CN111354869A - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
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- CN111354869A CN111354869A CN202010115403.6A CN202010115403A CN111354869A CN 111354869 A CN111354869 A CN 111354869A CN 202010115403 A CN202010115403 A CN 202010115403A CN 111354869 A CN111354869 A CN 111354869A
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The invention discloses a display substrate, a manufacturing method thereof and a display device, wherein the display substrate comprises a substrate base plate, a pixel defining layer, a heat conducting member and a flat buffering part, the pixel defining layer comprises a plurality of pixel isolation structures, a plurality of sub-pixel areas which are isolated from each other are formed between the pixel isolation structures, the heat conducting member is arranged between the substrate base plate and the pixel defining layer and comprises a main heat conducting part and a secondary heat conducting part, the secondary heat conducting part is connected with each main heat conducting part, the upward projection of the main heat conducting part is positioned on the inner periphery of the sub-pixel area, the upward projection of the secondary heat conducting part is positioned on the outer periphery of the sub-pixel area, the projection area of the main heat conducting part on the sub-pixel area is larger than the projection area of the secondary heat conducting part on the sub-pixel area, the flat buffering part is arranged above the heat conducting member in an insulating mode, and the pixel. Therefore, the method is not only beneficial to reducing the coffee ring effect in the drying process and forming a uniform film layer, but also beneficial to enlarging the heat dissipation area of the device.
Description
Technical Field
The invention relates to the technical field of flat panel display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
In recent years, OLED (organic light emitting diode) and QLED (quantum dot light emitting diode) display panels have been widely used in high-end mobile phones and other terminals due to their fantasy image quality, light weight, flexibility, and other properties. At present, the OLED and the QLED devices are basically prepared by a vacuum evaporation method and an ink-jet printing method, the utilization rate of materials by the vacuum evaporation method is low, the product yield is low, and the production cost is high. The ink-jet printing method is that the material is dissolved in solvent to make ink, after the ink is placed in printer, the ink is respectively driven into correspondent pixel pits, and the required pixel dot pattern is printed and formed.
However, in the manufacturing process of inkjet printing, the ink is dropped into the pixel pits and then dried to form corresponding functional layers (such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer), and since the uniformity of the functional layers directly affects the display performance of the product, the drying process of the ink is very important. In the current ink-jet printing mode, after ink is dripped into a pixel pit, because the evaporation rates of the edge and the middle part of the ink in each pixel pit are different, namely the evaporation rate of a solvent in the edge area of the ink is higher, and the solvent in the middle area carries a solute to move and evaporate to the edge area under the influence of intermolecular acting force, the ink in each pixel pit is particularly easy to generate a coffee ring effect, so that the uneven phenomena of thick edge and thin middle of a dried functional layer are caused, the stability and the display performance of a product are influenced,
Meanwhile, the conventional OLED and the conventional QLED are driven by current, a large amount of heat is easily generated after long-time work, the temperature of the display device can be increased due to the heat, and if the internal heat cannot be dissipated in time, the service life of the functional layer material can be shortened, so that the service life of the display device is influenced.
Disclosure of Invention
An object of the present invention is to provide a display substrate, a method for manufacturing the same, and a display device, which overcome the disadvantages of the prior art, and facilitate effective heat conduction to a pixel defining layer through a heat conducting member, thereby reducing a coffee ring effect and facilitating formation of a uniform film layer.
Another object of the present invention is to provide a display substrate, a method for manufacturing the same, and a display device, which are advantageous to increase heat conduction, lower device temperature, and improve device lifetime and stability by increasing a heat dissipation area.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: a display substrate includes a substrate base plate, a pixel defining layer including a plurality of pixel isolation structures forming a plurality of sub-pixel regions isolated from each other therebetween, each of the sub-pixel regions having a pit bottom, a heat conductive member disposed between the substrate base plate and the pixel defining layer, and a flat buffer portion including a plurality of main heat portions and a plurality of sub heat portions, the sub heat portions connecting the respective main heat portions, the main heat portions being located at an inner periphery of the sub-pixel regions in an orthogonal projection of the substrate base plate, the sub heat portions being located at an outer periphery of the sub-pixel regions in an orthogonal projection of the substrate base plate, a projected area of the main heat portions at the sub-pixel regions being larger than a projected area of the sub heat portions at the sub-pixel regions, the flat buffer portion being insulatively disposed over the heat conductive member, the pixel defining layer is located on an upper surface of the relief portion.
Preferably, the heat conducting member is selectively connected to a temperature control source, and the temperature control source is a heating source or a cooling source, so that the heat conducting member heats or dissipates heat to the display substrate.
Preferably, when the temperature control source is a heat source, the heat conduction amount of the main heat conduction portion to the inner periphery of the sub-pixel region is greater than the heat conduction amount of the sub-heat conduction portion to the outer periphery of the sub-pixel region, so that the evaporation rate of the ink solvent at the inner periphery of the sub-pixel region is not less than the evaporation rate of the ink solvent at the outer periphery of the sub-pixel region when the ink is disposed on the display substrate.
Preferably, the area of the orthographic projection of the main heat conducting portion is smaller than the area of the pit bottom, and the center of projection of the main heat conducting portion on the base plate and the center of projection of the pit bottom on the base plate coincide with each other.
Preferably, the area ratio of the front projection area of the main heat conducting part to the pit bottom is 1: 1.5-9, preferably, the area ratio of the orthographic projection area of the main heat conducting part to the pit bottom is 1: 3 to 5.
Preferably, the sub-thermal conductive portion includes a narrow conductive line and a wide conductive line, the narrow conductive line connects each of the main thermal conductive portions and the wide conductive line, the wide conductive line has a width greater than that of the narrow conductive line, and the wide conductive line has a length not greater than a distance between two adjacent sub-pixel regions.
Preferably, the thicknesses of the main heat conducting part and the secondary heat conducting part are the same or different, the thicknesses of the main heat conducting part and the secondary heat conducting part are 0.5-5 μm, and the thicknesses of the main heat conducting part and the secondary heat conducting part are 0.8-2 μm.
A display device comprises a display substrate as described in any of the above.
A method of manufacturing a display substrate as claimed in any one of the preceding claims, comprising the steps of:
s1 providing a base substrate;
s2 disposing a heat-conducting member on the substrate, the heat-conducting member including a plurality of primary heat-conducting portions and a plurality of secondary heat-conducting portions, the secondary heat-conducting portions electrically connecting the primary heat-conducting portions and a temperature-controlled source, the temperature-controlled source controlling the temperatures of the primary heat-conducting portions and the secondary heat-conducting portions, the temperature-controlled source being a heating source or a cooling source;
s3, arranging a layer of insulating flat buffer part above the heat conducting component;
s4 disposing a pixel defining layer above the heat conducting member, the pixel defining layer including a plurality of pixel isolation structures forming a plurality of sub-pixel regions isolated from each other therebetween, each of the sub-pixel regions having a pit bottom, the main heat conducting portion being located at an inner periphery of the sub-pixel region in an orthogonal projection of the base substrate, the sub heat conducting portion being located at an outer periphery of the sub-pixel region in an orthogonal projection of the base substrate, a projected area of the main heat conducting portion at the sub-pixel region being larger than a projected area of the sub heat conducting portion at the sub-pixel region.
Preferably, the method for manufacturing the display substrate includes:
(1) preparing a layer of uniform metal aluminum thin film with the thickness of 400 nm-1 mu m on the substrate base plate by a physical vapor deposition method at the evaporation temperature of 900-1300 ℃ and the speed of 0.5-4 a/s;
(2) forming a pattern including the main heat conductive portion and the sub heat conductive portion by a positive photoresist;
(3) removing the exposed metal aluminum by etching to form the main heat conducting part and the secondary heat conducting part;
(4) laminating silicon nitride or silicon dioxide on the main heat conducting part and the secondary heat conducting part by an enhanced chemical vapor deposition method, and reducing the reaction temperature to 250-400 ℃ to form a smooth part;
(5) polishing the upper surface of the flatting part to form a film of the flatting part with the thickness of not less than 400 nm;
(6) and manufacturing an electrode of the display substrate and the pixel defining layer on the flat buffering part.
Compared with the prior art, the invention has the beneficial effects that: when the temperature control source is a heating source, the heat conduction component is used as a heating element, so that the functional layer in the pixel definition layer is dried quickly, the production time is reduced, the production efficiency is improved, the coffee ring effect is reduced in the drying process, and a uniform film layer is formed conveniently; when the temperature control source is a cooling source, the heat conducting component is used as a heat radiating element, so that the heat radiating area of the device is increased, the heat conduction is accelerated, the temperature of the device is reduced, and the service life of the device is prolonged.
