CN111293060A - Wafer cleaning and fixing device and wafer cleaning equipment - Google Patents
Wafer cleaning and fixing device and wafer cleaning equipment Download PDFInfo
- Publication number
- CN111293060A CN111293060A CN202010114121.4A CN202010114121A CN111293060A CN 111293060 A CN111293060 A CN 111293060A CN 202010114121 A CN202010114121 A CN 202010114121A CN 111293060 A CN111293060 A CN 111293060A
- Authority
- CN
- China
- Prior art keywords
- wafer
- wheel disc
- fixing
- limiting
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning and fixing device and wafer cleaning equipment, and relates to the technical field of wafer cleaning, wherein the wafer cleaning and fixing device comprises a mounting seat, a fixing frame and a wafer box frame, wherein the fixing frame is rotatably arranged on the mounting seat, and the wafer box frame is rotatably arranged on the fixing frame; the fixing frame can drive the film box frame to rotate together, the film box frame can rotate relative to the fixing frame, and the rotation axis of the fixing frame and the rotation axis of the film box frame are arranged in a non-collinear mode. When the fixed frame rotates, the wafer box frame can drive the wafer to rotate, the structure is compact and simple, and the wafer cleaning uniformity is improved.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning and fixing device and wafer cleaning equipment.
Background
Semiconductor components are extremely susceptible to contamination by particles, metal ions, chemicals, organic matter, etc. during the production process, causing fatal defects to the components and eventual failure. In order to reduce defects in the production process and improve the yield, the wafer cleaning process runs through the whole chip production process. The wafer cleaning process can effectively remove pollutants generated in the processing of the previous procedure, and creates favorable conditions for the next procedure.
The cleaning technology of the wafer is various, and the wet cleaning technology is widely applied. The mechanism of the wet cleaning technology is to utilize chemicals to remove contaminants from the surface of the wafer in the cleaning equipment to ensure the electrical characteristics of the wafer assembly. The current wet cleaning equipment mainly comprises a groove type cleaning machine and a single chip cleaning machine. Among them, the tank type cleaning machine is widely used with characteristics of high efficiency, reliability, batch cleaning, and the like. With the increase of the size of the wafer and the decrease of the size of the digitalized pattern on the surface of the wafer, the requirement on the groove type cleaning machine is higher and higher in order to ensure the uniformity and the final cleaning effect of the wafer cleaning. How to improve the cleaning uniformity of the wafer is an important issue that is being studied.
Disclosure of Invention
The invention aims to provide a wafer cleaning and fixing device to improve the cleaning uniformity of a wafer.
The invention also aims to provide wafer cleaning equipment to provide cleaning uniformity of wafers.
The invention provides a wafer cleaning and fixing device which comprises a mounting seat, a fixing frame and a wafer box frame, wherein the fixing frame is rotatably arranged on the mounting seat, and the wafer box frame is rotatably arranged on the fixing frame;
the fixing frame can drive the sheet box frame to rotate together, the sheet box frame can rotate relative to the fixing frame, and the rotation axis of the fixing frame and the rotation axis of the sheet box frame are arranged in a non-collinear mode.
Furthermore, the number of the film cassette racks is multiple, and the film cassette racks are arranged on the fixed frame at intervals along the rotating direction of the fixed frame.
Furthermore, the fixing frame comprises a driving wheel disc, a driven wheel disc and a connecting rod, the driving wheel disc and the driven wheel disc are coaxially and oppositely arranged, the driving wheel disc and the driven wheel disc are respectively rotatably mounted on the mounting seat, and the connecting rod is fixedly connected between the driving wheel disc and the driven wheel disc;
the sheet box frame is rotatably connected between the driving wheel disc and the driven wheel disc.
Furthermore, the wafer box frame comprises a first limiting disc and a second limiting disc which are coaxially and oppositely arranged, a plurality of limiting rods are arranged between the first limiting disc and the second limiting disc and are arranged at intervals along the circumferential direction of the first limiting disc, and a wafer placing space is formed among the limiting rods;
the side surfaces, far away from each other, of the first limiting disc and the second limiting disc are respectively connected with the driving wheel disc and the driven wheel disc in a rotating mode through rotating shafts, and the rotating shafts are arranged in parallel with the axis of the driving wheel disc.
Furthermore, the number of the limiting rods is three, the three limiting rods comprise two fixing rods and a rotating rod, and two ends of the two fixing rods are respectively fixedly connected with the first limiting disc and the second limiting disc; the both ends of dwang with first spacing dish can dismantle with the spacing dish of second and be connected, and/or the both ends of dwang with first spacing dish and the spacing dish sliding connection of second, just the both ends of dwang can be relative first spacing dish and the spacing dish of second are fixed.
Further, first spacing dish with the spacing dish of second is provided with the guide way along its circumference respectively, dwang sliding connection be in the guide way.
Furthermore, many the gag lever post towards all be provided with the constant head tank of establishing fixed wafer of card on the side of the space of placing of wafer, the quantity of constant head tank is a plurality of, and is a plurality of the constant head tank is followed the length direction of gag lever post is interval arrangement in proper order.
Further, the wafer cleaning and fixing device further comprises a transmission mechanism, the transmission mechanism is connected with the driving wheel disc and the first limiting disc, and the transmission mechanism is used for synchronously driving the fixing frame to rotate and the wafer box frame to rotate.
Furthermore, the transmission mechanism comprises a planet carrier, a sun gear of the planet carrier is connected with the driving wheel disc, the axis of the sun gear is arranged in a collinear way with the rotation axis of the driving wheel disc, planet gears of the planet carrier are connected with the rotation axis of the first limiting disc of the sheet box frame, each planet gear is connected with at most one rotation axis of the first limiting disc, and the axis of each planet gear is arranged in a collinear way with the corresponding rotation axis; and the gear ring of the planet carrier is fixedly arranged.
Further, the quantity of the planet wheel of planet carrier is 3, the quantity of piece box frame is 3, the planet wheel with piece box frame one-to-one sets up.
Further, the mounting seat comprises a bottom plate, a gear ring fixing plate and a first vertical rod;
the gear ring fixing plate and the first vertical rod are arranged at intervals and are both installed on the bottom plate, a through hole is formed in the gear ring fixing plate, and the gear ring of the planet carrier is installed in the through hole; the driving wheel disc is arranged on one side, away from the first vertical rod, of the gear ring fixing plate, and the driven wheel disc is rotationally connected with one side, facing the gear ring fixing plate, of the first vertical rod;
and the bottom plate is provided with a bearing corresponding to the circumferential edge of the driving wheel disc, and the circumferential edge of the driving wheel disc is rotatably arranged on the bearing.
Furthermore, the bottom plate is also provided with two limiting wheel seats which are oppositely arranged, and the bearing and the driving wheel disc are arranged between the two limiting wheel seats.
Furthermore, the gear ring fixing plate is connected with a mounting convex shaft;
and a transverse mounting shaft is arranged on the first vertical rod.
Furthermore, a pull rod is connected between the gear ring fixing plate and the top end of the first vertical rod.
The wafer cleaning equipment provided by the invention comprises the wafer cleaning and fixing device.
The invention provides a wafer cleaning and fixing device, which comprises a mounting seat, a fixing frame and a wafer box frame, wherein the fixing frame is rotatably arranged on the mounting seat; the fixing frame can drive the film box frame to rotate together, the film box frame can rotate relative to the fixing frame, and the rotation axis of the fixing frame and the rotation axis of the film box frame are arranged in a non-collinear mode. In the use process of the wafer cleaning and fixing device, the wafer is firstly placed on the wafer box frame, then the wafer box frame is installed on the fixing frame, the fixing frame is installed on the cleaning tank through the installation seat, then the wafer box frame is driven to rotate through the fixing frame, and the wafer box frame rotates automatically, so that the wafer on the wafer box frame is in full contact with cleaning liquid (liquid medicine) in the cleaning tank, and the cleaning operation of the wafer is completed. According to the wafer cleaning and fixing device, the rotation axis of the fixing frame and the rotation axis of the wafer box frame are non-collinear, so that the fixing frame can drive the wafer box frame to rotate in the cleaning groove, the wafer box frame can be contacted with cleaning liquids at different positions in the cleaning groove, wafers soaked in the cleaning liquids can be sufficiently cleaned, and the final cleaning effect is improved; and the wafer box frame can rotate, so that each position of the wafer placed on the wafer box frame is more uniformly contacted with the cleaning solution, the cleaning uniformity of the wafer is improved, the subsequent processing of the wafer is better guaranteed, and the processing precision of the wafer is improved.
The wafer cleaning equipment provided by the invention comprises the wafer cleaning and fixing device provided by the invention, has the same beneficial effects as the wafer cleaning and fixing device provided by the invention, and is not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a wafer cleaning fixture according to an embodiment of the present invention;
fig. 2 is a schematic view of a cassette rack of a wafer cleaning and fixing apparatus according to an embodiment of the invention.
Icon: 1-driving a wheel disc; 2-a gear ring fixing plate; 3-a box frame; 4-a reinforcing rod; 5-a planet wheel; 6-a bearing; 7-limiting wheel seat; 8-a pull rod; 9-transverse mounting shaft; 10-a driven wheel disc; 11-a first vertical bar; 12-a central connecting shaft; 13-a base plate; 14-a second vertical bar; 15-mounting a convex shaft; 16-a connecting shaft; 17-a gear ring; 100-a rotating shaft; 200-a guide groove; 300-positioning grooves; 400-a first limiting disc; 500-fixing the rod; 600-rotating rods; 700-a second limiting disc; 800-wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, the present embodiment provides a wafer cleaning fixing apparatus for fixing a wafer 800 during a cleaning step of the wafer 800. The wafer cleaning and fixing device comprises a mounting seat, a fixing frame and a wafer box frame 3. The fixed frame is rotatably arranged on the mounting seat, and the film box frame 3 is rotatably arranged on the fixed frame. The fixing frame can drive the film box frame 3 to rotate together, the film box frame 3 can synchronously rotate relative to the fixing frame, and the rotation axis of the fixing frame and the rotation axis of the film box frame 3 are arranged in a non-collinear mode.
It is understood that the rotation axis of the holder is a straight line on which the holder rotates around the rotating shaft, and the rotation axis of the cassette holder 3 is a straight line on which the rotating shaft of the cassette holder 3 rotates. The rotation axis of the holder is non-collinear with the rotation axis of the cassette holder 3, i.e. the rotation axis of the holder intersects with or is parallel to the rotation axis of the rotation of the cassette holder 3, i.e. the rotation trajectories of the holder and the cassette holder 3 are not coincident, so that the rotation of the holder driving the cassette holder 3 and the rotation of the cassette holder 3 can be two different rotations.
The fixing frame drives the wafer cassette holder 3 to rotate in order to realize the contact between the wafer cassette holder 3 and cleaning liquid at different positions in the cleaning tank, because in the process of cleaning the wafer 800, the cleaning tank is generally horizontally arranged, the fixing frame can preferably rotate around a horizontal rotation axis to drive the wafer cassette holder 3 to move at different depths of the cleaning tank, the rotation axis of the wafer cassette holder 3 can be a horizontal axis parallel to the rotation axis of the fixing frame as shown in fig. 1, and can also be a vertical axis perpendicular to the horizontal plane, and the like. The present embodiment is described mainly by taking an example in which the rotation axis of the cassette holder 3 is parallel to the rotation axis of the holder.
This embodiment wafer washs fixing device, in the use, on placing wafer 800 to film box frame 3 earlier, then install film box frame 3 on the mount, the mount passes through the mount pad to be installed on the washing tank, then drive film box frame 3 through the mount pad and rotate, the synchronous rotation of film box frame 3 for wafer on the film box frame 3 fully contacts with the washing liquid (liquid medicine) in the washing tank, accomplishes the washing operation of wafer.
In the wafer cleaning and fixing device of the embodiment, the rotation axis of the fixing frame and the rotation axis of the wafer box frame 3 are non-collinear, so that the fixing frame can drive the wafer box frame 3 to rotate in the cleaning tank, the wafer box frame 3 can be contacted with cleaning solutions at different positions in the cleaning tank, wafers 800 soaked in the cleaning solutions can be sufficiently cleaned, and the final cleaning effect is improved; and the wafer box frame 3 can rotate, so that the contact between each position of the wafer 800 placed on the wafer box frame 3 and the cleaning liquid is more uniform, the cleaning uniformity of the wafer 800 is improved, the subsequent processing of the wafer 800 is better guaranteed, and the processing precision of the wafer 800 is improved.
Furthermore, the wafer cassette rack 3 of the wafer cleaning and fixing device of the embodiment is multiple in number, and the multiple wafer cassette racks 3 are arranged on the fixing frame at intervals along the rotation direction of the fixing frame.
For example, as shown in fig. 1, the number of the cassette holders 3 is 3, and 3 cassette holders 3 are provided at intervals in the rotation direction of the holder.
It can be understood that the number of the cassette holders 3 is plural, and the fixing frame can drive the plural cassette holders 3 to move at a time, so that the number of the wafers 800 to be cleaned at a time is increased, and accordingly, the cleaning efficiency and the processing efficiency of the wafers 800 are increased.
As a specific embodiment of the wafer cleaning and fixing device in this embodiment, the fixing frame includes a driving wheel disc 1, a driven wheel disc 10 and a connecting rod, the driving wheel disc 1 and the driven wheel disc 10 are coaxially disposed oppositely, and the connecting rod is fixedly connected between the driving wheel disc 1 and the driven wheel disc 10. The cassette holder 3 is rotatably connected between the driving wheel disc 1 and the driven wheel disc 10.
Wherein, the quantity of connecting rod can be many, and the quantity of connecting rod is three in this embodiment, and one of them connecting rod is central connecting axle 12, and central connecting axle 12 is connected on the center of driving wheel dish 1 and driven wheel dish 10, and two connecting rods are stiffener 4 in addition, and two stiffener 4 establish the both sides at central connecting axle 12. It should be noted that the connecting rods should be arranged to avoid affecting the rotation of the cassette holder 3.
Particularly, the wafer box frame 3 comprises a first limiting disc 400 and a second limiting disc 700 which are coaxially and oppositely arranged, a plurality of limiting rods are arranged between the first limiting disc 400 and the second limiting disc 700, the plurality of limiting rods are arranged along the circumferential interval of the first limiting disc 400, and a placing space of the wafer 800 is formed among the plurality of limiting rods. The side surfaces of the first limiting disc 400 and the second limiting disc 700, which are far away from each other, are respectively connected with the driving wheel disc 1 and the driven wheel disc 10 in a rotating manner through the rotating shaft 100, and the rotating shaft 100 is arranged in parallel with the axis of the driving wheel disc 1.
That is, as shown in fig. 1, the left side of the first stopper plate 400 of each of the 3 cassette racks 3 is connected to the driving wheel disk 1 through the rotating shaft 100, and the right side of the second stopper plate 700 is connected to the driven wheel disk 10 through the rotating shaft 100. The axis of the rotating shaft 100 is collinear with the centers of the driving wheel disc 1 and the driven wheel disc 10, and a plurality of parallel limiting rods are arranged between the first limiting disc 400 and the second limiting disc 700.
As a specific implementation manner, as shown in fig. 1, the number of the limiting rods is three, the three limiting rods include two fixing rods 500 and a rotating rod 600, and two ends of the two fixing rods 500 are respectively fixedly connected with the first limiting plate 400 and the second limiting plate 700. The both ends of dwang 600 can dismantle with first spacing dish 400 and the spacing dish 700 of second and be connected to and/or the both ends of dwang 600 and first spacing dish 400 and the spacing dish 700 sliding connection of second, and the both ends of dwang 600 can be fixed by first spacing dish 400 and the spacing dish 700 of second relatively.
That is, the rotating lever 600 may be detachably attached, may be slidably attached, or may be detachably and slidably attached. The rotation lever 600 is installed in such a manner that the wafer 800 is placed on the cassette holder 3 or the wafer 800 is removed from the cassette holder 3 by moving the rotation lever 600.
In this embodiment, as shown in fig. 2, the first and second limiting disks 400 and 700 are each provided with a guide groove 200 along the circumferential direction thereof, the left end of the rotating rod 600 is slidably connected in the guide groove 200 of the first limiting disk 400, and the right end of the rotating rod 600 is slidably connected in the guide groove 200 of the second limiting disk 700. The rotating rod 600 can move to a position where the wafer 800 can be conveniently taken out in the guide groove 200, and can also move to a position where the wafer 800 is limited between the three limiting rods. Wherein, the guide groove 200 may be provided with fixing grooves or fixing members at both ends thereof, respectively, so that when the rotating lever 600 moves to a corresponding position of the guide groove 200, the rotating lever 600 is relatively fixed to the first and second limiting discs 400 and 700.
In order to facilitate the interval fixing of the wafer 800, as shown in fig. 2, the positioning grooves 300 for clamping and fixing the wafer 800 are respectively arranged on the sides of the three limiting rods facing the placing space of the wafer 800, the number of the positioning grooves 300 is multiple, and the plurality of positioning grooves 300 are sequentially arranged at intervals along the length direction of the limiting rods.
When the wafer positioning device is used specifically, the wafers 800 are sequentially placed in the positioning grooves 300 and are limited and fixed through the three limiting rods. It is understood that the locating grooves 300 may improve the stability of the wafer 800 and provide gaps between the wafers 800 to allow each wafer 800 to be cleaned sufficiently.
In order to simplify the apparatus, the wafer cleaning and fixing device of this embodiment further includes a transmission mechanism, the transmission mechanism is connected to the driving wheel disc 1 and the first limiting disc 400, and the transmission mechanism is configured to synchronously drive the fixing frame to rotate and the cassette holder 3 to rotate. That is, by providing the transmission mechanism, one driving mechanism can drive the fixed frame and the cassette frame 3 to rotate at the same time.
Specifically, the transmission mechanism comprises a planet carrier, a sun gear of the planet carrier is connected with the driving wheel disc 1, and the axis of the sun gear is arranged in a collinear way with the rotation axis of the driving wheel disc 1, namely, the wheel axle of the sun gear is coaxial with the central connecting shaft 12 of the driving wheel disc; the planet wheels 5 of the planet carrier are connected with the rotating shaft 100 of the first limiting disc 400 of the wafer box frame 3, each planet wheel 5 is connected with at most one rotating shaft 100 of the first limiting disc 400, and the axis of each planet wheel 5 is arranged in a collinear way with the corresponding rotating shaft 100; the ring gear 17 of the planet carrier is fixedly arranged.
Wherein, the rotating shaft 100 of each sheet cassette holder 3 needs to be connected with a planetary gear 5 to realize the rotation of the sheet cassette holder 3, but the number of the planetary gears 5 can be larger than that of the sheet cassette holders 3, and the redundant planetary gears 5 can idle, that is, are not connected with the sheet cassette holder 3. Preferably, the number one-to-one of planet wheel 5 and film cassette frame 3 is set up, and in this embodiment, the number of planet wheel 5 of planet carrier is 3, and the number of film cassette frame 3 is 3, and planet wheel 5 and film cassette frame 3 one-to-one set up.
In the present embodiment, as shown in fig. 1, the sun gear of the planet carrier is disposed on the side of the driving wheel disc 1 close to the driven wheel disc 10, and the side of the driving wheel disc 1 away from the driven wheel disc 1 is provided with a connecting shaft 16 connected with a driving mechanism (e.g., a motor) such as a motor. The driving wheel disc 1 and the driven wheel disc 10 are the same in size, the diameter of the driving wheel disc 1 is larger than that of the sun wheel of the planet carrier, and the wheel shaft of the planet wheel 5 can be rotatably connected to the driving wheel disc 1 through a bearing so as to improve the stability of the device. Wherein, the rotating shaft 100 of the first limiting disc 400 is fixedly connected with the axle of the planet wheel 5.
Further, the mounting seat of the wafer cleaning and fixing device of the embodiment comprises a bottom plate 13, a gear ring fixing plate 2 and a first vertical rod 11. The gear ring fixing plate 2 and the first vertical rod 11 are arranged at intervals and are both arranged on the bottom plate 13, a through hole is formed in the gear ring fixing plate 2, and the gear ring 17 of the planet carrier is arranged in the through hole; the driving wheel disc 1 is arranged on one side, deviating from the first vertical rod 11, of the gear ring fixing plate 2, and the driven wheel disc 10 is rotatably connected with one side, facing the gear ring fixing plate 2, of the first vertical rod 11. The bottom plate 13 is provided with a bearing 6 corresponding to the circumferential edge of the driving wheel disc 1, and the circumferential edge of the driving wheel disc 1 is rotatably arranged on the bearing 6.
Preferably, the bottom plate 13 is further provided with two limiting wheel seats 7 which are oppositely arranged, and the bearing 6 and the driving wheel disc 1 are arranged between the two limiting wheel seats 7.
The ring gear fixing plate 2 may be an integral structure with the ring gear 17 of the planet carrier, that is, as shown in fig. 1, internal teeth are provided on the through hole on the ring gear fixing plate 2 along the circumferential direction thereof as a ring gear. The bearing 6 can be flange bearing, and quantity can be two, and two bearings 6 set up respectively between two spacing wheel seats 7, and every bearing 6 sets up on a spacing wheel seat 7, and the bearing all is located the below of driving rim plate 1 with spacing wheel seat 7. The setting of bearing 6 not only can support drive rim plate 1, makes drive rim plate 1 can rotate, and cooperates the position that spacing wheel seat 7 can spacing drive rim plate 1, still can make the mount set up from driving rim plate 10 and bottom plate 13 interval when the level sets up simultaneously.
In order to facilitate the installation of the installation base on the cleaning tank, the gear ring fixing plate 2 of the embodiment is connected with an installation convex shaft 15; set up horizontal installation axle 9 on the first vertical rod 11, wherein installation protruding axle 15 sets up with horizontal installation axle 9 level, both ends respectively with the cell wall of washing tank or fixed connection such as mount on the washing tank.
In the embodiment, a pull rod 8 is connected between the gear ring fixing plate 2 and the top end of the first vertical rod 11.
Specifically, a second vertical rod 14 is connected above the gear ring fixing plate 2, and a pull rod 8 is installed between the second vertical rod 14 and the top end of the first vertical rod 11. It will be appreciated that the provision of the pull rod 8 facilitates the lifting of the mobile wafer cleaning fixture.
It should be noted that the height of the pull rod 8 should not affect the rotation of the holder and cassette holder 3.
Finally, the embodiment provides a form that a driving mechanism synchronously drives the fixed frame and the film box frame 3 to rotate through a transmission mechanism, and naturally, the form can also be a form that the fixed frame is driven independently and the film box frame 3 is driven independently. However, compared with the form of driving the fixing frame independently and driving the cassette holder 3 independently, the wafer cleaning and fixing device of the embodiment has a simpler and more compact structure.
In this embodiment, the cassette holder 3 and the fixing holder of the wafer cleaning and fixing apparatus may be detachably and rotatably connected to facilitate cleaning of wafers of different sizes by replacing the cassette holder 3.
To sum up, the gear ring fixing plate 2 and the first vertical rod 11 of the wafer cleaning and fixing device of the embodiment are installed on the bottom plate 13 and are connected by the pull rod 8 to form a basic frame, namely, a mounting seat; the driven wheel disc 10 is arranged on a first vertical rod 11 and is connected with the driving wheel disc 1 through a connecting rod to form a rotating part of the fixing frame, and the fixing frame driving piece box frame 3 rotates under the driving of external force. The film box frame 3 is arranged between the driven wheel disc 10 and the planet wheel 5 of the planet carrier, and the rotation part of the film box frame 3 is formed by the connection of the planet wheel 5 of the planet carrier, the sun wheel and the gear ring 17. The limiting wheel seat 7 is arranged on the bottom plate 13, the bearing 6 is arranged on the limiting wheel seat 7, and the driving wheel disc 1 is limited and supported; the transverse mounting shaft 9 is mounted on the first vertical rod 11, and forms a part connected with the groove body together with a mounting convex shaft 15 of the gear ring fixing plate 2. Wafer cassette holder 3 is provided with dwang 600, and dwang 600 can be in the activity between first spacing dish 400 and the spacing dish 700 of second, makes things convenient for the wafer to place and dismantle.
In the embodiment, the wafer cleaning and fixing device drives the plurality of wafer box frames 3 to rotate integrally through the driving wheel disc 1, so that the wafer 800 soaked in the liquid medicine can be sufficiently cleaned, and the final cleaning effect is improved; the rotation of the wafer box frame 3 can be realized through the connection of the planet wheel 5 and the gear ring 17, so that the wafer is cleaned more uniformly; meanwhile, a plurality of wafer box frames 3 are supported, and by changing the form of the wafer box frames 3, a plurality of same wafers can be cleaned at the same time, and wafers with different sizes can be cleaned at the same time. Therefore, in the wafer cleaning and fixing device of the embodiment, the wafer box frame 3 can drive the wafer to rotate while the fixing frame rotates, so that a single shaking form in groove type cleaning is avoided, the structure is compact and simple, and the wafer cleaning uniformity and the final effect can be improved.
The embodiment further provides a wafer cleaning device, which comprises the wafer cleaning and fixing device provided by the embodiment.
Naturally, the wafer cleaning apparatus of the present embodiment further includes a cleaning tank, a driving mechanism and other devices for cleaning the wafer, wherein the driving mechanism may be a motor for connecting with the connecting shaft 16 of the driving wheel disc 1.
The specific structure, operation process, effect, etc. of the wafer cleaning apparatus in this embodiment can be referred to the description of the wafer cleaning fixing device provided in this embodiment, and will not be described herein again.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A wafer cleaning and fixing device is characterized by comprising a mounting seat, a fixing frame and a wafer box frame, wherein the fixing frame is rotatably arranged on the mounting seat, and the wafer box frame is rotatably arranged on the fixing frame;
the fixing frame can drive the sheet box frame to rotate together, the sheet box frame can rotate relative to the fixing frame, and the rotation axis of the fixing frame and the rotation axis of the sheet box frame are arranged in a non-collinear mode.
2. The wafer cleaning and fixing device of claim 1, wherein the wafer cassette holder is provided in a plurality, and the plurality of wafer cassette holders are disposed on the fixing frame at intervals along a rotation direction of the fixing frame.
3. The wafer cleaning and fixing device as claimed in claim 1 or 2, wherein the fixing frame comprises a driving wheel disc, a driven wheel disc and a connecting rod, the driving wheel disc and the driven wheel disc are coaxially and oppositely arranged, the driving wheel disc and the driven wheel disc are respectively rotatably mounted on the mounting seat, and the connecting rod is fixedly connected between the driving wheel disc and the driven wheel disc;
the sheet box frame is rotatably connected between the driving wheel disc and the driven wheel disc.
4. The wafer cleaning and fixing device of claim 3, wherein the wafer cassette holder comprises a first limiting disc and a second limiting disc which are coaxially arranged in an opposite manner, a plurality of limiting rods are arranged between the first limiting disc and the second limiting disc and are arranged at intervals along the circumferential direction of the first limiting disc, and a wafer placing space is formed between the plurality of limiting rods;
the side surfaces, far away from each other, of the first limiting disc and the second limiting disc are respectively connected with the driving wheel disc and the driven wheel disc in a rotating mode through rotating shafts, and the rotating shafts are arranged in parallel with the axis of the driving wheel disc.
5. The wafer cleaning and fixing device as claimed in claim 4, wherein the number of the limiting rods is three, the three limiting rods comprise two fixing rods and a rotating rod, and two ends of the two fixing rods are respectively fixedly connected with the first limiting disc and the second limiting disc; the both ends of dwang with first spacing dish can dismantle with the spacing dish of second and be connected, and/or the both ends of dwang with first spacing dish and the spacing dish sliding connection of second, just the both ends of dwang can be relative first spacing dish and the spacing dish of second are fixed.
6. The wafer cleaning and fixing device as claimed in claim 4, wherein a plurality of positioning grooves for clamping and fixing wafers are formed in the side surfaces of the limiting rods facing the placing space of the wafers, and the plurality of positioning grooves are sequentially arranged at intervals along the length direction of the limiting rods.
7. The wafer cleaning and fixing device of claim 4, further comprising a transmission mechanism, wherein the transmission mechanism is connected with the driving wheel disc and the first limiting disc, and is used for synchronously driving the fixing frame to rotate and the wafer cassette holder to rotate;
the transmission mechanism comprises a planet carrier, a sun gear of the planet carrier is connected with the driving wheel disc, the axis of the sun gear is arranged in a collinear way with the rotation axis of the driving wheel disc, planet gears of the planet carrier are connected with the rotation axis of the first limiting disc of the wafer box frame, each planet gear is at most connected with the rotation axis of the first limiting disc, and the axis of each planet gear is arranged in a collinear way with the corresponding rotation axis; and the gear ring of the planet carrier is fixedly arranged.
8. The wafer cleaning fixture of claim 7, wherein the mount includes a base plate, a ring gear mounting plate, and a first vertical rod;
the gear ring fixing plate and the first vertical rod are arranged at intervals and are both installed on the bottom plate, a through hole is formed in the gear ring fixing plate, and the gear ring of the planet carrier is installed in the through hole; the driving wheel disc is arranged on one side, away from the first vertical rod, of the gear ring fixing plate, and the driven wheel disc is rotationally connected with one side, facing the gear ring fixing plate, of the first vertical rod;
and the bottom plate is provided with a bearing corresponding to the circumferential edge of the driving wheel disc, and the circumferential edge of the driving wheel disc is rotatably arranged on the bearing.
9. The wafer cleaning and fixing device of claim 8, wherein the bottom plate is further provided with two limiting wheel seats which are oppositely arranged, and the bearing and the driving wheel disc are arranged between the two limiting wheel seats;
the gear ring fixing plate is connected with a mounting convex shaft, and a transverse mounting shaft is arranged on the first vertical rod;
and a pull rod is connected between the gear ring fixing plate and the top end of the first vertical rod.
10. A wafer cleaning apparatus comprising the wafer cleaning fixture as recited in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010114121.4A CN111293060B (en) | 2020-02-21 | 2020-02-21 | Wafer cleaning and fixing device and wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010114121.4A CN111293060B (en) | 2020-02-21 | 2020-02-21 | Wafer cleaning and fixing device and wafer cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111293060A true CN111293060A (en) | 2020-06-16 |
| CN111293060B CN111293060B (en) | 2023-03-10 |
Family
ID=71021779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010114121.4A Active CN111293060B (en) | 2020-02-21 | 2020-02-21 | Wafer cleaning and fixing device and wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111293060B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992734A (en) * | 2021-02-09 | 2021-06-18 | 江苏亚电科技有限公司 | Drying device for cleaning semiconductor wafer |
| CN113909198A (en) * | 2021-09-06 | 2022-01-11 | 邱献超 | Cleaning device for wafer semiconductor processing |
| CN114292031A (en) * | 2021-11-30 | 2022-04-08 | 华能(泰安)光电科技有限公司 | Horizontal acid dip pickle of optical fiber perform |
| CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
| CN114864475A (en) * | 2022-04-13 | 2022-08-05 | 智程半导体设备科技(昆山)有限公司 | Silicon chip belt cleaning device with breakage-proof piece function |
| CN115106329A (en) * | 2022-06-17 | 2022-09-27 | 广东先导微电子科技有限公司 | Wafer processing device |
| CN116564866A (en) * | 2023-07-10 | 2023-08-08 | 盛奕半导体科技(无锡)有限公司 | Semiconductor wet etching cleaning device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672212A (en) * | 1994-07-01 | 1997-09-30 | Texas Instruments Incorporated | Rotational megasonic cleaner/etcher for wafers |
| CN104001704A (en) * | 2014-05-19 | 2014-08-27 | 中国电子科技集团公司第四十五研究所 | Special multi-station rotating stand for rotary flushing equipment |
| CN106024674A (en) * | 2016-05-11 | 2016-10-12 | 中国电子科技集团公司第四十五研究所 | Multi-station rotating frame device of washing and spin-drying equipment and method for cleaning wafer |
| CN109304318A (en) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | A kind of wafer cleaning device and cleaning method |
| WO2019058774A1 (en) * | 2017-09-22 | 2019-03-28 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate holding device and substrate processing device |
| CN209613645U (en) * | 2018-12-28 | 2019-11-12 | 杭州捷菱机械设备有限公司 | A kind of more dynamic rotation cleaning devices for brake disc |
-
2020
- 2020-02-21 CN CN202010114121.4A patent/CN111293060B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672212A (en) * | 1994-07-01 | 1997-09-30 | Texas Instruments Incorporated | Rotational megasonic cleaner/etcher for wafers |
| CN104001704A (en) * | 2014-05-19 | 2014-08-27 | 中国电子科技集团公司第四十五研究所 | Special multi-station rotating stand for rotary flushing equipment |
| CN106024674A (en) * | 2016-05-11 | 2016-10-12 | 中国电子科技集团公司第四十五研究所 | Multi-station rotating frame device of washing and spin-drying equipment and method for cleaning wafer |
| WO2019058774A1 (en) * | 2017-09-22 | 2019-03-28 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate holding device and substrate processing device |
| CN109304318A (en) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | A kind of wafer cleaning device and cleaning method |
| CN209613645U (en) * | 2018-12-28 | 2019-11-12 | 杭州捷菱机械设备有限公司 | A kind of more dynamic rotation cleaning devices for brake disc |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992734A (en) * | 2021-02-09 | 2021-06-18 | 江苏亚电科技有限公司 | Drying device for cleaning semiconductor wafer |
| CN112992734B (en) * | 2021-02-09 | 2022-01-28 | 江苏亚电科技有限公司 | Drying device for cleaning semiconductor wafer |
| CN113909198A (en) * | 2021-09-06 | 2022-01-11 | 邱献超 | Cleaning device for wafer semiconductor processing |
| CN113909198B (en) * | 2021-09-06 | 2023-09-01 | 天津晟龙科技发展有限公司 | Cleaning device for wafer semiconductor processing |
| CN114292031A (en) * | 2021-11-30 | 2022-04-08 | 华能(泰安)光电科技有限公司 | Horizontal acid dip pickle of optical fiber perform |
| CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
| CN114864475A (en) * | 2022-04-13 | 2022-08-05 | 智程半导体设备科技(昆山)有限公司 | Silicon chip belt cleaning device with breakage-proof piece function |
| CN114864475B (en) * | 2022-04-13 | 2023-11-03 | 苏州智程半导体科技股份有限公司 | Silicon wafer cleaning device with breakage-proof function |
| CN115106329A (en) * | 2022-06-17 | 2022-09-27 | 广东先导微电子科技有限公司 | Wafer processing device |
| CN115106329B (en) * | 2022-06-17 | 2024-05-24 | 广东先导微电子科技有限公司 | Wafer processing device |
| CN116564866A (en) * | 2023-07-10 | 2023-08-08 | 盛奕半导体科技(无锡)有限公司 | Semiconductor wet etching cleaning device |
| CN116564866B (en) * | 2023-07-10 | 2023-09-05 | 盛奕半导体科技(无锡)有限公司 | Semiconductor wet etching cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111293060B (en) | 2023-03-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111293060B (en) | Wafer cleaning and fixing device and wafer cleaning equipment | |
| US20070181149A1 (en) | Single wafer backside wet clean | |
| JP5973300B2 (en) | Substrate processing equipment | |
| JP5973299B2 (en) | Substrate processing equipment | |
| JP2019061996A (en) | Substrate inversion device, substrate processing apparatus and substrate clamping device | |
| JP5637974B2 (en) | Substrate cleaning apparatus and substrate cleaning method | |
| US9889476B2 (en) | Substrate processing apparatus and substrate processing method | |
| CN113284808B (en) | Preparation method of semiconductor structure | |
| CN114256062A (en) | Method for removing photoresist and cleaning AL product before film coating | |
| CN113113346A (en) | Bearing device and semiconductor cleaning equipment | |
| JP6259857B2 (en) | Wafer rotation device | |
| CN210215536U (en) | Hanger revolution mechanism of film plating machine | |
| CN110695798A (en) | Automatic polishing device for automobile castings | |
| TWI744988B (en) | A device for cleaning and etching | |
| CN216262574U (en) | Etching solution packaging bottle belt cleaning device | |
| CN111640692B (en) | Cleaning auxiliary device and cleaning device for wafer | |
| CN114678294A (en) | Substrate holding device, liquid processing apparatus provided with same, and substrate processing apparatus | |
| KR100855737B1 (en) | Wafer spin chuck | |
| CN217750941U (en) | Polishing equipment for preventing polishing solution from splashing | |
| CN110828329A (en) | Chip rotating device of destressing corrosion machine | |
| CN220382108U (en) | Edge covering mechanism and edge covering device | |
| KR20210011626A (en) | Composition for cleaning substrate, method for producing there of and method for cleaing substrate using there of | |
| KR101681181B1 (en) | Apparatus and Method for treating substrate | |
| TWI847464B (en) | Cleaning device | |
| CN209880558U (en) | Wafer edge washing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |