CN106450959A - Design method for saving space by using high-density connector wafer - Google Patents
Design method for saving space by using high-density connector wafer Download PDFInfo
- Publication number
- CN106450959A CN106450959A CN201611029412.3A CN201611029412A CN106450959A CN 106450959 A CN106450959 A CN 106450959A CN 201611029412 A CN201611029412 A CN 201611029412A CN 106450959 A CN106450959 A CN 106450959A
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- China
- Prior art keywords
- link
- driver chip
- driver
- designing
- space
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/04—Connectors or connections adapted for particular applications for network, e.g. LAN connectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The invention discloses a design method for saving space by using a high-density connector wafer. The method comprises: S1, selecting driver chips with different drive capabilities based on combination of performance requirements of a high-speed link channel and a cost control requirement; S2, placing the driver chips on a connector; and S3, opening driving of a long link and closing driving of a short link are realized by using software according to link situations. Compared with the prior art, the method disclosed by the invention has the following beneficial effects: because the drivers are arranged on the connector wafer, the integration of the high-speed connector is improved; the driver chip space on the single board can be saved, so that the space is left for the layout and wiring of the single board; and the method is simple and is easy to use and the operability is high, so that the method is easy to implement in design and manufacturing.
Description
Technical field
The present invention relates to server veneer SI design field, specifically a kind of using highly dense mouth adapter wafer come
The method for designing of save space.
Background technology
In many electronic systems using electric connector.In several printed circuit board (PCB)s being connected to each other by electric connector
(" PCB ") upper one system of manufacture is typically easier and more cost-effective.The traditional arrangement for connecting several PCB is that have
One PCB as backboard (backplane).Then, other PCB of referred to as daughter board or subcard are by electric connector via the back of the body
Plate connects.
In server system signal integrity field, increase with high speed signal link, on veneer, generally require to increase
driver（Driver）To lift driving force.And the usual device of veneer is many, compact in design.It is further added by cloth of the driver to veneer
Office challenges.
Meanwhile, the input and output of signal driver chip are all high speed cablings, cabling requirement height, and backflow ground hole is many, to which
The wiring of its signal and wiring space are it is also proposed that challenge.How driver must added to lift link driving force and not in list
Occurring driver on plate becomes a difficult problem of puzzlement SI design.
Content of the invention
The technical assignment of the present invention is that offer is a kind of using highly dense mouth adapter wafer come the method for designing of save space.
The technical assignment of the present invention is realized in the following manner, and concrete grammar step is as follows：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
Preferably, described driver chip, with preemphasis function with lifted link driving force repeater or
redriver.
Preferably, described driver chip, with equalization function with lifted link driving force repeater or
redriver.
Preferably, adapter is High speed rear panel adapter.
The present invention's is a kind of using highly dense mouth adapter wafer come the method for designing of save space, compared to the prior art
Have the beneficial effect that：
1st, driver is placed on adapter wafer, lifts the integrated level of high speed connector；
2nd, driver chip space can be saved on veneer, be placement-and-routing's slot milling of veneer；
3rd, the method is easy to use, workable, it is easy to realize in design and making；
4th, PCB space is saved, improves the performance of product.
Description of the drawings
Accompanying drawing 1 is a kind of using highly dense mouth adapter wafer come the structural representation of the method for designing of save space.
Wherein:1st, adapter wafer；2nd, driver chip.
Specific embodiment
Increase with high-speed link, generally require on veneer to increase driver driving force is lifted, how to add driver
Lifting link driving force and not occurring driver on veneer becomes a difficult problem of puzzlement si design.For solving above-mentioned being somebody's turn to do
Problem, the present invention is proposed：A kind of driver is placed on the method for designing on adapter wafer.
Embodiment 1：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
Being required according to Product Cost Control, can select the driver chip of different driving ability is placed on wafer.Even
Device customization, junction link situation is connect, long link needs to add and drives, short link need not plus drive.By software control
Opening and closing for driver way, realizes Properties Control and cost control, realizes veneer placement-and-routing space and increases, high-speed chain
Road performance meets si design requirement.
Described driver chip, be with preemphasis function to lift the repeater (repeater) of link driving force.
Embodiment 2：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
Being required according to Product Cost Control, can select the driver chip of different driving ability is placed on wafer.Even
Device customization, junction link situation is connect, long link needs to add and drives, short link need not plus drive.By software control
Opening and closing for driver way, realizes Properties Control and cost control, realizes veneer placement-and-routing space and increases, high-speed chain
Road performance meets si design requirement.
Described driver chip, be with equalization function to lift the repeater (repeater) of link driving force.
Embodiment 3：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
Being required according to Product Cost Control, can select the driver chip of different driving ability is placed on wafer.Even
Device customization, junction link situation is connect, long link needs to add and drives, short link need not plus drive.By software control
Opening and closing for driver way, realizes Properties Control and cost control, realizes veneer placement-and-routing space and increases, high-speed chain
Road performance meets si design requirement.
Described driver chip, be with equalization function to lift the driver of link driving force.
Embodiment 4：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
Being required according to Product Cost Control, can select the driver chip of different driving ability is placed on wafer.Even
Device customization, junction link situation is connect, long link needs to add and drives, short link need not plus drive.By software control
Opening and closing for driver way, realizes Properties Control and cost control, realizes veneer placement-and-routing space and increases, high-speed chain
Road performance meets si design requirement.
Described driver chip, be with preemphasis function to lift the driver of link driving force.
High speed rear panel adapter, the adapter of the type is fitted together one by one, the unit per a piece of formation
I.e.：The wafer of high speed connector.
As such, it is possible to lift the integrated level of high speed connector.Meanwhile, the space for putting driver can be saved on veneer,
So as to reserve more spaces for the placement-and-routing of veneer.The invention is easy to use, workable, it is easy in design and making
Middle realization.
By specific embodiment above, the those skilled in the art can readily realize the present invention.But should
Work as understanding, the present invention is not limited to above-mentioned several specific embodiments.On the basis of disclosed embodiment, the technology
The technical staff in field can the different technical characteristic of combination in any, so as to realize different technical schemes.
Claims (4)
1. a kind of using highly dense mouth adapter wafer come the method for designing of save space, it is characterised in that concrete grammar step is such as
Under：
S1, combine high-speed link channel performance demand and cost control and require, choose the driver chip of different driving ability；
S2, driver chip is put on the connectors；
S3, junction link situation, realize long link by software and open driving, and short link-down drives.
2. according to claim 1 a kind of using highly dense mouth adapter wafer come the method for designing of save space, its feature
It is that described driver chip is the repeater with preemphasis function or redriver.
3. according to claim 1 a kind of using highly dense mouth adapter wafer come the method for designing of save space, its feature
It is that described driver chip is the repeater with equalization function or redriver.
4. according to claim 1 a kind of using highly dense mouth adapter wafer come the method for designing of save space, its feature
It is, adapter is High speed rear panel adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611029412.3A CN106450959A (en) | 2016-11-22 | 2016-11-22 | Design method for saving space by using high-density connector wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611029412.3A CN106450959A (en) | 2016-11-22 | 2016-11-22 | Design method for saving space by using high-density connector wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106450959A true CN106450959A (en) | 2017-02-22 |
Family
ID=58221613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611029412.3A Pending CN106450959A (en) | 2016-11-22 | 2016-11-22 | Design method for saving space by using high-density connector wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106450959A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107203673A (en) * | 2017-06-09 | 2017-09-26 | 郑州云海信息技术有限公司 | A kind of design method of PCIE connectors |
| CN108683033A (en) * | 2018-05-22 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of connector tablet seat being integrated with driver, connector and preparation method thereof |
| CN111384609A (en) * | 2018-12-28 | 2020-07-07 | 中兴通讯股份有限公司 | Interconnection device for chip and backplane connector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| CN105392071A (en) * | 2015-11-20 | 2016-03-09 | 天津光电通信技术有限公司 | Optical line intersection system architecture based on circuit domain |
| CN205210880U (en) * | 2015-12-16 | 2016-05-04 | 山东海量信息技术研究院 | PCIEBox keysets based on high -end server |
| CN205229924U (en) * | 2015-12-16 | 2016-05-11 | 山东海量信息技术研究院 | PCIE expands integrated circuit board based on high -end server |
-
2016
- 2016-11-22 CN CN201611029412.3A patent/CN106450959A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| CN105392071A (en) * | 2015-11-20 | 2016-03-09 | 天津光电通信技术有限公司 | Optical line intersection system architecture based on circuit domain |
| CN205210880U (en) * | 2015-12-16 | 2016-05-04 | 山东海量信息技术研究院 | PCIEBox keysets based on high -end server |
| CN205229924U (en) * | 2015-12-16 | 2016-05-11 | 山东海量信息技术研究院 | PCIE expands integrated circuit board based on high -end server |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107203673A (en) * | 2017-06-09 | 2017-09-26 | 郑州云海信息技术有限公司 | A kind of design method of PCIE connectors |
| CN108683033A (en) * | 2018-05-22 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of connector tablet seat being integrated with driver, connector and preparation method thereof |
| CN111384609A (en) * | 2018-12-28 | 2020-07-07 | 中兴通讯股份有限公司 | Interconnection device for chip and backplane connector |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170222 |
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| WD01 | Invention patent application deemed withdrawn after publication |