Drawings
FIG. 1 is a schematic diagram of a display substrate according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural view illustrating a heat conductive member according to the above preferred embodiment of the present invention;
fig. 3 is a schematic projection view of a heat-conducting member and a pixel defining layer according to an embodiment of the present invention;
fig. 4 is a schematic structural view illustrating a second heat conductive member according to an embodiment of the present invention;
fig. 5 is a schematic structural view illustrating a third heat conductive member according to an embodiment of the present invention.
In the figure: 1. a display substrate; 10. a substrate base plate; 20. a heat conductive member; 21. a main heat transfer part; 22. a secondary heat conduction portion; 23. a narrow wire; 24. a wide wire; 25. a temperature control source; 30. a smoothing part; 40. a pixel defining layer; 41. a pixel isolation structure; 42. a sub-pixel region; 43. a middle region; 44. an edge region; 45. and (5) pit bottom.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
In the description of the present invention, it should be noted that, for the orientation words, such as the terms "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, is only for convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and is not to be construed as limiting the specific scope of the present invention.
The terms "comprises," "comprising," and "having," and any variations thereof, in the description and claims of this application, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As shown in fig. 1, a display substrate 1 includes a substrate 10, a pixel defining layer 40, a heat conducting member 20, and a flat buffer portion 30, the pixel defining layer 40 includes a plurality of pixel isolating structures 41, a plurality of sub-pixel regions 42 isolated from each other are formed between the pixel isolating structures 41, each sub-pixel region 42 has a pit bottom 45, the heat conducting member 20 is disposed between the substrate 10 and the pixel defining layer 40, the heat conducting member 20 includes a plurality of main heat conducting portions 21 and a plurality of sub-heat conducting portions 22, the sub-heat conducting portions 22 connect the main heat conducting portions 21, a front projection of the main heat conducting portions 21 on the substrate 10 is located on an inner periphery of the sub-pixel regions 42, a front projection of the sub-heat conducting portions 22 on the substrate 10 is located on an outer periphery of the sub-pixel regions 42, a projection area of the main heat conducting portions 21 on the sub-pixel regions 42 is larger than a projection area of the sub-heat conducting portions 22 on the sub-pixel regions 42, the display substrate 1, the flat buffer portion 30 is disposed over the main thermal conductive portion 21 and the sub thermal conductive portion 22 in an insulated manner, and the pixel defining layer 40 is disposed on an upper surface of the flat buffer portion 30.
In some embodiments, the heat conducting member 20 is selectively connected to the temperature control source 25, and the temperature control source 25 is a heating source or a cooling source, such that the heat conducting member 20 heats or dissipates heat to the display substrate 1, for example, the heating source is a power source, and the heat conducting member 20 is powered on to generate heat, for example, the cooling source is a cooling plate, so as to reduce the temperature of the heat conducting member 20. Therefore, the display substrate 1 is selectively heated and radiated through the improvement of the heat conducting member 20 on the display substrate 1, which is not only beneficial to reducing the coffee ring effect in the manufacturing process of the pixel defining layer 40, but also beneficial to radiating heat through the heat conducting member 20 in the use process of the display substrate 1, reducing the temperature of the device and prolonging the service life of the device.
In some embodiments, the thermal conductivity of the main heat conducting portion 21 and the thermal conductivity of the sub-heat conducting portion 22 may be the same or different, and when the temperature control source 25 is a heating source, the heat conducting amount of the main heat conducting portion 21 to the inner periphery of the sub-pixel region 42 is greater than the heat conducting amount of the sub-heat conducting portion 22 to the outer periphery of the sub-pixel region 42, so that the ink solvent evaporation rate at the inner periphery of the sub-pixel region 42 is not less than the ink solvent evaporation rate at the outer periphery of the sub-pixel region 42 when the ink is disposed on the display substrate 1. That is, the main heat conducting portion 21 and the secondary heat conducting portion 22 may be made of the same material or different materials, and preferably, the same material is simpler to manufacture, the projected area of the main heat conducting portion 21 in the middle area 43 is larger than the projected area of the secondary heat conducting portion 22 in the edge area 44, so that the heating amount of the main heat conducting portion 21 to the middle area 43 is larger than the heating amount of the secondary heat conducting portion 22 to the edge area 44, and the evaporation rate of the ink solvent in the middle area 43 is ensured to be not smaller than that of the edge area 44, so that the film layer is dried and formed uniformly.
