CN106057864A - Flexible display panel and preparation method thereof - Google Patents
Flexible display panel and preparation method thereof Download PDFInfo
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- CN106057864A CN106057864A CN201610704703.1A CN201610704703A CN106057864A CN 106057864 A CN106057864 A CN 106057864A CN 201610704703 A CN201610704703 A CN 201610704703A CN 106057864 A CN106057864 A CN 106057864A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
The invention provides a flexible display panel and a preparation method thereof. The flexible display panel comprises a flexible substrate, an Array plate, an OLED element and a TFE layer. The preparation method is simple and comprises the steps of: etching a hard substrate and forming crisscrossed grooves; utilizing a coating or a spraying mode to coat heatproof glue on the hard substrate; then pasting the flexible substrate on the hard substrate coated by the heatproof glue, and obtaining the hard substrate pasted by the flexible substrate; successively arranging the Array plate, the OLED element and the TFE layer on the hard substrate pasted by the flexible substrate, and then carrying out lamination; and carrying out cutting along the edge of a display effective area, separating the hard substrate from the heatproof glue, the flexible substrate, the Array plate, the OLED element and the TFE layer, and obtaining the flexible display panel. The flexible display panel and the preparation method thereof effectively solve problems that the separation between an existing flexible panel and the hard substrate is difficult, and the preparation process of the flexible display panel is complex, high in cost and low in yield rate.
Description
Technical field
The present invention relates to plane display field, be specifically related to a kind of flexible panel and preparation method thereof.
Background technology
Organic light-emitting display device possesses the spies such as self-luminous, high brightness, wide viewing angle, high-contrast, deflection, low energy consumption
Property, therefore suffer from paying close attention to widely, and as the display mode of a new generation, have started to gradually replace traditional liquid crystal display device,
It is widely used on the electronic products such as mobile phone screen, computer monitor, full-color TV.
OLED Display Technique is different from traditional LCD display mode, it is not necessary to backlight, uses the thinnest organic material to be coated with
Layer and glass substrate, when there being electric current to pass through, these organic materials will be luminous.
The development of OLED Display Technique makes flexible OLED Display Technique become the rising star of panel industry.But flexible base board by
In easily deforming upon, in process of production, especially para-position, TFT (Thin Film Transistor, thin film transistor (TFT)) or
OLED film forming procedure is difficult to operate.
Along with the mankind are for the raising of the requirement of display floater, flexible panel (Flexible display) also conforms to produce
And development, flexible display has multiple advantage light, thin, collapsible, portable.
Flexible display is made up of soft material, the flexible display device of changeable type.Sensitive paper is the thinnest, even if cutting
Power down source, content also will not disappear, and is also designated as " Electronic Paper ".Arizona State state university flexible display center (FDC)
Announce a breakthrough flexible display technologies in formula of can having mercy on, the first in the world touch screen actively square developed by paneless substrate
Battle array display, this revolutionary display is to illustrate for the first time flexible electronic displays to be capable of instant user defeated
Enter.This achievement broken through is combined with the low temperature thin film transistor technology at flexible display center, Di Ren thin film company of Du Pont
High-effect PEN and the VizplexTM of E INK company, form active matrix electrophoretic (Electronic Paper) display
Device.Touch screen function is then to integrate by E INK company and the low-power consumption display controller of EPSON company joint development.
Flexible display screen employs PHOLED phosphorescent OLED technology, and the feature of this technology is, low-power consumption, and volume is little,
The most visual flexible.
Low-power consumption: this flexible touch screen display is supported to input via the instant user of writing pencil or touch, and only
Electric power just can be consumed when Electronic Paper is activated.Once delineating on screen, before the erasing, information can be stored or wireless
Send.Power consumption relatively traditional screen saves more than 30%.
Volume is little, light: display device is so far, as teleputer display, has a certain degree of heavy
Amount and thickness and volume, be fixed on the form somewhere of indoor.Flexible display has the most frivolous, deformable spy
Levy, as distinct device, it is possible to use in distinct purposes.Screen body average weight is only 20KGS/M2, than
The light 40KGS/M2 of traditional screen.The screen body thickness of flexible screen is only 10mm, thinner 150mm than traditional screen.
Display mode is various: the display mode of the flexible display that full color shows has, and plastic film etc. is formed above
Machine EL or the mode of organic semiconductor (OLED) layer.
Convenient transportation: it is cylindric that superpower pliability makes screen body to be rolled into, convenient packed and transported.
Simple installation: light control box can arbitrarily splice and not limited by orientation, more conventional display screen saves 90% peace
Dress expense.
Remarkable image quality: using of high-power SMD5050 lamp ensures that the high brightness of display screen, high-resolution picture show, reaches
The viewing effect identical with traditional screen.
Water resistance: superelevation classification of waterproof IP68, screen body can all enter water, it is adaptable to outdoor use.
In the manufacture method of existing flexible base board, first pass through the suitable PI material of selection, be then coated in advance
On ready glass substrate, to be prepared complete after by lift-off technology, PI material and glass substrate are separated i.e. again
Can.On the basis of flexible base board completes, it is further continued for making TFT element and evaporation OLED etc. i.e. can get existing flexibility
Display.
Flexible display is to be bonded on rigid substrate by flexible baseplate material, carries out the making of product, system
Separating from rigid substrate after completing, this complex process, difficulty is high again.
Flexible panel is a kind of Display Technique using polyimides (PI) as substrate, and current PI has two ways to be produced on
On the rigid substrates such as glass；
First kind of way, is to use spraying or the mode of coating (coating), PI material is produced on glass substrate
On, follow-up laser lift-off (LLO, laser left off) need to be used it to be taken off from glass substrate, this technique makes
Complexity, cost is high, and laser (laser) energy may produce certain impact showing of counter plate.
