CN111207614A - Manufacturing method of vapor chamber and vapor chamber structure - Google Patents
Manufacturing method of vapor chamber and vapor chamber structure Download PDFInfo
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- CN111207614A CN111207614A CN201811401729.4A CN201811401729A CN111207614A CN 111207614 A CN111207614 A CN 111207614A CN 201811401729 A CN201811401729 A CN 201811401729A CN 111207614 A CN111207614 A CN 111207614A
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- metal plate
- plate body
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- frequency ultrasonic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
A manufacturing method of a vapor chamber comprises the following steps: providing a first metal plate body and a second metal plate body; arranging a capillary structure on at least one of the first metal plate body and the second metal plate body, and arranging a supporting structure between the first metal plate body and the second metal plate body; the first metal plate and the second metal plate are correspondingly covered, the first metal plate and the second metal plate are jointed by high-frequency ultrasonic waves (the frequency is 20 KHz-80 KHz), and the first metal plate and the second metal plate are vacuumized and filled with working fluid. Therefore, the sintering furnace process is not needed, and the rapid combination is realized, so that the productivity is increased and the cost is reduced.
Description
Technical Field
The present invention relates to a method for manufacturing a vapor chamber and a vapor chamber structure, and more particularly, to a method for manufacturing a vapor chamber and a vapor chamber structure for providing heat transfer through cyclic variation of gas phase and liquid phase.
Background
In addition to the miniaturization of the device, the amount of heat generated by the device is also greatly increased, and the amount of heat generated during the operation is considerable. The electronic heating components are provided with corresponding radiators or heat dissipation devices so as to keep the electronic heating components to normally operate at an allowable temperature. In addition, heat transfer through a heat pipe or a vapor chamber is also an application of the prior art, and the vapor chamber and the heat pipe have the same principle and provide heat transfer through the cyclic change of gas-liquid phase.
The vapor chamber (vapor chamber) has the characteristics of high heat transfer capacity, high heat transfer rate, light weight, simple structure, multiple purposes and the like, so that the vapor chamber is widely applied to the heat conduction of the electronic heating component, and the heat collection phenomenon of the electronic heating component at the present stage is effectively solved by rapidly conducting away the heat of the electronic heating component.
However, the conventional vapor chamber requires a diffusion welding process or a laser process, and the diffusion welding equipment requires a vacuum hot pressing sintering furnace (sintering furnace for short), and the conventional sintering process takes about 8 hours, the production time is too long, the yield is low, and it is difficult to increase the productivity and reduce the cost.
Disclosure of Invention
The present invention is directed to a method for manufacturing a vapor chamber and a vapor chamber structure, which can shorten the production time, increase the yield, increase the productivity and reduce the cost without using a sintering furnace process.
In order to solve the above technical problem, the present invention provides a method for manufacturing a vapor chamber, comprising: providing a first metal plate body and a second metal plate body; arranging a capillary structure on at least one of the first metal plate body and the second metal plate body, wherein the capillary structure is positioned in a cavity defined by the first metal plate body and the second metal plate body together, and arranging a supporting structure between the first metal plate body and the second metal plate body; and correspondingly covering the first metal plate body and the second metal plate body, sealing the periphery of the first metal plate body and the periphery of the second metal plate body by high-frequency ultrasonic bonding with the frequency of 20 KHz-80 KHz, forming a closed space in the cavity, vacuumizing and filling working fluid.
Preferably, the first metal plate and the second metal plate are plate-shaped, and the periphery of the first metal plate and the periphery of the second metal plate are pressed in a rolling manner and then joined by high-frequency ultrasonic waves.
Preferably, the capillary structure is bonded to at least one of the first metal plate and the second metal plate by using high-frequency ultrasonic waves with a frequency of 20KHz to 80KHz, the support structure is bonded to the first metal plate and the second metal plate by using high-frequency ultrasonic waves with a frequency of 20KHz to 80KHz, and the support structure is used for preventing deformation when being bonded with the electronic heating component.
Preferably, the capillary structure is pressed by rolling and then bonded to at least one of the first metal plate and the second metal plate by high-frequency ultrasonic waves.