In some preferred embodiments, the materials of the primary and secondary heat conducting portions 21 and 22 include, but are not limited to, one or more of steel, copper, aluminum, silver, and heat conducting ceramics.
In some embodiments, the area of the orthographic projection of the main heat conductor 21 is smaller than the area of the pit bottom 45, and preferably, the center of projection of the main heat conductor 21 on the substrate base 10 coincides with the center of projection of the pit bottom 45 on the substrate base 10. The shape of the main heat conducting portion 21 includes, but is not limited to, an ellipse, a circle, a square, and a polygon, and the center of the main heat conducting portion 21 is aligned with the center of the effective volatilization region of the ink. Therefore, by heating the middle area 43 of each pit bottom 45, the size of the heating area is smaller than the area of a single pit bottom 45, the volatilization rate of the ink solvent in the middle area 43 is effectively improved, and the phenomenon that the ink solvent in the middle moves to the edge under the natural drying condition is reduced.
In some embodiments, the area ratio of the front projection area of the main heat conducting portion 21 to the pit bottom 45 is 1: 1.5-9, in some preferred embodiments, the area ratio of the orthographic projection area of the main heat conducting part 21 to the pit bottom 45 is 1: 3 to 5. When the boiling point of the solvent of the ink is high, for example, the boiling point of the solvent of the ink for printing and film forming is 200-300 ℃, the orthographic projection area of the main heat conducting part 21 is 50-70% of the area of the pit bottom 45, and when the boiling point of the solvent of the ink is low, for example, the boiling point of the solvent of the ink for printing and film forming is 100-200 ℃, the orthographic projection area of the main heat conducting part 21 is 10-40% of the area of the pit bottom 45.
In some embodiments, the sub heat conductive portion 22 includes a narrow conductive line 23 and a wide conductive line 24, the narrow conductive line 23 connects each of the main heat conductive portions 21 and the wide conductive line 24, the width of the wide conductive line 24 is greater than the width of the narrow conductive line 23, and the length of the wide conductive line 24 is not greater than the distance between two adjacent sub-pixel regions 42. The projection of the wide wire 24 on the substrate 10 is located in the projection of the pixel isolation structure 41 on the substrate 10, and the wide wires 24 are located between the adjacent main heat conducting portions 21 and are connected by the narrow wires 23. Therefore, when the heat conducting member 20 is connected to a cooling source, the wide wire 24 is beneficial to increasing the overall heat dissipation area of the heat conducting member 20 and speeding up the heat dissipation, and meanwhile, the projection of the wide wire 24 in the pixel isolation structure 41 is deviated from the edge area 44 of the ink drop, so that when the heat conducting member 20 is connected to a power source, the wide wire 24 is effectively prevented from heating the edge area 44.
Wherein, the ink is dropped in the pit bottom 45 of the sub-pixel region 42, under the natural drying condition, the solvent evaporation rate of the edge region 44 in the pit bottom 45 is larger than that of the middle region 43 in the pit bottom 45, in order to balance the solvent evaporation rates of the middle region 43 and the edge region 44, the heating is carried out by adding the heat-leading part 21 right below the middle region 43, so that the solvent evaporation rate of the middle region 43 is not smaller than that of the edge region 44, which is helpful to maintain the uniformity of the dried film layer.
The inner periphery of the sub-pixel region 42 in this embodiment is a middle region 43 of the pit bottom 45, the main heat conducting portions 21 face the middle region 43 of the pit bottom 45, the outer periphery of the sub-pixel region 42 is a part outside the middle region 43, and includes an edge region 44 of the pit bottom 45 and the pixel isolation structure 41, the sub-heat conducting portions 22 are transversely connected with the main heat conducting portions 21 in sequence, the projection of the sub-heat conducting portions 22 is located at the edge region 44 and the pixel isolation structure 41, for example, the projection of the narrow conducting wire 23 is located at the edge region 44, and the projection of the wide conducting wire 24 is located at the pixel isolation structure 41.