Another mode, it is simply that use high-temperature plastic, lamellar PI material is sticked on the glass substrate, panel
(display), after completing, tear off from glass substrate by flexible display by the way of tearing off.Wherein
Exotic material coating used is the thickest, and follow-up flexible display separates relatively difficult with base plate glass, and yield is low, if
The heatproof glue material of coating is the thinnest, it is possible to viscosity is inadequate, and the process made at display occurs the feelings that glass separates with substrate
Condition, causes flexible base board out-of-flatness to affect making of product.
And the manufacturing process of the Array plate in flexible base board uses photoetching technique, the most frequently used is exactly 5MASK technique, often
Procedure all includes: cleaning, film forming, coating, preliminary drying, expose, develop, dry and wet quarter, after bake, the master operation such as PR stripping.Along with
The requirement of FTF-LCD product quality is improved by people, and the high-end product such as high PPI, wide viewing angle arises at the historic moment, and these high-end products
Control to residue, underlying membrane residual etc. is more strict, and slight residue this may result in functional defect.
But in actual production process, need the Array panel products to going wrong in lithographic process to reprocess, return
Need during repairing, by the photoresist lift off on Array plate top layer, prior art to be generally adopted by wet method photoresist lift off
Method, directly at the photoresist surface spraying photoresist lift off liquid of Array plate, it is anti-that photoresist lift off liquid and photoresist carry out chemistry
Should, and then remove photoresist.But, owing to the photoresist ratio of the border area of photoetching offset plate figure is relatively thin, or at exposure imaging
Step in, at via, easily leave a thinnest layer photoetching glue, the light that this layer is the thinnest when that developer solution not being the cleanest
Photoresist is easy overbaking in post-baking step, is not easily stripped clean, can remain down some photoresists when causing reprocessing.
For the problem of above-mentioned existence, wish to seek a kind of flexible display panels in the art, and in preparation flexible face
The bonding heat-resistant adhesive realized during plate between rigid substrate from flexible base board designs in the structure that zones of different thickness is different, thus can
To save LLO technique, effectively solve flexible base board and separate difficulty with rigid substrate, prepare the complex process of flexible display panels, one-tenth
This height, the problem that yield is low.
Summary of the invention
It is an object of the invention to provide a kind of flexible display panels and preparation method thereof, save LLO technique, low cost,
Making simple, effectively solve flexible base board and separate difficulty with rigid substrate, preparation flexible display panels complex process, cost are high and good
The problem that rate is low.
To achieve these goals, the present invention provides a kind of flexible display panels and preparation method thereof.
A kind of flexible display panels includes stacking gradually the flexible base board of setting, Array plate, OLED element and TFE layer.
Described flexible base board, Array plate, OLED element and TFE layer is cascading and is coating the rigid of heat-resistant adhesive
On substrate, more described flexible base board, Array plate, OLED element are separated together with TFE layer from described rigid substrate,
To flexible display panels.
Rigid substrate in the present invention is glass substrate, quartz base plate, ceramic substrate or plastic base；
Preferably glass substrate；
Rigid substrate is carried out by the deionized water using deionized water or interpolation abluent in the present invention, to remove
Surface contaminant, described abluent can be surfactant；
Surfactant (surfactant) is described as " industry monosodium glutamate ", refers to have fixing hydrophilic and oleophilic group,
The surface of solution can align, and can make the material that surface tension is remarkably decreased.Surfactant be typically hydrophilic with
The organic amphiprotic molecule of hydrophobic group, dissolves in organic solution and aqueous solution.Hydrophilic group is often the group of polarity, as carboxylic acid,
Sulfonic acid, sulphuric acid, amino or amido and salt thereof, it is possible to be hydroxyl, amide groups, ehter bond etc.；And hydrophobic group is often nonpolar hydrocarbon chain,
Such as 8 above hydrocarbon chains of carbon atom.Surfactant is divided into ionic surfactant and nonionic surfactant etc..It is
One big class organic compound, their great characteristic of character, application extremely flexibly, extensively, has the biggest practical value and theory
Meaning.
Surfactant in the present invention is specially dodecyl sodium sulfate, sodium lauryl sulphate, dimethyl
Benzylphosphonium Bromide ammonium, alkyl polyoxyethylene 2, 2-Oxydiphenol or alkyl polyoxyethylene alcohol ether；
The present invention preferably use the deionized water adding abluent rigid substrate is carried out, to remove surface
Pollutant, described abluent is surfactant, surfactant preferably dodecyl sodium sulfate.
Preferably dodecyl sodium sulfate in the present invention.
In the present invention, heat-resistant adhesive is acrylic glue system or silica gel system；
Preferably acrylic glue system；
In the present invention, flexible base board is PI flexible base board, PEN substrate or pet substrate；
Preferably PI flexible base board；
In the present invention, OLED element includes anode, the organic material layer being formed on anode and is formed at organic material layer
On negative electrode.
The manufacturing process of the Array plate in the present invention uses photoetching technique, and the most frequently used is exactly 5MASK technique, per pass work
Sequence all includes: cleaning, film forming, coating, preliminary drying, expose, develop, dry and wet quarter, after bake, the master operation such as PR stripping；Therefore, in order to
Obtaining high-end product, Array plate is cleaned by the present invention, eliminates the slight residue causing defect.
In the present invention, the photoresist to Array plate surface carries out dry method stripping, removes the overbaking part of photoresist；?
Remove and on the photoresist of overbaking part, coat photoresist lift off liquid, carry out instead with the described photoresist having removed overbaking part
Should, the described photoresist having removed overbaking part is peeled off from described Array plate；
Also include cleaning the Array plate the most thoroughly removing photoresist；
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Active ion in state process gas and photoresist carry out chemical reaction, and photoresist is bombarded by charged particle simultaneously, remove
The overbaking part of photoresist.
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Charged particle in state process gas carries out physical bombardment to the photoresist on described Array plate surface, removes the overbaking of photoresist
Part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: existed by photoresist lift off liquid spray
Remove on the photoresist of overbaking part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: overbaking part light will have been removed
The Array plate of photoresist is immersed in photoresist lift off liquid.
By above scheme, the invention discloses for the photoresist lift off of Array plate is reprocessed, including: to institute
The photoresist stating Array plate surface carries out dry method stripping, removes the overbaking part of photoresist；At the light having removed overbaking part
Coat photoresist lift off liquid in photoresist, react with the described photoresist having removed overbaking part, removed described
The photoresist of overbaking part is peeled off from described Array plate.When the photoresist lift off of Array plate is reprocessed, use the present invention
The stripping means of disclosed Array plate photoresist, uses dry method to peel off, just can remove one layer the thinnest in lithographic process after
Drying the photoresist of overbaking in step, coat photoresist lift off liquid on remaining photoresist, photoresist lift off liquid enters with photoresist
Row reaction, removes remaining photoresist, it becomes possible to thoroughly peel off the photoresist on Array plate.
The application of flexible display panels prepared by the present invention:
Flexible display panels prepared by the present invention applies to the equipment such as portable electric appts, pen and touch input.
Flexible display panels prepared by the present invention will drive the new opplication of a series of non-friable display.
Flexible display panels prepared by the present invention can stimulate some that army and other terminal use can be made to use frivolous, sun
The very-low-pover displays can read under light inputs, storage or the application from the remote location instant data of transmission.
Flexible display panels prepared by the present invention can be used for smart mobile phone, wearable electronic based on Internet of Things and intelligence
In energy household.
The preparation method of flexible display panels comprises the following steps:
Step 1, offer rigid substrate, etch crisscross groove on rigid substrate；Surrounded between groove
The viewing area of the corresponding described flexible display panels in region；In viewing area, Further Division shows effective district again；
Heat-resistant adhesive is coated on rigid substrate by the mode of step 2, employing coating or spraying, makes the heat-resistant adhesive on rigid substrate
Flush, obtain coating the rigid substrate of heat-resistant adhesive；
Step 3, flexible base board is sticked on coating heat-resistant adhesive rigid substrate on, obtain posting the rigid base of flexible base board
Plate；
Step 4, on the rigid substrate post flexible base board, set gradually Array plate, OLED element and TFE layer, then enter
Row lamination；Cut along the edge showing effective district again, then by described flexible base board, Array plate, OLED element and TFE layer
Separate from described rigid substrate together, obtain flexible display panels.
Described rigid substrate is glass substrate, quartz base plate, ceramic substrate or plastic base；
Preferably glass substrate；
Rigid substrate is carried out by the deionized water using deionized water or interpolation abluent in the present invention, to remove
Surface contaminant, described abluent can be surfactant；
Surfactant (surfactant) is described as " industry monosodium glutamate ", refers to have fixing hydrophilic and oleophilic group,
The surface of solution can align, and can make the material that surface tension is remarkably decreased.Surfactant be typically hydrophilic with
The organic amphiprotic molecule of hydrophobic group, dissolves in organic solution and aqueous solution.Hydrophilic group is often the group of polarity, as carboxylic acid,
Sulfonic acid, sulphuric acid, amino or amido and salt thereof, it is possible to be hydroxyl, amide groups, ehter bond etc.；And hydrophobic group is often nonpolar hydrocarbon chain,
Such as 8 above hydrocarbon chains of carbon atom.Surfactant is divided into ionic surfactant and nonionic surfactant etc..It is
One big class organic compound, their great characteristic of character, application extremely flexibly, extensively, has the biggest practical value and theory
Meaning.
Surfactant in the present invention is specially dodecyl sodium sulfate, sodium lauryl sulphate, dimethyl
Benzylphosphonium Bromide ammonium, alkyl polyoxyethylene 2, 2-Oxydiphenol or alkyl polyoxyethylene alcohol ether；
The present invention preferably use the deionized water adding abluent rigid substrate is carried out, to remove surface
Pollutant, described abluent is surfactant, surfactant preferably dodecyl sodium sulfate.
Described heat-resistant adhesive is acrylic glue system or silica gel system；
Preferably acrylic glue system；
Acrylic in acrylic glue system is come Acrylics acrylic compounds and metering system by English Acrylics transliteration
The common name of acids chemicals；
Silica gel system is high temperature resistant silica gel, is a kind of common performance silica gel product of silica gel product, common silica gel is high temperature resistant degree
Between 200 DEG C～300 DEG C；In short time, as in 2h, maximum temperature can reach about 350 DEG C.
Described flexible base board is PI flexible base board, PEN substrate or pet substrate；
Preferably PI flexible base board；
PI flexible base board is due to polyimide high temperature-resistant soldering, high intensity, high-modulus, the premium properties such as fire-retardant, thus obtains
Obtained extensive application.Polyimides has prominent heat stability, good radiation hardness and chemically stable as macromolecular material
Property and excellent mechanical property.
Described is etched to acid etching or dry ecthing；
Preferably acid etching；
Described acid etching is to use HF solution to be etched；
When rigid substrate is carried out acid etching, the resin material of paraffin or the solution of resistance to HF is used to shelter from rigid substrate
Viewing area；
Described dry ecthing is to be etched rigid substrate by board equipment；
Described etches crisscross groove on rigid substrate, and the degree of depth of groove is 10 μm～50 μm；
The degree of depth of groove preferably 20 μm～40 μm；
On described viewing area, the thickness of heat-resistant adhesive is 5 μm～10 μm；
On viewing area, the thickness of heat-resistant adhesive is preferably 7 μm～8 μm；
The area of described viewing area is more than the area showing effective district.
OLED element described in step 4 includes anode, the organic material layer being formed on anode and is formed at organic material
Negative electrode on the bed of material.
The manufacturing process of the Array plate described in step 4 uses photoetching technique, and the most frequently used is exactly 5MASK technique, per pass
Operation all includes: cleaning, film forming, coating, preliminary drying, expose, develop, dry and wet quarter, after bake, the master operation such as PR stripping；Therefore, for
Acquisition high-end product, Array plate is cleaned by the present invention, eliminate the slight residue causing defect.
In the present invention, the photoresist to Array plate surface carries out dry method stripping, removes the overbaking part of photoresist；?
Remove and on the photoresist of overbaking part, coat photoresist lift off liquid, carry out instead with the described photoresist having removed overbaking part
Should, the described photoresist having removed overbaking part is peeled off from described Array plate；
Also include cleaning the Array plate the most thoroughly removing photoresist；
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Active ion in state process gas and photoresist carry out chemical reaction, and photoresist is bombarded by charged particle simultaneously, remove
The overbaking part of photoresist.
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Charged particle in state process gas carries out physical bombardment to the photoresist on described Array plate surface, removes the overbaking of photoresist
Part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: existed by photoresist lift off liquid spray
Remove on the photoresist of overbaking part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: overbaking part light will have been removed
The Array plate of photoresist is immersed in photoresist lift off liquid.
By above scheme, the invention discloses for the photoresist lift off of Array plate is reprocessed, including: to institute
The photoresist stating Array plate surface carries out dry method stripping, removes the overbaking part of photoresist；At the light having removed overbaking part
Coat photoresist lift off liquid in photoresist, react with the described photoresist having removed overbaking part, removed described
The photoresist of overbaking part is peeled off from described Array plate.When the photoresist lift off of Array plate is reprocessed, use the present invention
The stripping means of disclosed Array plate photoresist, uses dry method to peel off, just can remove one layer the thinnest in lithographic process after
Drying the photoresist of overbaking in step, coat photoresist lift off liquid on remaining photoresist, photoresist lift off liquid enters with photoresist
Row reaction, removes remaining photoresist, it becomes possible to thoroughly peel off the photoresist on Array plate.
In some embodiments, rigid substrate is carried out clearly by the deionized water using deionized water or interpolation abluent
Washing, to remove surface contaminant, described abluent can be surfactant；
Surfactant (surfactant) is described as " industry monosodium glutamate ", refers to have fixing hydrophilic and oleophilic group,
The surface of solution can align, and can make the material that surface tension is remarkably decreased.Surfactant be typically hydrophilic with
The organic amphiprotic molecule of hydrophobic group, dissolves in organic solution and aqueous solution.Hydrophilic group is often the group of polarity, as carboxylic acid,
Sulfonic acid, sulphuric acid, amino or amido and salt thereof, it is possible to be hydroxyl, amide groups, ehter bond etc.；And hydrophobic group is often nonpolar hydrocarbon chain,
Such as 8 above hydrocarbon chains of carbon atom.Surfactant is divided into ionic surfactant and nonionic surfactant etc..It is
One big class organic compound, their great characteristic of character, application extremely flexibly, extensively, has the biggest practical value and theory
Meaning.
Specifically, surfactant is specially dodecyl sodium sulfate, sodium lauryl sulphate, dimethyl benzyl
Ammonium bromide, alkyl polyoxyethylene 2, 2-Oxydiphenol or alkyl polyoxyethylene alcohol ether.
In some embodiments, rigid substrate is glass substrate.
In some embodiments, rigid substrate is quartz base plate.
In some embodiments, rigid substrate is ceramic substrate.
In some embodiments, rigid substrate is plastic base.
In some embodiments, use deionized water that rigid substrate is carried out.
In some embodiments, the deionized water adding abluent is used rigid substrate to be carried out, to remove table
Surface pollution thing, described abluent can be surfactant；Described surfactant is dodecyl sodium sulfate.
In some embodiments, the deionized water adding abluent is used rigid substrate to be carried out, to remove table
Surface pollution thing, described abluent can be surfactant；Described surfactant is sodium lauryl sulphate.
In some embodiments, the deionized water adding abluent is used rigid substrate to be carried out, to remove table
Surface pollution thing, described abluent can be surfactant；Described surfactant is dimethyl Benzylphosphonium Bromide ammonium.
In some embodiments, the deionized water adding abluent is used rigid substrate to be carried out, to remove table
Surface pollution thing, described abluent can be surfactant；Described surfactant is alkyl polyoxyethylene 2, 2-Oxydiphenol.
In some embodiments, the deionized water adding abluent is used rigid substrate to be carried out, to remove table
Surface pollution thing, described abluent can be surfactant；Described surfactant is alkyl polyoxyethylene alcohol ether.
In some embodiments, OLED element includes anode, the organic material layer being formed on anode and has been formed at
Negative electrode on machine material layer.
In some embodiments, etching crisscross groove on rigid substrate, rigid substrate is split by groove
Becoming many sub regions, the region that groove surrounds is viewing area；Divide in viewing area again and show effective district；The program is passed through machine
Platform equipment carries out part removal to rigid substrate, obtains multiple groove, and its forming method the most easily realizes；The degree of depth phase of groove
With, the degree of depth of groove is 10 μm～50 μm；The degree of depth of groove is preferably 20 μm～40 μm；
The degree of depth of concrete groove is preferably 30 μm；
Owing to the heat-resistant adhesive in groove is thicker, enough viscosity is had to be adhered on rigid substrate by flexible base board, and
The heat-resistant adhesive ratio of viewing area is relatively thin, and viscosity is relatively small, and after cutting, flexible display panels is easy to take from rigid substrate
Under.
The width of groove is identical in some embodiments, and the width of groove is 10 μm～50 μm；The width of groove is preferred
It is 20 μm～30 μm；
Make the position of each groove identical by thermal stress and caking property by this set, advantageously ensure that whole flexible base
Plate institute stress, by thermal balance.
Groove on rigid substrate is crisscross in certain embodiments, is divided into by rigid substrate and multiple has regular shape
The subregion of shape, these subregions can reduce the concentration of thermal stress suffered by the edge to flexible base board further, and, these
The setting of groove also helps and is easier to flexible display panels is cut into some in successive process；
In certain embodiments, the region that groove surrounds is viewing area；
Divide in viewing area again and show effective district；
Cut along the outward flange showing effective district in the display area during cutting；
The area of viewing area is more than the area showing effective district；
The area of viewing area damages when being to avoid cutting more than the area showing effective district and shows effective district；
This setting can make to be distributed on the less area of the regional of flexible base board less thermal stress, i.e. reduces soft
Property thermal stress suffered by substrate edges, thus avoid the warping phenomenon that is heated at glass substrate edge.
In certain embodiments, rigid substrate is divided into different regions, i.e. groove and shows effective district；
The glue thickness of groove is 15 μm～60 μm；
Glue thickness at viewing area is 5 μm～10 μm.
In certain embodiments, using the mode of coating to be coated on rigid substrate by heat-resistant adhesive, make on rigid substrate is resistance to
Hot glue flushes, and obtains coating the rigid substrate of heat-resistant adhesive；
Wherein, the glue thickness at rigid substrate upper groove is 15 μm～60 μm；
Show on rigid substrate that the glue thickness at effective district is 10 μm～50 μm.
Thickness on rigid substrate is identical makes rigid substrate and flexible base board smooth time bonding, stress and being heated all
Even.
Owing to the heat-resistant adhesive in groove is thicker, enough viscosity is had to be adhered on rigid substrate by flexible base board, and
The heat-resistant adhesive ratio of viewing area is relatively thin, and viscosity is relatively small, and after cutting, flexible display panels is easy to take from rigid substrate
Under；
In certain embodiments, using the mode of spraying to be coated on rigid substrate by heat-resistant adhesive, make on rigid substrate is resistance to
Hot glue flushes, and obtains coating the rigid substrate of heat-resistant adhesive；
Wherein, the glue thickness at rigid substrate upper groove is 15 μm～60 μm；
Show on rigid substrate that the glue thickness at effective district is 10 μm～50 μm.
Glue thickness on rigid substrate is identical makes rigid substrate and flexible base board smooth time bonding, stress and being heated all
Even.
In certain embodiments, flexible base board is tiled by roller bearing rolling and vac sorb is in being coated with the hard of heat-resistant adhesive
On property substrate.
In certain embodiments, the rigid substrate post flexible base board sets gradually Array plate, OLED element and
TFE layer, then be laminated；Cut along the edge showing effective district again；
Again described flexible base board, Array plate, OLED element are separated together with TFE layer from described rigid substrate,
To flexible display panels.
Therefore this flexible display panels is smooth and is not susceptible to deformation, the most operable.
Beneficial effects of the present invention:
One, one flexible display panels plate of the present invention and preparation method thereof, method is simple, by etching on rigid substrate
Crisscross groove, forms viewing area；Heat-resistant adhesive is coated again, owing to the heat-resistant adhesive in groove compares on groove and viewing area
Thickness, has 15 μm～60 μ m-thick, has enough viscosity to be sticked on rigid substrate by flexible base board, and shows that the glue in effective district compares
Thin, there are 5 μm～10 μm, viscosity is the most comparatively small, after cutting, shows that the heat-resistant adhesive between effective district and rigid substrate is thin,
So easily flexible base board is taken off from rigid substrate；By the thickness of zones of different heat-resistant adhesive on change rigid substrate not
With, reduce the technology difficulty that flexible base board takes off from rigid substrate, compared with prior art, eliminate existing LLO technique,
Low cost, preparation is simple；
Two, the flexible display panels that prepared by the present invention is smooth, and production cost reduces, and compared with prior art, cost reduces
50%～60%；Product yield improves, and product yield is up to 99%～100%；
Three, the present invention effectively solves existing flexible panel and separates difficulty with rigid substrate, prepares flexible display panels work
Skill is complicated, cost is high, the problem that yield is low.
Above-mentioned technical characteristic can combine in any suitable manner or be substituted, as long as can reach by the technical characteristic of equivalence
To the purpose of the present invention.
Accompanying drawing explanation
Hereinafter based on embodiment reference accompanying drawing, the present invention will be described in more detail.Wherein:
Fig. 1 is the schematic diagram of the rigid substrate etching groove of the present invention one better embodiment；
Fig. 2 is the schematic diagram of the rigid substrate of the coating heat-resistant adhesive of the present invention one better embodiment；
Fig. 3 is the schematic diagram of the rigid substrate posting flexible base board of the present invention one better embodiment；
Fig. 4 is that the post rigid substrate of flexible base board, Array plate, OLED element and TFE layer after being laminated are illustrated
Figure；
Fig. 5 is the schematic diagram carrying out along the edge showing effective district in the present invention one better embodiment cutting；
Fig. 6 is the schematic diagram of the flexible display panels that the present invention one better embodiment obtains；
Fig. 7 is the flexible display panels preparation method flow chart that the present invention one better embodiment obtains.
In the accompanying drawings, identical parts use identical reference.Accompanying drawing is not according to actual ratio.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
Referring to Fig. 1～7, the present invention provides the preparation method of a kind of flexible display panels.
Step 1, offer rigid substrate 20, etch crisscross groove 21 on rigid substrate 20；Between groove 21
The viewing area 22 of the corresponding described flexible display panels of area defined；In viewing area 22, Further Division shows effective district again
23；
As shown in Figure 1；Fig. 1 is the schematic diagram of the rigid substrate etching groove of the present invention one better embodiment；
In Fig. 1,20 is rigid substrate, and 21 is groove, and 22 is viewing area, and 23 for showing effective district；
Described rigid substrate 20 is glass substrate, quartz base plate, ceramic substrate or plastic base；
In the present embodiment, rigid substrate 20 is glass substrate；
Described is etched to acid etching or dry ecthing；
The present embodiment uses acid etching；
Acid etching is to use HF solution to be etched；
When rigid substrate is carried out acid etching, the resin material of paraffin or the solution of resistance to HF is used to shelter from rigid substrate
Viewing area；
The present embodiment use paraffin shelter from the viewing area on rigid substrate；
The region that described groove 21 surrounds is viewing area 22；Divide in viewing area again and show effective district 23；
The degree of depth of groove is 10 μm～50 μm；
The degree of depth of the present embodiment further groove is 30 μm；
The width of groove is 10 μm～50 μm；
The width of the present embodiment further groove is 40 μm；
The area of viewing area 22 is more than the area showing effective district 23；
The area of viewing area 22 damages when being to avoid cutting more than the area showing effective district 23 and shows effective district；
The region that described groove 21 surrounds be viewing area 22 be regular figure, it is simple to cutting；
The region that the present embodiment further groove 21 surrounds be viewing area 22 be rectangle；
Divide in viewing area and show effective district 23；Show that effective district 23 is regular figure, it is simple to cutting；
The present embodiment showing, effective district 23 is rectangle；
Show that the edge in effective district 23 and the Edge Distance of groove 21 are more than 10 μm；
Rigid substrate is carried out, to go by the deionized water using deionized water or interpolation abluent in the present embodiment
Except surface contaminant, described abluent can be surfactant；
Surfactant (surfactant) is described as " industry monosodium glutamate ", refers to have fixing hydrophilic and oleophilic group,
The surface of solution can align, and can make the material that surface tension is remarkably decreased.Surfactant be typically hydrophilic with
The organic amphiprotic molecule of hydrophobic group, dissolves in organic solution and aqueous solution.Hydrophilic group is often the group of polarity, as carboxylic acid,
Sulfonic acid, sulphuric acid, amino or amido and salt thereof, it is possible to be hydroxyl, amide groups, ehter bond etc.；And hydrophobic group is often nonpolar hydrocarbon chain,
Such as 8 above hydrocarbon chains of carbon atom.Surfactant is divided into ionic surfactant and nonionic surfactant etc..It is
One big class organic compound, their great characteristic of character, application extremely flexibly, extensively, has the biggest practical value and theory
Meaning.
Described surfactant is specially dodecyl sodium sulfate, sodium lauryl sulphate, dimethyl benzyl
Ammonium bromide, alkyl polyoxyethylene 2, 2-Oxydiphenol or alkyl polyoxyethylene alcohol ether；
The present embodiment preferably use the deionized water adding abluent rigid substrate is carried out, to remove table
Surface pollution thing, described abluent is surfactant, surfactant preferably dodecyl sodium sulfate；
Heat-resistant adhesive 30 is coated on rigid substrate 20 by the mode of step 2, employing coating or spraying, makes on rigid substrate 20
Heat-resistant adhesive 30 flushes uniformly；Obtain coating the rigid substrate of heat-resistant adhesive；
As shown in Figure 2；Fig. 2 is the schematic diagram of the rigid substrate of the coating heat-resistant adhesive of the present invention one better embodiment；
In Fig. 2,20 is rigid substrate, and 30 is heat-resistant adhesive；
Heat-resistant adhesive 30 is coated on rigid substrate 20 by the described mode using coating or spraying；
Heat-resistant adhesive 30 is coated on rigid substrate 20 by the mode using coating in the present embodiment；
Described heat-resistant adhesive 30 is acrylic glue system or silica gel system；
Acrylic in acrylic glue system is come Acrylics acrylic compounds and metering system by English Acrylics transliteration
The common name of acids chemicals；
Silica gel system is high temperature resistant silica gel, is a kind of common performance silica gel product of silica gel product, common silica gel is high temperature resistant degree
Between 200 DEG C～300 DEG C；In short time, as in 2h, maximum temperature can reach about 350 DEG C.
Heat-resistant adhesive 30 in the present embodiment preferably acrylic glue system；
The described glue thickness at groove 21 is 15 μm～60 μm；
Glue thickness at the present embodiment further groove 21 is preferably 40 μm；
Glue thickness at viewing area 22 is 5 μm～10 μm；
In the present embodiment, the glue thickness at viewing area 22 is preferably 10 μm；
Owing to the heat-resistant adhesive 30 in groove 21 is the thickest, there is enough viscosity, and the heat-resistant adhesive 30 in viewing area 22 compares
Thin, viscosity is relatively small；
Step 3, flexible base board 40 is sticked on coating heat-resistant adhesive rigid substrate on, obtain posting the rigid of flexible base board
Substrate；
As shown in Figure 3；Fig. 3 is the schematic diagram of the rigid substrate posting flexible base board of the present invention one better embodiment；
In Fig. 3,20 is rigid substrate, and 30 is heat-resistant adhesive, and 40 is flexible base board；
Wherein, the glue thickness at rigid substrate 20 upper groove 21 is 15 μm～60 μm；
Glue thickness at the present embodiment further groove 21 is preferably 40 μm；
Show on rigid substrate 20 that the glue thickness at effective district 23 is 10 μm～50 μm.
In the present embodiment, the glue thickness at viewing area 22 is preferably 10 μm；
Owing to the heat-resistant adhesive 30 in groove 21 is the thickest, it is 40 μm；Enough viscosity is had to be adhered to firmly by flexible base board 40
On property substrate 20, and heat-resistant adhesive 30 ratio in viewing area 22 is relatively thin, is 10 μm；Viscosity is relatively small, after cutting, flexible aobvious
Show panel to be easy to from rigid substrate to take off；
Glue thickness on rigid substrate 20 is identical so that rigid base, and 20 is smooth time bonding with flexible base board 40, stress and
It is heated evenly；
Rigid substrate 20 is divided into multiple subregion with regular shape, and it is right that these subregions can reduce further
The concentration of thermal stress suffered by the edge of flexible base board 40, and, the setting of these grooves 21 also helps in successive process more
Easily flexible display panels is cut into some；
Described flexible base board 40 is PI flexible base board, PEN substrate or pet substrate；
Flexible base board 40 preferably PI flexible base board in the present embodiment；
PI flexible base board 40 due to polyimide high temperature-resistant soldering, high intensity, high-modulus, the premium properties such as fire-retardant, thus
It is applied widely.Polyimides has prominent heat stability as macromolecular material, and good radiation hardness and chemistry are steady
Qualitative and excellent mechanical property.
In the present embodiment, by flexible base board 40 by roller bearing rolling tiling also vac sorb in being coated with the rigid of heat-resistant adhesive
On substrate；
Step 4, on the rigid substrate post flexible base board, set gradually Array plate 50, OLED element 60 and TFE layer
70, then be laminated；Cut along the edge showing effective district again；
Again by described flexible base board 20, Array plate 50, OLED element 60 together with TFE layer 70 from described rigid substrate
Separate, obtain flexible display panels.
After being laminated as shown in Figure 4；Fig. 4 be after being laminated post the rigid substrate of flexible base board, Array plate,
OLED element and TFE layer schematic diagram；
In Fig. 4,20 is rigid substrate, and 30 is heat-resistant adhesive, and 40 is flexible base board, and 50 is Array plate, and 60 is OLED element, 70
For TFE layer；
Cutting is as shown in Figure 5；Fig. 5 is to carry out cutting along the edge showing effective district in the present invention one better embodiment
Schematic diagram；
In Fig. 5,22 is viewing area, and 23 for showing effective district；
The flexible display panels obtained in the present embodiment is as shown in Figure 6；Fig. 6 is that the present invention one better embodiment obtains
The schematic diagram of flexible display panels；
In Fig. 6,40 is flexible base board, and 50 is Array plate, and 60 is OLED element, and 70 is TFE layer.
Fig. 7 is the flexible display panels preparation method flow chart that the present invention one better embodiment obtains.
The manufacturing process of the Array plate described in the present embodiment step 4 uses photoetching technique, and that the most frequently used is exactly 5MASK
Technique, every procedure all includes: cleaning, film forming, coating, preliminary drying, expose, develop, dry and wet quarter, after bake, the main work such as PR stripping
Sequence；Therefore, in order to obtain high-end product, Array plate is cleaned by the present embodiment, eliminates the slight residual causing defect
Thing.
In the present embodiment, the photoresist to Array plate surface carries out dry method stripping, removes the overbaking part of photoresist；?
Coat photoresist lift off liquid on photoresist through removing overbaking part, carry out instead with the described photoresist having removed overbaking part
Should, the described photoresist having removed overbaking part is peeled off from described Array plate；
Also include cleaning the Array plate the most thoroughly removing photoresist；
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Active ion in state process gas and photoresist carry out chemical reaction, and photoresist is bombarded by charged particle simultaneously, remove
The overbaking part of photoresist.
The photoresist on described Array plate surface is carried out dry method stripping, and the overbaking part removing photoresist includes: plasma
Charged particle in state process gas carries out physical bombardment to the photoresist on described Array plate surface, removes the overbaking of photoresist
Part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: existed by photoresist lift off liquid spray
Remove on the photoresist of overbaking part.
The photoresist having removed overbaking part coats photoresist lift off liquid include: overbaking part light will have been removed
The Array plate of photoresist is immersed in photoresist lift off liquid.
The present embodiment preferably carries out dry method stripping to the photoresist on Array plate surface；
Including: the active ion in plasma state process gas and photoresist carry out chemical reaction, simultaneously charged particle pair
Photoresist bombards, and removes the overbaking part of photoresist；
Remove the overbaking part of photoresist；
The photoresist having removed overbaking part coats photoresist lift off liquid, with the described overbaking part removed
Photoresist reacts；
Including: the Array plate having removed overbaking part photoresist is immersed in photoresist lift off liquid；
The described photoresist having removed overbaking part is peeled off from described Array plate；
Clean the Array plate the most thoroughly removing photoresist；
Owing to the heat-resistant adhesive 30 in the groove 21 on rigid substrate 20 is the thickest, enough viscosity is had to be glued by flexible base board 40
Being attached on rigid substrate 20, and heat-resistant adhesive 30 ratio in viewing area 22 is relatively thin, viscosity is relatively small, after cutting, flexible aobvious
Show panel to be easy to from rigid substrate 20 to take off；
Cut along the outward flange showing effective district 23 in viewing area 22 during cutting；
OLED element described in the present embodiment step 4 includes anode, the organic material layer being formed on anode and is formed
Negative electrode on organic material layer.
Therefore flexible display panels in the present embodiment is smooth and is not susceptible to deformation, the most operable.
The application of flexible display panels prepared by the present embodiment:
Flexible display panels prepared by the present embodiment applies to the equipment such as portable electric appts, pen and touch input.
Flexible display panels prepared by the present embodiment will drive the new opplication of a series of non-friable display.
Flexible display panels prepared by the present embodiment can stimulate some that army and other terminal use can be made to use frivolous,
The very-low-pover displays can read under sunlight inputs, storage or the application from the remote location instant data of transmission.
Flexible display panels prepared by the present embodiment can be used for smart mobile phone, wearable electronic based on Internet of Things and
In Smart Home.
The beneficial effect of the present embodiment:
One, the present embodiment one flexible display panels and preparation method thereof, method is simple, by etching on rigid substrate
Crisscross groove, forms viewing area；Heat-resistant adhesive is coated again, owing to the heat-resistant adhesive in groove compares on groove and viewing area
Thickness, has 15 μm～60 μ m-thick, has enough viscosity to be sticked on rigid substrate by flexible base board, and shows that the glue in effective district compares
Thin, there are 5 μm～10 μm, viscosity is the most comparatively small, after cutting, shows that the heat-resistant adhesive between effective district and rigid substrate is thin,
So easily flexible base board is taken off from rigid substrate；By the thickness of zones of different heat-resistant adhesive on change rigid substrate not
With, reduce the technology difficulty that flexible base board takes off from rigid substrate, compared with prior art, eliminate existing LLO technique,
Low cost, preparation is simple；
Two, the flexible display panels that prepared by the present embodiment is smooth, and production cost reduces, and compared with prior art, cost drops
Low by 50%～60%；Product yield improves, and product yield is up to 99%～100%；
Three, the present embodiment effectively solves existing flexible panel and separates difficulty with rigid substrate, prepares flexible display panels
Complex process, cost are high, the problem that yield is low.
Although herein with reference to specific embodiment, the present invention is described it should be understood that, these are real
Execute the example that example is only principles and applications.It should therefore be understood that exemplary embodiment can be carried out
Many amendments, and can be designed that other layout, without departing from the spirit of the present invention that claims are limited
And scope.It should be understood that and can combine different appurtenances by being different from original claim manner described
Profit requires and feature specifically described herein.Will also be appreciated that combining the feature described by independent embodiment can use
In other described embodiments.
Claims (12)
1. a flexible display panels, it is characterised in that described flexible display panels includes the flexible base stacking gradually setting
Plate, Array plate, OLED element and TFE layer.
2. a kind of flexible display panels as claimed in claim 1, it is characterised in that in the fabrication process, described flexible base
Plate, Array plate, OLED element and TFE layer are cascading on the rigid substrate of coating heat-resistant adhesive, then by described flexible base
Plate, Array plate, OLED element are separated together with TFE layer from described rigid substrate, obtain flexible display panels.
3. flexible display panels as claimed in claim 2 a kind of, it is characterised in that described rigid substrate be glass substrate,
Quartz base plate, ceramic substrate or plastic base.
4. a kind of flexible display panels, it is characterised in that described heat-resistant adhesive is acrylic glue
System or silica gel system.
5. a kind of flexible display panels as described in any one in claims 1 to 3, it is characterised in that described flexible base
Plate is PI flexible base board, PEN substrate or pet substrate.
The preparation method of a kind of flexible display panels the most as claimed in claim 1, it is characterised in that this preparation method include with
Lower step:
Step 1, offer rigid substrate, etch crisscross groove on rigid substrate；Area defined between groove
The viewing area of corresponding described flexible display panels；In viewing area, Further Division shows effective district again；
Heat-resistant adhesive is coated on rigid substrate by the mode of step 2, employing coating or spraying, makes the heat-resistant adhesive on rigid substrate neat
Flat, obtain coating the rigid substrate of heat-resistant adhesive；
Step 3, flexible base board is sticked on coating heat-resistant adhesive rigid substrate on, obtain posting the rigid substrate of flexible base board；
Step 4, on the rigid substrate post flexible base board, set gradually Array plate, OLED element and TFE layer, then carry out layer
Pressure；Cut along the edge showing effective district again, then by described flexible base board, Array plate, OLED element together with TFE layer
Separate from described rigid substrate, obtain flexible display panels.
The preparation method of a kind of flexible display panels the most as claimed in claim 6, it is characterised in that the degree of depth of described groove
It is 10 μm～50 μm.
The preparation method of a kind of flexible display panels the most as claimed in claims 6 or 7, it is characterised in that described viewing area
The thickness of upper heat-resistant adhesive is 5 μm～10 μm.
The preparation method of a kind of flexible display panels the most as claimed in claims 6 or 7, it is characterised in that described is etched to
Acid etching or dry ecthing.
The preparation method of a kind of flexible display panels the most as claimed in claims 6 or 7, it is characterised in that described viewing area
Area more than show effective district area.
The preparation method of 11. a kind of flexible display panels as claimed in claims 6 or 7, it is characterised in that described OLED unit
Part includes anode, the organic material layer being formed on anode and the negative electrode being formed on organic material layer.
The preparation method of 12. a kind of flexible display panels as claimed in claims 6 or 7, it is characterised in that described groove
Width is preferably 20 μm～30 μm.
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