CN111384609A - Interconnection device for chip and backplane connector - Google Patents
Interconnection device for chip and backplane connector Download PDFInfo
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- CN111384609A CN111384609A CN201811626651.6A CN201811626651A CN111384609A CN 111384609 A CN111384609 A CN 111384609A CN 201811626651 A CN201811626651 A CN 201811626651A CN 111384609 A CN111384609 A CN 111384609A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention provides a chip and backplane connector interconnection device and communication equipment. In the invention, the high-speed signal of the chip is directly connected with the single-board side backplane connector without passing through the single-board PCB, thereby avoiding the problem of large electric signal loss caused by the transmission of the high-speed signal by the single-board PCB.
Description
Technical Field
The invention relates to the field of communication, in particular to a chip and backplane connector interconnection device.
Background
With the increasing demand for interconnection of everything, the development of the internet is more and more rapid, and a large amount of traffic is instantly transferred between different sites, which puts higher and higher demands on the switching capacity of the switching devices in the network. The centralized switching device based on OTN, PTN, etc. generally comprises a plurality of service boards/line cards lc (line Card) and a plurality of Switch boards/Switch cards (Switch cards), wherein each service Board and each Switch Board has a chip IC (Integrated Circuit) or an ASIC (Application Specific Integrated Circuit) for high-speed service processing, and there are enough physical connection paths between these IC chips, and these paths are directly interconnected through a single Board PCB (Printed Circuit Board), or high-speed signal interconnection between each service Board and the Switch Board is realized through a Circuit on the backplane.
At present, as shown in fig. 1, an IC chip or an ASIC chip is basically soldered to a single board PCB by using solder balls of a BGA (Ball grid array) package at the bottom of the chip, so that all signals such as high-speed signals, low-speed signals, and power supply signals on the chip are connected to the PCB. The single board side backplane connector is generally characterized in that a single board surface of the single board side backplane connector is pressed on a single board PCB, so that signals on the single board are transmitted to the single board side backplane connector; the plug-in surface of the single board is connected with the backboard connector on the side of the backboard in a plug-in mode, and signals on the single board are transmitted to the backboard. The high-speed service signal of the IC chip is connected to the single-board side backplane connector through a transmission line inside the PCB. However, the high-speed electrical signal is subjected to BGA soldering to generate a certain loss, and the high-speed electrical signal is transmitted to the backplane connector on the side of the single board after a certain distance from the single board PCB, so that the single board PCB also generates a large loss to the high-speed electrical signal, which results in a large loss of the high-speed electrical signal on the single board.
With the improvement of the speed of the electrical signal, the electrical signal transmission loss caused by the connection mode of the IC chip and the backplane connector is larger and larger, so that the electrical signal can only be transmitted over a very short distance, and after the electrical signal is transmitted over a long distance, that is, when the electrical signal is transmitted across the backplane, the electrical signal is still transmitted to the receiving end of the chip and cannot be correctly received. Moreover, since there are many high-speed signals between the IC chip and the backplane connector, in order to realize the transmission between the high-density and high-speed electrical signals of the chip inside the single-board PCB, the problems of high cost of the single-board PCB design and manufacture, long processing time, and great processing difficulty may result.
Disclosure of Invention
The invention provides a chip and backplane connector interconnection device and communication equipment based on the interconnection device, which at least solve the problem of electric signal transmission loss caused by the connection mode of an IC chip and a backplane connector in the related art.
According to an aspect of the present invention, there is provided a chip-to-backplane connector interconnection apparatus comprising a first IC chip and a first backplane connector, wherein the first IC chip is directly interconnected with the first backplane connector.
Wherein the first IC chip is interconnected with the first backplane connector by soldering or crimping.
The IC chip comprises a first backplane connector and a second backplane connector, wherein the bottom of a substrate of the IC chip is provided with BGA solder balls or solder pads, and the welding surface of the first backplane connector is provided with corresponding BGA solder pads or solder balls.
The IC chip comprises a first backplane connector and a second backplane connector, wherein the bottom of a substrate of the IC chip is provided with a crimping pin or hole, and the connecting surface of the first backplane connector is provided with a corresponding crimping hole or pin.
The first IC chip is connected to the single-board PCB through welding or a pin connector.
And the edge of the substrate of the first IC chip is also provided with a welded electric pin, and the electric pin is connected with the single-board PCB in a welding way.
And the bottom of the substrate of the IC chip is also provided with a contact pin or a hole, and the contact pin or the hole is connected with a contact pin connector of the single-board PCB.
And the single-board PCB is also provided with a second IC chip, and the first IC chip and the second IC chip are connected through a welding cable or a cable connector.
Wherein the substrate of the first IC chip is provided with BGA solder balls on the bottom layer and/or the top layer, or with crimpable pins or holes for connecting to the second IC chip by soldering cables or by cable connectors.
The first backplane connector is fixed on the single-board PCB in a crimping or screw fixing mode.
The PCB contact surface of the first backplane connector is provided with a crimping pin or a crimping hole, or the surfaces on two sides of the PCB contact surface are provided with screw holes or screw hole columns for fixing, so that the single-board PCB is crimped or fixed by screws.
The interconnection device further comprises a second backplane connector, wherein the first backplane connector is connected with one or more second backplane connectors in a plug-and-socket manner.
And holes or pins for plug connection are correspondingly arranged on the plug-in surfaces of the first backplane connector and the second backplane connector.
Wherein the interconnect device further comprises a backplane, the second backplane connector being disposed on the backplane.
The first backplane connector is horn-shaped, and the high-speed signal lines on the connecting sheets in the first backplane connector are in an amplitude-amplification relationship on the connecting surface of the first IC chip and the connecting surface of the second backplane connector.
According to another aspect of the present invention, there is provided a communication device comprising the chip-to-backplane connector interconnection arrangement of the above embodiments.
In the embodiment of the invention, the high-speed signal of the chip is directly connected with the single-board side backplane connector without passing through the single-board PCB, so that the problems of large electric signal loss and the like caused by the transmission of the high-speed signal by the single-board PCB are solved, and the design difficulty and the manufacturing cost of the single-board PCB can be reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a schematic diagram of a connection relationship between an IC chip on a board and a board-side backplane connector in the related art;
fig. 2 is a schematic diagram of a connection relationship between an IC chip and a single-board side backplane connector according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the connection relationship between the IC chip on the single board PCB and the single board side backplane connector and other components according to the embodiment of the present invention;
FIGS. 4(a) to (d) are schematic diagrams of pins of an IC chip according to an embodiment of the present invention;
fig. 5(a) to (g) are schematic diagrams of a single-board-side backplane connector according to an embodiment of the present invention;
fig. 6(a) to (b) are schematic diagrams illustrating connection between an IC chip and a single-board-side backplane connector according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of the relationship between the IC chip on the PCB and the backplane connector after the IC chip is connected to the backplane connector;
fig. 8 is a block diagram of a communication device according to an embodiment of the present invention.
Detailed Description
The invention will be described in detail hereinafter with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The embodiment of the invention provides an interconnection device of a chip and a backplane connector. For convenience of description, the present embodiment will be specifically described from the perspective of the IC chip, the backplane connector, and the interconnection between the IC chip and the backplane connector.
IC chip
In this embodiment, the bottom of the substrate of the IC chip is BGA solder balls for solder connection with a backplane connector. Or the bottom of the substrate of the IC chip is provided with a pressed pin or hole so as to be connected with the hole or pin on the backplane connector in a pressing mode.
In another alternative embodiment, the bottom of the substrate of the IC chip is also provided with pins or holes for welding or pin connector connection with the PCB; or the edge of the substrate of the IC chip may also have solderable electrical leads to allow direct soldering with the PCB by solder.
In an alternative embodiment, the IC chip substrate may also have BGA solder balls on the bottom and/or top layers, or may have crimpable pins or holes to allow connection of other chips or modules on a single board by solder cables or by cable connectors to achieve high speed interconnections within the board.
(II) backboard connector
In one embodiment, the PCB contact surface of the backplane connector has press-fit pins or screw holes for fixing, or the surfaces on both sides of the PCB contact surface have screw hole posts for mounting, for welding or press-fitting or screw fixing with the PCB.
In one embodiment, holes or pins for connection may also be provided on the mating face of the backplane connector to make mating connections with other backplane connectors, e.g., backplane-side backplane connectors.
In one embodiment, BGA pads or solder balls may be provided on the non-backplane connector side or PCB contact side of the backplane connector for solder connection with the IC chip; or have pins or holes for making a press-fit connection with holes or pins at the bottom of the IC chip.
In one embodiment, wafer units (wafers) within the backplane connector may be in an amplitude-amplified relationship at the chip-connection face and the backplane-side backplane connector face to enable connection of high-density IC chips and low-density backplane-side backplane connectors, respectively.
And (III) an interconnection device between the IC chip and the backplane connector:
in one embodiment, the IC chip is interconnected with the single board side backplane connector by soldering or crimping.
In one embodiment, the IC chip may also be connected to the single board PCB by soldering or pin connectors. Further, on this basis, the IC chip is also connected to other chips or modules on the single board by a bonding wire or by a cable connector.
In one embodiment, the single board side backplane connector may be secured to the single board PCB by crimping or screw fastening.
In the embodiment, the high-speed signal of the IC chip can be directly connected to the backplane connector without passing through the PCB of the single board, so that the problem of abnormal electrical signal transmission and reception caused by signal loss due to the connection of the high-speed signal to the backplane connector through the PCB of the single board is avoided. And a large amount of high-speed signals transmitted to the backplane connector are not required to be transmitted on the single-board PCB, so that the manufacturing difficulty of the single-board PCB can be reduced, the manufacturing cost is saved, and the area of the single-board PCB can be reduced.
The chip-to-backplane connector interconnection provided by embodiments of the present invention will be described in further detail with reference to fig. 2 to 8.
Fig. 2 is an exemplary diagram of a connection relationship between an IC chip and a single-board-side backplane connector according to an embodiment of the present invention. As shown in fig. 2, the IC chip is interconnected with the single-board side backplane connector by soldering or pressing, so as to enable the high-speed service signal to be transmitted therebetween, and therefore, connection through the single-board PCB is not required.
Fig. 3 is an embodiment of a connection relationship between an IC chip on a single board PCB and a single board side backplane connector and other components according to an embodiment of the present invention. In this embodiment, the IC chip is directly connected to the board-side backplane connector by soldering or crimping, the chip is connected to the board PCB by soldering or pin connector, the board-side backplane connector is mounted on the board PCB by crimping or screw fastening, and the board-side backplane connector and the backplane-side backplane connector are in an opposite-insertion relationship.
As shown in fig. 3, the IC chip may also be connected to other chips or modules on a single board by a solder cable or by a cable connector; the chips or modules can be fixed on the single-board PCB by welding or pin connectors or direct compression connection.
Fig. 4(a) to fig. 4(d) are schematic diagrams of IC chip pins (pins) according to an embodiment of the present invention. As shown in fig. 4(a) to 4 (d).
401 is a substrate of an IC chip. 402 are BGA solder balls or pads on the bottom of the substrate for solder connection with pads or solder balls on the backplane connector. 402 may also be pins or holes in the bottom of the substrate for crimping to make a crimp connection with holes or pins on the backplane connector.
403 are solderable electrical leads on the edge of the IC chip substrate, which may be distributed on the bottom or top of the IC chip substrate, etc. for soldering directly with the single-board PCB by solder. 404 are pins or holes on the bottom of the substrate of the IC chip for soldering or pin connector connection to a PCB.
404 may be BGA solder balls on the bottom and/or top layers of the substrate of the IC chip or may be crimped pins or holes so that other chips or modules on the single board may be connected by solder cables or by cable connectors to achieve high speed interconnections within the single board.
405 is the top of the IC chip and is typically used to contact a heat sink to transfer heat generated by the chip during operation. Fig. 4(a), 4(b), and 4(c) are schematic views from the bottom of the chip, and fig. 4(d) is a schematic view from the obliquely upper side of the chip. In fig. 4(d), 402 at the bottom of the chip substrate, 404 may be disposed at the bottom and/or top of the chip substrate.
Fig. 5(a) to 5(g) are schematic views of a single-board side backplane connector. As shown in fig. 5(a) to 5 (g).
And 501, a single board side backplane connector. One of the faces is a PCB contact face having press-fit pins to enable the connector to be press-fitted into a hole in a single board PCB. Or the face may have screw holes for fixing so that the connector can be fixed with screws from the bottom of the PCB. Or screw hole columns for mounting, such as 505 in fig. 5(g), are arranged on the two sides of the contact surface of the PCB so as to fix the PCB with screws. Holes or pins are provided on the mating surface of the backplane connector 501 for mating with a backplane-side backplane connector.
In fig. 5(a) to 5(g), 502 is a BGA pad or solder ball for solder connection with a solder ball or pad on the bottom of the IC chip substrate; alternatively, 502 may be a pin or a hole for press-fitting connection with a hole or a pin in the bottom of the IC chip substrate. And the location of 502 may be on one or more sides of 501. In fig. 5(a), 5(b), 5(e) and 5(g), 502 is located on the opposite side of the backplane connector mating face. In fig. 5(c) and 5(f), 502 is located on the opposite side of the PCB contact surface. In fig. 5(d), 502 is located on a side adjacent to each of the PCB contact side and the socket side.
In fig. 5(b) to 5(f), 503 is a pin or a hole when the board-side backplane connector 501 and the backplane-side backplane connector are plugged, and is located on the plugging surface of 501, so as to realize the plug-and-socket connection with the hole or pin on the backplane-side backplane connector. 504 is a wire for realizing connection between 502 and 503 inside the board-side backplane connector 501, and may be a metal sheet and/or a cable.
As shown in fig. 5(a), 5(b), 5(c), 5(d) and 5 (g). The backplane connector 501 may be a regular rectangular parallelepiped, and the high-speed signal lines on the connection wafers inside the backplane connector may be in a parallel relationship between the chip connection surface and the backplane connector surface.
As shown in fig. 5(e) and 5(f), the single board side backplane connector 501 may also be flared because the pin density of BGA pads or solder balls 502 may be high and the spacing between pins is very small; 503 has a small pin density and a large interval, so that the horn shape with an enlarged amplitude can be respectively connected with a high-density IC chip and a low-density backplane-side backplane connector, and at this time, the connection wafer inside the backplane connector can be in an amplitude enlarged relationship between the chip connection surface and the backplane-side backplane connector surface. In this case, the plugging surface of the backplane connector may be divided into a plurality of connector end surfaces, so that the single board-side backplane connector can be connected to a plurality of backplane-side backplane connectors.
Fig. 6(a) and 6(b) are schematic diagrams illustrating connection of an IC chip to a single-board-side backplane connector. Fig. 6(a) shows a scenario before the connection between the two devices, and fig. 6(b) shows a scenario after the connection between the two devices. As shown in fig. 6(a) and 6(b), BGA pads or solder balls 502 are on the opposite side of the PCB contact surface of single board side backplane connector 501. It is apparent that BGA pads or solder balls 502 may also be on other sides of the single board side backplane connector 501. After the two are connected, the connection of the high-speed signal from the IC chip to the single-board side back board connector is completed without transmitting through a single-board PCB and the like.
Fig. 7 is a schematic diagram of the relationship between the IC chip on the PCB and the backplane after the IC chip is connected to the single-board side backplane connector.
As shown in fig. 7, 801 is a single board PCB, on which the single board side backplane connector 501 is mounted, wherein the single board side backplane connector 501 and the single board PCB 801 may be pressed together or fixed by screws at the bottom. The chip IC is directly soldered or press-connected to the board-side backplane connector 501.
And 802, the IC chip is connected with pins of the single-board PCB 801 in a welding manner so as to complete the signal connection between the chip and the single-board PCB.
803 is a backplane PCB, 804 is a backplane side backplane connector on the backplane PCB 803, and 805 is a pin or hole on the patch panel 804.
In this embodiment, only 2 backplane side backplane connectors 804 are drawn on the backplane PCB 803. During connection, in the process of pushing the single board PCB 801 to be inserted into the backplane PCB 803, the insertion of the single board side backplane connector 501 and the backplane side backplane connector 804 can be realized, so that the function of transmitting signals on a chip to the backplane PCB 803 through the backplane connector is realized, and the problems of signal loss and the like caused by the transmission of high-speed signals through the single board PCB 801 are avoided.
Therefore, the signal on the IC chip can be connected with the pin on one surface of the backplane connector in a compression joint or welding way through the pin at the bottom of the substrate, and the function that the high-speed signal of the IC chip is directly connected with the backplane connector is realized.
The embodiment of the invention also provides communication equipment. Fig. 8 is a block diagram of a communication device according to an embodiment of the present invention, and as shown in fig. 8, the communication device 100 includes the chip-to-backplane connector interconnection apparatus 200 in the above-described embodiment. The communication device 100 may be a communication device for interconnection between a high-speed service chip and a backplane connector used by a server, a router, or the like. In this embodiment, the communication device 100 may include a plurality of such backplane connector interconnect devices 200 according to data of a board.
In the embodiment of the invention, the high-speed signal of the IC chip can be directly connected to the backplane connector without passing through the PCB of the single board, so that the problem of abnormal receiving and sending of the electric signal caused by signal loss caused by the connection of the high-speed signal to the backplane connector through the PCB of the single board is avoided, the loss in the transmission of the electric signal is greatly reduced, and the transmission distance of the electric signal on the backplane can be effectively prolonged. In addition, the power consumption of the chip serial deserializer can be reduced due to the fact that the electric signal loss between the chips is reduced; in addition, because the single-board PCB does not need to transmit high-speed signals from the IC chip to the backplane connector, the single-board PCB can also reduce the manufacturing difficulty, save the manufacturing cost and reduce the area of the single board.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (16)
1. A chip and backplane connector interconnection apparatus includes a first IC chip and a first backplane connector, wherein the first IC chip is directly interconnected with the first backplane connector.
2. The interconnect device of claim 1, wherein the first IC chip is interconnected with the first backplane connector by soldering or crimping.
3. The interconnection device of claim 2, wherein the IC chip has a BGA solder ball or pad disposed on a bottom of the substrate, and the first backplane connector has a corresponding BGA pad or solder ball disposed on a bonding surface thereof.
4. The interconnection apparatus according to claim 2, wherein the IC chip is provided with press-fit pins or holes at a bottom of the substrate, and the first backplane connector is provided with corresponding press-fit holes or pins at a connection face thereof.
5. The interconnect device of claim 1, further comprising a single-board PCB, wherein the first IC chip is connected to the single-board PCB by soldering or a pin connector.
6. The interconnect device according to claim 5, wherein the substrate edge of the first IC chip is further provided with a soldered electrical pin, and the soldered electrical pin is connected to the single-board PCB by soldering.
7. The interconnection apparatus according to claim 5, wherein the bottom of the substrate of the IC chip is further provided with pins or holes, and the pins or holes are connected with the pin connectors of the single-board PCB.
8. The interconnect device according to claim 5, wherein a second IC chip is further disposed on the single-board PCB, and the first IC chip and the second IC chip are connected by a solder cable or a cable connector.
9. The interconnect device of claim 8, wherein the substrate of the first IC chip is provided with BGA solder balls on a bottom layer and/or a top layer, or with crimpable pins or holes for connection to the second IC chip by solder cables or by cable connectors.
10. The interconnect device as claimed in claim 5, wherein the first backplane connector is fixed on the single-board PCB by crimping or screw fixation.
11. The interconnection device according to claim 10, wherein a press-fit pin or hole is provided on the PCB contact surface of the first backplane connector, or a screw hole post for fixing is provided on both sides of the PCB contact surface, so as to be press-fitted or screw-fixed with the single-board PCB board.
12. The interconnect apparatus of claim 1, further comprising a second backplane connector, wherein the first backplane connector is mated to the second backplane connector.
13. The interconnect device as claimed in claim 11, wherein the first backplane connector and the second backplane connector are provided with holes or pins for plug connection on the plug-in surface.
14. The interconnect device of claim 13, further comprising a backplane PCB, the second backplane connector being disposed on the backplane PCB.
15. The interconnect apparatus of claim 14, wherein the first backplane connector is flared such that the high speed signal lines on the connection wafers within the first backplane connector are in an amplitude-amplified relationship at the first IC chip connection face and the second backplane connector connection face.
16. A communication device comprising the chip-to-backplane connector interconnection arrangement of any one of claims 1 to 15.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811626651.6A CN111384609B (en) | 2018-12-28 | 2018-12-28 | Interconnection device for chip and backplane connector |
| PCT/CN2019/128620 WO2020135561A1 (en) | 2018-12-28 | 2019-12-26 | Chip and backplane connector interconnection apparatus, and communications device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811626651.6A CN111384609B (en) | 2018-12-28 | 2018-12-28 | Interconnection device for chip and backplane connector |
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| CN111384609A true CN111384609A (en) | 2020-07-07 |
| CN111384609B CN111384609B (en) | 2022-08-02 |
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| CN201811626651.6A Active CN111384609B (en) | 2018-12-28 | 2018-12-28 | Interconnection device for chip and backplane connector |
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| WO (1) | WO2020135561A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11482802B2 (en) | 2020-12-04 | 2022-10-25 | Cisco Technology, Inc. | High speed traceless interconnect |
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| WO2020135561A1 (en) | 2020-07-02 |
| CN111384609B (en) | 2022-08-02 |
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