CN111276591B - LED packaging structure and LED die bonding method - Google Patents
LED packaging structure and LED die bonding method Download PDFInfo
- Publication number
- CN111276591B CN111276591B CN202010099517.6A CN202010099517A CN111276591B CN 111276591 B CN111276591 B CN 111276591B CN 202010099517 A CN202010099517 A CN 202010099517A CN 111276591 B CN111276591 B CN 111276591B
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- pad
- chip
- polar plate
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 238000009417 prefabrication Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000004073 vulcanization Methods 0.000 abstract description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The application provides an LED packaging structure and an LED die bonding method; the LED packaging structure comprises a support, a vertical structure chip, a first conducting wire and a second conducting wire, wherein the support comprises a first polar plate, a second polar plate and a support, a first bonding pad and a second bonding pad are arranged on the first polar plate, and a third bonding pad is arranged on the second polar plate. The LED packaging structure and the LED die bonding method provided by the embodiment of the application have the advantages that the first bonding pads and the second bonding pads are arranged on the first polar plate at intervals, the first bonding pads and the second bonding pads are connected through the first conducting wires in a welding mode, the vertical structure chip is fixed on the first bonding pads, the vertical structure chip can be effectively prevented from being separated from the first polar plate under special environments (such as high temperature, high humidity or cold and hot environments), cold and hot impact resistance and vulcanization resistance of the LED packaging structure are effectively improved, the reliability of connection of the vertical structure chip and the first polar plate is guaranteed, and further the reliability of the LED packaging structure is effectively improved.
Description
Technical Field
The application belongs to the technical field of LEDs, and particularly relates to an LED packaging structure and an LED die bonding method.
Background
Light-Emitting diodes (LED for short). The LED has the advantages of high efficiency, energy conservation, environmental protection, long service life, small volume, easy maintenance and the like, and is widely concerned by researchers at home and abroad. At present, the LED is gradually replacing the traditional light source to become the mainstream of the lighting source, and the application fields thereof include the fields of commercial lighting, industrial lighting, outdoor lighting, indoor lighting, special lighting and the like. The vertical structure chip refers to a structure in which two electrodes of an LED chip are respectively located on the top surface and the bottom surface of the LED chip. In the current installation of a chip with a vertical structure, the chip is generally directly fixed on a polar plate of a bracket through a die attach adhesive, and a bottom electrode of the chip is connected with the polar plate; and the electrode on the top surface is connected with the other electrode plate of the bracket through a conducting wire. However, the LED package structure still has a problem of poor reliability under severe use conditions.
Disclosure of Invention
An object of the embodiments of the present application is to provide an LED package structure, so as to solve the problem that the reliability of the LED package structure in the prior art is still poor under harsh operating conditions.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: the first aspect provides an LED packaging structure, including support and vertical structure chip, the support includes first polar plate and the second polar plate and the support that just the interval set up side by side first polar plate with the support of second polar plate, the interval is equipped with first pad and second pad on the first polar plate, be equipped with the third pad on the second polar plate, LED packaging structure still includes first conductor wire and second conductor wire, the both ends of first conductor wire weld respectively in first pad with on the second pad, the vertical structure chip is fixed in first pad, the bottom surface electrode of vertical structure chip with first pad links to each other, the both ends of second conductor wire weld respectively in the top surface electrode of vertical structure chip with on the third pad.
In one embodiment, the LED package structure further includes a die attach adhesive layer coated on the first bonding pad, and the vertical structure chip is connected to the first bonding pad through the die attach adhesive layer.
In one embodiment, the die attach adhesive layer extends to cover the first conductive line.
In one embodiment, the die attach adhesive layer extends to cover the second bonding pad.
In one embodiment, the first conductive line is a gold line; or/and the second conductive wire is a gold wire.
In one embodiment, the first pad area is greater than or equal to the area of the bottom surface of the vertical structure chip.
In one embodiment, the first pad area is greater than or equal to the second pad area.
