CN111354845A - 预设有导电凸块的发光二极管载板 - Google Patents
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
本发明提供一种预设有导电凸块的发光二极管载板,其包括一基板、一电路层及多个导电凸块,基板具有一LED承载面,电路层形成于该LED承载面,且电路层具有多个电接点,该些导电凸块分别形成于该些电接点顶面,且该些导电凸块是分别供多个LED晶粒电性连接。藉此,提升整体制程的良率。
Description
技术领域
本发明是关于一种发光二极管载板,特别是关于一种表面粘着型发光二极管(SMDLED)载板。
背景技术
发光二极管(以下简称LED)的制程可分为上游磊晶制造、中游芯片制造及下游封装测试及***组装,其中,当LED晶粒制造完成后,会将LED晶粒粘着于发光二极管载板(以下简称LED载板)上,经过固晶、固化、打线、封胶、切割等一系列制作流程后,制成发光二极管组件(以下简称LED组件)。
现有的封装技术是通过焊料使LED晶粒的凸块与基板的电接点形成电性连接,但由于目前LED晶粒的体积越来越小,使得在LED晶粒上形成凸块的制程难度显著升高,良率难以提升。
发明内容
有鉴于此,本发明的主要目的在于提供一种有助于提升LED晶粒封装良率的发光二极管载板。
为了达成上述的目的,本发明提供一种预设有导电凸块的发光二极管载板,其包括一基板、一电路层及多个导电凸块,基板具有一发光二极管承载面(以下简称LED承载面),电路层形成于该LED承载面,且电路层具有多个电接点,该些导电凸块分别形成于该些电接点顶面,且该些导电凸块是分别供多个LED晶粒电性连接。
通过在发光二极管载板预设导电凸块,LED晶粒上即无须额外形成凸块,而由于在载板上形成凸块的制程难度远低于在LED晶粒上形成凸块,因此本发明可以解决以往LED封装制程中,LED晶粒凸块制程良率较差的问题,进而提升整体制程的良率。
有关本发明的其它功效及实施例的详细内容,配合图式说明如下。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。
图1为本发明其中一实施例的剖面示意图;
图2至图4为本发明其中一实施例的制程示意图;
图5、图6为本发明其中一实施例贴装LED晶粒的制程示意图。
符号说明
1LED晶粒 2电极
10基板 11LED承载面
20电路层 21电接点
211表面镀层 30导电凸块
40防焊层 41开窗
具体实施方式
在下文的实施方式中所述的位置关系,包括:上,下,左和右,若无特别指明,皆是以图式中组件绘示的方向为基准。
请参考图1,在本发明的其中一实施例中,LED载板包括一基板10、一电路层20、多个导电凸块30及防焊层40。该LED载板例如可应用于SMD LED组件的封装制程。
基板10本身具有一或多层绝缘层,这些绝缘层例如是环氧树脂、玻璃布(wovenglass)、聚酯或其它常用于制作电路板基材的材质。此外,基板10具有一LED承载面11,LED承载面11上可能具有一或多个分别供多个LED晶粒贴装的LED承载区(未绘示)。
电路层20形成于LED承载面11,且电路层20具有多个电接点21,电接点21的数量视LED承载面11所需承载的LED晶粒数量而定,其中一部份的电接点21是与LED晶粒的p极通过导电凸块30电性连接,另一部份的电接点21是与LED晶粒的n极通过导电凸块30电性连接。电路层20由导电材料制成,例如铜。为了提供足够的电流传输能力,电接点21还可具有一表面镀层211,表面镀层211的材质例如可为镍、金、银、钯或其合金。
导电凸块30分别形成于该些电接点21顶面,由于本实施例中,电接点21具有表面镀层211,在此情况下,导电凸块30是形成于表面镀层211的顶面,这些导电凸块30是分别供多个LED晶粒电性连接。导电凸块30的材质例如为锡。
防焊层40形成于LED承载面11,防焊层40局部覆盖电路层20,但电接点21及导电凸块30未被防焊层40覆盖,其中导电凸块30的顶部高于防焊层40顶面,以便与LED晶粒电性连接。所述防焊层40为一绝缘层,其材料可为环氧树脂、硅树脂、聚酰亚胺树脂、酚类树脂、氟树脂、二氧化硅或氧化铝。在第1图所示的实施例中,防焊层40具有实质上齐平的顶面。在其它可能的实施方式中,位于如图1所示两电接点21之间防焊层的高度等高或略低于电接点的顶面。
图2至图4绘示上述LED载板的制备过程的其中一实施方式。首先,如图2所示,在基板10的LED承载面11形成一至数层铜层,接着对铜层进行图形化处理而形成所述电路层20;接着,如图3所示,在LED承载面11形成防焊层40,并在对应电接点21处形成开窗41,使电接点21得以裸露;而后,如图4所示,在电接点21顶面进行表面处理,使其具有表面镀层211,再于表面镀层211顶面形成导电凸块30,即成为如图1所示的LED载板。
图5、图6绘示上述LED载板贴装LED晶粒的制程示意图,亦即,令LED晶粒1的电极2分别对准导电凸块30,再通过回流焊接使LED晶粒1与导电凸块30形成电性连接,以利后续进行其它LED封装制程。
综合上述,由于在载板上形成凸块的制程难度远低于在LED晶粒上形成凸块的难度,因此本发明可以解决以往LED封装制程中,LED晶粒凸块制程良率较差的问题,进而提升整体制程的良率。
以上所述的实施例及/或实施方式,仅是用以说明实现本发明技术的较佳实施例及/或实施方式,并非对本发明技术的实施方式作任何形式上的限制,任何本领域技术人员,在不脱离本发明内容所公开的技术手段的范围,当可作些许的更动或修饰为其它等效的实施例,但仍应视为与本发明实质相同的技术或实施例。
Claims (4)
1.一种预设有导电凸块的发光二极管载板,其特征在于,包括:
一基板,具有一发光二极管承载面;
一电路层,形成于该发光二极管承载面,该电路层具有多个电接点;
多个导电凸块,分别形成于该些电接点顶面,该些导电凸块是分别供多个发光二极管晶粒电性连接。
2.如权利要求1所述预设有导电凸块的发光二极管载板,其特征在于,更包括一防焊层形成于该发光二极管承载面,该防焊层局部覆盖该电路层,该些电接点及该些导电凸块未被该防焊层覆盖。
3.如权利要求2所述预设有导电凸块的发光二极管载板,其特征在于,该些导电凸块高于该防焊层顶面。
4.如权利要求1所述预设有导电凸块的发光二极管载板,其特征在于,各该电接点更具有一表面镀层,该些导电凸块是分别形成于该表面镀层顶面。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200843064A (en) * | 2007-04-18 | 2008-11-01 | Phoenix Prec Technology Corp | Surface structure of a packaging substrate and a fabricating method thereof |
TW201021136A (en) * | 2008-11-18 | 2010-06-01 | Unimicron Technology Corp | Method for fabricating conductive bump and circuit board structure with the same |
CN103794515A (zh) * | 2012-10-30 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | 芯片封装基板和结构及其制作方法 |
CN208014702U (zh) * | 2018-02-14 | 2018-10-26 | 同泰电子科技股份有限公司 | 微发光二极管模块 |
CN209056520U (zh) * | 2018-12-20 | 2019-07-02 | 同泰电子科技股份有限公司 | 预设有导电凸块的发光二极管载板 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200843064A (en) * | 2007-04-18 | 2008-11-01 | Phoenix Prec Technology Corp | Surface structure of a packaging substrate and a fabricating method thereof |
TW201021136A (en) * | 2008-11-18 | 2010-06-01 | Unimicron Technology Corp | Method for fabricating conductive bump and circuit board structure with the same |
CN103794515A (zh) * | 2012-10-30 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | 芯片封装基板和结构及其制作方法 |
CN208014702U (zh) * | 2018-02-14 | 2018-10-26 | 同泰电子科技股份有限公司 | 微发光二极管模块 |
CN209056520U (zh) * | 2018-12-20 | 2019-07-02 | 同泰电子科技股份有限公司 | 预设有导电凸块的发光二极管载板 |
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