CN111278248B - Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method - Google Patents

Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method Download PDF

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Publication number
CN111278248B
CN111278248B CN202010069387.1A CN202010069387A CN111278248B CN 111278248 B CN111278248 B CN 111278248B CN 202010069387 A CN202010069387 A CN 202010069387A CN 111278248 B CN111278248 B CN 111278248B
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plastic
edge
plate
board
mold
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CN111278248A (en
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张春笋
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Hefei Shanxiu Carbon Fiber Technology Co ltd
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Hefei Shanxiu Carbon Fiber Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The embodiment of the invention provides a plastic edge-covered plate for electronic equipment and a secondary plastic molding method, wherein the plastic edge-covered plate is used for manufacturing a shell of an electronic device, the plastic edge-covered plate comprises a plate body, M first plastic bodies and a second plastic body, the M first plastic bodies are arranged on the edge of the upper surface of the plate body, each first plastic body comprises a first surface, a second surface, a third surface, a first edge and a second edge, and N grooves are formed in the second surface; the second plastic body wraps the third surface, the first edge and the second edge, fills the groove and is connected with the side edge of the plate body; wherein M is a positive integer, and N is 0 or a positive integer. The technical problems that plastic is wrapped at the edge of a plate in an one-step forming mode in the prior art, the shrinkage is large after the plastic is formed, and the plate is prone to deformation are solved, and the technical effects that the plastic is wrapped at the edge of the plate in a secondary forming mode, and the deformation degree of the plate is reduced are achieved.

Description

Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method
Technical Field
The invention relates to the technical field of electronic equipment shells, in particular to a plastic edge-wrapped plate for electronic equipment and a secondary plastic molding method.
Background
At present, the shell of the electronic equipment is usually assembled by a plurality of formed plates, the plastic material is arranged on the edge of the plate in an in-mold forming mode, the edge of the plate is completely wrapped, the sealing performance of the shell can be improved, the vibration between the plates on the shell can be reduced, and the noise of the shell is reduced.
However, the present inventors have found that the above prior art has at least the following technical problems:
the plastic material is directly wrapped on the edge of the plate in a mode of one-step molding in the mold, the shrinkage of the plastic material is large after molding, the plate is deformed, the appearance of the plate is uneven, and the appearance of the shell is affected.
Disclosure of Invention
The invention provides a plastic-covered plate for electronic equipment and a secondary plastic forming method, which solve the technical problems that in the prior art, plastic is wrapped at the edge of the plate in a one-step forming mode, the shrinkage is large after plastic forming, and the plate is easy to deform, and achieve the technical effects of wrapping the plastic at the edge of the plate in a secondary forming mode and reducing the deformation degree of the plate.
In order to solve the above problem, in one aspect, an embodiment of the present invention provides a plastic edge-wrapped board for an electronic device, for manufacturing a housing of an electronic device, where the plastic edge-wrapped board includes: a plate body; m first plastic bodies, M first plastic body sets up the edge of this body upper surface of board, first plastic body includes: a first surface connected with an upper surface of the plate body; a second surface that is not adjacent to the first surface; a third surface adjacent to the first surface, the second surface; a first edge, the first edge being an interface of the first surface and the third surface; a second edge, the second edge being an interface of the second surface and the third surface; n grooves disposed on the second surface; the second plastic body wraps the third surface, the first edge and the second edge, fills the groove and is connected with the side edge of the plate body; wherein M is a positive integer, and N is 0 or a positive integer.
Preferably, when M is larger than or equal to 2, a first interval is arranged between every two adjacent first plastic bodies, and the second plastic bodies are filled with a plurality of first intervals.
Preferably, the first surface and the upper surface of the plate body are attached together to form an overlapping part, the width of the overlapping part is K, and the width of the first surface is P; wherein K is more than or equal to 0.5P and less than or equal to P.
Preferably, the plate body is made of one of a composite material, a metal material and a plastic material.
Preferably, the composite material is one or more of carbon fiber, glass fiber and Kevlar fiber.
Preferably, the first plastic body and the second plastic body are made of one of PC + ABS, PC + 10% -60% of glass fiber, PA + 10% -60% of glass fiber and PPS + 10% -60% of glass fiber.
Preferably, the first plastic body further comprises: a fourth surface adjacent to the second surface; the lower surface of the boss is attached to the upper surface of the plate body, wherein the boss is flush with the first surface and connected with the fourth surface.
Preferably, the height of the boss is H1The height of the first plastic body is H2，0.25H2≤H1≤0.5H2Wherein H is2、H1Is a positive number.
On the other hand, the embodiment of the invention provides a secondary plastic molding method for manufacturing the plastic edge-covered plate, and the secondary plastic molding method comprises the following steps:
placing the plate body in a first mold;
pouring a first plastic material into the first mold to form the first plastic body;
removing the first mold after the first plastic material is solidified;
placing the board body comprising the first plastic body in a second mold;
pouring a second plastic material into the second mold to form a second plastic body;
and removing the second mold after the second plastic material is solidified.
Preferably: the inner shape of the first mold is matched with the outer shape of the first plastic body;
the inner shape of the second mold is matched with the outer shape of the second plastic body.
One or more technical solutions in the embodiments of the present invention at least have one or more of the following technical effects:
the embodiment of the invention provides a plastic edge-covered plate for electronic equipment, which is used for manufacturing a shell of an electronic device, and comprises the following components: the plastic injection molding plate comprises a plate body, a first plastic body and a second plastic body, wherein the edge of the upper surface of the plate body is arranged in a plastic injection molding mode, the first plastic body is arranged, the existence of the first plastic body enhances the structural strength of the edge of the plate body, the structural strength of the edge of the plate body is improved, the edge of the plate body resists the capability of the deformation of the plate body caused by the shrinkage after the plastic material is molded, and the deformation of the plate body caused by the molding shrinkage of the second plastic body is reduced. Set up with plastic injection moulding's mode the second plastic body, the second plastic body parcel the third surface the first edge the second edge fills the recess, and with the side of board body is connected, reaches and will the first plastic body the second plastic body the technical effect that the board body combines together. Wherein the second surface of the first plastic body is provided with a plurality of grooves, so that the combination area of the second plastic body and the first plastic body is increased, and the technical effect of firmly fixing the second plastic body and the first plastic body together is achieved. Need be in when the edge parcel frame of certain thickness of board body, under the same circumstances of plastic material use amount, the quantity of the second plastic body is less than when once moulding plastics, has further reduced the shrinkage behind the plastic material shaping, has further reduced the deflection at board body edge has improved the outward appearance of plastic board of borduring.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Fig. 1 is a schematic structural view of a plastic-covered board for an electronic device according to an embodiment of the present invention;
fig. 2 is another structural schematic view of the plastic covered panel for electronic devices shown in fig. 1.
Description of reference numerals: a plate body 1; a first plastic body 2; a second plastic body 3; a first surface 4; a second surface 5; a third surface 6; a groove 7; a boss 8; a first edge 9; a second edge 10; a fourth surface 11.
Detailed Description
The embodiment of the invention provides a plastic edge-wrapped plate for electronic equipment and a secondary plastic forming method, solves the technical problems that in the prior art, plastic is wrapped at the edge of the plate in a one-step forming mode, the shrinkage is large after the plastic is formed, and the plate is easy to deform, and achieves the technical effects that the plastic is wrapped at the edge of the plate in a secondary forming mode, and the deformation degree of the plate is reduced.
The technical scheme in the embodiment of the invention has the following overall structure:
a plastic board of borduring for electronic equipment for make electron device's casing, plastic board of borduring includes: a plate body; m first plastic bodies, M first plastic body sets up the edge of this body upper surface of board, first plastic body includes: a first surface connected with an upper surface of the plate body; a second surface that is not adjacent to the first surface; a third surface adjacent to the first surface, the second surface; a first edge, the first edge being an interface of the first surface and the third surface; a second edge, the second edge being an interface of the second surface and the third surface; n grooves disposed on the second surface; the second plastic body wraps the third surface, the first edge and the second edge, fills the groove and is connected with the side edge of the plate body; wherein M is a positive integer, and N is 0 or a positive integer. Through the plastic board of borduring for electronic equipment of the aforesaid, solved among the prior art and wrapped up the plastic at the panel edge with one shot forming mode among the prior art, the plastic shaping back shrinkage is big, easily arouses the technical problem that panel warp, has reached and has wrapped up the plastic at the panel edge with secondary forming's mode, reduces the technical effect of panel deformation degree.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The embodiment of the present invention provides a plastic covered edge plate for electronic equipment, please refer to fig. 1-2, for manufacturing a housing of an electronic device, the plate includes:
a plate body 1;
specifically, the board body 1 is a plate having a certain shape and a certain shape, and a plurality of the board bodies 1 are assembled together to form a housing in which electronic equipment is disposed.
The M first plastic bodies 2 are arranged on the edge of the upper surface of the plate body 1;
further, when M is larger than or equal to 2, a first interval is arranged between every two adjacent first plastic bodies 2, and the second plastic bodies 3 are filled with the first intervals.
Specifically, M first plastic body 2 sets up through injection molding process the edge of 1 upper surface of board body, M first plastic body 2 with board body 1 combines together, every first plastic body 2 is the integrated into one piece structure. When M is 1, the first plastic body 2 is integrally disposed on the edge of the upper surface of the plate body 1. When M is larger than or equal to 2, the M first plastic bodies 2 are uniformly arranged on the edge of the upper surface of the plate body 1, and a first interval is arranged between every two adjacent first plastic bodies 2, so that the technical effects of reducing the using amount of plastic materials and reducing the influence of the shrinkage of the plastic materials on the edge of the plate body 1 are achieved. The first plastic body 2 is arranged on the edge of the upper surface of the plate body 1, so that the structural strength of the edge of the plate body 1 can be enhanced.
The first plastic body 2 includes:
a first surface 4, the first surface 4 being connected with an upper surface of the board body 1;
a second surface 5, said second surface 5 not being adjacent to said first surface 4;
a third surface 6, said third surface 6 being adjacent to said first surface 4, said second surface 5;
n grooves 7, N of said grooves 7 being provided on said second surface 5;
a first edge 9, said first edge 9 being the boundary line of said first surface 4 and said third surface 6;
a second edge 10, said second edge 10 being the intersection of said second surface 5 and said third surface 6;
wherein M is a positive integer, and N is 0 or a positive integer.
Specifically, the boundary line between the first surface 4 and the third surface 6 is the first edge 9, and the boundary line between the third surface 6 and the second surface 5 is the second edge 10. The first plastic body 2 is combined with the upper surface of the plate body 1 through the first surface 4. The second surface 5 is uniformly provided with N grooves 7, and the depth of each groove 7 is smaller than the height of the first plastic body 2, namely, the grooves 7 do not penetrate through the first plastic body 2. The arrangement of the groove 7 increases the combination area of the second plastic body 3 and the first plastic body 2, so that the technical effect that the second plastic body 3 and the first plastic body 2 are firmly combined together is achieved.
The groove 7 may not be formed in the first plastic body 2, and in this case, N is 0. The specific value of N may be determined by the actual needs, and the application is not limited herein.
And the second plastic body 3 wraps the third surface 6, the first edge 9 and the second edge 10, fills the groove 7 and is connected with the side edge of the plate body 1.
Specifically, the second plastic body 3 is an integrally formed structure and is combined with the first plastic body 2 and the side edge of the plate body 1 together through an injection molding process. The second plastic body 3 wraps the third surface 6, the first edge 9 and the second edge 10, fills the groove 7, and is connected with the side edge of the plate body 1, so that the technical effect that the first plastic body 2 and the plate body 1 are combined together is achieved.
Need be in during the frame of certain thickness of edge parcel of board body 1, divide the plastic material twice to mould plastics on the edge of board body 1, the formation of moulding plastics for the first time first plastic body 2, the formation of moulding plastics for the second time second plastic body 2, the existence of first plastic body 2 has strengthened the structural strength at 1 edge of board body has improved 1 edge of board body resists that the shrink arouses after the plastic material shaping the ability of the deformation of board body 1 reduces the shrink arouses behind the 3 shaping of second plastic body the deformation degree at 1 edge of board body has improved the outward appearance of board of borduring. Under the condition that the usage amount of the plastic materials is the same, the usage amount of the second plastic body 3 is less than that of the second plastic body in one-time injection molding, and the shrinkage after the plastic materials are molded is further reduced.
Further, the first surface 4 is attached to the upper surface of the plate body 1 to form an overlapping portion, the width of the overlapping portion is K, and the width of the first surface is P; wherein K is more than or equal to 0.5P and less than or equal to P.
Specifically, the width of the overlapping portion is at least half of the width of the first surface 4, so as to increase the contact area between the first surface and the upper surface of the plate body 1, and firmly fix the first plastic body 2 and the upper surface of the plate body 1 together
Further, the first plastic body 2 further includes: a fourth surface 11, said fourth surface 11 being adjacent to said second surface 5;
a boss 8, the lower surface of boss 8 with the upper surface laminating of plate body 1 is in the same place, wherein boss 8 with first surface 4 parallel and level, with fourth surface 11 is connected.
Specifically, the boss 8 is an extension of the first surface 4 and is a part of the first plastic body 2, that is, the boss 8 and the first plastic body 2 are an integral structure. The lower surface of the boss 8 is flush with the first surface 4 and is attached to the upper surface of the plate body 1. The height of boss 8 is less than the height of first plastic body 2, the existence of boss 8 has reached and has increased first plastic body 2 with the area of contact of board body 1 upper surface, thereby reach with first plastic body 2 with the technical effect that board body 1 firm solid is in the same place.
Further, the convexThe height of the table 8 is H1The height of the first plastic body 2 is H2，0.25H2≤H1≤0.5H2Wherein H is2、H1Is a positive number.
Specifically, the height more than or equal to of boss 8 the fourth of first plastic body 2 height, less than or equal to the half of first plastic body 2 height reaches the increase first plastic body 2 with when 1 upper surface area of contact reduces the use amount of plastic material, thereby reach with first plastic body 2 with when 1 firm is in the same place, reduce the use amount of plastic material, reduce the technological effect of the shrink volume after the plastic material shaping.
Further, the plate body 1 further includes: the Q mounting holes are formed in the edge of the body 1, and the first plastic body 2 or the second plastic body 3 wraps the plurality of mounting holes; wherein Q is a positive integer.
Specifically, the mounting hole is the through-hole, runs through the upper and lower surface of board body 1, and the connecting piece passes through Q the mounting hole is with two or the polylith the board of borduring is fixed together. First plastic body 2 or 3 parcel of second plastic body are a plurality of the mounting hole reaches completely cut off the connecting piece with board body 1 avoids the connecting piece directly with the technical effect that board body 1 bumps.
Further, the plate body 1 is made of one of a composite material, a metal material and a plastic material.
Further, the composite material is one or more of carbon fiber, glass fiber and Kevlar fiber.
Specifically, the plate body 1 has a wide material selection range, almost all materials of the electronic device shell are covered, and the technical scheme has strong applicability.
Furthermore, the first plastic body 2 and the second plastic body 3 are made of one of PC + ABS, PC + 10% -60% glass fiber, PA + 10% -60% glass fiber, and PPS + 10% -60% glass fiber.
Specifically, the first plastic body 2 and the second plastic body 3 may be made of one of, but not limited to, PC + ABS, PC + 10% -60% glass fiber, PA + 10% -60% glass fiber, and PPS + 10% -60% glass fiber. The first plastic body 2 the material of the second plastic body 3 can be the same, also can be different, first plastic body 2 the material of the second plastic body 3 is the same, and the user can select according to actual need, and this application does not do specific restriction once more.
Through the plastic board of borduring for electronic equipment in this embodiment, solved among the prior art at panel edge with the one shot forming mode parcel plastic, the shrinkage is big after the plastic shaping, easily arouses the technical problem that panel warp, has reached and has wrapped up the plastic at panel edge with the mode of post forming, reduces the technical effect of panel deformation degree.
Example two
The application also provides a secondary plastic molding method for manufacturing the plastic edge-wrapped plate, please refer to fig. 1-2, the secondary plastic molding method comprises:
step 1: placing the plate body 1 in a first mould;
step 2: pouring a first plastic material into the first mold to form the first plastic body 2;
and step 3: removing the first mold after the first plastic material is solidified;
and 4, step 4: placing the board body 1 including the first plastic body 2 in a second mold;
and 5: pouring a second plastic material into the second mold to form the second plastic body 3;
step 6: and removing the second mold after the second plastic material is solidified.
Specifically, the first plastic material and the second plastic material may be one of PC + ABS, PC + 10% -60% glass fiber, PA + 10% -60% glass fiber, and PPS + 10% -60% glass fiber, but are not limited to the above materials. The first plastic material and the second plastic material may be the same or different, and whether the first plastic material and the second plastic material are the same or not may be selected by a user according to actual needs.
Further, the inner shape of the first mold is matched with the outer shape of the first plastic body 2; the inner shape of the second mold is matched with the outer shape of the second plastic body 3.
Specifically, the inner shape of the first mold matches the outer shape of the first plastic body 2, a first plastic material is poured into the first mold, and the first plastic body 2 is formed on the edge of the upper surface of the plate body 1. The inner shape of the second mold is matched with the outer shape of the second plastic body 3, and a second plastic material is poured into the second mold to form the second plastic body 3.
By the secondary plastic molding method in the embodiment, the technical problems that in the prior art, plastic wraps the edges of the plates in a one-step molding mode, shrinkage is large after plastic molding, and the plates are prone to deformation are solved, and the technical effects that the plastic wraps the edges of the plates in a secondary molding mode and the deformation degree of the plates is reduced are achieved.
One or more technical solutions in the embodiments of the present invention at least have one or more of the following technical effects:
the embodiment of the invention provides a plastic edge-covered plate for electronic equipment, which is used for manufacturing a shell of an electronic device, and comprises the following components: the plastic injection molding plate comprises a plate body, a first plastic body and a second plastic body, wherein the edge of the upper surface of the plate body is arranged in a plastic injection molding mode, the first plastic body is arranged in the existence of the first plastic body 2, the structural strength of the edge of the plate body 1 is enhanced, the capability of resisting the plastic material at the edge of the plate body to be deformed after the plastic material is molded and causing the shrinkage of the edge of the plate body is improved, and the deformation of the plate body caused by the molding shrinkage of the second plastic body is reduced. Set up with plastic injection moulding's mode the second plastic body, the second plastic body parcel the third surface the first edge the second edge fills the recess, and with the side of board body is connected, reaches and will the first plastic body the second plastic body the technical effect that the board body combines together. Wherein the second surface of the first plastic body is provided with a plurality of grooves, so that the combination area of the second plastic body and the first plastic body is increased, and the technical effect of firmly fixing the second plastic body and the first plastic body together is achieved. Need be in when the edge parcel frame of certain thickness of board body, under the same circumstances of plastic material use amount, the quantity of the second plastic body is less than when once moulding plastics, has further reduced the shrinkage behind the plastic material shaping, has further reduced the deflection at board body edge has improved the outward appearance of plastic board of borduring.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.

Claims (6)

1. The utility model provides a plastic board of borduring for electronic equipment for make electron device's casing, its characterized in that, plastic board of borduring includes:
a plate body;
m first plastic bodies, M first plastic body sets up the edge of this body upper surface of board, first plastic body includes:
a first surface connected with an upper surface of the plate body;
a second surface that is not adjacent to the first surface;
a third surface adjacent to the first surface, the second surface;
a first edge, the first edge being an interface of the first surface and the third surface;
a second edge, the second edge being an interface of the second surface and the third surface;
n grooves disposed on the second surface;
the second plastic body wraps the third surface, the first edge and the second edge, fills the groove and is connected with the side edge of the plate body;
wherein M is a positive integer, and N is 0 or a positive integer;
when M is larger than or equal to 2, a first interval is arranged between every two adjacent first plastic bodies, and the second plastic bodies are filled with a plurality of first intervals;
the first surface is attached to the upper surface of the plate body to form an overlapping part, the width of the overlapping part is K, and the width of the first surface is P;
wherein K is more than or equal to 0.5P and less than or equal to P;
the first plastic body further comprises:
a fourth surface adjacent to the second surface;
the lower surface of the boss is attached to the upper surface of the plate body, and the boss is flush with the first surface and connected with the fourth surface;
the height of the boss is H1The height of the first plastic body is H2，0.25H2≤H1≤0.5H2Wherein H is2、H1Is a positive number.
2. The plastic-covered board for electronic equipment as claimed in claim 1, wherein the board body is made of one of a composite material, a metal material and a plastic material.
3. The plastic-covered board for electronic equipment as claimed in claim 2, wherein the composite material is one or more of carbon fiber, glass fiber, Kevlar fiber.
4. The plastic-covered board for electronic equipment according to claim 1, wherein the first plastic body and the second plastic body are made of one of PC + ABS, PC + 10% -60% glass fiber, PA + 10% -60% glass fiber, and PPS + 10% -60% glass fiber.
5. A secondary plastic molding method for manufacturing the plastic-covered plate for electronic equipment of any one of claims 1 to 4, wherein the secondary plastic molding method comprises:
placing the plate body in a first mold;
pouring a first plastic material into the first mold to form the first plastic body;
removing the first mold after the first plastic material is solidified;
placing the board body comprising the first plastic body in a second mold;
pouring a second plastic material into the second mold to form a second plastic body;
and removing the second mold after the second plastic material is solidified.
6. The secondary plastic molding method of claim 5, wherein:
the inner shape of the first mold is matched with the outer shape of the first plastic body;
the inner shape of the second mold is matched with the outer shape of the second plastic body.
CN202010069387.1A 2020-01-21 2020-01-21 Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method Active CN111278248B (en)

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CN202010069387.1A CN111278248B (en) 2020-01-21 2020-01-21 Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method

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Application Number Priority Date Filing Date Title
CN202010069387.1A CN111278248B (en) 2020-01-21 2020-01-21 Plastic rubber edge-wrapped plate for electronic equipment and secondary plastic rubber molding method

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CN111278248B true CN111278248B (en) 2021-11-02

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068191A (en) * 2011-10-21 2013-04-24 深圳富泰宏精密工业有限公司 Electronic device housing case and manufacturing method thereof
CN104935692A (en) * 2015-06-01 2015-09-23 努比亚技术有限公司 Cellphone housing and cellphone

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212875A (en) * 2006-12-29 2008-07-02 鸿富锦精密工业（深圳）有限公司 Thermoplastic composite structure and producing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068191A (en) * 2011-10-21 2013-04-24 深圳富泰宏精密工业有限公司 Electronic device housing case and manufacturing method thereof
CN104935692A (en) * 2015-06-01 2015-09-23 努比亚技术有限公司 Cellphone housing and cellphone

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