In a second aspect, an LED die bonding method is provided, which includes the following steps:
prefabrication: providing a support, wherein the support comprises a first polar plate and a second polar plate which are arranged side by side and at intervals, and a support for supporting the first polar plate and the second polar plate;
and (3) treating the polar plate: arranging a first bonding pad and a second bonding pad on the first polar plate, enabling the first bonding pad to be spaced from the second bonding pad, and arranging a third bonding pad on the second polar plate;
first welding: respectively welding two ends of a first conductive wire on the first pad and the second pad;
crystal solidification treatment: fixing a vertical structure chip on the first bonding pad;
and (3) second welding: and respectively welding two ends of a second conductive wire on the top surface electrode of the vertical structure chip and the third bonding pad.
In one embodiment, the method further comprises the following steps between the first welding step and the die bonding treatment step:
gluing: and coating die bond glue on the first bonding pad.
In one embodiment, in the gluing step, the die bond glue covers the first conductive line.
One or more technical solutions in the embodiments of the present application have at least one of the following technical effects:
the LED packaging structure and the LED die bonding method provided by the embodiment of the application have the advantages that the first bonding pads and the second bonding pads are arranged on the first polar plate at intervals, the first bonding pads and the second bonding pads are connected through the first conducting wires in a welding mode, the vertical structure chip is fixed on the first bonding pads, the vertical structure chip can be effectively prevented from being separated from the first polar plate under special environments (such as high temperature, high humidity or cold and hot environments), cold and hot impact resistance and vulcanization resistance of the LED packaging structure are effectively improved, the reliability of connection of the vertical structure chip and the first polar plate is guaranteed, and further the reliability of the LED packaging structure is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic front view of a first LED package structure provided in an embodiment of the present application;
fig. 2 is a schematic cross-sectional structure diagram of the LED package structure shown in fig. 1.
Fig. 3 is a schematic front view of a second LED package structure according to an embodiment of the present disclosure;
fig. 4 is a schematic cross-sectional structure diagram of the LED package structure shown in fig. 3.
Fig. 5 is a schematic cross-sectional structure diagram of a third LED package structure provided in this embodiment of the application.
Fig. 6 is a flowchart of a first LED die bonding method according to an embodiment of the present disclosure.
Fig. 7 is a flowchart of a second LED die bonding method according to an embodiment of the present application.
Fig. 8 is a flowchart of a third LED die bonding method according to an embodiment of the present application.
Wherein, in the drawings, the reference numerals are mainly as follows:
100-LED package structure; 10-a scaffold; 11-a first plate; 111-a first pad; 112-a second pad; 113-a die bond adhesive layer; 12-a second plate; 121-a third pad; 13-a support; 14-a support; 21-vertical structure chip; 22-packaging adhesive; 31-a first electrically conductive line; 32-second electrically conductive line.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present application, it is to be understood that the terms "top," "bottom," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings for convenience in describing the present application and simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1 and fig. 2, a description will now be given of an LED package structure 100 provided in the present application. The LED package structure 100 includes a support 10, a vertical structure chip 21, a first conductive line 31, and a second conductive line 32. The support 10 comprises a first plate 11, a second plate 12 and a support 13, the first plate 11 and the second plate 12 being arranged side by side and spaced apart so as to connect the two electrodes of the chip 21 in a vertical configuration. The first and second electrode plates 11 and 12 are supported by the support 13, and the first and second electrode plates 11 and 12 are fixed by the support 13. A first bonding pad 111 and a second bonding pad 112 are arranged on the first electrode plate 11 at intervals, a third bonding pad 121 is arranged on the second electrode plate 12, two ends of a first conductive wire 31 are respectively welded on the first bonding pad 111 and the second bonding pad 112, the vertical structure chip 21 is fixed on the first bonding pad 111, a bottom electrode of the vertical structure chip 21 is connected with the first bonding pad 111, and two ends of a second conductive wire 32 are respectively welded on a top electrode of the vertical structure chip 21 and the third bonding pad 121; thereby mounting the vertical structural chip 21 on the support 10 and electrically connecting the bottom surface electrode of the vertical structural chip 21 with the first plate 11 and the top surface electrode of the vertical structural chip 21 with the second plate 12. The first pad 111 and the second pad 112 are arranged on the first plate 11 at an interval, the first pad 111 and the second pad 112 are connected by welding through the first conductive wire 31, and the vertical structure chip 21 is mounted on the first pad 111 but not directly mounted on the first plate 11, so that the cold and heat impact resistance and the sulfuration resistance of the LED package structure 100 can be effectively improved, the LED package structure can better adapt to high-temperature, high-humidity or cold and heat environments, and the reliability of the connection between the vertical structure chip 21 and the first plate 11 is improved.
The LED package structure 100 of the embodiment of the present application, through set up first pad 111 and second pad 112 at the interval on first polar plate 11, and use first lead wire 31 welded connection first pad 111 and second pad 112, fix vertical structure chip 21 on first pad 111, can effectively avoid causing vertical structure chip 21 and first polar plate 11 to break away from under the special environment (such as high temperature, high humidity, or cold and hot environment), effectively promote the anti cold and hot impact and the resistant vulcanization ability of LED package structure 100, in order to guarantee the reliability that vertical structure chip 21 and first polar plate 11 are connected, and then effectively promote the reliability of LED package structure 100.
In one embodiment, the LED package structure 100 further includes a die attach adhesive layer 113 coated on the first bonding pads 111, and the vertical structure chip 21 is connected to the first bonding pads 111 through the die attach adhesive layer 113. The die bond layer 113 is arranged so that the vertical chip 21 can be better fixed on the first bonding pad 111, the vertical chip 21 can be more reliably mounted, and cold and hot shock resistance and vulcanization resistance are improved.
In one embodiment, the first conductive line 31 is a gold line to ensure a good conductive line. In some embodiments, the first conductive wire 31 may also be a silver wire or other well-conducting wire.
In one embodiment, second conductive line 32 is a gold line to ensure a good conductive line. In some embodiments, second conductive wire 32 may also be a silver wire or other well conducting wire.
In one embodiment, the area of the first bonding pad 111 is greater than or equal to the area of the bottom surface of the vertical chip 21, so as to better support the vertical chip 21 and ensure good mounting and fixing of the vertical chip 21.
In one embodiment, the area of the first pad 111 is greater than or equal to the area of the second pad 112 to reduce the area of the first pad 111 and the second pad 112 occupied on the first plate 11.
In one embodiment, the support 13 is further provided with a lamp cup 14, and the vertical structure chip 21 is placed in the lamp cup 14. The lamp cup 14 is provided to perform a dimming function and protect the vertical structure chip 21.
In one embodiment, the support 13 and the lamp cup 14 may be integrally formed to ensure the structural strength of the bracket 10.
In one embodiment, the first electrode plate 11 and the second electrode plate 12 may be integrally injection-molded with the support 13 to ensure the connection strength of the support 13 with the first electrode plate 11 and the second electrode plate 12.
In one embodiment, the lamp cup 14 may also be filled with an encapsulation adhesive (not shown) to better protect the vertical structure chip 21, and the first conductive traces 31 and the second conductive traces 32 may be protected to improve the reliability of the LED package structure 100.
In an embodiment, referring to fig. 3 and 4, the die attach adhesive layer 113 extends to cover the first conductive lines 31, so as to protect the first conductive lines 31 through the die attach adhesive layer 113, and the die attach adhesive layer 113 connects the first conductive lines 31 with the first electrode plate 11, so as to fix the first conductive lines 31 better, ensure the mounting reliability of the first conductive lines 31, and improve the cold and heat shock resistance and the environmental adaptability of the LED package structure 100.
In one embodiment, referring to fig. 3 and 4, the die attach adhesive layer 113 extends to cover the second pad 112, so as to protect the second pad 112 by the die attach adhesive layer 113, ensure good connection between the first conductive traces 31 and the second pad 112, ensure the reliability of the first conductive traces 31, and improve the thermal shock resistance and environmental adaptability of the LED package structure 100.
In one embodiment, referring to fig. 5, the package adhesive 22 may be directly disposed on the support 13, such that the package adhesive 22 wraps the vertical chip 21, the first conductive line 31, the second conductive line 32, the first pad 111, the second pad 112, and the third pad 121, so as to protect the vertical chip 21 and improve the reliability of the manufactured LED package structure 100.
Referring to fig. 6, an embodiment of the present application further provides an LED die bonding method. Referring to fig. 1 and fig. 2, the LED die bonding method includes the following steps:
prefabrication S1: providing a support 10, wherein the support 10 comprises a first polar plate 11 and a second polar plate 12 which are arranged side by side and at intervals, and a support 13 for supporting the first polar plate 11 and the second polar plate 12;
plate treatment S2: providing a first pad 111 and a second pad 112 on the first plate 11 with the first pad 111 spaced apart from the second pad 112, and providing a third pad 121 on the second plate 12;
first welding S3: soldering both ends of the first conductive wire 31 on the first pad 111 and the second pad 112, respectively;
die bonding processing S5: fixing the vertical-structured chip 21 on the first pad 111;
second welding S6: both ends of the second conductive wire 32 are soldered to the top electrode of the vertical structure chip 21 and the third pad 121, respectively.
In the step of prefabricating S1, the first plate 11 and the second plate 12 are arranged side by side and spaced apart so as to connect two electrodes of the vertical structure chip 21; the first and second electrode plates 11 and 12 are supported by the support 13, and the first and second electrode plates 11 and 12 are fixed by the support 13.
In the step of the pad process S2, the first pad 111 and the second pad 112 are provided on the first pad 11 so as to solder the first conductive line 31, ensuring the reliability of the connection; the third pad 121 is disposed on the second plate 12 so that the second conductive line 32 is well connected to the second plate 12, ensuring reliability of connection.
In the die bonding process S5, the vertical structure chip 21 is mounted on the first bonding pad 111, and the bottom electrode of the vertical structure chip 21 may be connected to the first bonding pad 111 and further connected to the first electrode plate 11, so as to ensure the mounting stability and reliability of the vertical structure chip 21 and ensure the connection reliability of the vertical structure chip 21 and the first electrode plate 11.
According to the LED die bonding method, the first bonding pads 111 and the second bonding pads 112 are arranged on the first polar plate 11 at intervals, the first bonding pads 111 and the second bonding pads 112 are connected by welding through the first conducting wires 31, the vertical structure chip 21 is fixed on the first bonding pads 111, the vertical structure chip 21 can be effectively prevented from being separated from the first polar plate 11 under special environments (such as high temperature, high humidity or cold and hot environments), cold and heat impact resistance and vulcanization resistance of the LED packaging structure 100 are effectively improved, the reliability of connection of the vertical structure chip 21 and the first polar plate 11 is ensured, and further the reliability of the LED packaging structure 100 is effectively improved.
In one embodiment, referring to fig. 7, and referring to fig. 1 and fig. 2, the LED die bonding method includes the steps of:
prefabrication S1: providing a support 10, wherein the support 10 comprises a first polar plate 11 and a second polar plate 12 which are arranged side by side and at intervals, and a support 13 for supporting the first polar plate 11 and the second polar plate 12;
plate treatment S2: providing a first pad 111 and a second pad 112 on the first plate 11 with the first pad 111 spaced apart from the second pad 112, and providing a third pad 121 on the second plate 12;
first welding S3: soldering both ends of the first conductive wire 31 on the first pad 111 and the second pad 112, respectively;
gluing S4: coating die attach adhesive on the first pad 111;
die bonding processing S5: fixing the vertical-structured chip 21 on the first pad 111;
second welding S6: both ends of the second conductive wire 32 are soldered to the top electrode of the vertical structure chip 21 and the third pad 121, respectively.
In the step of applying the adhesive S4, a die bond layer 113 may be coated on the first pads 111 by using a die bond adhesive. And a gluing step S4 is arranged between the first welding step S3 and the die bonding step S5, the vertical structure chip 21 is connected with the first bonding pad 111 through the die bonding glue layer 113, and the vertical structure chip 21 is better fixed on the first bonding pad 111 through the die bonding glue, so that the vertical structure chip 21 is more reliably mounted, and the cold and hot shock resistance and the vulcanization resistance are improved.
In one embodiment, referring to fig. 7, and referring to fig. 3 and 4, in the step of gluing S4, the die attach adhesive covers the first conductive line 31. The first conductive wire 31 is protected by the die attach adhesive, and the first conductive wire 31 is connected with the first electrode plate 11 by the die attach adhesive, so that the first conductive wire 31 is better fixed, the installation reliability of the first conductive wire 31 is ensured, and the cold and heat impact resistance and the environmental adaptability of the LED packaging structure 100 are improved.
In one embodiment, in the step of gluing S4, the die attach adhesive extends to cover the second pad 112, so as to protect the second pad 112 by the die attach adhesive, ensure good connection between the first conductive trace 31 and the second pad 112, and ensure the reliability of the first conductive trace 31, thereby improving the thermal shock resistance and environmental compatibility of the LED package structure 100.
In one embodiment, referring to fig. 5 and 8, after the step of second bonding S6, the method further includes a step of packaging S7:
packaging S7: the packaging adhesive 22 is arranged on the support 10, and the packaging adhesive 22 wraps the vertical structure chip 21, the first conductive wire 31, the second conductive wire 32, the first bonding pad 111, the second bonding pad 112 and the third bonding pad 121, so that the vertical structure chip 21 is protected, and the reliability of the manufactured LED packaging structure 100 is improved.
In one embodiment, referring to fig. 2 and 8, when the lamp cup 14 is disposed on the support 13, in the step of packaging S7, a packaging adhesive (not shown) is filled in the lamp cup 14 to facilitate disposing the packaging adhesive. And the lamp cup 14, can play the dimming role, and can protect the vertical structure chip 21.
The LED die bonding method of the embodiment of the present application can be used to fabricate the LED package structure 100 of the above embodiment. The LED package structure 100 of the above embodiment can be manufactured by the LED die bonding method of the embodiment of the present application.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (7)
- LED packaging structure, including support and vertical structure chip, its characterized in that: the LED packaging structure comprises a support, a first electrode plate, a second electrode plate, a first conducting wire and a second conducting wire, wherein the support comprises the first electrode plate and the second electrode plate which are arranged side by side at intervals, a support for supporting the first electrode plate and the second electrode plate, the first electrode plate is provided with a first bonding pad and a second bonding pad at intervals, the second electrode plate is provided with a third bonding pad, the LED packaging structure further comprises the first conducting wire and the second conducting wire, two ends of the first conducting wire are respectively welded on the first bonding pad and the second bonding pad, the vertical structure chip is fixed on the first bonding pad, a bottom surface electrode of the vertical structure chip is connected with the first bonding pad, and two ends of the second conducting wire are respectively welded on a top surface electrode of the vertical structure chip and the; the LED packaging structure further comprises a die bond adhesive layer coated on the first bonding pad, the vertical structure chip is connected with the first bonding pad through the die bond adhesive layer, and the die bond adhesive layer extends to cover the first conductive wire and the second bonding pad.
- 2. The LED package structure of claim 1, wherein: the die bond adhesive layer extends to cover the first conductive line.
- 3. The LED package structure of claim 2, wherein: the die bond adhesive layer extends to cover the second bonding pad.
- 4. The LED package structure of any one of claims 1-3, wherein: the first conductive wire is a gold wire; or/and the second conductive wire is a gold wire.
- 5. The LED package structure of any one of claims 1-3, wherein: the area of the first bonding pad is larger than or equal to the area of the bottom surface of the chip with the vertical structure.
- 6. The LED package structure of any one of claims 1-3, wherein: the first pad area is greater than or equal to the second pad area.
- 7. An LED die bonding method is characterized in that: the method comprises the following steps:prefabrication: providing a support, wherein the support comprises a first polar plate and a second polar plate which are arranged side by side and at intervals, and a support for supporting the first polar plate and the second polar plate;and (3) treating the polar plate: arranging a first bonding pad and a second bonding pad on the first polar plate, enabling the first bonding pad to be spaced from the second bonding pad, and arranging a third bonding pad on the second polar plate;first welding: respectively welding two ends of a first conductive wire on the first pad and the second pad;gluing: coating die bond adhesive on the first bonding pad; covering the first conductive line and the second bonding pad with the die attach adhesive;crystal solidification treatment: fixing a vertical structure chip on the first bonding pad;and (3) second welding: and respectively welding two ends of a second conductive wire on the top surface electrode of the vertical structure chip and the third bonding pad.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010099517.6A CN111276591B (en) | 2020-02-18 | 2020-02-18 | LED packaging structure and LED die bonding method |
| PCT/CN2020/089167 WO2021017562A1 (en) | 2020-02-18 | 2020-05-08 | Led encapsulation structure and led die bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010099517.6A CN111276591B (en) | 2020-02-18 | 2020-02-18 | LED packaging structure and LED die bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111276591A CN111276591A (en) | 2020-06-12 |
| CN111276591B true CN111276591B (en) | 2020-12-11 |
Family
ID=71002261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010099517.6A Active CN111276591B (en) | 2020-02-18 | 2020-02-18 | LED packaging structure and LED die bonding method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111276591B (en) |
| WO (1) | WO2021017562A1 (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067184A (en) * | 2005-08-31 | 2007-03-15 | Showa Denko Kk | Led package |
| CN201204212Y (en) * | 2008-05-30 | 2009-03-04 | 深圳市瑞丰光电子有限公司 | LED encapsulation structure |
| CN201562690U (en) * | 2009-10-27 | 2010-08-25 | 深圳市晶台光电有限公司 | LED with single electrode chip |
| CN201681969U (en) * | 2010-04-16 | 2010-12-22 | 深圳市斯迈得光电子有限公司 | Low-power LED packaging structure |
| CN201780996U (en) * | 2010-07-27 | 2011-03-30 | 深圳万润科技股份有限公司 | LED packaging structure |
| US8232574B2 (en) * | 2010-10-28 | 2012-07-31 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting package with a mechanical latch |
| KR20120069290A (en) * | 2010-12-20 | 2012-06-28 | 삼성엘이디 주식회사 | Led package |
| CN103680340A (en) * | 2013-12-18 | 2014-03-26 | 长春希达电子技术有限公司 | Integrated LED display encapsulated module suitable for ultrahigh display density |
| CN108598246A (en) * | 2018-07-13 | 2018-09-28 | 广东格斯泰气密元件有限公司 | A kind of SMD-UV-LED of vacuum tight encapsulation |
| CN209150142U (en) * | 2018-09-14 | 2019-07-23 | 惠州市鑫永诚光电科技有限公司 | A kind of die pressing type LED structure |
-
2020
- 2020-02-18 CN CN202010099517.6A patent/CN111276591B/en active Active
- 2020-05-08 WO PCT/CN2020/089167 patent/WO2021017562A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN111276591A (en) | 2020-06-12 |
| WO2021017562A1 (en) | 2021-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100629496B1 (en) | Led package structure and manufacturing method for the same | |
| CN102916112B (en) | A kind of high power LED device and manufacture method thereof | |
| CN1457513A (en) | Enhanced leadless chip carrier | |
| CN111276591B (en) | LED packaging structure and LED die bonding method | |
| CN111370556B (en) | LED support light source packaging structure and process thereof | |
| CN213583847U (en) | Mini LED packaging structure | |
| CN205028918U (en) | LED support and LED packaging body | |
| CN210950884U (en) | LED flexible light spot-free lamp strip | |
| CN202307889U (en) | High-power LED (Light Emitting Diode) integrated package structure | |
| CN214848670U (en) | LED module and LED lamp | |
| WO2008138182A1 (en) | Chip type light-emitting diode | |
| CN202058786U (en) | Luminescent device adopting COB packaging | |
| CN214956886U (en) | LED packaging structure containing Zener diode coated with high-reflectivity white glue | |
| CN112259672A (en) | Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process | |
| CN206163520U (en) | LED packaging bracket and LED luminous body | |
| CN102723420B (en) | A kind of support and LED | |
| CN204558524U (en) | For the bar-shaped LED support of flip-chip | |
| CN212625635U (en) | Plane mirror surface circuit support | |
| CN215869455U (en) | Kilowatt-level COB (chip on board) packaged LED (light-emitting diode) light source module | |
| CN201112412Y (en) | Package structure used for high power light-emitting diode heat dispersion | |
| CN203746909U (en) | Filament type LED | |
| CN204558533U (en) | A kind of luminescent device of reverse installation | |
| CN216447934U (en) | Light-emitting component and lamp | |
| CN215342578U (en) | COB packaging structure | |
| CN211959159U (en) | Two-sided double glazing heavy current photovoltaic module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |