CN111223399A - Manufacturing method of flexible display panel - Google Patents
Manufacturing method of flexible display panel Download PDFInfo
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- CN111223399A CN111223399A CN201811426431.9A CN201811426431A CN111223399A CN 111223399 A CN111223399 A CN 111223399A CN 201811426431 A CN201811426431 A CN 201811426431A CN 111223399 A CN111223399 A CN 111223399A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The manufacturing method of the flexible display panel comprises the following steps. Sequentially forming a first release layer and a metal layer on the carrier. The metal layer is patterned to form a first metal layer and a second metal layer, wherein part of the first release layer is exposed. Modifying the exposed first release layer to form a second release layer, wherein the adhesion of the second release layer is greater than the adhesion of the first release layer. And removing the second metal layer. And forming a flexible substrate on the carrier plate, wherein the flexible substrate covers the first metal layer, the first release layer and the second release layer. And forming a component array on the flexible substrate, wherein the display area of the component array is correspondingly arranged with the first release layer through the first metal layer, and the non-display area of the component array is correspondingly arranged with the second release layer. And cutting the flexible substrate, the second release layer and the carrier plate to form a plurality of flexible display panels. And carrying out a laser stripping process to remove the second release layer. And carrying out a mechanical stripping process to separate the flexible display panel from the carrier plate.
Description
Technical Field
The present invention relates to a method for manufacturing a display panel, and more particularly, to a method for manufacturing a flexible display panel.
Background
The manufacturing process of the flexible display panel is generally to form required components on the rigid carrier plate, and the flexible display panel can be removed from the rigid carrier plate through a laser lift-off process or a mechanical lift-off process after the flexible display panel is completed. However, the process of separating the flexible display panel and the rigid carrier by irradiating laser through the laser lift-off process will make the surface of the flexible substrate of the flexible display panel uneven, which affects the optical characteristics of the display area of the flexible display panel. On the other hand, the problem can be avoided by separating the flexible display panel and the hard carrier plate through a mechanical stripping process, but in the manufacturing process of the flexible display panel, the adhesion between the flexible substrate located in the non-display area of the flexible display panel and the hard carrier plate is large due to the hot pressing process, so that the stripping stress needs to be increased, and the non-display area of the flexible display panel is easily damaged by separating the flexible display panel and the hard carrier plate through the mechanical stripping process.
Disclosure of Invention
The invention provides a manufacturing method of a flexible display panel, which can enable a display area of the flexible display panel to have good optical characteristics and can avoid damage of a non-display area of the flexible display panel.
According to an embodiment of the present invention, a method for manufacturing a flexible display panel of the present invention includes the following steps. Sequentially forming a first release layer and a metal layer on the carrier. The metal layer is patterned to form a first metal layer and a second metal layer, wherein part of the first release layer is exposed. Modifying the exposed first release layer to form a second release layer, wherein the adhesion of the second release layer is greater than the adhesion of the first release layer. And removing the second metal layer. And forming a flexible substrate on the carrier plate, wherein the flexible substrate covers the first metal layer, the first release layer and the second release layer. And forming a component array on the flexible substrate, wherein the display area of the component array is correspondingly arranged with the first release layer through the first metal layer, and the non-display area of the component array is correspondingly arranged with the second release layer. And cutting the flexible substrate, the second release layer and the carrier plate to form a plurality of flexible display panels. And carrying out a laser stripping process to remove the second release layer. And carrying out a mechanical stripping process to separate the flexible display panel from the carrier plate.
In the method for manufacturing a flexible display panel according to the embodiment of the invention, the forming of the first metal layer and the second metal layer includes the following steps. And forming a mask on the metal layer, wherein the mask comprises a first pattern and a second pattern, and the thickness of the first pattern is greater than that of the second pattern. Patterning the metal layer using a mask, wherein the first pattern and the second pattern are each located above the first metal layer and the second metal layer.
In the method for manufacturing the flexible display panel according to the embodiment of the invention, before the second metal layer is removed, an ashing process is performed to remove the second pattern and a part of the first pattern.
In the method for manufacturing the flexible display panel according to the embodiment of the invention, after the second metal layer is removed, the remaining first pattern is removed.
In the method of manufacturing a flexible display panel according to an embodiment of the present invention, the step of modifying the exposed first release layer includes irradiating a light source to the exposed first release layer.
In the method of manufacturing a flexible display panel according to an embodiment of the present invention, the light source includes ultraviolet light.
In the method for manufacturing a flexible display panel according to the embodiment of the invention, in the step of performing the laser lift-off process to remove the second release layer, laser is irradiated from a side of the carrier plate not facing the second release layer.
In the method for manufacturing the flexible display panel according to the embodiment of the invention, the material of the first release layer includes parylene.
In the method of manufacturing a flexible display panel according to an embodiment of the present invention, a material of the metal layer includes molybdenum, aluminum, titanium, or a combination thereof.
In the method of manufacturing a flexible display panel according to the embodiment of the present invention, the material of the flexible substrate includes polyimide.
Based on the above, in the manufacturing method of the flexible display panel of the invention, the second release layer with larger adhesion in the non-display area is removed by using the laser lift-off process, and the first release layer with smaller adhesion in the display area is removed by using the mechanical lift-off process, so that the damage of the non-display area of the flexible display panel due to the mechanical lift-off process can be avoided, the damage of the display area of the component array can be avoided, the optical characteristics of the flexible display panel can be reduced, and the flatness of the flexible display panel can be increased.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
Fig. 1A to fig. 1L are schematic cross-sectional views illustrating a method for manufacturing a flexible display panel according to an embodiment of the invention;
fig. 2A to fig. 2D are schematic top views illustrating a manufacturing method of a flexible display panel according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The thickness of layers and regions in the drawings may be exaggerated for clarity. The same or similar reference numbers refer to the same or similar components, and the following paragraphs will not be repeated. In addition, directional terms mentioned in the embodiments, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
Fig. 1A to fig. 1L are schematic cross-sectional views illustrating a method for manufacturing a flexible display panel according to an embodiment of the invention. Fig. 2A to fig. 2D are schematic top views illustrating a manufacturing method of a flexible display panel according to an embodiment of the invention. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 specifically 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3, 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 1 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 B 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 is 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 cross 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 sectional 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 view 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 of 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 section 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 line 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 ' 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 in 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 2A 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3, 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 1 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 g 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 is 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 cross 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 sectional 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 view 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 of 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 section 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 line 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3' 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 in 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 32 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 B 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3, 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 1 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 i 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 is 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 cross 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 sectional 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 view 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 of 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 section 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 line 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 ' 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 in 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 32 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 c 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3, 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 and 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 1 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 j 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 is 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 cross 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 sectional 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 view 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 of 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 section 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 line 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3- 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 a 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3' 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 in 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 fig. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 32 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 d 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3. 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
Referring to fig. 1A, a first release layer 110 and a metal layer 120 are sequentially formed on a carrier 100.
In one embodiment, the carrier 100 may be a rigid substrate. Therefore, the carrier 100 is not easily deformed by an external force during the manufacturing process, so that the first release layer 110 and the metal layer 120 formed on the carrier 100 have good flatness and stability. The material of the carrier plate 100 may be glass, polycarbonate, stainless steel plate, or a combination thereof.
In one embodiment, the first release layer 110 is formed by a chemical vapor deposition method or a physical vapor deposition method. The material of the first release layer 110 may be, for example, an organic material or an inorganic material. For example, the material of the first release layer 110 may be, for example, an organic material sensitive to ultraviolet light or light having a specific wavelength band. In the present embodiment, the material of the first release layer 110 is parylene. The first release layer 110 is used to temporarily attach a flexible substrate to be formed on the carrier 100, so the adhesion of the first release layer 110 can be smaller than that of a conventional permanent adhesive layer.
In one embodiment, the metal layer 120 is formed by a chemical vapor deposition method or a physical vapor deposition method. The material of the metal layer 120 may be, for example, molybdenum, aluminum, titanium, or a combination thereof, and the metal layer 120 may be, for example, a single-layer structure or a multi-layer structure. For example, the metal layer 120 may be a multi-layer structure composed of molybdenum/aluminum/molybdenum or titanium/aluminum/titanium, for example, but the present invention is not limited thereto.
Referring to fig. 1B and fig. 2A, a mask 130 is formed on the metal layer 120. In one embodiment, the mask 130 is a half-tone mask (half-tone mask). In detail, the mask 130 includes a plurality of first patterns 132 and a plurality of second patterns 134. In one embodiment, the first pattern 132 is located in a corner region of the carrier 100, and the second pattern 134 is located in a central region of the carrier 100. The thickness of the first pattern 132 is, for example, greater than that of the second pattern 134.
Referring to fig. 1C, the metal layer 120 is patterned by using a mask 130 to form a first metal layer 122 and a second metal layer 124, wherein a portion of the metal layer 120 is removed to expose a portion of the first release layer 110. In one embodiment, the metal layer 120 is patterned by, for example, a wet etching process. The etching solution used in the wet etching process is, for example, phosphoric acid, acetic acid, nitric acid, aluminic acid, or a combination thereof. In this embodiment, a combination of phosphoric acid, acetic acid and nitric acid is used as the etching liquid, but the present invention is not limited thereto. In the present embodiment, the positions of the first metal layer 122 and the second metal layer 124 are defined by a plurality of first patterns 132 and a plurality of second patterns 134. In detail, the first pattern 132 and the second pattern 134 are respectively located above the first metal layer 122 and the second metal layer 124.
Referring to fig. 1D, the exposed first release layer 110 is modified to form a second release layer 110 a. In one embodiment, the exposed first release layer 110 is modified by irradiating the light source 200 to the exposed first release layer 110, but the invention is not limited thereto. The light source 200 to be used may be selected according to the material included in the first release layer 110. For example, the light source 200 may be an ultraviolet light or a laser. In the present embodiment, the light source 200 is ultraviolet light. Part of the first release layer 110 (i.e., the first release layer 110 not covered by the mask 130) is modified after being irradiated by the light source 200, and is converted into a second release layer 110a having stronger adhesiveness than the first release layer 110. In detail, the adhesion of the second release layer 110a is greater than that of the first release layer 110.
Referring to fig. 1E, the second pattern 134 and a portion of the first pattern 132 are removed. In one embodiment, the second pattern 134 and a portion of the first pattern 132 are removed by, for example, an ashing process, but the invention is not limited thereto. In detail, since the thickness of the first patterns 132 is greater than that of the second patterns 134, a portion of each of the first patterns 132 is removed when the second patterns 134 are completely removed, and the remaining first patterns 132 are formed on the first metal layer 122 and expose the second metal layer 124.
Referring to fig. 1F, the second metal layer 124 is removed. In one embodiment, the second metal layer 124 is removed by, for example, a wet etching process. The etching solution used in the wet etching process is, for example, phosphoric acid, acetic acid, nitric acid, aluminic acid, or a combination thereof. In this embodiment, a combination of phosphoric acid, acetic acid and nitric acid is used as the etching liquid, but the present invention is not limited thereto.
Referring to fig. 1G and fig. 2B, the remaining first pattern 132 is removed. In one embodiment, the remaining first pattern 132 is removed by, for example, performing an ashing process, but the invention is not limited thereto. After removing the remaining first pattern 132, the first metal layer 122 is exposed. The first metal layer 122 may serve as a registration mark to enable a subsequently formed device array to be precisely located at a desired position.
In the present embodiment, the first metal layer 122 as the alignment mark and the first release layer 110 and the second release layer 110a with different adhesion are simultaneously formed only by one mask, so that the manufacturing cost of the flexible display panel can be reduced.
Referring to fig. 1H, a flexible substrate 140 is formed on the carrier 100. In an embodiment, the flexible substrate 140 is formed by performing a slit coating process, a spin coating process, or a combination thereof on the carrier 100 to form a flexible substrate material layer (not shown), and then performing a thermal curing process on the flexible substrate material layer, but the invention is not limited thereto. The flexible substrate 140 is formed to cover the first metal layer 122, the first release layer 110 and the second release layer 110a, for example. The material of the flexible substrate 140 may be, for example, polyimide, polyethylene naphthalate, polyethylene terephthalate, or a combination thereof. In the present embodiment, the material of the flexible substrate 140 is polyimide.
Referring to fig. 1I and fig. 2C, a device array 150 is formed on the flexible substrate 140. In one embodiment, the device array 150 may be a Liquid Crystal Display (LCD) array, an Organic Light Emitting Diode (OLED) array, a quantum dot light emitting diode (QLED) array, or a Micro light emitting diode (Micro LED) array, but the invention is not limited thereto. In an embodiment, the device array 150 may include a plurality of active devices (not shown), a plurality of scan lines (not shown), a plurality of data lines (not shown), and a plurality of sub-pixels (not shown), wherein each sub-pixel may be electrically connected to a corresponding scan line and a corresponding data line in the device array 150, respectively, but the invention is not limited thereto. The device array 150 has, for example, a display area 150a and a non-display area 150b surrounding the display area 150 a. Since the first metal layer 122 is formed in the previous process, the first metal layer 122 can be used as an alignment mark to correspondingly dispose the display region 150a of the device array 150 with the first release layer 110 through the first metal layer 122. In one embodiment, the orthographic projection area of the display area 150a of the device array 150 overlaps the first release layer 110. In addition, since the non-display area 150b of the device array 150 surrounds the display area 150a, the non-display area 150b of the device array 150 is disposed corresponding to the second release layer 110 a.
Referring to fig. 1J, fig. 1K and fig. 2D, a cutting process 300 is performed to cut the flexible substrate 140, the second release layer 110a and the carrier 100, so as to form a plurality of flexible display panels 10. The method of cutting the flexible substrate 140, the second release layer 110a and the carrier board 100 may be, for example, by performing a laser cutting process or a knife wheel cutting process. For example, the plurality of flexible display panels 10 separated from each other may be formed by cutting the edge of the non-display area 150b of the device array 150 toward the carrier 100 by using laser, but the invention is not limited thereto.
With reference to fig. 1K, a laser lift-off process 400 is performed to remove the second release layer 110 a. For example, the second release layer 110a may be irradiated with laser from a side of the carrier 100 not facing the second release layer 110a to remove the second release layer 110 a. In this embodiment, since the laser is only irradiated onto the second release layer 110a corresponding to the non-display area 150b of the device array 150, the display area 150a of the device array 150 is not damaged, and the optical characteristics of the display area of the flexible display panel 10 are not affected.
Referring to fig. 1L, a mechanical peeling process 500 is performed to separate the flexible display panel 10 and the carrier 100. Since the second release layer 110a with the larger adhesion has been removed by the laser peeling process 400, the flexible display panel 10 and the carrier 100 can be separated by the mechanical peeling process 500 without causing damage on the flexible display panel 10.
In summary, in the manufacturing method of the flexible display panel of the invention, the design of the alignment mark (the first metal layer) can precisely form the display region of the device array on the unmodified release layer (the first release layer) and form the non-display region of the device array on the modified release layer (the second release layer). In addition, the alignment mark, the first release layer and the second release layer can be formed at the same time by only one mask, so that the manufacturing cost of the flexible display panel can be reduced. In addition, the manufacturing method of the flexible display panel removes the second release layer with larger adhesive force in the non-display area by using the laser peeling process and removes the first release layer with smaller adhesive force in the display area by using the mechanical peeling process, thereby not only preventing the non-display area of the flexible display panel from being damaged by the mechanical peeling process, but also preventing the display area of the component array from being damaged to reduce the optical property of the flexible display panel and increasing the flatness of the flexible display panel.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
sequentially forming a first release layer and a metal layer on the carrier plate;
patterning the metal layer to form a first metal layer and a second metal layer, wherein part of the first release layer is exposed;
modifying the exposed first release layer to form a second release layer, wherein the adhesion of the second release layer is greater than the adhesion of the first release layer;
removing the second metal layer;
forming a flexible substrate on the carrier plate, wherein the flexible substrate covers the first metal layer, the first release layer and the second release layer;
forming a component array on the flexible substrate, wherein a display area of the component array is arranged corresponding to the first release layer through the first metal layer, and a non-display area of the component array is arranged corresponding to the second release layer;
cutting the flexible substrate, the second release layer and the carrier plate to form a plurality of flexible display panels;
performing a laser lift-off process to remove the second release layer; and
and carrying out a mechanical stripping process to separate the flexible display panel from the carrier plate.
2. The method of claim 1, wherein the step of forming the first and second metal layers comprises:
forming a mask on the metal layer, wherein the mask comprises a first pattern and a second pattern, and the thickness of the first pattern is larger than that of the second pattern; and
patterning the metal layer with the mask, wherein the first pattern and the second pattern are each located over the first metal layer and the second metal layer.
3. The method of claim 2, wherein an ashing process is performed to remove the second pattern and a portion of the first pattern before removing the second metal layer.
4. The method of claim 3, wherein the first pattern remaining after removing the second metal layer is removed.
5. The method of manufacturing a flexible display panel according to claim 1, wherein the step of modifying the exposed first release layer comprises: irradiating a light source to the exposed first release layer.
6. The method of claim 5, wherein the light source comprises ultraviolet light.
7. The method for manufacturing a flexible display panel according to claim 1, wherein in the step of performing the laser lift-off process to remove the second release layer, a laser is irradiated from a side of the carrier not facing the second release layer.
8. The method for manufacturing the flexible display panel according to claim 1, wherein the material of the first release layer comprises parylene.
9. The method of claim 1, wherein the metal layer comprises molybdenum, aluminum, titanium, or a combination thereof.
10. The method of manufacturing a flexible display panel according to claim 1, wherein a material of the flexible substrate comprises polyimide.
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| CN112672523A (en) * | 2021-01-31 | 2021-04-16 | 惠州中京电子科技有限公司 | Method for manufacturing thin copper thin wire single-sided flexible board |
| WO2022052219A1 (en) * | 2020-09-09 | 2022-03-17 | 武汉华星光电半导体显示技术有限公司 | Composite film layer and display device |
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