It should be noted that if the areas of the main heat conducting portion 21 and the sub heat conducting portion 22 are compared, the projection of the main heat conducting portion 21 on the inner periphery of the sub pixel region 42 refers to the projection area of the main heat conducting portion 21 on the middle region 43, and the projection of the sub heat conducting portion 22 on the outer periphery of the sub pixel region 42 refers to the projection area of the sub heat conducting portion 22 on the edge region 44, that is, the projection area of the main heat conducting portion 21 on the pit bottom 45 is larger than the projection area of the narrow wire 23 on the pit bottom 45. If the heat conduction of the main heat conducting part 21 and the sub heat conducting part 22 to the sub pixel region 42 is compared, the heat conduction to the inner periphery of the sub pixel region 42 refers to the heat conduction of the main heat conducting part 21 to the middle region 43 of the pit bottom 45, and the heat conduction to the outer periphery of the sub pixel region 42 refers to the heat conduction of the sub heat conducting part 22 to the edge region 44 of the pit bottom 45.
The middle area 43 and the edge area 44 do not have a fixed shape and area, and the ranges of the middle area 43 and the edge area 44 are different for different solvents, so that the main heat conducting part 21 is correspondingly kept aligned with the middle areas 43, and the ink is effectively and uniformly dried.
In some embodiments, the thicknesses of the main heat conducting part 21 and the secondary heat conducting part 22 are the same or different, and the thicknesses of the main heat conducting part 21 and the secondary heat conducting part 22 are 0.5-5 μm. In some preferred embodiments, the thickness of the primary and secondary heat conduction parts 21 and 22 is 0.8 to 2 μm.
In some embodiments, the insulating material selected for the flattish portions 30 includes, but is not limited to, one or more of silicon dioxide, silicon nitride, silicon oxynitride, germanium nitride, and aluminum oxide.
A display device, such as OLED or QLED, comprises a display substrate 1 as above, when the display device is used, a heat conducting member 20 is connected with a cooling source, and a main heat conducting part 21 and a secondary heat conducting part 22 transfer the heat of the display substrate 1 to the outside, so that the heat of the display substrate 1 can be dissipated, the temperature of the display device in use is reduced, and the service life of the display device is prolonged.
A method of fabricating a display substrate as claimed in any one of the above, comprising the steps of:
s1 providing a base substrate 10;
s2 disposing the heat conducting member 20 on the substrate 10, wherein the heat conducting member 20 includes a plurality of primary heat conducting portions 21 and a plurality of secondary heat conducting portions 22, the secondary heat conducting portions 22 are electrically connected to the primary heat conducting portions 21 and the temperature control source 25, the temperature control source 25 controls the temperatures of the primary heat conducting portions 21 and the secondary heat conducting portions 22, and the temperature control source 25 is a heating source or a cooling source;
s3 providing a layer of insulating flattish portions 30 above the primary and secondary heat conduction portions 21 and 22;
s4 disposing the pixel defining layer 40 above the heat conducting member 20, the pixel defining layer 40 including a plurality of pixel isolation structures 41, a plurality of sub-pixel regions 42 isolated from each other formed between the pixel isolation structures 41, each sub-pixel region 42 having a pit bottom 45, a front projection of the main heat conducting portion 21 on the substrate 10 being located on an inner periphery of the sub-pixel region 42, a front projection of the sub-heat conducting portion 22 on the substrate 10 being located on an outer periphery of the sub-pixel region 42, a projected area of the main heat conducting portion 21 on the sub-pixel region 42 being larger than a projected area of the sub-heat conducting portion 22 on the sub-pixel region 42.
In step S2, when the temperature control source 25 is a heat source, the heat conduction portion 22 conducts electricity to the heat conduction portion 21, the heat conduction portion 21 heats the inner periphery of the sub-pixel region 42, and the sub-heat conduction portion 22 heats the outer periphery of the sub-pixel region 42, so that the evaporation rate of the solvent in the inner periphery of the sub-pixel region 42 is controlled to be not less than the evaporation rate of the solvent in the outer periphery of the sub-pixel region 42 because the projected area of the heat conduction portion 21 in the sub-pixel region 42 is larger than the projected area of the sub-heat conduction portion 22 in the sub-pixel region 42; when the temperature control source 25 is a cooling source, the main heat conducting portion 21 and the sub heat conducting portion 22 transfer heat of the display substrate 1 to the outside, so that the display substrate 1 is cooled.
In some embodiments, the main heat conducting portions 21 and the secondary heat conducting portions 22 are disposed on the substrate 10 by etching or wet printing, the secondary heat conducting portions 22 include narrow wires 23 and wide wires 24, the narrow wires 23 connect the respective main heat conducting portions 21 and the wide wires 24, the wide wires 24 have a width greater than that of the narrow wires 23, and a projection of the wide wires 24 on the substrate 10 is located within a projection of the pixel isolation structure 41 on the substrate 10.
In some embodiments, the manufacturing method of the display substrate 1 includes the steps of:
(1) preparing a layer of uniform metal aluminum thin film with the thickness of 400 nm-1 mu m on a substrate base plate 10 by a physical vapor deposition method at the evaporation temperature of 900-1300 ℃ and the speed of 0.5-4 a/s;
(2) forming a pattern including the main heat conductive portion 21 and the sub heat conductive portion 22 by a positive photoresist;
(3) removing the exposed metallic aluminum by etching to form a primary heat conduction part 21 and a secondary heat conduction part 22;
(4) laminating silicon nitride or silicon dioxide on the main heat conducting part 21 and the secondary heat conducting part 22 by an enhanced chemical vapor deposition method, and reducing the reaction temperature to 250-400 ℃ to form a smoothing part 30;
(5) polishing the upper surface of the gentle portion 30 to form a gentle portion 30 with a film thickness of not less than 400 nm;
(6) the electrodes of the display substrate 1 and the pixel defining layer 40 are formed on the flattish portions 30.
Example 1
As shown in fig. 2 to 3, in the first display substrate 1, the main heat conductors 21 are uniformly arranged on the substrate 10, the main heat conductors 21 have an elliptical structure, the secondary heat conductor 22 includes narrow wires 23 and wide wires 24, the narrow wires 23 laterally connect the main heat conductors 21 and the wide wires 24, the wide wires 24 have a width greater than that of the narrow wires 23, the wide wires 24 have a length not greater than a distance between two adjacent sub-pixels, a projection of the wide wires 24 on the substrate 10 is located within a projection of the pixel isolation structure 41 on the substrate 10, and the wide wires 24 are located between the adjacent main heat conductors 21 and connected by the narrow wires 23.
Wherein, the area of the main heat conducting part 21 is 30 percent of the area of the pit bottom 45, the solvent is dodecane, and the boiling point is 216 ℃. The width of the wide wire 24 is 50 μm and the width of the narrow wire 23 is 5 μm.
The manufacturing method of the display substrate 1 specifically comprises the following steps:
(1) preparing a layer of uniform metal aluminum film with the thickness of about 400nm on the cleaned substrate 10 by a physical vapor deposition method at the temperature of 1200 ℃ and the speed of 1 a/s;
(2) forming a pattern including the main heat conductive portion 21 and the sub heat conductive portion 22 by a positive photoresist;
(3) removing the exposed metallic aluminum by etching to form a primary heat conducting part 21 and a secondary heat conducting part 22, the narrow wire 23 being selectively connected to a temperature control source 25;
(4) silicon nitride is laminated on the main heat conducting part 21 and the secondary heat conducting part 22 by an enhanced chemical vapor deposition method, and the reaction temperature is reduced to 350 ℃ to form a smooth part 30;
(5) polishing the upper surface of the gentle portion 30 to form a gentle portion 30 with a film thickness of about 800 nm;
(6) the electrodes of the display substrate 1 and the pixel defining layer 40 are fabricated on the flattish portions 30, during the ink-jet printing process, the heat conducting member 20 is connected with a current source, the heat conducting portion 21 and the sub-heat conducting portion 22 are electrified and heated through the conductive connection of the narrow wires 23, the heat conducting portion 21 heats the inner periphery of the sub-pixel regions 42 to increase partial heat for the middle region 43 of each sub-pixel region 42, so that the solvent evaporation rate of the middle region 43 is controlled to be not less than that of the edge region 44, the pixel ink in the pixel defining layer 40 is dried uniformly, and a uniform pixel function film layer is formed, wherein the heating temperature of the heat conducting portion 21 is determined by an external current source, and the heating time is determined by the solvent property (such as boiling point and the like) of the ink.
Example 2
The display substrate 1 and the manufacturing method thereof of this embodiment are the same as those of embodiment 1, except that the sub-thermal conductive portions 22 radially connect the outer peripheries of the respective main thermal conductive portions 21, the sub-thermal conductive portions 22 include narrow wires 23 and wide wires 24, and the wide wires 24 between the two main thermal conductive portions 21 are integrally connected in the longitudinal direction, as shown in fig. 4.
Wherein, the area of the main heat conducting part 21 is 40% of the area of the sub-pixel region 42, the solvent is n-octanol, and the boiling point is 196 ℃. The width of the wide wire 24 is 60 μm and the width of the narrow wire 23 is 4 μm.
Example 3
The display substrate 1 and the manufacturing method thereof of this embodiment are the same as those of embodiment 1, except that the secondary heat conduction portion 22 includes narrow conductive lines 23, and the narrow conductive lines 23 are sequentially connected to the respective primary heat conduction portions 21 in a transverse direction, as shown in fig. 5.
Wherein, the area of the main heat conducting part 21 is 25% of the area of the sub-pixel region 42, the solvent is toluene, and the boiling point is 110 ℃. The width of the wide wire 24 is 3 μm and the width of the narrow wire 23 is 3 μm.
The foregoing has described the general principles, principal features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A display substrate, comprising:
a substrate base plate;
the pixel defining layer comprises a plurality of pixel isolating structures, a plurality of sub-pixel regions which are isolated from each other are formed between the pixel isolating structures, and each sub-pixel region is provided with a pit bottom;
a heat conductive member disposed between the substrate base plate and the pixel defining layer, the heat conductive member including a plurality of main heat conductive portions and a plurality of sub heat conductive portions, the sub heat conductive portions connecting the main heat conductive portions, the main heat conductive portions being located on an inner periphery of the sub pixel region in a front projection of the substrate base plate, the sub heat conductive portions being located on an outer periphery of the sub pixel region in a front projection of the substrate base plate, a projected area of the main heat conductive portions on the sub pixel region being larger than a projected area of the sub heat conductive portions on the sub pixel region;
a buffer portion disposed above the heat conductive member in an insulated manner, the pixel defining layer being disposed on an upper surface of the buffer portion.
2. The display substrate of claim 1, wherein the heat conducting member is selectively connected to a temperature control source, the temperature control source being a heating source or a cooling source, such that the heat conducting member heats or dissipates heat to the display substrate.
3. The display substrate according to claim 2, wherein the thermal conductivity of the main heat conducting portion and the thermal conductivity of the sub heat conducting portion are the same or different, and when the temperature control source is a heat source, the thermal conductivity of the main heat conducting portion to the inner periphery of the sub pixel region is larger than the thermal conductivity of the sub heat conducting portion to the outer periphery of the sub pixel region, so that the evaporation rate of the ink solvent at the inner periphery of the sub pixel region is not smaller than the evaporation rate of the ink solvent at the outer periphery of the sub pixel region when the ink is disposed on the display substrate.
4. The display substrate according to claim 1, wherein the area of the orthographic projection of the main heat conducting portion is smaller than the area of the pit bottom, and preferably, the projection center of the main heat conducting portion on the substrate and the projection center of the pit bottom on the substrate coincide.
5. The display substrate according to claim 1, wherein the ratio of the area of the main heat conducting portion projected forward to the area of the pit bottom is 1: 1.5-9, preferably, the area ratio of the orthographic projection area of the main heat conducting part to the pit bottom is 1: 3 to 5.
6. The substrate according to any one of claims 1 to 5, wherein the secondary thermal conductive portion comprises a narrow conductive line and a wide conductive line, the narrow conductive line connects each of the primary thermal conductive portions and the wide conductive line, the wide conductive line has a width greater than that of the narrow conductive line, and the wide conductive line has a length not greater than a distance between two adjacent sub-pixel regions.
7. The display substrate according to any one of claims 1 to 5, wherein the thicknesses of the main heat conducting portion and the secondary heat conducting portion are the same or different, and the thicknesses of the main heat conducting portion and the secondary heat conducting portion are 0.5 to 5 μm, preferably 0.8 to 2 μm.
8. A display device comprising the display substrate according to any one of claims 1 to 7.
9. A method for manufacturing a display substrate according to any one of claims 1 to 8, comprising the steps of:
s1 providing a base substrate;
s2 disposing a heat-conducting member on the substrate, the heat-conducting member including a plurality of primary heat-conducting portions and a plurality of secondary heat-conducting portions, the secondary heat-conducting portions electrically connecting the primary heat-conducting portions and a temperature-controlled source, the temperature-controlled source controlling the temperatures of the primary heat-conducting portions and the secondary heat-conducting portions, the temperature-controlled source being a heating source or a cooling source;
s3, arranging a layer of insulating flat buffer part above the heat conducting component;
s4 disposing a pixel defining layer above the heat conducting member, the pixel defining layer including a plurality of pixel isolation structures forming a plurality of sub-pixel regions isolated from each other therebetween, each of the sub-pixel regions having a pit bottom, the main heat conducting portion being located at an inner periphery of the sub-pixel region in an orthogonal projection of the base substrate, the sub heat conducting portion being located at an outer periphery of the sub-pixel region in an orthogonal projection of the base substrate, a projected area of the main heat conducting portion at the sub-pixel region being larger than a projected area of the sub heat conducting portion at the sub-pixel region.
10. The method for manufacturing a display substrate according to claim 9, comprising the steps of:
(1) preparing a layer of uniform metal aluminum thin film with the thickness of 400 nm-1 mu m on the substrate base plate by a physical vapor deposition method at the evaporation temperature of 900-1300 ℃ and the speed of 0.5-4 a/s;
(2) forming a pattern including the main heat conductive portion and the sub heat conductive portion by a positive photoresist;
(3) removing the exposed metal aluminum by etching to form the main heat conducting part and the secondary heat conducting part;
(4) laminating silicon nitride or silicon dioxide on the main heat conducting part and the secondary heat conducting part by an enhanced chemical vapor deposition method, and reducing the reaction temperature to 250-400 ℃ to form a smooth part;
(5) polishing the upper surface of the flatting part to form a film of the flatting part with the thickness of not less than 400 nm;
(6) and manufacturing an electrode of the display substrate and the pixel defining layer on the flat buffering part.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933817A (en) * | 2020-07-27 | 2020-11-13 | 合肥维信诺科技有限公司 | Display panel and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104233195A (en) * | 2014-08-28 | 2014-12-24 | 京东方科技集团股份有限公司 | Evaporation equipment and evaporation method |
| CN105428554A (en) * | 2015-12-21 | 2016-03-23 | Tcl集团股份有限公司 | Printed OLED device and fabrication method thereof |
| CN106654059A (en) * | 2016-12-12 | 2017-05-10 | 纳晶科技股份有限公司 | Light dimming plate and manufacturing method for light-emitting device |
| CN108091778A (en) * | 2017-12-27 | 2018-05-29 | 深圳市华星光电技术有限公司 | Drying means, heating unit and its manufacturing method of inkjet printing film layer |
| CN109585654A (en) * | 2018-11-30 | 2019-04-05 | 合肥鑫晟光电科技有限公司 | Organic layer and preparation method, directive property thermal source component, display panel |
| CN110228293A (en) * | 2019-06-24 | 2019-09-13 | 深圳市华星光电技术有限公司 | Inkjet-printing device |
-
2020
- 2020-02-25 CN CN202010115403.6A patent/CN111354869B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104233195A (en) * | 2014-08-28 | 2014-12-24 | 京东方科技集团股份有限公司 | Evaporation equipment and evaporation method |
| CN105428554A (en) * | 2015-12-21 | 2016-03-23 | Tcl集团股份有限公司 | Printed OLED device and fabrication method thereof |
| CN106654059A (en) * | 2016-12-12 | 2017-05-10 | 纳晶科技股份有限公司 | Light dimming plate and manufacturing method for light-emitting device |
| CN108091778A (en) * | 2017-12-27 | 2018-05-29 | 深圳市华星光电技术有限公司 | Drying means, heating unit and its manufacturing method of inkjet printing film layer |
| CN109585654A (en) * | 2018-11-30 | 2019-04-05 | 合肥鑫晟光电科技有限公司 | Organic layer and preparation method, directive property thermal source component, display panel |
| CN110228293A (en) * | 2019-06-24 | 2019-09-13 | 深圳市华星光电技术有限公司 | Inkjet-printing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933817A (en) * | 2020-07-27 | 2020-11-13 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111933817B (en) * | 2020-07-27 | 2022-09-13 | 合肥维信诺科技有限公司 | Display panel and display device |
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|---|---|
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