CN111261569B - Transfer device and transfer method for micro-component - Google Patents
Transfer device and transfer method for micro-component Download PDFInfo
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- CN111261569B CN111261569B CN201811455038.2A CN201811455038A CN111261569B CN 111261569 B CN111261569 B CN 111261569B CN 201811455038 A CN201811455038 A CN 201811455038A CN 111261569 B CN111261569 B CN 111261569B
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- 238000012546 transfer Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 229910000531 Co alloy Inorganic materials 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- -1 polydimethylsiloxane Polymers 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 150000002910 rare earth metals Chemical class 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 3
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 claims description 3
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 239000010702 perfluoropolyether Substances 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001195 polyisoprene Polymers 0.000 claims description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 21
- 230000001939 inductive effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Reciprocating Pumps (AREA)
- Coating Apparatus (AREA)
Abstract
The application discloses transfer device of microelement and transfer method thereof, and the transfer device comprises: at least one suction nozzle having a vacuum channel; the telescopic head is coupled with the control circuit and is positioned in the vacuum channel; the control circuit is used for controlling and changing the length/cross section area of the telescopic head so that at least part of the telescopic head or a gate valve driven by the telescopic head blocks a vacuum channel or conversely the vacuum channel is unblocked. The transfer device can reliably and efficiently transfer the micro-elements in batches.
Description
Technical Field
The present disclosure relates to the field of micro-component processing technologies, and in particular, to a micro-component transferring apparatus and a micro-component transferring method.
Background
The micro-component display technology refers to an array of micro-sized components integrated at high density on a substrate. At present, a Micro-pitch light emitting diode (Micro-LED) technology gradually becomes a hot research door, and compared with an Organic Light Emitting Diode (OLED) technology, the Micro-LED has the advantages of long service life, high brightness, low power consumption and the like, so that the Micro-LED has a very strong application prospect in the display field.
However, no mature method for transferring the LED chip from the carrier substrate to the receiving substrate exists, which limits the application of Micro-LEDs.
Disclosure of Invention
The application mainly provides a transfer device and a transfer method of micro-components, and the micro-components can be reliably and efficiently transferred in batches by the transfer device.
In order to solve the above technical problem, a first technical solution adopted by the present application is to provide a transfer device for a micro-component, the transfer device including: at least one suction nozzle having a vacuum channel; the telescopic head is coupled with the control circuit and is positioned in the vacuum channel; the control circuit is used for controlling and changing the length/cross section area of the telescopic head so that at least part of the telescopic head or a gate valve driven by the telescopic head blocks a vacuum channel or conversely the vacuum channel is unblocked.
In order to solve the above technical problem, a second technical solution adopted by the present application is to provide a method for transferring a micro-component, the method comprising: moving the suction nozzle to the micro-component; the length/cross section area of the telescopic head is changed through the control circuit so as to ensure that the vacuum channel is smooth, and the vacuum channel is vacuumized; the length/cross section area of the telescopic head is changed through a control circuit so as to block a vacuum channel and transfer the micro-element; the length/cross-sectional area of the telescoping head is varied by the control circuit to clear the vacuum channel to release the micro-component.
The beneficial effect of this application is: different from the situation of the prior art, the transfer device of the application enables the telescopic head to extend/expand or shorten/contract through the matching of the control circuit and the telescopic head, so as to open or close a vacuum channel in the suction nozzle, enable the suction nozzle to be switched between a vacuum state and a non-vacuum state, further complete the absorption and transfer of the micro-component on the bearing substrate, and release the micro-component to the transfer process on the receiving substrate. The transfer device can reliably and efficiently transfer the micro-elements in batches. In addition, this application can realize the accurate control to every suction nozzle, is favorable to accurate location dead pixel to the convenience is restoreed the dead pixel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic structural diagram of a first embodiment of a transfer device provided in the present application;
FIG. 2 is a schematic structural view of a second embodiment of the transfer device provided herein;
FIG. 3 is a schematic structural diagram of a third embodiment of a transfer device provided herein;
FIG. 4 is a schematic structural diagram of a fourth embodiment of a transfer device provided herein;
FIG. 5 is a schematic structural diagram of a fifth embodiment of a transfer device provided herein;
fig. 6 is a schematic flow chart of an embodiment of a method for transferring a micro-component provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
At present, no mature transfer technology of the micro-components exists, so that the micro-components cannot be reliably and efficiently transferred in batches. This application has provided a transfer device of microelement to this technical problem, and cooperation through control circuit and flexible head makes flexible head extension/inflation or shorten/shrink, and then opens or close the vacuum channel in the suction nozzle, makes the suction nozzle change between vacuum and non-vacuum state, and then accomplishes absorbing and shifting the microelement that is located on bearing substrate to release the microelement to receiving on the base plate. The transfer device can reliably and efficiently transfer the micro-elements in batches. Hereinafter, the present application will be described in detail with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a transfer device provided in the present application. As shown in fig. 1, the transfer device includes a plurality of suction nozzles 102, a plurality of retractable heads 104 coupled to each other, and a control circuit (not shown in fig. 1).
The suction nozzle 102 has a vacuum channel 103, the vacuum channel 103 has a narrow channel opening 105, the narrow channel opening 105 divides the vacuum channel 103 into a first channel 1031 and a second channel 1032, i.e. the two sides of the narrow channel opening 105 are respectively the first channel 1031 and the second channel 1032, wherein the first channel 1031 is connected to a vacuum source (not shown in fig. 1), and the end of the second channel 1032 is connected to the outside atmosphere through the suction opening 110. The telescopic head 104 is located in the first passage 1031 at both sides of the narrow passage opening 105, the cross-sectional area of the second passage 1032 is greater than or equal to that of the narrow passage opening 105, the second passage 1032 is formed by the side wall 111 of the chamber body, a second step 107 is formed on the top wall of the chamber body, and the narrow passage opening 105 is formed by the second step 107. The cross-sectional area refers to a cross-sectional area in a horizontal direction.
In one embodiment, as shown in FIG. 1, the cross-sectional area of the second channel 1032 is greater than the cross-sectional area of the narrow channel opening 105, facilitating the formation of the narrow channel opening 105 in the second step 107. In an alternative embodiment, as shown in FIG. 2, FIG. 2 is a schematic structural view of a second embodiment of the transfer device provided herein, in which FIG. 2 the gate valve 206 has a cross-sectional area equal to the cross-sectional area of the narrow passage opening 205 and equal to the cross-sectional area of the second passage 2032, wherein the narrow passage opening 205 divides the vacuum passage 203 into a first passage 2031 and a second passage 2032; when the magnetostrictive body 2041 has the second length, the gate valve 206 is pushed by the magnetostrictive body 2041 to open the narrow passage opening 205 to open the vacuum passage 203; when the magnetostrictive body 2041 has a first length, the gate valve 206 blocks the narrow passage opening 205, and the second length is longer than the first length, so that only the gate valve 206 is required and the second step is not required.
In one embodiment, the vacuum source connected to the first channel 1031 is a vacuum pump, and the end of the second channel 1032 is connected to the outside atmosphere through the suction opening 110. The suction opening 110 is used for sucking the micro-component 101 and has a cross-sectional area smaller than that of the micro-component 101 to prevent the micro-component 101 from being sucked into the suction nozzle 102.
The magnetostrictive head 104 is a magnetostrictive head, and the magnetostrictive head includes a magnetostrictive body 1041 and an inductive coil 1042 wound around the magnetostrictive body 1041, and the inductive coil 1042 is connected to a control circuit.
In one embodiment, the gate valve 106 is a flapper and the magnetostrictive 1041 is a conventional metal and alloy or rare earth alloy magnetostrictive material, wherein conventional metals, conventional metal alloys include: pure nickel, nickel-cobalt alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy; the rare earth alloy giant magnetostrictive material is Tb 1-X Dy X Fe 2 The compound is based alloy, the magnetostriction coefficient of the two materials is large, and the change of the expansion amount under the action of a magnetic field is large, so that the vacuum channel 103 can be switched between unblocked and blocked better. And the first passage 1031 is provided with a mounting cavity 108 therein, the mounting cavity 108 is far away from the cavity wall of the narrow passage opening 105 and extends towards the narrow passage opening 105 to form a fixing member 109, and the free end of the fixing member 109 is fixed with the fixed end of the magnetostrictive body 1041. That is, the fixed end of the magnetostrictive member 1041 is fixed by the fixing member 109, and when the magnetostrictive member 1041 is elongated from the first length to the second length, the fixed end passes through the magnetostrictive member 1041 to push the baffle.
In one embodiment, the control circuitry is used to control the change in length/cross-sectional area of the telescoping head 104 to cause the gate valve 106, which is at least partially actuated by the telescoping head 104, to block the vacuum passageway 103 or, conversely, to unblock the vacuum passageway 103. Each suction nozzle 102 in the transfer device is controlled by the control circuit individually and transfers the micro-component 101 without influencing each other, i.e. only part of the suction nozzles 102 can be controlled to suck and transfer the micro-component 101 in each transfer process, and all the suction nozzles 102 can be controlled to suck and transfer the micro-component 101, which is determined according to the actual situation. That is, the precise control of each suction nozzle 102 can be realized, which is beneficial to precisely positioning the dead pixel, so as to repair the dead pixel conveniently.
Specifically, a baffle plate is disposed in the second channel 1032, the area of the baffle plate is larger than the cross-sectional area of the narrow channel opening 105; the fixed end of the magnetostrictive member 1041 is fixed in the first passage 1031, and the telescopic end of the magnetostrictive member 1041 enters the second passage 1032 from the first passage 1031 through the narrow passage opening 105, and is in direct contact with the side of the barrier close to the first passage 1031. When pulse alternating current is applied to the inductive coil 1042 positioned at the periphery of the magnetostrictive body 1041 through the control circuit, a magnetic field is generated around the inductive coil 1042, so that the magnetostrictive body 1041 positioned in the magnetic field is extended from a first length to a second length, further, the magnetostrictive body 1041 pushes the baffle to leave the narrow channel opening 105 so as to enable the vacuum channel 103 to be unblocked, at the moment, the second channel 1032 is vacuumized through the narrow channel opening 105, so that the gas pressure of the second channel 1032 is lower than the atmospheric pressure, and the suction nozzle 102 can suck the micro-component 101 from the carrier substrate by using the gas pressure difference.
When the pressure difference of the gas for sucking the micro-component 101 reaches a predetermined value, the control circuit does not output a pulse alternating current to the inductor 1042 and the inductor 1042 does not generate a magnetic field, so that the magnetostrictive body 1041 is shortened from the second length to the first length, at this time, the baffle is blocked at the side of the narrow channel opening 105 adjacent to the second channel 1032, so that the baffle blocks the vacuum channel 103, that is, at this time, the second channel 1032 reaches a predetermined vacuum state without performing a vacuum operation.
When the micro-component 101 is transferred to the receiving substrate by the nozzle 102, the pulse alternating current is applied to the inductive coil 1042 again to generate the magnetic field, so that the magnetostrictive body 1041 extends from the first length to the second length, and then the magnetostrictive body 1041 pushes the baffle to leave the narrow channel opening 105 to open the vacuum channel 103, at this time, no vacuum operation is performed, the external atmosphere enters the second channel 1032 through the narrow channel opening 105, so that the gas pressure of the second channel 1032 is equal to the external atmospheric pressure, and the second channel 1032 is in a non-vacuum state, so that the micro-component 101 is released to the receiving substrate.
In a more specific embodiment, one end of the baffle is rotatably connected to one end of the narrow passage opening 105, the other end of the narrow passage opening 105 forms a second step 107, and when the control circuit does not output a pulse current to the inductor 1042 and the magnetostrictive body 1041 is maintained at the first length or is shortened from the second length to the first length, the periphery of the other end of the baffle directly overlaps the second step 107, so that the baffle blocks the vacuum passage 103. In this embodiment, when the magnetostrictive body 1041 has the first length, the orthographic projection area of the baffle on the second step 107 at least partially overlaps the second step 107. In a preferred embodiment, the shutter is an elastic shutter, so that when the other end of the elastic shutter is overlapped on the second step 107, the blocking of the vacuum channel 103 can be better realized to prevent air leakage during the movement of the micro-component 101 through the suction nozzle 102.
In an alternative embodiment, please refer to fig. 3, fig. 3 is a schematic structural diagram of a third embodiment of a transfer device provided in the present application. As shown in fig. 3, one end of the gate valve 306 is rotatably connected to one end of the narrow passage port 305, the other end of the narrow passage port 305 forms a first step 307 in an annular shape, the gate valve 306 is also in an annular shape, and the narrow passage port 305 divides the vacuum passage 303 into a first passage 3031 and a second passage 3032. When the control circuit controls the magnetostrictive body 3041 to be the second length, the magnetostrictive body 3041 pushes the baffle away from the first step 307 to clear the vacuum channel 303; when the control circuit controls the magnetostrictive body 3041 to a first length, the periphery of the gate valve 306 is engaged with the annular first step 307, so that the gate valve 306 blocks the vacuum passage 303, and the second length is greater than the first length. The main difference from the first embodiment in fig. 1 is that, when the magnetostrictive body 1041 in fig. 1 has the first length, the gate valve 106 and the second step 107 are respectively located on two different horizontal planes, and an orthographic projection area of the gate valve 106 on the horizontal plane and an orthographic projection area of the second step 107 on the horizontal plane at least partially overlap to block the vacuum passage 103; in this third embodiment, when the magnetostrictive body 3041 has the first length, the gate valve 306 is located on the same horizontal plane as the first step 307, and the orthographic projection area of the gate valve 306 on the horizontal plane is in contact with and does not overlap the orthographic projection area of the first step 307 on the horizontal plane to block the vacuum passage 303. More specifically, the gate valve 306 is a baffle plate, the baffle plate is an elastic baffle plate, or an elastic sealing body is arranged on one side of the periphery of the baffle plate facing the annular first step 307, or the elastic sealing body is arranged on the annular first step 307. In this alternative embodiment, the blocking of the vacuum channel 303 by the baffle can be better achieved by using the baffle as an elastic baffle or an elastic sealing body, so as to prevent air leakage during the process of moving the micro component 301 through the suction nozzle 302. In addition, the gate valve 306 and the first step 307 are configured to have a mutually matched annular structure, so that the gate valve 306 and the first step 307 can be better engaged when the magnetostrictive body 3041 has the first length, and the sealing performance is further improved to avoid air leakage. The annular first step and annular gate valve are exemplified in this embodiment, and in other embodiments, the first step and gate valve may be of other shapes.
In one embodiment, the material of the elastomeric seal comprises at least one of polydimethylsiloxane, perfluoropolyether, polytetrahydrofuran, polyethylene oxide, polyoxetane, polyisoprene, polybutadiene, fluoroolefin-based fluoroelastomers, preferably polydimethylsiloxane, which is relatively low cost and chemically inert.
In the above embodiments, the suction nozzle is provided with a baffle, and in other alternative embodiments, the suction nozzle may not be provided with a baffle, specifically referring to fig. 4, fig. 4 is a schematic structural diagram of a fourth embodiment of the transfer device provided in the present application. Vacuum channel 403 has a narrow channel opening 405, narrow channel opening 405 dividing vacuum channel 403 into a first channel 4031 and a second channel 4032. The magnetostrictive body 4041 has a cross-sectional area equal to or greater than the area of the narrow passage opening 405, the narrow passage opening 405 being formed by the second step 407 in the top wall of the chamber. When the magnetostrictive 4041 is at the first length, the vacuum channel 403 is unobstructed; when the magnetostrictive body 4041 is elongated from the first length to the second length, the narrow passage opening 405 is now directly blocked by the magnetostrictive body 4041 of the second length to block the vacuum passage 403. The magnetostrictive body 4041 can be in the shape of a cylinder, a cone, a cuboid, a circular truncated cone, etc., and the projection area of the magnetostrictive body 4041 on the horizontal plane is only required to be larger than the cross-sectional area of the narrow passage opening 405.
In other alternative embodiments, when no baffle is disposed on the suction nozzle, the retractable head (e.g., the retractable body 4041) is located in the narrow passage opening 405, and when the cross-sectional area of the retractable head is in a natural state, the cross-sectional area of the retractable head is smaller than the cross-sectional area of the narrow passage opening 405, and the vacuum passage 403 is unblocked; when the cross-sectional area of the retractable head is expanded to the first state by the control circuit, the narrow passage opening 405 is closed to close the vacuum passage 403. When the control circuit does not act on the telescopic head, the telescopic head returns to a natural state.
Therefore, the control circuit is matched with the telescopic head to extend/expand or shorten/contract the telescopic head, so that a vacuum channel in the suction nozzle is opened or closed, the suction nozzle is switched between a vacuum state and a non-vacuum state, the micro-component on the bearing substrate is sucked and transferred, and the micro-component is released to a transfer process on the receiving substrate. The transfer device can reliably and efficiently transfer micro-components in batches. In addition, the blockage or smoothness of the vacuum channel in each suction nozzle is independently controlled, so that the precise control of each suction nozzle can be realized, the precise positioning of dead spots is facilitated, and the repair of the dead spots is facilitated.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a fifth embodiment of a transfer device provided in the present application. As shown in FIG. 5, the transfer device includes a suction nozzle 502, a retractable head 504 and a control circuit (not shown in FIG. 5) coupled to each other.
The suction nozzle 502 has a vacuum passage 503, the vacuum passage 503 has a narrow passage opening 505, the narrow passage opening 505 divides the vacuum passage 503 into a first passage 5031 and a second passage 5032, the telescopic head 504 is located in the first passage 5031 at two sides of the narrow passage opening 505, and the cross-sectional area of the second passage 5032 is larger than that of the narrow passage opening 505. Wherein the first channel 5031 is connected to a vacuum source (not shown in fig. 5), and the end of the second channel 5032 is connected to the outside atmosphere.
In one embodiment, the vacuum source connected to the first channel 5031 is a vacuum pump, and the end of the second channel 5032 is open to the outside atmosphere via the suction opening 510. The suction opening 510 is used for sucking the micro component 501, and has a cross-sectional area smaller than that of the micro component 501, so as to prevent the micro component 501 from being sucked into the suction nozzle 502.
The magnetostrictive head 504 is a magnetostrictive head 504, the magnetostrictive head 504 includes a magnetostrictive body 5041 and an inductive coil 5042 wound around the periphery of the magnetostrictive body 5041, and the inductive coil 5042 is connected to a control circuit.
This fifth embodiment differs from the first embodiment in that the gate valve in the first embodiment is located on the side of the narrow passage opening facing the second passage, i.e. when the magnetostrictive body is of the first length the vacuum passage is blocked, when the magnetostrictive body is located in the first passage; when the magnetostrictors are in the second length, the gate valves are pushed to open the narrow passages, the vacuum passages are unblocked, the fixed ends of the magnetostrictors are located in the first passages, and the free ends of the magnetostrictors are located in the second passages. The gate valve in the fifth embodiment is located on the side of the narrow passage opening facing the first passage, that is, when the magnetostrictive body has the first length, the vacuum passage is unblocked, when the magnetostrictive body has the second length, the gate valve is pushed to block the narrow passage, the vacuum passage is blocked, and when the magnetostrictive body has the first length and the second length, the magnetostrictive body is located in the first passage, so that the gate valve is not limited to the position of the gate valve.
In the fifth embodiment, when the magnetostrictive body 5041 is controlled to extend from the first length to the second length, the gate valve 506 driven by the magnetostrictive body 5041 blocks the narrow passage opening 505, and the narrow passage opening 505 is opened while no pulse current is output to the induction coil 5042 to keep the magnetostrictive body 5041 at the first length or to shorten from the second length to the first length.
Specifically, the gate valve 506 is disposed in the first passage 5031, the area of the gate valve 506 is larger than the cross-sectional area of the narrow passage opening 505, and the magnetostrictive body 5041 is located in the first passage 5031. When the control circuit does not output pulse alternating current to the inductance line, the inductance coil 5042 does not generate a magnetic field, and at this time, the magnetostrictive body 5041 has a first length to open the narrow passage opening 505, the vacuum passage 503 is unblocked, the second passage 5032 is vacuumized through the narrow passage opening 505 to make the air pressure of the second passage 5032 lower than the external atmospheric pressure, and the suction nozzle 502 sucks the micro-component 501 from the carrier substrate by using the air pressure difference. And when the pressure difference of the gas for sucking the micro-component 501 reaches a predetermined value, the control circuit applies a pulse alternating current to the inductance coil 5042, a magnetic field is generated around the inductance coil 5042, the magnetostrictive body 5041 in the magnetic field is extended from a first length to a second length, and the magnetostrictive body 5041 pushes the gate valve 506 to block the narrow passage opening 505 by the gate valve 506, at this time, the second passage 5032 reaches a predetermined vacuum state, that is, at this time, no vacuum operation is performed. After the micro-component 501 is transferred to the receiving substrate by the nozzle 502, the pulse alternating current is stopped from being applied to the inductor 5042, so that the magnetostrictive body 5041 is shortened from the second length to the first length, the vacuum channel 503 is unblocked, no vacuum operation is performed at this time, the external atmosphere enters the second channel 5032 through the narrow channel opening 505, the gas pressure of the second channel 5032 is equal to the external atmospheric pressure, that is, the second channel 5032 is in a non-vacuum state, so that the micro-component 501 can be released onto the receiving substrate.
In a more specific embodiment, the gate valve 506 is a flapper and the magnetostrictive 5042 is a conventional metal and alloy or rare earth alloy giant magnetostrictive material, wherein conventional metals and alloys include: pure nickel, nickel-cobalt alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy; the rare earth alloy giant magnetostrictive material is Tb 1-X Dy X Fe 2 Alloys based on compounds having large magnetostriction coefficients in the two main classesThe expansion amount under the action of the magnetic field is changed greatly, so that the vacuum channel 503 can be switched between unblocked and blocked better. The first channel 5031 is provided with an installation cavity 508, the installation cavity 508 is far away from the cavity wall of the narrow channel opening 505 and extends towards the narrow channel opening 505 to form a fixing member 509, and the free end of the fixing member 509 is fixed with the fixed end of the magnetostrictive body.
It can be seen from the above that, without being limited to the position of the gate valve, the control circuit and the retractable head are matched to extend or shorten the retractable head, so as to open or close the vacuum channel in the suction nozzle, so that the suction nozzle is switched between a vacuum state and a non-vacuum state, and further, the micro-component on the carrier substrate is sucked and transferred, and the micro-component is released to the receiving substrate in the transferring process. The transfer device can reliably and efficiently transfer micro-components in batches. In addition, the blockage or smoothness of the vacuum channel in each suction nozzle is independently controlled, so that the precise control of each suction nozzle can be realized, the precise positioning of the dead pixel is facilitated, and the repair of the dead pixel is facilitated.
Referring to fig. 6, fig. 6 is a schematic flow chart of an embodiment of a transfer method of a micro device provided in the present application, the transfer method mainly includes the following steps:
step 61: the suction nozzle is moved to the micro component.
When transferring the micro-component, the suction nozzle is moved to the micro-component to be transferred, that is, the transfer device is moved to the micro-component.
Step 62: the length/cross section area of the telescopic head is changed through the control circuit, so that the vacuum channel is smooth, and the vacuum channel is vacuumized.
In one embodiment, referring to fig. 1, when a pulse alternating current is applied to the inductive coil 1042 positioned at the periphery of the magnetostrictive body 1041 by the control circuit, a magnetic field is generated around the inductive coil 1042, so that the magnetostrictive body 1041 in the magnetic field extends from a first length to a second length, and then the magnetostrictive body 1041 pushes the baffle away from the narrow channel opening 105 to open the vacuum channel 103, at this time, the narrow channel opening 105 performs a vacuum pumping operation on the second channel 1032 to make the gas pressure of the second channel 1032 lower than the atmospheric pressure, and further the micro-component 101 is sucked through the suction opening 110.
And step 63: the length/cross-sectional area of the telescopic head is changed by the control circuit to block the vacuum channel and transfer the micro-component.
In one embodiment, referring to fig. 1, when the pressure difference of the gas for sucking the micro-component 101 reaches a predetermined value, the control circuit does not output the pulse alternating current to the inductor 1042, and the inductor 1042 does not generate the magnetic field, so that when the magnetostrictive body 1041 is shortened from the second length to the first length, the baffle blocks the narrow channel opening 105 near the side of the second channel 1032, so that the baffle blocks the vacuum channel 103, that is, the second channel 1032 reaches a predetermined vacuum state, and the micro-component 101 is transferred to the receiving substrate by the suction nozzle 102 without performing the vacuum operation.
Step 64: the length/cross-sectional area of the telescopic head is changed by the control circuit to open the vacuum channel to release the micro-component.
In one embodiment, referring to fig. 1, when the micro-component 101 is transferred to the receiving substrate by the nozzle 102, the pulse alternating current is applied to the inductive coil 1042 to generate a magnetic field, so that the magnetostrictive body 1041 extends from the first length to the second length, and then the magnetostrictive body 1041 pushes the baffle plate to leave the narrow passage opening 105 to open the vacuum passage 103, at this time, no vacuum operation is performed, the external atmosphere enters the second passage 1032 through the narrow passage opening 105, so that the gas pressure of the second passage 1032 is equal to the external atmospheric pressure, and the second passage 1032 is in a non-vacuum state, so that the micro-component 101 is released onto the receiving substrate.
The beneficial effect of this application is: different from the situation of the prior art, the transfer device of the application enables the telescopic head to extend/expand or shorten/contract through the matching of the control circuit and the telescopic head, so that a vacuum channel in the suction nozzle is opened or closed, the suction nozzle is switched between a vacuum state and a non-vacuum state, and then the micro-component on the bearing substrate is sucked and transferred, and the micro-component is released to the transfer process on the receiving substrate. The transfer device can reliably and efficiently transfer the micro-elements in batches. In addition, this application can realize the accurate control to every suction nozzle, is favorable to accurate location dead pixel to the convenience is restoreed the dead pixel.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (12)
1. A transfer device for microcomponents, characterized in that it comprises:
at least one suction nozzle having a vacuum channel;
the telescopic head is coupled with the control circuit and is positioned in the vacuum channel;
the control circuit is used for controlling and changing the length/cross-sectional area of the telescopic head so as to enable at least part of the telescopic head or a gate valve driven by the telescopic head to block the vacuum channel or conversely enable the vacuum channel to be unblocked; wherein, the first and the second end of the pipe are connected with each other,
in response to the gate valve being a baffle, the control circuit controls the telescoping head to a second length, the telescoping head pushing the baffle to clear or block the vacuum passage; or the like, or, alternatively,
the control circuit controls the expansion of the cross-sectional area of the telescoping head to cause the vacuum channel to be blocked.
2. The transfer device of claim 1,
the vacuum channel comprises a narrow channel port which divides the vacuum channel into a first channel and a second channel;
the magnetostrictive head is a magnetostrictive head, and comprises a magnetostrictive body and an inductance coil wound on the periphery of the magnetostrictive body, and the inductance coil is connected with the control circuit.
3. The transfer device of claim 2,
the magnetostrictive material comprises traditional metal, traditional metal alloy or rare earth alloy giant magnetostrictive material.
4. The transfer device of claim 3,
the conventional metal comprises pure nickel, and the conventional metal alloy comprises: nickel-cobalt alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy; the rare earth alloy giant magnetostrictive material is Tb 1-X Dy X Fe 2 Compound-based alloys.
5. The transfer device of claim 2,
the gate valve is a baffle plate, the baffle plate is arranged in the second channel, and the area of the baffle plate is larger than or equal to the cross-sectional area of the narrow channel opening;
the fixed end of the magnetostrictive body is fixed in a first channel, and the telescopic end of the magnetostrictive body enters the second channel from the first channel through the narrow channel opening and is in direct contact with one side, close to the first channel, of the baffle;
when the control circuit controls the magnetostrictive body to be in the second length, the magnetostrictive body pushes the baffle to leave the narrow passage opening so as to ensure that the vacuum passage is unblocked; when the control circuit controls the magnetostrictive body to be in the first length, the baffle is blocked at one side of the narrow channel opening, which is adjacent to the second channel, so that the vacuum channel is blocked by the baffle.
6. The transfer device of claim 5,
one end of the baffle is rotatably connected with one end of the narrow passage opening, the other end of the narrow passage opening forms a first step, and when the control circuit controls the magnetostrictive body to be in the second length, the magnetostrictive body pushes the baffle to leave the first step so as to ensure that the vacuum passage is unblocked; when the control circuit controls the magnetostrictive body to be in the first length, the periphery of the baffle is clamped on the first step, so that the vacuum channel is blocked by the baffle.
7. The transfer device of claim 6,
the baffle periphery is equipped with the elastic seal towards first ladder one side, or be equipped with the elastic seal on the first ladder, or the baffle is the elastic baffle.
8. The transfer device of claim 7,
the material of the elastic sealing body comprises at least one of polydimethylsiloxane, perfluoropolyether, polytetrahydrofuran, polyethylene oxide, polyoxetane, polyisoprene, polybutadiene and fluoroolefin-based fluorine-containing elastomer.
9. The transfer device of claim 8 wherein said elastomeric seal material is polydimethylsiloxane.
10. The transfer device of claim 2,
the gate valve is disposed within the first passage;
the control circuit is used for outputting pulse current to the inductance coil to enable the magnetostriction body to extend from a first length to a second length, the gate valve driven by the magnetostriction body blocks the narrow passage opening, and when not outputting pulse current to the inductance coil to enable the magnetostriction body to be kept at the first length or shortened from the second length to the first length, the narrow passage opening is opened.
11. The transfer device of claim 5 or 10,
one end of the gate valve is rotatably connected with one end of the narrow passage opening, the other end of the narrow passage opening forms a second step, and the other end of the gate valve is overlapped on the second step in a circumferential mode, so that the gate valve blocks the vacuum passage.
12. A method for transferring a micro-component, characterized in that the transfer device of any one of claims 1 to 11 is used, the method comprising:
moving a suction nozzle to the micro-component;
changing the length/cross section area of the telescopic head through a control circuit to enable a vacuum channel to be smooth, and vacuumizing the vacuum channel to enable the micro-element to be adsorbed;
changing the length/cross-sectional area of the telescopic head through the control circuit to block the vacuum channel and transfer the micro-component;
the length/cross-sectional area of the telescoping head is varied by the control circuit to clear the vacuum channel to release the micro-component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455038.2A CN111261569B (en) | 2018-11-30 | 2018-11-30 | Transfer device and transfer method for micro-component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455038.2A CN111261569B (en) | 2018-11-30 | 2018-11-30 | Transfer device and transfer method for micro-component |
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| CN111261569A CN111261569A (en) | 2020-06-09 |
| CN111261569B true CN111261569B (en) | 2022-10-28 |
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| CN112614799B (en) * | 2020-12-18 | 2022-12-20 | 上海广川科技有限公司 | Wafer transmission device and transmission method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM459093U (en) * | 2013-03-21 | 2013-08-11 | Raden Automatic Co Ltd | Object gripping device |
| CN107039298A (en) * | 2016-11-04 | 2017-08-11 | 厦门市三安光电科技有限公司 | Transfer device, transfer method, manufacture method, device and the electronic equipment of microcomponent |
| CN207402796U (en) * | 2017-03-07 | 2018-05-25 | 迅得机械（东莞）有限公司 | Pressure holding structure of suction device |
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2018
- 2018-11-30 CN CN201811455038.2A patent/CN111261569B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM459093U (en) * | 2013-03-21 | 2013-08-11 | Raden Automatic Co Ltd | Object gripping device |
| CN107039298A (en) * | 2016-11-04 | 2017-08-11 | 厦门市三安光电科技有限公司 | Transfer device, transfer method, manufacture method, device and the electronic equipment of microcomponent |
| CN207402796U (en) * | 2017-03-07 | 2018-05-25 | 迅得机械（东莞）有限公司 | Pressure holding structure of suction device |
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| CN111261569A (en) | 2020-06-09 |
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