CN111288307A

CN111288307A - LED light source module and lamp

Info

Publication number: CN111288307A
Application number: CN201811502116.XA
Authority: CN
Inventors: 林聪毅; 杜金; 何孝亮; 许礼
Original assignee: Shanghai Sansi Technology Co Ltd; Shanghai Sansi Electronic Engineering Co Ltd
Current assignee: Shanghai Sansi Technology Co Ltd; Shanghai Sansi Electronic Engineering Co Ltd; Jiashan Sansi Photoelectric Technology Co Ltd
Priority date: 2018-12-10
Filing date: 2018-12-10
Publication date: 2020-06-16

Abstract

The invention provides an LED light source module and a lamp, wherein the structure comprises: the LED lamp comprises a substrate, LED chips arranged on the substrate and lenses covering the LED chips; the LED chip is covered with packaging glue containing fluorescent powder; and transparent lens filling glue is arranged between the lens and the LED chip. The LED light source module solves the problem that high-transmittance organic silica gel is filled for improving the lighting effect, but the high-transmittance organic silica gel can cause color temperature drift of partial chips, so that the color temperature drift of the lamp is caused.

Description

LED light source module and lamp

Technical Field

The present invention relates to a light source module, and more particularly, to a lamp including the light source module.

Background

Along with the development of the LED lighting lamp, the luminous flux of the LED lamp is improved, and the heat dissipation of the LED lamp is improved, so that the LED lighting lamp is one of the development directions of the LED lamp at present. Generally, the function of the package is to provide sufficient protection for the chip, so as to prevent the chip from being exposed to air for a long time or from being damaged by mechanical damage to cause failure, thereby improving the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED.

The lens of the existing LED lamp mostly uses PC or PMMA material, and the refractive index of the lens is higher than that of air. After light emitted by the chip reaches the lens through air, a certain proportion of total reflection loss exists, so that the luminous flux is reduced. The color temperature that leaves factory of current chip indicates the color temperature that detects out when the chip exposes in the air, and filling glue is in the curing process after changing the medium, because it is inhomogeneous to be heated, causes partly glue earlier solidification, just so causes the phosphor powder of mixing in gluing to sink and the dispersion is inhomogeneous easily, causes the inconsistent and causes dispersion phenomenon of light refraction law, has caused the color temperature drift. Therefore, the existing LED has the defects of unsatisfactory lighting effect and low heat dissipation capability.

Disclosure of Invention

In view of the above disadvantages of the prior art, an object of the present invention is to provide a light source module and a lamp for improving color temperature drift of the lamp caused by filling high-transmittance silicone rubber (filling high-transmittance silicone rubber can improve light efficiency, but can cause color temperature drift of a part of chips) in the prior art; if the air layer can be replaced by an optical material with the refractive index close to that of the lens, the reflection loss can be obviously reduced, the luminous flux of the LED lamp is improved (the heat loss is reduced), the lighting effect of the lamp is further improved, the heat dissipation of a chip is improved, and the service life of the chip in the LED lamp is prolonged.

To achieve the above and other related objects, the present invention provides an LED light source module, comprising: the LED lamp comprises a substrate, LED chips arranged on the substrate and lenses covering the LED chips; the LED chip is covered with packaging glue containing fluorescent powder; and transparent lens filling glue is arranged between the lens and the LED chip.

In an embodiment of the invention, the shape of the encapsulation adhesive is a convex spherical crown shape or a convex elliptical crown shape.

In an embodiment of the invention, the LED chip is a blue chip.

In an embodiment of the invention, an absorption spectrum of the phosphor contained in the encapsulant matches an emission spectrum of the LED chip.

In an embodiment of the invention, the encapsulant compounded with the phosphor in the encapsulant is epoxy glue or organic silica gel with a transmittance of 95%.

In an embodiment of the present invention, the inner side and the outer side of the lens respectively have an incident surface and an exit surface; the surfaces of the entrance and exit faces are at least partially frosted.

In an embodiment of the invention, the lens filling adhesive is an epoxy adhesive or an organic gel having a transmittance of 95%.

In an embodiment of the invention, the refractive index of the lens filling glue is similar to or the same as the refractive index of the lens.

In an embodiment of the invention, the refractive index of the lens filling adhesive is 1.49 or 1.56.

In order to achieve the above and other related objects, the present invention provides an LED lamp including the LED light source module.

As described above, the LED light source module and the lamp of the present invention have the following advantages: the LED lamp with the high-transmittance organic silica gel structure solves the problem that the color temperature of a part of chips can drift due to the fact that the high-transmittance organic silica gel is filled for improving the lighting effect, the problem of color temperature drift of a lamp is solved, the lighting effect of the lamp is further improved by improving the LED light source module and the lamp, the heat dissipation of the chips is improved, and the service life of the chips in the LED lamp is prolonged.

Drawings

Fig. 1 is a schematic structural diagram of an LED light source module according to the present invention.

Fig. 2 is a schematic structural diagram of an LED light source module according to the present invention.

Fig. 3 is a schematic structural diagram of an LED light source module using an aluminum substrate according to the present invention.

Description of the element reference numerals

1 LED light source module

11 substrate

12 chips

13 packaging adhesive

14 lens

15 lens filling glue

2 applied LED light source module

21 ceramic heat sink

225050 chip

23 packaging adhesive

24 PC lens

25 low-folding silicone gel

3 LED light source module using aluminum substrate

31 aluminum substrate

323030 chip

33 packaging adhesive

34 PMMA lens

35 Low-folding silicone gel

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.

It is noted that in the following description, reference is made to the accompanying drawings which illustrate several embodiments of the present application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "over," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

As shown in fig. 1, the present patent application provides a lifting LED light source module 1, the light source module 1 includes: the LED lamp comprises a substrate 11, LED chips 12 arranged on the substrate 11, and lenses 13 covering the LED chips 12; wherein, the LED chip 12 covers the packaging adhesive 14 containing fluorescent powder; and transparent lens filling glue 15 is arranged between the lens 13 and the LED chip 12.

In one embodiment, after the LED is packaged, the package adhesive 14 has a convex spherical crown shape or a convex elliptical crown shape.

The packaging adhesive 14 is in a convex spherical crown shape or a convex elliptical crown shape and is used for protecting the LED chip 12 and the like from being corroded by the outside; the convex spherical crown or the convex elliptical crown is adopted to play the function of a lens or a diffusion lens, the divergence angle of light is controlled, and the visual angle is increased. Since the light is dispersed very little, its light range is further and distinct. The shape of the packaging adhesive 14 of the light source module 1 is a convex spherical crown or a convex elliptical crown, and the lens 13, the LED chip 12, the packaging adhesive 14 and the lens filling adhesive 15 do not have structural interference.

In one embodiment, the LED chip 12 is the core component of the LED lamp, i.e., the P-N junction. The main functions are as follows: the electric energy is converted into light energy, and the main material of the chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When a current is applied to the wafer through the wire, electrons are pushed into the P-region where they recombine with holes and then emit energy in the form of photons. The wavelength of the light, i.e., the color of the light, is determined by the material forming the P-N junction. In the invention, the blue light wafer is adopted, the LED can emit light, but the wavelength is shorter, the longest is blue light, namely, the blue light LED can be realized by emitting blue light by the blue light wafer. The blue light emitting chip is coated with fluorescent powder capable of absorbing blue light and emitting yellow light, and then the fluorescent powder is combined to emit white light. The commonly used blue chip chips are: a lumen 5050 chip, a 3030 chip, a 757 chip and the like.

In an embodiment, after the encapsulation adhesive 14, which is obtained by re-configuring the LED phosphor, is used as a medium, due to the problem of multiple fluorescence, the color temperature drift is caused by the change of the color light ratio of different colors, and the color temperature and the color rendering index need to be adjusted by using the phosphor. The LED fluorescent powder with the absorption spectrum matched with the emission spectrum of the wafer can be used for preparing LEDs with other wave bands by utilizing the advantage of high luminous efficiency of certain wave band LEDs so as to improve the luminous efficiency of the wave bands. The emission wavelength of the LED is difficult to control accurately, so that some wavelengths of the LED cannot be used and are wasted, and the so-called "waste" can be converted into the required color by using the fluorescent powder and utilized. Useful LED phosphors include chlorate phosphor (yellow emission color), silicate phosphor (green and orange emission color), nitrogen/oxide phosphor (red and green emission color), tungstate phosphor (red emission color), and the like. The blue light LED chip and the yellow fluorescent powder are adopted, white light is obtained by the complementation of blue light and yellow light, or the blue light LED chip is matched with the red fluorescent powder and the green fluorescent powder, and the blue light emitted by the chip, the red light emitted by the fluorescent powder and the green light are mixed to obtain the white light.

In one embodiment, the packaging adhesive 14 is used to package the LED chip 12 to provide sufficient protection to the LED chip 12, so as to prevent the LED chip 12 from being damaged by air or mechanical damage, thereby improving the stability of the LED chip 12; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging materials can make LEDs have better luminous efficiency and heat dissipation environment, thereby improving the life of LEDs. The packaging colloid is epoxy glue or organic silica gel with the transmittance of 95 percent, and an epoxy resin system after the epoxy glue is cured has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of the cured epoxy system, chemical stability is also dependent on the resin and curing agent selected. The epoxy resin and the curing agent are appropriately selected to have a specific chemical stability. The organic silica gel has good temperature resistance, weather resistance and good electrical insulation performance. The size of the packaging adhesive can be selected according to actual requirements; for example, 2mm, 3mm, or 4mm in diameter, etc.

In one embodiment, the lens 13 covering each of the LED chips 12 has an incident surface and an exit surface. A scattering agent may be added, and light enters through the entrance surface of the lens 13 and exits through the exit surface of the lens 13. The lens is applied to LED structures, and PMMA lenses and PC lenses are mostly selected according to materials. The PMMA lens is made of (polymethyl methacrylate, commonly known as acrylic) plastic material, has the advantages of high production efficiency (can be completed by injection molding and extrusion molding), high light transmittance (the transmittance is about 93 percent when the thickness is 3 mm), but the temperature cannot exceed 80 degrees (the thermal deformation temperature is 92 degrees). The PC lens is made of polycarbonate plastic materials, has high production efficiency (can be completed by injection molding and extrusion molding), has slightly low light transmittance (about 89% of transmittance at the thickness of 3 mm), and has the temperature of not more than 110 degrees (135 degrees of heat distortion temperature). Silicone lenses as well as glass lenses may also be used.

The lens 13 is fixed on the substrate 11 and covers the LED chip 12 and the packaging adhesive 14 to form a whole with the LED, the LED chip theoretically emits light of 360 degrees, but actually, after the chip is packaged, the maximum light-emitting angle is 180 degrees (a small amount of residual light exists in a range larger than 180 degrees), in addition, the chip also has some stray light, so that all light of the chip can be effectively converged through the lens, different light-emitting angles such as 180 degrees, 160 degrees, 140 degrees, 120 degrees, 90 degrees and 60 degrees can be obtained, however, the light-emitting efficiency of the LED with different light-emitting angles has certain difference, and according to different actual requirements, the difference of light-emitting degree and light intensity can achieve the desired light-emitting effect by performing frosting treatment on the incident surface and the emergent surface of the lens. Compared with the same frosting treatment of the existing LED light source module of the same type, the light emitting efficiency of the LED light source module is obviously better.

In one embodiment, the lens filling adhesive 15 is disposed between the incident surface of the lens 13 and the chip 12; the lens filling adhesive 15 can be suitable for filling and packaging the lens of the high-power LED, has high light transmittance and certain elasticity, and can form an interlayer with uniform thickness with the lens after packaging. The heat conductivity coefficient of air is about 0.02W/m.K, the heat conductivity coefficient of common transparent silica gel is about 0.2W/m.K, and the heat resistance can be reduced and the heat dissipation can be increased by replacing organic silica gel with an air layer between the chip and the lens. The difference between the refractive index of the chip and the refractive index of air is too large, so that the critical angle of total reflection in the chip is very small, only a small part of light generated by the active layer is taken out, most of the light is easy to be absorbed in the chip through multiple reflections, the total reflection is easy to generate to cause excessive light loss, and the filling adhesive with the corresponding refractive index is selected for transition, so that the light emergence efficiency of the chip is improved. The filling adhesive 15 used in the invention is epoxy adhesive or organic gel with the transmittance of 95%, and an epoxy resin system obtained after the epoxy adhesive is cured has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of the cured epoxy system, chemical stability is also dependent on the resin and curing agent selected. The epoxy resin and the curing agent are appropriately selected to have a specific chemical stability. Or the organic silicon gel is soft and transparent after being vulcanized, can keep elasticity for a long time at the temperature of-65-200 ℃, and has excellent electrical property, chemical stability and physiological inertia. The size of the lens filling glue can be selected according to actual requirements; for example, 2mm, 3mm, or 4mm in diameter, etc.

In one embodiment, the lens filling adhesive 15 is suitable for lens filling packaging of a high-power LED, has high light transmittance and certain elasticity, and can form a spacer layer with a uniform thickness with the lens after packaging. The optical material with the refractive index close to or the same as that of the lens is selected as the filling glue, so that the reflection loss can be obviously reduced, and the luminous flux of the LED lamp is improved (the heat loss is reduced).

In an embodiment, the lens 13 in the light source module 1 is made of PC or PMMA material, and the refractive index thereof is 1.56, 1.49, respectively, and the refractive index of the lens filling glue is 1.49 or 1.56.

The light source module 1 is specifically exemplified as an embodiment in practical application.

For example, according to the LED light source module 2 shown in fig. 2, a ceramic heat sink 21, 4000K color temperature 5050LED chips 22 disposed on the ceramic heat sink 21, and a PC lens 23 covering each LED chip 22; wherein, the LED chip 22 covers the low-refractive-index organic silicon packaging adhesive 24 containing fluorescent powder with central wavelength of 620nm and 552 nm; a transparent low-refractive silicone gel 25 is arranged between the lens 23 and the LED chip 22. According to the embodiment of the invention, the purposes of improving the lighting effect and increasing the heat dissipation are achieved.

For example, an LED light source module 3 using an aluminum substrate is described with reference to fig. 3, the aluminum substrate 31, the 4000K color temperature 3030LED chips 32 disposed on the aluminum substrate 31, and the PMMA lens 33 covering each LED chip 32; wherein, the LED chip 32 covers the low-refractive-index organic silicon packaging adhesive 34 containing fluorescent powder with central wavelength of 620nm and 552 nm; a transparent low-refractive silicone gel 35 is arranged between the lens 33 and the LED chip 22. According to the embodiment of the invention, the purposes of improving the lighting effect and increasing the heat dissipation are achieved.

The light source module can be practically applied by the above embodiment, and the correlated color temperature and the display index of the chip can be increased or not changed.

In an embodiment of the invention, the invention can also provide an LED lamp, according to which the package of the LED light source module is improved.

The lamp is an appliance capable of transmitting light, distributing and changing the light distribution of the LED light source, comprises all parts and components which are required for fixing and protecting the LED light source except the LED light source, and line accessories which are required for connecting with a power supply, and comprises the LED lamp which is used for a display screen and a traffic signal display light source, and the lamp which is applied to the automobile industry and comprises an instrument panel in the automobile, an audio indicator lamp, a backlight source of a switch, a reading lamp, a brake lamp, a tail lamp, a side lamp, a head lamp and the like in the automobile, and is applied to aspects of electronic watches, mobile phones, BP machines, electronic calculators, card readers, traditional lighting lamp replacement and the like.

Experiments prove that the LED lamp can improve the heat dissipation of the chip, reduce the temperature near the chip by 5-10 ℃, improve the lighting effect of the lamp by 4-12% and increase the light-emitting angle by 10-25%.

In summary, the package-enhanced LED light source module and the lamp of the present invention include: the LED lamp comprises a substrate, LED chips arranged on the substrate and lenses covering the LED chips; the LED chip is covered with packaging glue containing fluorescent powder; and transparent lens filling glue is arranged between the lens and the LED chip. The structure solves the problem of lamp color temperature drift caused by filling high-transmittance organic silica gel (the filling of the high-transmittance organic silica gel can improve the lighting effect, but can cause the color temperature drift of partial chips); further improve lamps and lanterns light efficiency, improve the chip heat dissipation, prolong chip working life in the LED lamps and lanterns. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. An LED light source module, comprising:

the LED lamp comprises a substrate, LED chips arranged on the substrate and lenses covering the LED chips;

the LED chip is covered with packaging glue containing fluorescent powder; and transparent lens filling glue is arranged between the lens and the LED chip.

2. The LED light source module of claim 1, wherein the encapsulant has a convex spherical crown shape or a convex elliptical crown shape.

3. The elevated LED light source module of claim 1, wherein the LED chip is a blue wafer.

4. The LED light source module of claim 1 or 3, wherein an absorption spectrum of the phosphor contained in the encapsulant matches an emission spectrum of the LED chip.

5. The LED light source module of claim 1, wherein the encapsulant compound with the phosphor contained in the encapsulant is an epoxy or silicone with a transmittance of 95%.

6. The elevated LED light source module of claim 1 wherein the lens inner and outer sides have an entrance face and an exit face, respectively; the surfaces of the entrance and exit faces are at least partially frosted.

7. The elevated LED light source module of claim 1, wherein the lens fill adhesive is an epoxy or organogel having a transmittance of 95%.

8. A boosted LED light source module as set forth in claim 1, wherein the refractive index of the lens fill gel is similar or identical to the refractive index of the lens.

9. The elevated LED light source module of claim 7, wherein the lens fill gel has a refractive index of 1.49 or 1.56.

10. LED luminaire comprising an LED light source module according to claims 1-9.