CN111385977A - PCB (printed circuit board) blind hole layer negative film process - Google Patents
PCB (printed circuit board) blind hole layer negative film process Download PDFInfo
- Publication number
- CN111385977A CN111385977A CN201811652480.4A CN201811652480A CN111385977A CN 111385977 A CN111385977 A CN 111385977A CN 201811652480 A CN201811652480 A CN 201811652480A CN 111385977 A CN111385977 A CN 111385977A
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- China
- Prior art keywords
- pcb
- circuit board
- blind hole
- exposure
- negative film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a negative film process of a PCB (printed circuit board) blind hole layer, which comprises the following steps of: A. cutting: cutting the plate into the Pnl size of the engineering design by using a cutting machine; B. drilling: drilling a plate edge positioning hole and a blind hole on the PCB; C. copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire; D. chemical cleaning: cleaning the PCB in a chemical cleaning line; E. line exposure: after a dry film is pasted on the surface of the PCB, an exposure machine and a negative film are used for circuit exposure; F. etching: transferring the PCB subjected to circuit exposure to an etching process through the inserting frame to perform etching treatment; G. and (4) checking: and transferring the PCB to an AOI (automated optical inspection) process for scanning detection by using a rubber frame for the etched circuit board. According to the invention, the exposure machine and the negative film are used for carrying out exposure operation on the PCB, compared with the exposure machine and the positive film are used for carrying out exposure operation on the PCB, the tin plating working procedures of the PCB are reduced, the manufacturing time is shortened, and the manufacturing cost is correspondingly reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a negative film process of a PCB (printed circuit board) blind hole layer.
Background
In the prior art, in the manufacture of the blind hole layer core board of the multilayer circuit board, in the exposure and development process, an exposure machine and a positive film are usually adopted to expose and develop the circuit board circuit, and then the circuit board circuit is etched by etching, and the circuit of the circuit board is required to be subjected to tin plating operation by adopting the positive film to expose the circuit board so as to protect the circuit pattern from being etched in the subsequent etching, so that the process is complex, the manufacture time is prolonged, and the manufacture cost is correspondingly increased.
Disclosure of Invention
In order to fill the blank of the prior art, the invention provides a negative film process of a PCB circuit board blind hole layer.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a PCB circuit board blind hole layer negative film process technology comprises the following steps:
cutting materials: cutting the plate into the Pnl size of the engineering design by using a cutting machine;
b, drilling holes: drilling a plate edge positioning hole and a blind hole on the PCB;
c, copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire;
d, chemical cleaning: cleaning the PCB in a chemical cleaning line;
e, exposure of the circuit: after a dry film is pasted on the surface of the PCB, an exposure machine and a negative film are used for circuit exposure;
f, etching: transferring the PCB subjected to circuit exposure to an etching process through the inserting frame, and etching the PCB through an etching machine;
g, testing: and transferring the PCB to an AOI (automated optical inspection) process by using a rubber frame for the etched circuit board, and scanning and detecting the circuit of the PCB by using an AOI scanner.
As an improvement of the above scheme, in the step B, the board edge positioning holes are drilled on the PCB board by a numerical control drilling machine, the board edge positioning holes are positioned by pinning, and the blind holes are drilled by using the board edge positioning holes as a positioning reference.
As an improvement of the above scheme, in the step C, when the deposited copper is thickened, the single-hole copper thickness single point is 12um minimum, and the single-hole copper thickness single point is 15um on average.
As an improvement of the above scheme, in the step E, after the exposure, the PCB board circuit is developed by using a developing machine, and the unhardened dry film attached to the PCB board circuit is washed away.
The PCB processed with the unhardened dry film is transferred to an outside line inspection process through an inserting frame, and whether the circuit of the PCB has exposure abnormality or deviation abnormality or other abnormal conditions is inspected through visual inspection and a 10-fold mirror.
In the step F, the qualified PCB is transferred to an etching line through the frame, and the PCB circuit pattern is etched.
As an improvement of the above scheme, an acidic etching solution is used for etching.
As an improvement of the above scheme, in the step G, the AOI scanner is used to scan and detect the PCB board circuit, detect the defects on the PCB board, and automatically mark the defects for adjustment by the maintenance personnel and subsequent technical improvement.
The invention has the beneficial effects that: when the exposure operation is carried out on the PCB, the exposure machine and the negative film are used for carrying out the exposure operation on the PCB, compared with the exposure operation on the PCB by using the exposure machine and the positive film, the tin plating procedure of the PCB is reduced, the procedure is simpler and more convenient, the manufacturing time is reduced, and the manufacturing cost is correspondingly reduced.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
The invention relates to a negative process of a PCB blind hole layer, and the preferred embodiment of the invention is further explained in detail below.
A PCB circuit board blind hole layer negative film process technology comprises the following steps:
cutting materials: cutting a plate into a Pnl size of an engineering design by using a cutting machine, wherein the Pnl is an abbreviation of a panel and represents a large block/piece of PCB, generally, a splicing plate which is a step plate is actually used for online punching, a plurality of step plates are arranged on one panel, and Pnl is an operation plate used when a PCB is manufactured in an actual PCB factory;
b, drilling holes: drilling a plate edge positioning hole and a blind hole on the PCB;
c, copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire;
d, chemical cleaning: cleaning the PCB in a chemical cleaning line;
e, exposure of the circuit: after a dry film is pasted on the surface of the PCB, an exposure machine and a negative film are used for circuit exposure;
f, etching: transferring the PCB subjected to circuit exposure to an etching process through the inserting frame, and etching the PCB through an etching machine;
g, testing: the etched circuit board transfers the PCB to an AOI process by using a rubber frame, and the circuit of the PCB is scanned and detected by an AOI scanner, wherein the AOI (automated Optical inspection) is called automatic Optical detection and is equipment for detecting common defects encountered in welding production based on an Optical principle.
Preferably, in the step B, a numerical control drilling machine is used for drilling the plate edge positioning hole on the PCB, then a dowel is used for positioning the plate edge positioning hole, and the blind hole is drilled by using the plate edge positioning hole as a positioning reference.
Preferably, after the blind hole is drilled, a group of outer line positioning holes are additionally drilled for auxiliary positioning.
Preferably, in the step C, when the copper deposition is thickened, the single-hole copper thickness single point is 12um at the minimum, and the single-hole copper thickness single point is 15um on average.
Preferably, in the step E, the PCB board circuit is developed using a developing machine after the exposure, and the uncured dry film attached to the PCB board circuit is washed away.
Preferably, the PCB after the uncured dry film is processed is transferred to an outside inspection process through a cradle, and the circuit of the PCB is inspected for the presence of exposure abnormality, deviation abnormality, or other abnormality by visual inspection and a 10-fold mirror inspection.
Preferably, in the step F, the PCB that is qualified for inspection is transferred to an etching line through a frame, and a circuit pattern of the PCB is etched.
Preferably, an acidic etching solution is used for etching.
Preferably, in the step G, the AOI scanner scans and detects the PCB board circuit, detects the defects on the PCB board, and automatically marks the defects for the adjustment of the maintenance personnel and the subsequent technical improvement.
As an optional implementation manner, in the step E, a reciprocating forward film pasting manner may be adopted for pasting the dry film, that is, the film is pasted for a distance L, then the distance of 2/5L is returned, the film pasting distance L is advanced again, and the process is repeated in sequence until the film pasting is completed, and meanwhile, a pressing roller is provided for pressing, which is favorable for pasting the dry film with different layers, and is favorable for marking the PCB board in a partitioning manner in the subsequent exposure and development, and simultaneously improves the accuracy of detecting the poor exposure and the abnormal deviation.
When the PCB circuit board is exposed, an exposure machine and a negative film PCB circuit board are used for exposure, after the PCB circuit board is developed by a developing machine, the dry film attached to the circuit board is hardened under the action of illumination, and the circuit part of the PCB circuit board is blocked by black shadow due to the existence of the circuit, so that the dry film is not hardened, after the unhardened dry film is washed away, the PCB is transferred into an acid etching line, and after copper which is not covered by the dry film is etched away, the circuit to be used is left.
The practical application of the invention is as follows: after the PCB is manufactured, the PCB can be used as a core board of a multilayer circuit board, then resin in PP (the main component is glass fiber cloth) is converted from a semi-solidified state into a liquid state by a pressing and heating method through a press, the core board is bonded together and solidified to complete pressing, the laminated multilayer PCB is transferred to a de-browning process through a W-shaped transfer car, a browning layer on the surface of the PCB is removed through a de-browning line, the plate is transferred to a micro-etching thinning process through the W-shaped transfer car, the copper thickness of a blind hole of the PCB is thinned to half ounce through a micro-etching thinning machine, the PCB is transferred to a checking process through the W-shaped transfer car, the copper thickness is confirmed to be half ounce, and the PCB is transferred to a drilling process through the W-shaped transfer car to manufacture a finished product of the multilayer PCB.
Finally, the above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the same, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution, and all of them shall fall within the scope of the claims of the present invention.
Claims (8)
1. A PCB circuit board blind hole layer negative film process technology is characterized by comprising the following steps:
cutting materials: cutting the plate into the Pnl size of the engineering design by using a cutting machine;
b, drilling holes: drilling a plate edge positioning hole and a blind hole on the PCB;
c, copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire;
d, chemical cleaning: cleaning the PCB in a chemical cleaning line;
e, exposure of the circuit: after a dry film is pasted on the surface of the PCB, an exposure machine and a negative film are used for circuit exposure;
f, etching: transferring the PCB subjected to circuit exposure to an etching process through the inserting frame, and etching the PCB through an etching machine;
g, testing: and transferring the PCB to an AOI (automated optical inspection) process by using a rubber frame for the etched circuit board, and scanning and detecting the circuit of the PCB by using an AOI scanner.
2. The PCB circuit board blind hole layer negative film process according to claim 1, characterized in that: and B, drilling the plate edge positioning hole on the PCB by using a numerical control drilling machine, positioning the plate edge positioning hole by using a pin, and drilling the blind hole by using the plate edge positioning hole as a positioning reference.
3. The PCB circuit board blind hole layer negative film process according to claim 1, characterized in that: in the step C, when the copper deposition is thickened, the thickness of the single-hole copper single point is minimum 12um, and the thickness of the single-hole copper single point is average 15 um.
4. The PCB circuit board blind hole layer negative film process according to claim 1, characterized in that: and in the step E, developing the PCB circuit by using a developing machine after exposure, and washing out the unhardened dry film attached to the PCB circuit.
5. The PCB circuit board blind hole layer negative film process according to claim 4, characterized in that: and transferring the PCB subjected to the treatment of the unhardened dry film to an outside inspection process through an inserting frame, and inspecting whether the circuit of the PCB is exposed abnormally or deviated abnormally or in other abnormal conditions through visual inspection and a 10-time lens.
6. The PCB circuit board blind hole layer negative film process according to claim 1, characterized in that: and F, transferring the PCB qualified for inspection to an etching line through the inserting frame, and etching a circuit pattern of the PCB.
7. The PCB circuit board blind hole layer negative film process according to claim 6, characterized in that: the etching is carried out using an acidic etching solution.
8. The PCB circuit board blind hole layer negative film process according to claim 1, characterized in that: and G, scanning and detecting the circuit of the PCB by using the AOI scanner to detect the defects on the PCB, and automatically marking the defects for the adjustment of maintenance personnel and the subsequent technical improvement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811652480.4A CN111385977A (en) | 2018-12-31 | 2018-12-31 | PCB (printed circuit board) blind hole layer negative film process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811652480.4A CN111385977A (en) | 2018-12-31 | 2018-12-31 | PCB (printed circuit board) blind hole layer negative film process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111385977A true CN111385977A (en) | 2020-07-07 |
Family
ID=71218385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811652480.4A Withdrawn CN111385977A (en) | 2018-12-31 | 2018-12-31 | PCB (printed circuit board) blind hole layer negative film process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111385977A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601363A (en) * | 2020-12-21 | 2021-04-02 | 江西旭昇电子有限公司 | Processing method of outer layer negative film of PTH square groove of printed circuit board |
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
| CN113194617A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | PCB negative film production process |
-
2018
- 2018-12-31 CN CN201811652480.4A patent/CN111385977A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601363A (en) * | 2020-12-21 | 2021-04-02 | 江西旭昇电子有限公司 | Processing method of outer layer negative film of PTH square groove of printed circuit board |
| CN112601363B (en) * | 2020-12-21 | 2022-09-06 | 江西旭昇电子有限公司 | Processing method of outer layer negative film of PTH square groove of printed circuit board |
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
| CN113194617A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | PCB negative film production process |
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Application publication date: 20200707 |
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| WW01 | Invention patent application withdrawn after publication |