming agents and 5 parts of phosphatide are placed in batch mixer
In, under the conditions of revolving speed is 1200r/min, high-speed stirred mixes 60min to get flame retardant type organic silicon potting adhesive.It is described organic
Silicone resin is methylsiloxane resin.The low-melting alloy is bismuth tin alloy, and wherein bismuth accounts for 51%(ω), tin accounts for 30%(ω),
Lead accounts for 8%(ω), indium accounts for 11%(ω).The curing agent is diethylenetriamine.The curing accelerator is resorcinol.It is described slow
Solidifying agent is potassium tartrate.The diluent is diethanol diglycidyl ether.The defoaming agent is polyoxyethylene polyoxypropylene season
Penta 4 alcohol ethers.The phosphatide is soybean lecithin.
According to parts by weight, by 60 parts of organic siliconresins, 20 parts of zeolites, 10 parts of low-melting alloys, 8 parts of curing agent, 5 parts solid
Change promotor, 5 parts of retarder, 5 parts of diluents, 5 parts of defoaming agents and 5 parts of phosphatide are placed in batch mixer, in revolving speed be 1200r/min
Under the conditions of, high-speed stirred mixes 60min to get flame retardant type organic silicon potting adhesive.The organic siliconresin is methylsiloxane tree
Rouge.The low-melting alloy is bismuth tin alloy, and wherein bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%
(ω).The curing agent is diethylenetriamine.The curing accelerator is resorcinol.The retarder is potassium tartrate.Institute
Stating diluent is diethanol diglycidyl ether.The defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether.The phosphatide
For soybean lecithin.
Chitosan and water 1:100 in mass ratio are placed in a beaker, stir 20min with glass bar, it, will after standing swelling 5h
Beaker is placed in digital display and tests the speed in constant temperature blender with magnetic force, is 85 DEG C in temperature, under the conditions of revolving speed is 500r/min, heating stirring is molten
60min is solved, chitosan liquid is obtained；By zeolite ball milling, the sieve of 100 mesh is crossed, refinement zeolite is obtained；It is with mass fraction by refinement zeolite
20% copper chloride solution 1:10 in mass ratio is placed in single-necked flask, under the conditions of revolving speed is 500r/min, is stirred
60min obtains mixed liquor, and mixed liquor is placed in Rotary Evaporators, is 75 DEG C in temperature, under the conditions of pressure is 800Pa, depressurizes dense
Contracting 60min obtains concentrate, then concentrate is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains pre- place
Manage zeolite, will pretreatment zeolite and chitosan liquid 1:20 in mass ratio be placed in three-necked flask, in revolving speed be 600r/min condition
Under, it is stirred 60min, mixed serum is obtained, then mixed serum is filtered, obtains filter cake, then with deionized water by Washing of Filter Cake 5
It is secondary, then filter cake will be obtained after washing be placed in drying box, under the conditions of temperature is 110 DEG C, drying to constant weight obtains dry cake,
Then dry cake is placed in retort, and nitrogen is filled with into furnace with 120mL/min rate, in temperature be 750 DEG C of conditions
Under, 2h is carbonized to get modified zeolite；According to parts by weight, by 60 parts of organic siliconresins, 20 parts of modified zeolites, 8 parts of curing agent, 5
Part curing accelerator, 5 parts of retarder, 5 parts of diluents, 5 parts of defoaming agents and 5 parts of phosphatide are placed in batch mixer, are in revolving speed
Under the conditions of 1200r/min, high-speed stirred mixes 60min to get flame retardant type organic silicon potting adhesive.The organic siliconresin is methyl
Organic siliconresin.The curing agent is diethylenetriamine.The curing accelerator is resorcinol.The retarder is tartaric acid
Potassium.The diluent is diethanol diglycidyl ether.The defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether.It is described
Phosphatide is soybean lecithin.
Chitosan and water 1:100 in mass ratio are placed in a beaker, stir 20min with glass bar, it, will after standing swelling 5h
Beaker is placed in digital display and tests the speed in constant temperature blender with magnetic force, is 85 DEG C in temperature, under the conditions of revolving speed is 500r/min, heating stirring is molten
60min is solved, chitosan liquid is obtained；By zeolite ball milling, the sieve of 100 mesh is crossed, refinement zeolite is obtained；It is with mass fraction by refinement zeolite
20% copper chloride solution 1:10 in mass ratio is placed in single-necked flask, under the conditions of revolving speed is 500r/min, is stirred
60min obtains mixed liquor, and mixed liquor is placed in Rotary Evaporators, is 75 DEG C in temperature, under the conditions of pressure is 800Pa, depressurizes dense
Contracting 60min obtains concentrate, then concentrate is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains pre- place
Manage zeolite, will pretreatment zeolite and chitosan liquid 1:20 in mass ratio be placed in three-necked flask, in revolving speed be 600r/min condition
Under, it is stirred 60min, mixed serum is obtained, then mixed serum is filtered, obtains filter cake, then with deionized water by Washing of Filter Cake 5
It is secondary, then filter cake will be obtained after washing be placed in drying box, under the conditions of temperature is 110 DEG C, drying to constant weight obtains dry cake,
Then dry cake is placed in retort, and nitrogen is filled with into furnace with 120mL/min rate, in temperature be 750 DEG C of conditions
Under, 2h is carbonized to get modified zeolite；According to parts by weight, by 60 parts of organic siliconresins, 20 parts of modified zeolites, 10 parts of low melting points
Alloy, 8 parts of curing agent, 5 parts of curing accelerators, 5 parts of retarder, 5 parts of diluents, 5 parts of defoaming agents are placed in batch mixer, in revolving speed
Under the conditions of 1200r/min, high-speed stirred mixes 60min to get flame retardant type organic silicon potting adhesive.The organic siliconresin is first
Base organic siliconresin.The low-melting alloy is bismuth tin alloy, and wherein bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω),
Indium accounts for 11%(ω).The curing agent is diethylenetriamine.The curing accelerator is resorcinol.The retarder is winestone
Sour potassium.The diluent is diethanol diglycidyl ether.The defoaming agent is polyoxyethylene polyoxypropylene pentaerythrite ether.
Comparative example: the flame retardant type organic silicon potting adhesive of Shanghai City Jiao Ye Co., Ltd production.
The resulting flame retardant type organic silicon potting adhesive of example 1 to 4 and comparative example product are subjected to performance detection, specific detection side
Method is as follows:
1. tensile strength and elongation at break: according to GB/T528 standard, being measured using electronic universal tester and (stretch speed
Rate 500mm/min, 25 DEG C of measurements)；
2. oxygen index (OI): being tested according to GB/T2406, sample size 85mm × 10mm × 3.2mm.
Specific testing result is as shown in table 1:
Table 1: performance detection table
| Detection project | Example 1 | Example 2 | Example 3 | Example 4 | Comparative example |
| Tensile strength/MPa | 3.12 | 2.89 | 2.23 | 2.10 | 1.56 |
| Elongation at break/% | 80.10 | 70.54 | 68.71 | 65.9 | 60.44 |
| Oxygen index (OI)/% | 55 | 48 | 40 | 36 | 28 |
By 1 testing result of table it is found that the flame retardant type organic silicon potting adhesive of technical solution of the present invention preparation has excellent anti-flammability
Energy and mechanical property.
Claims (10)
1. a kind of flame retardant type organic silicon potting adhesive, it is characterised in that: be made of the raw material of following parts by weight:
40~60 parts of organic siliconresin
10~20 parts of modified zeolite
8~10 parts of low-melting alloy
5~8 parts of curing agent
3~5 parts of curing accelerator
3~5 parts of retarder
3~5 parts of diluent
3~5 parts of defoaming agent
Phosphatidase 3~5 part
The process for preparation of the flame retardant type organic silicon potting adhesive are as follows: each raw material is weighed by raw material composition, it is modified by organic siliconresin
Zeolite, low-melting alloy, curing agent, curing accelerator, retarder, diluent, defoaming agent and phosphatide are stirred to get fire-retardant
Type organic silicon potting adhesive.
2. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the organic siliconresin is methyl
Any one in organic siliconresin, ethyl organic siliconresin or aryl organic siliconresin.
3. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the preparation of the modified zeolite
Journey are as follows: by zeolite ball milling, cross the sieve of 100 mesh, obtain refinement zeolite；Zeolite and copper chloride solution 1:5~1 in mass ratio will be refined:
10 are stirred, and are concentrated under reduced pressure, dry, obtain pretreatment zeolite, will pre-process zeolite and chitosan liquid 1:10~1 in mass ratio:
20 are stirred, and filter, and wash, dry, carbonize to get modified zeolite.
4. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the low-melting alloy is bismuth tin
Alloy, wherein bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).
5. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the curing agent is divinyl three
Any one in amine, triethylene tetramine or dipropylenetriamine.
6. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the curing accelerator is isophthalic
Any one in diphenol, dimethyl benzylamine or 2-ethyl-4-methylimidazole.
7. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the retarder is tartaric acid
Any one in potassium, calgon or hydroxyl hydrochloric acid.
8. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the diluent is diethanol two
Glycidol ether, any one in o-tolyl glycidol ether or neopentylglycol diglycidyl ether.
9. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the defoaming agent is polyoxyethylene
Polyoxypropylene pentaerythrite ether, any one in polyoxyethylene polyoxy propyl alcohol amidogen ether or polypropylene glycerol aether.
10. a kind of flame retardant type organic silicon potting adhesive according to claim 1, it is characterised in that: the phosphatide is soybean lecithin,
Any one in milk phosphatide or yolk phospholipid.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229621A (en) * | 2019-05-30 | 2019-09-13 | 李全峰 | A kind of preparation method of composite foamed glue film |
| CN115141599A (en) * | 2022-07-22 | 2022-10-04 | 江西省奋发粘胶化工有限公司 | Preparation method of high-hardness organosilicon sealant |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102527347A (en) * | 2012-01-19 | 2012-07-04 | 上海海洋大学 | Magnetic chitosan/cationic surface active agent modified zeolite adsorbent and preparation method and application thereof |
| CN103265929A (en) * | 2013-06-20 | 2013-08-28 | 李季 | Preparation method for carbon nano tube antiflaming heat conducting organic silicone pouring sealant |
| CN104031600A (en) * | 2013-03-04 | 2014-09-10 | 中国科学院理化技术研究所 | Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof |
| CN106188653A (en) * | 2016-08-29 | 2016-12-07 | 桂林舒康建材有限公司 | A kind of Novel wood-plastic composite material antibacterial and preparation method thereof |
| CN106701012A (en) * | 2017-01-11 | 2017-05-24 | 广州天赐有机硅科技有限公司 | Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof |
| CN107459963A (en) * | 2017-09-08 | 2017-12-12 | 常州市好利莱光电科技有限公司 | A kind of organic silicon potting adhesive |
-
2018
- 2018-08-31 CN CN201811011655.3A patent/CN109266299A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102527347A (en) * | 2012-01-19 | 2012-07-04 | 上海海洋大学 | Magnetic chitosan/cationic surface active agent modified zeolite adsorbent and preparation method and application thereof |
| CN104031600A (en) * | 2013-03-04 | 2014-09-10 | 中国科学院理化技术研究所 | Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof |
| CN103265929A (en) * | 2013-06-20 | 2013-08-28 | 李季 | Preparation method for carbon nano tube antiflaming heat conducting organic silicone pouring sealant |
| CN106188653A (en) * | 2016-08-29 | 2016-12-07 | 桂林舒康建材有限公司 | A kind of Novel wood-plastic composite material antibacterial and preparation method thereof |
| CN106701012A (en) * | 2017-01-11 | 2017-05-24 | 广州天赐有机硅科技有限公司 | Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof |
| CN107459963A (en) * | 2017-09-08 | 2017-12-12 | 常州市好利莱光电科技有限公司 | A kind of organic silicon potting adhesive |
Non-Patent Citations (3)
| Title |
|---|
| 倪礼忠: "《聚合物基复合材料》", 28 February 2007, 华东理工大学出版社 * |
| 方亮: "《药用高分子材料学》", 30 August 2015, 中国医药科技出版社 * |
| 王宁: "《有机化学》", 30 January 2018, 江苏凤凰科学技术出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229621A (en) * | 2019-05-30 | 2019-09-13 | 李全峰 | A kind of preparation method of composite foamed glue film |
| CN115141599A (en) * | 2022-07-22 | 2022-10-04 | 江西省奋发粘胶化工有限公司 | Preparation method of high-hardness organosilicon sealant |
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