Preferably, the supporting structure comprises a plurality of supporting pillars, and the supporting pillars are pressed in a rolling manner and then respectively bonded to the first metal plate and the second metal plate by high-frequency ultrasonic waves.
In order to solve the above technical problem, the present invention further provides a vapor chamber structure, including: a first metal plate; at least one of the first metal plate body and the second metal plate body is provided with a capillary structure, and the capillary structure is positioned in a cavity defined by the first metal plate body and the second metal plate body; the supporting structure is arranged between the first metal plate body and the second metal plate body; the first metal plate and the second metal plate are correspondingly covered, the periphery of the first metal plate and the periphery of the second metal plate are jointed and sealed by high-frequency ultrasonic wave with the frequency of 20 KHz-80 KHz, so that the cavity forms a closed space, and the vacuum pumping and the filling of working fluid are carried out.
Preferably, the first metal plate and the second metal plate are plate-shaped, and the periphery of the first metal plate and the periphery of the second metal plate are pressed in a rolling manner and then joined by high-frequency ultrasonic waves.
Preferably, the capillary structure is bonded to at least one of the first metal plate and the second metal plate by using high-frequency ultrasonic waves with a frequency of 20KHz to 80KHz, the support structure is bonded to the first metal plate and the second metal plate by using high-frequency ultrasonic waves with a frequency of 20KHz to 80KHz, and the support structure is used for preventing deformation when being bonded with the electronic heating component.
Preferably, the capillary structure is pressed by rolling and then bonded to at least one of the first metal plate and the second metal plate by high-frequency ultrasonic waves.
Preferably, the supporting structure comprises a plurality of supporting pillars, and the supporting pillars are pressed in a rolling manner and then respectively bonded to the first metal plate and the second metal plate by high-frequency ultrasonic waves.
The invention has the beneficial effects that:
the first metal plate body and the second metal plate body are jointed and sealed by high-frequency ultrasonic waves, and the capillary structure and the supporting structure can also be jointed with the first metal plate body and the second metal plate body by the high-frequency ultrasonic waves. Therefore, the manufacturing method of the temperature-equalizing plate and the temperature-equalizing plate structure do not need a sintering furnace or a sintering furnace manufacturing process, can reduce the traditional sintering production time to about 8 hours and 20-60 seconds, can shorten the production time, improve the qualification rate, increase the productivity and reduce the cost.
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, which is to be read in connection with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to be limiting.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a vapor chamber according to the present invention.
FIG. 2 is an exploded perspective view of the temperature equalization plate structure of the present invention.
FIG. 3 is a cross-sectional view of a vapor chamber structure according to the present invention.
FIG. 4 is an exploded perspective view of another embodiment of the temperature equalization plate structure of the present invention.
Detailed Description
[ first embodiment ]
Please refer to fig. 1 to 3, which are preferred embodiments of the present invention, and it should be noted that, in the embodiments, related numbers and shapes are mentioned in the drawings for describing the embodiments of the present invention in detail only, so as to facilitate the understanding of the contents, but not to limit the scope of the present invention.
The invention provides a manufacturing method of a vapor chamber, which comprises the following steps:
first, a first metal plate 1 and a second metal plate 2 are provided, which are made of metal with good thermal conductivity, such as copper or aluminum, and the first metal plate 1 and the second metal plate 2 are plate-shaped bodies and can be formed by a stamping process, and the sizes of the first metal plate 1 and the second metal plate 2 are not limited and can be changed as required. The first metal plate 1 and the second metal plate 2 can be used as an upper cover and a lower cover of the temperature equalizing plate, respectively, in this embodiment, the first metal plate 1 is a planar plate and can be used as a welding part with the heat dissipating fins, and the second metal plate 2 is a lower cover and can be used as a heat source contact end to form a groove-type cavity.
Then, at least one of the first metal plate 1 and the second metal plate 2 is provided with a capillary structure, in this embodiment, the first metal plate 1 and the second metal plate 2 are both provided with capillary structures, that is, one side of the first metal plate 1 corresponding to one side of the second metal plate 2 is provided with capillary structures 3 and 4, the type and structure of the capillary structures 3 and 4 are not limited, the capillary structures 3 and 4 can be various existing capillary structures, and the capillary structures 3 and 4 can achieve the effect of adsorption and circulation of the working fluid by using capillary action. In this embodiment, the capillary structure 3 may be a metal mesh (e.g., a copper mesh), the capillary structure 4 may be metal powder (e.g., copper powder), and the capillary structures 3 and 4 are respectively disposed on opposite sides of the first metal plate 1 and the second metal plate 2, so that the capillary structures 3 and 4 can be located in the cavity 21 defined by the first metal plate 1 and the second metal plate 2. The capillary structures 3 and 4 can be respectively bonded to the first metal plate body 1 and the second metal plate body 2 by high-frequency ultrasonic waves, the capillary structures 3 and 4 can be pressed by a rolling manner, and then the capillary structures are respectively bonded to the first metal plate body 1 and the second metal plate body 2 by the high-frequency ultrasonic waves.
In addition, a supporting structure 5 is arranged between the first metal plate body 1 and the second metal plate body 2, the type and the structure of the supporting structure 5 are not limited, the supporting structure 5 can be various existing supporting structures, and the supporting structure 5 is mainly used for preventing deformation when being combined with an electronic heating component, so that the first metal plate body 1 and the second metal plate body 2 are prevented from deforming and collapsing, and the temperature-equalizing plate has better strength. The invention does not need to use high-temperature sintering and can not deform in the process. In the present embodiment, the supporting structure 5 includes a plurality of supporting pillars 51, the supporting pillars 51 may be copper pillars (metal pillars), and the supporting pillars 51 may be bonded to the first metal plate 1 and the second metal plate 2 by using high frequency ultrasonic waves, that is, two ends of the supporting pillars 51 are bonded to the first metal plate 1 and the second metal plate 2, respectively. The supporting pillars 51 may be pressed by rolling, and then bonded to the first metal plate 1 and the second metal plate 2 by high frequency ultrasonic waves.
The first metal plate 1 and the second metal plate 2 are correspondingly covered, the periphery of the first metal plate 1 and the periphery of the second metal plate 2 are sealed by high-frequency ultrasonic bonding, so that the cavity 21 forms a closed space, and the working fluid is pumped and filled. The working fluid is a working fluid with low boiling point, and can be pure water, methanol, refrigerant, acetone or ammonia, and the like, so that the aims of rapid heat transfer and uniform heat transfer are achieved by utilizing the phase change of the working fluid. The periphery of the first metal plate 1 and the periphery of the second metal plate 2 may be pressed in a rolling manner and then joined by high frequency ultrasonic waves.
The present invention further provides a vapor chamber structure, which includes a first metal plate 1, a second metal plate 2 and a supporting structure 5. At least one of the first metal plate 1 and the second metal plate 2 is provided with a capillary structure, in this embodiment, one side of the first metal plate 1 corresponding to one side of the second metal plate 2 is provided with a capillary structure 3, 4, the capillary structure 3 may be a metal mesh (e.g., a copper mesh), the capillary structure 4 may be metal powder (e.g., copper powder), and the capillary structures 3, 4 may be located in a cavity 21 defined by the first metal plate 1 and the second metal plate 2. The capillary structures 3 and 4 may be bonded to the first metal plate 1 and the second metal plate 2, respectively, using high frequency ultrasound.
The supporting structure 5 is disposed between the first metal plate 1 and the second metal plate 2, in this embodiment, the supporting structure 5 includes a plurality of supporting pillars 51, the supporting pillars 51 may be copper pillars (metal pillars), and the supporting pillars 51 may be bonded to the first metal plate 1 and the second metal plate 2 by high-frequency ultrasonic bonding.
The first metal plate 1 and the second metal plate 2 are correspondingly covered, the periphery of the first metal plate 1 and the periphery of the second metal plate 2 are sealed by high-frequency ultrasonic bonding, so that the cavity 21 forms a closed space, and the vacuum pumping and the filling of the working fluid are performed. Thus, a temperature equalizing plate structure is formed. Since the structure of the vapor chamber of the present invention has been described in detail in the above embodiments, further description is omitted.
The working fluid in the temperature equalizing plate structure can absorb heat in the evaporation area to be vaporized and quickly expand to the whole cavity 21, the heat is released in the condensation area to be condensed into liquid, the liquid working fluid can return to the evaporation area through the capillary structures 3 and 4, and the heat can be quickly transferred by circulation.
In the above-mentioned manufacturing process of high-frequency ultrasonic bonding, the frequency of the high-frequency ultrasonic wave is 20KHz to 80KHz, such as 20KHz, 30KHz, 40KHz, 50KHz, 60KHz, 70KHz or 80KHz, etc., the high-frequency ultrasonic bonding (welding) is to connect the same metal or dissimilar metals by using the mechanical vibration energy of the ultrasonic frequency.
[ second embodiment ]
Referring to fig. 4, which is a second embodiment of the present invention, in this embodiment, the capillary structure 3 may be a metal powder (e.g., copper powder), the capillary structure 4 may be a metal mesh (e.g., copper mesh), and the capillary structures 3 and 4 are disposed on opposite sides of the first metal plate body 1 and the second metal plate body 2.
The invention has the characteristics and functions that:
the first metal plate 1 and the second metal plate 2 are bonded and sealed by high-frequency ultrasonic waves, and the capillary structures 3 and 4 and the supporting structure 5 can also be bonded to the first metal plate 1 and the second metal plate 2 by high-frequency ultrasonic waves. Therefore, the manufacturing method of the temperature-equalizing plate and the temperature-equalizing plate structure do not need a sintering furnace or a sintering furnace manufacturing process, can reduce the traditional sintering production time to about 8 hours and 20-60 seconds, can shorten the production time, improve the qualification rate, increase the productivity and reduce the cost.
It should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that equivalent changes made by using the contents of the present specification and the drawings are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a vapor chamber is characterized by comprising the following steps:
providing a first metal plate body and a second metal plate body;
arranging a capillary structure on at least one of the first metal plate body and the second metal plate body, wherein the capillary structure is positioned in a cavity defined by the first metal plate body and the second metal plate body together, and a supporting structure is arranged between the first metal plate body and the second metal plate body; and
correspondingly covering the first metal plate body and the second metal plate body, sealing the periphery of the first metal plate body and the periphery of the second metal plate body by high-frequency ultrasonic bonding with the frequency of 20 KHz-80 KHz, forming a closed space in the cavity, and vacuumizing and filling working fluid.
2. The method of claim 1, wherein the first metal plate and the second metal plate are plate-shaped, and the first metal plate and the second metal plate are joined by rolling and ultrasonic bonding at high frequency.
3. The method of claim 1, wherein the wick structure is bonded to at least one of the first metal plate and the second metal plate by high frequency ultrasonic waves having a frequency of 20KHz to 80KHz, and the support structure is bonded to the first metal plate and the second metal plate by high frequency ultrasonic waves having a frequency of 20KHz to 80KHz, and the support structure is used to prevent deformation when combined with the electronic heating element.
4. The method of claim 3, wherein the capillary structure is pressed by rolling and then ultrasonically bonded to at least one of the first metal plate and the second metal plate.
5. The method according to claim 3, wherein the support structure comprises a plurality of support pillars, and the support pillars are pressed by rolling and bonded to the first metal plate and the second metal plate by high frequency ultrasonic waves.
6. A vapor panel structure, comprising:
a first metal plate;
at least one of the first metal plate body and the second metal plate body is provided with a capillary structure, and the capillary structure is positioned in a cavity defined by the first metal plate body and the second metal plate body; and
a support structure disposed between the first metal plate and the second metal plate;
the first metal plate body and the second metal plate body are correspondingly covered, the periphery of the first metal plate body and the periphery of the second metal plate body are sealed by high-frequency ultrasonic joint with the frequency of 20 KHz-80 KHz, so that the cavity forms a closed space, and the vacuum pumping and the filling of working fluid are carried out.
7. The vapor-deposited plate structure according to claim 6, wherein said first metal plate and said second metal plate are plate-shaped, and the periphery of said first metal plate and the periphery of said second metal plate are pressed by rolling and then joined by high-frequency ultrasonic waves.
8. The vapor chamber plate structure of claim 6, wherein said wick structure is bonded to at least one of said first metal plate and said second metal plate by high frequency ultrasonic waves having a frequency of 20KHz to 80KHz, and said support structure is bonded to said first metal plate and said second metal plate by high frequency ultrasonic waves having a frequency of 20KHz to 80KHz, said support structure being configured to prevent deformation when combined with an electronic heating element.
9. The vapor-temperature plate structure of claim 8, wherein said capillary structure is pressed by rolling and then bonded to at least one of said first metal plate and said second metal plate by high frequency ultrasonic waves.
10. The vapor-deposition plate structure of claim 8, wherein the supporting structure comprises a plurality of supporting pillars, and the supporting pillars are pressed by rolling and then bonded to the first metal plate and the second metal plate by high frequency ultrasonic waves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811401729.4A CN111207614A (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of vapor chamber and vapor chamber structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811401729.4A CN111207614A (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of vapor chamber and vapor chamber structure |
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| CN111207614A true CN111207614A (en) | 2020-05-29 |
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| CN201811401729.4A Pending CN111207614A (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of vapor chamber and vapor chamber structure |
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Citations (8)
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| JP2003080378A (en) * | 2001-09-10 | 2003-03-18 | Furukawa Electric Co Ltd:The | Method for manufacturing planar heat pipe and method for mounting this tube |
| CN1845321A (en) * | 2005-04-08 | 2006-10-11 | 奇鋐科技股份有限公司 | Flat-type heat pipe manufacturing method using ultrasonic welding |
| CN101100017A (en) * | 2006-07-05 | 2008-01-09 | 奇鋐科技股份有限公司 | Method for manufacturing plate type heat pipe with ultrasonic welding |
| CN102494550A (en) * | 2011-12-29 | 2012-06-13 | 四川鋈新能源科技有限公司 | Temperature-equalizing plate and device and method for manufacturing temperature-equalizing plate |
| CN102956583A (en) * | 2011-08-29 | 2013-03-06 | 奇鋐科技股份有限公司 | Temperature equalization plate structure and manufacturing method thereof |
| DE102011115784A1 (en) * | 2011-10-04 | 2013-04-04 | Asia Vital Components Co., Ltd. | Vapor chamber radiator for use in electronic product, has capillary and supporting structures provided in cavity, where capillary structure is formed at walls of cavity and supporting structure is connected with metal and ceramic plates |
| CN105841533A (en) * | 2015-01-14 | 2016-08-10 | 奇鋐科技股份有限公司 | Method for manufacturing flat heat pipe |
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
-
2018
- 2018-11-22 CN CN201811401729.4A patent/CN111207614A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003080378A (en) * | 2001-09-10 | 2003-03-18 | Furukawa Electric Co Ltd:The | Method for manufacturing planar heat pipe and method for mounting this tube |
| CN1845321A (en) * | 2005-04-08 | 2006-10-11 | 奇鋐科技股份有限公司 | Flat-type heat pipe manufacturing method using ultrasonic welding |
| CN101100017A (en) * | 2006-07-05 | 2008-01-09 | 奇鋐科技股份有限公司 | Method for manufacturing plate type heat pipe with ultrasonic welding |
| CN102956583A (en) * | 2011-08-29 | 2013-03-06 | 奇鋐科技股份有限公司 | Temperature equalization plate structure and manufacturing method thereof |
| DE102011115784A1 (en) * | 2011-10-04 | 2013-04-04 | Asia Vital Components Co., Ltd. | Vapor chamber radiator for use in electronic product, has capillary and supporting structures provided in cavity, where capillary structure is formed at walls of cavity and supporting structure is connected with metal and ceramic plates |
| CN102494550A (en) * | 2011-12-29 | 2012-06-13 | 四川鋈新能源科技有限公司 | Temperature-equalizing plate and device and method for manufacturing temperature-equalizing plate |
| CN105841533A (en) * | 2015-01-14 | 2016-08-10 | 奇鋐科技股份有限公司 | Method for manufacturing flat heat pipe |
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
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