CN111203991A - Crystal silicon vertical squarer and use method thereof - Google Patents
Crystal silicon vertical squarer and use method thereof Download PDFInfo
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- CN111203991A CN111203991A CN202010120837.5A CN202010120837A CN111203991A CN 111203991 A CN111203991 A CN 111203991A CN 202010120837 A CN202010120837 A CN 202010120837A CN 111203991 A CN111203991 A CN 111203991A
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- 239000013078 crystal Substances 0.000 title claims abstract description 95
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 75
- 239000010703 silicon Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 100
- 238000004804 winding Methods 0.000 claims abstract description 37
- 238000007599 discharging Methods 0.000 claims abstract description 12
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 75
- 238000001514 detection method Methods 0.000 claims description 49
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000007667 floating Methods 0.000 claims description 7
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 10
- 235000017491 Bambusa tulda Nutrition 0.000 description 10
- 241001330002 Bambuseae Species 0.000 description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 10
- 239000011425 bamboo Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a vertical crystal silicon squarer and a use method thereof, belonging to the technical field of crystal silicon processing equipment, and comprising a machine body base, wherein a feeding and discharging unit and a cutting unit are arranged on the machine body base along the conveying direction of crystal silicon, the feeding and discharging unit comprises a rotary worktable piece and crystal silicon detecting devices positioned on two sides of the rotary worktable, the cutting unit comprises a cutting assembly, a winding assembly and a lifting device, the cutting assembly is arranged above the rotary worktable and connected with the lifting device to cut the crystal silicon positioned on the rotary assembly, the winding assembly is arranged on two sides of the lifting device, the invention adopts a crystal silicon fixing assembly on the rotary worktable to be in a crystal silicon vertical state, and performs squaring operation on a plurality of groups of crystal silicon through a plurality of groups of groined cutting wire frames at the same time, thereby realizing that the crystal silicon once squaring operation in the vertical direction is completed, greatly improves the working efficiency and has wide development prospect.
Description
Technical Field
The invention belongs to the technical field of crystalline silicon processing equipment, and particularly relates to a crystalline silicon vertical squaring machine and a using method thereof.
Background
Crystalline silicon is the main raw material of solar cell panel, crystalline silicon need cut and the crystal silicon thin slice can be made to the processing such as section through technology such as piece and use, need carry out the crystal line with the silicon rod and detect in the course of working of crystalline silicon, cut operation such as arris evolution, equipment in the past can only carry out the arris evolution operation to a silicon rod after the crystal line detection of crystalline silicon, efficiency is lower, seriously influence the whole course of working's of crystalline silicon speed improvement, consequently, realize that many crystalline silicon go on simultaneously that the crystal line detects and the automatic pipelining of evolution has important meaning to the processing of crystalline silicon.
Disclosure of Invention
In order to solve the above problems, a vertical crystal silicon squarer and a method for using the same are proposed to effectively automate the crystal silicon squaring.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a vertical squaring machine of brilliant silicon, includes the fuselage base, unloading unit and cutting unit about being provided with along the direction of delivery of crystalline silicon on the fuselage base, go up unloading unit and include rotary worktable and the crystalline silicon detection device who is located the rotary worktable both sides, cutting unit includes cutting component, wire winding subassembly and plays to rise the device, cutting component sets up and is connected in rotary worktable's top and plays to rise the device and be located the crystalline silicon on rotary worktable with the cutting, wire winding subassembly sets up in the both sides that play to rise the device, and the crystalline silicon that is located rotary worktable is carried to the cutting area, carries out the squaring operation through cutting component.
Further, last feed and discharge district and the cutting area of being provided with of rotary table along the direction of delivery of crystal silicon, and its central department is provided with the gyration pivot, it all is provided with the fixed subassembly of at least a set of crystal silicon to go up feed and discharge district and cutting area, just it uses the gyration pivot to set up as symmetry axis symmetry to go up feed and discharge district and cutting area, rotary table's below is provided with a rotary motor and is used for driving rotary table around the rotatory 180 degrees of gyration pivot, realizes feed and discharge district and cutting area position interchange.
Further, go up unloading district and cutting area and all be provided with the fixed subassembly of four group crystal silicon, the fixed subassembly of four group crystal silicon is located four angles of rectangle, the fixed subassembly of crystal silicon is including fixed block and the locking cylinder that is used for supporting crystal silicon, the fixed block be located the top of locking cylinder and with locking cylinder clearance fit, the piston end of locking cylinder is equipped with the sphere that floats admittedly, and its periphery cover is equipped with slewing bearing, rotates crystal silicon through rotatory fixed block to the contained angle through adjustment fixed block and horizontal plane is in vertical direction with adjustment crystal silicon.
Further, the bilateral symmetry of rotary worktable is provided with crystal wire detection device, crystal wire detection device is including detecting the base, detect support and the clamping jaw that sets up in pairs, detect the base through vertical feed screw and fuselage base sliding connection who sets up along crystal silicon direction of delivery, detect the support and be located detection base top, it is through with crystal silicon direction of delivery looks vertically cross feed screw and detection base sliding connection, the clamping jaw is located detection support, and two clamping jaws set up relatively in order to form the space that holds crystal silicon, be provided with crystal wire detection device between two clamping jaws and detect in order to carry out crystal wire to crystal silicon.
Further, a cutting assembly is arranged above the cutting area, the cutting assembly is connected with a vertically arranged lifting device in a sliding mode, and winding assemblies are arranged on two sides of the lifting device and matched with the cutting assembly.
Further, cutting unit includes the gauze frame and lies in the warp direction wheelset and the latitudinal direction wheelset that the perpendicular crisscross setting set up on the gauze frame, warp direction wheelset and latitudinal direction wheelset all are on a parallel with the gauze frame setting, and the same and both not lie in the coplanar of quantity of warp direction wheelset and latitudinal direction wheelset, warp direction wheelset and latitudinal direction wheelset are driven by gauze drive arrangement respectively, the below of gauze frame is provided with the direction wheelset, is provided with an inlet wire wheel and an outlet wire wheel on its adjacent both sides face, just inlet wire wheel and outlet wire wheel are located the warp direction wheelset respectively and the adjacent one end of latitudinal direction wheelset, and the line of cut forms multiunit groined type cutting wire frame through warp direction wheelset, latitudinal direction.
Further, rise the device and include the vertical lifting frame that sets up and fix the lifting unit who rises on the lifting frame, rise to be provided with two guide rails along the vertical direction is parallel on the lifting frame, and lifting unit includes lift drive and ball, and lift drive's output links to each other with ball, ball sets up between two guide rails and produces the ascending displacement of vertical side with drive sliding base through screw nut and sliding base fixed connection, sliding base is last to have set firmly the lifting slide, cutting assembly passes through lifting slide and lifting unit sliding connection.
Further, the winding assembly comprises a winding drum and a paying-off drum, the winding drum and the paying-off drum are arranged along the horizontal direction and are parallel to the wire net frame, the winding drum and the paying-off drum are located on different sides of the lifting device, and a winding driving device and a winding displacement driving device are arranged at the winding drum and the paying-off drum.
Furthermore, the rotary worktable, the crystal wire detection device, the cutting assembly, the winding assembly and the lifting device are connected with a control box positioned at the lifting device through data transmission lines.
In addition, the invention also provides a use method of the crystal silicon vertical squarer, which comprises the following steps:
s1: positioning of crystal silicon and crystal line detection
The method comprises the following steps that crystalline silicon to be cut is placed on a crystalline silicon fixing assembly of an upper feeding area and a lower feeding area, the crystalline silicon is adjusted to be arranged along the vertical direction through a locking cylinder, and a first rotary motor drives a fixing block to rotate so as to be matched with a crystalline silicon detection device to carry out crystalline silicon line detection on the crystalline silicon;
s2: after the crystal line of the crystal silicon is detected, rotating the rotary worktable for 180 degrees, conveying the crystal silicon to be cut to a cutting area, and waiting for cutting;
s3: operation of squaring
The winding driving device, the wire arranging driving device and the lifting device are started, the cutting wires positioned on the wire mesh frame generate displacement in the horizontal direction and the vertical direction, and the edge skin cutting operation is performed on the crystalline silicon to finish the squaring of the crystalline silicon;
s4: operation of blanking
And rotating the rotary worktable for 180 degrees, transferring the cut silicon into an upper blanking area, and performing blanking operation.
The invention has the beneficial effects that:
1. cutting assembly includes warp direction wheelset and latitudinal direction wheelset that the perpendicular crisscross set up, and the line of cut forms 4 groups groined type cutting wire frames through cutting assembly, has optimized evolution operation in the past, has realized cutting when the flaw-piece of two sets of opposite sides, once only accomplishes the evolution operation of crystal silicon to can carry out the edge-piece cutting operation to the crystal silicon of four sets of vertical settings simultaneously, very big improvement the evolution efficiency of crystal silicon, have the influence of making a deep or distant to the processing of crystal silicon.
2. The rotary worktable is provided with a feeding and discharging area and a cutting area along the conveying direction of the crystal silicon, a rotary rotating shaft is fixedly arranged at the center of the rotary worktable, the first rotary motor drives the rotary worktable to rotate 180 degrees around the rotary rotating shaft, the crystal silicon is fed and discharged, and the crystal silicon can be conveyed to the cutting area to be cut.
3. Crystal line detection device can slide on the direction of delivery of direction and the perpendicular to crystal silicon along crystal silicon, can detect the crystal silicon of different positions on the direction of delivery along crystal silicon, and it can give way for the rotary worktable to slide on the vertical direction, can measure the crystal silicon of different diameters through cooperating with the clamping jaw, and application scope is wide.
4. The cutting assembly is connected with the lifting device, drives the cutting assembly to generate displacement in the vertical direction through the lifting driving device, is closely matched with the cutting assembly, and is favorable for squaring the crystal silicon in the vertical state.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the rotary table;
FIG. 3 is a schematic structural diagram of a silicon wafer fixing assembly;
FIG. 4 is a schematic structural diagram of a wafer inspection apparatus;
FIG. 5 is a schematic view of the cutting assembly;
FIG. 6 is another schematic view of the cutting assembly;
fig. 7 is a schematic structural view of a hoist;
fig. 8 is another structural schematic diagram of the hoist;
fig. 9 is a schematic structural view of the wire winding assembly.
In the drawings:
1-a body base;
2-a rotary worktable, 201-a rotary rotating shaft, 202-a crystalline silicon fixing component, 203-a fixing block, 204-a locking cylinder, 205-a floating spherical surface, 206-a rotary bearing and 207-a connecting block;
3-crystal line detection device, 301-detection base, 302-detection support, 303-clamping jaw and 304-crystal line detection device;
4-cutting component, 401-wire mesh frame, 402-wire feeding wheel and 403-wire discharging wheel;
5-warp wheel group, 501-first warp wheel group, 502-second warp wheel group, 503-third warp wheel group, 504-fourth warp wheel group;
6-weft wheel set, 601-first weft wheel set, 602-second weft wheel set, 603-third weft wheel set and 604-fourth weft wheel set;
7-a guide wheel group, 701-a first guide wheel, 702-a second guide wheel;
8-a cutting line;
9-a lifting device, 901-a lifting frame, 902-a guide rail, 903-a ball screw, 904-a sliding base and 905-a lifting slide block;
10-a winding component, 1001-a take-up drum, 1002-a tension pulley and 1003-a wire arranging pulley;
11-control box.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following description of the technical solutions of the present invention with reference to the accompanying drawings of the present invention is made clearly and completely, and other similar embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application shall fall within the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The first embodiment is as follows:
referring to fig. 1, a vertical squaring machine of crystalline silicon, including fuselage base 1, be provided with on the fuselage base 1 along crystalline silicon direction of delivery on and expect unit and cutting unit, it includes rotary worktable 2 and the crystalline silicon detection device 3 that is located 2 both sides of rotary worktable to go up the unloading unit, the cutting unit includes cutting component 4, wire winding subassembly 10 and plays to rise device 9, cutting component 4 sets up in rotary worktable 2's top, and it is connected with the crystal silicon that plays to rise device 9 and is located rotary worktable 2 with the cutting, and simultaneously, wire winding subassembly 10 sets up in the both sides that play to rise device 9, and the crystal silicon that is located rotary worktable 2 is carried to the cutting area, carries out the squaring operation through cutting component 4.
Referring to fig. 1, 2 and 3, a feeding and discharging area and a cutting area are arranged on the rotary table 2 along the conveying direction of the crystalline silicon, meanwhile, a rotary rotating shaft 201 is fixedly arranged at the center of the rotary table 2, a first rotary motor is arranged below the rotary table 2, and an output end of the first rotary motor is connected with the rotary rotating shaft 201 to drive the rotary rotating shaft 201 to rotate, so that the rotary table 2 is driven to rotate. Specifically, the first rotary motor drives the rotary worktable 2 to rotate 180 degrees, and the crystalline silicon in the feeding and discharging area is conveyed to the cutting area to be cut; meanwhile, the cut crystalline silicon is conveyed to an upper blanking area for blanking operation and feeding operation of unprocessed crystalline silicon.
Referring to fig. 2 and 3, the feeding and discharging area and the cutting area are both provided with at least one set of crystalline silicon fixing assembly 202, and the crystalline silicon fixing assembly 202 is symmetrically arranged on the rotary worktable 2 by taking the rotary rotating shaft 201 as a symmetry axis. In this embodiment, the feeding and discharging area and the cutting area are both provided with four sets of silicon fixing components 202, the four sets of silicon fixing components 202 are located at four corners of a rectangle, specifically, the crystalline silicon fixing assembly 202 comprises a fixing block 203 for supporting crystalline silicon and a locking cylinder 204, wherein the locking cylinder 204 is arranged below the fixing block 203, and the fixing block 203 is in clearance fit with a connecting block 207 below the fixing block through a connecting screw, the center of the piston of the locking cylinder 204 is provided with a floating spherical surface 205, the peripheries of the floating spherical surface 205 and the piston end of the locking cylinder 204 are provided with a connecting block 207, and a groove for accommodating the floating spherical surface 205 is arranged on the lower surface of the fixed block 203, the floating spherical surface 205 is abutted against the concave surface of the groove, and at the same time, a rotary bearing 206 is sleeved on the periphery of the locking cylinder 204, and the rotary bearing 206 is connected with a second rotary motor through a coupler. The floating spherical surface 205 ensures that the crystal silicon is in a vertical state by adjusting the contact point of the fixed block 203 and the horizontal plane, and meanwhile, the second rotary motor drives the rotary bearing 206 to rotate to drive the fixed block 203 to rotate, so that the crystal silicon on the fixed block 203 rotates along with the rotary bearing and is matched with the crystal line detection devices 3 on the two sides of the rotary worktable 2.
Example two
Referring to fig. 1 and 4, the crystal line detection device 3 is symmetrically arranged on two sides of the rotary table 2, and the crystal line detection device 3 includes a detection base 301, a detection support 302, a clamping jaw 303 and a clamping jaw cylinder. The detection base 301 is connected with the machine body base 1 in a sliding mode through a longitudinal feed screw, and the longitudinal feed screw is arranged along the conveying direction of the crystalline silicon; meanwhile, the detection bracket 302 is arranged above the detection base 301, and is slidably connected with the detection base 301 through a transverse feed screw rod, and the transverse feed screw rod is arranged along the direction perpendicular to the crystal silicon conveying direction. Detect and be provided with clamping jaw 303 and clamping jaw cylinder on the support 302, the equal symmetry of clamping jaw 303 and clamping jaw cylinder sets up two, and clamping jaw cylinder and clamping jaw 303 all set up along the horizontal direction, the one end of clamping jaw 303 with the piston end of clamping jaw cylinder links firmly, and its other end is the free end, just the cross section of clamping jaw 303 becomes the V-arrangement, and two clamping jaws 303 set up in order to form the space that holds crystal silicon relatively. In addition, a crystal wire detection device 304 is fixedly arranged on the detection support 302, and the crystal wire detection device 304 is positioned between the two clamping jaws 303 and is used for detecting the crystal orientation of the crystalline silicon. That is, the clamping jaw 303 can slide along the conveying direction of the crystalline silicon through the longitudinal feed screw to detect the crystalline silicon at different positions, and can also slide along the direction perpendicular to the conveying direction of the crystalline silicon through the transverse feed screw to detect the crystalline silicon or provide a space for the rotation of the rotary table 2.
EXAMPLE III
Referring to fig. 5, 6, 7 and 8, a cutting assembly 4 is arranged above the cutting area, the cutting assembly 4 is connected with a lifting device 9 in a sliding manner, the lifting device 9 is arranged vertically, and meanwhile, winding assemblies 10 matched with the cutting assembly 4 are arranged on two sides of the lifting device 9.
Referring to fig. 5 and 6, cutting assembly 4 includes gauze frame 401 and is located gauze frame 401 and go up warp wheelset 5 and the latitudinal direction wheelset 6 of vertical cross setting, warp wheelset 5 and latitudinal direction wheelset 6 all are on a parallel with gauze frame 401 and set up, warp wheelset 5 is the same with the quantity of latitudinal direction wheelset 6, and both do not lie in the coplanar, simultaneously gauze frame 401's below is provided with direction wheelset 7, warp wheelset 5 and latitudinal direction wheelset 6 are driven by gauze drive arrangement respectively, gauze drive arrangement includes first drive arrangement, second drive arrangement, third drive arrangement drive and fourth drive arrangement. In this embodiment, the driving device is a servo motor.
In order to facilitate the cutting line 8 to enter and exit the wire net, a wire inlet wheel 402 and a wire outlet wheel 403 are arranged on the wire net frame 401, the wire inlet wheel 402 and the wire outlet wheel 403 are respectively positioned at one ends of the warp-wise wheel set 5 and the weft-wise wheel set 6, the cutting line 8 enters the warp-wise wheel set 5 and the weft-wise wheel set 6 through the wire inlet wheel 402 and forms a plurality of groups of groined-shaped cutting line frames through the guiding action of the guiding wheel set 7, and a plurality of groups of crystal silicon can be.
Specifically, the warp wheel sets 5 include a first warp wheel set 501, a second warp wheel set 502, a third warp wheel set 503 and a fourth warp wheel set 504 which are sequentially arranged in parallel, each warp wheel set 5 includes a driving wheel and a driven wheel which are arranged at intervals, wheel shafts of the two driving wheels and wheel shafts of the two driven wheels in the first warp wheel set 501 and the second warp wheel set 502 are connected through a rotating shaft, and the driving wheels of the two driving wheels are driven by a first driving device, that is, the first driving device drives the driving wheels in the first warp wheel set 501 and the second warp wheel set 502 to rotate synchronously, and meanwhile, the driven wheels of the two driving wheels also rotate synchronously; similarly, the third warp wheel set 503 and the fourth warp wheel set 504 have the same structure as the first warp wheel set 501 and the second warp wheel set 502, and the driving wheels of the third warp wheel set and the second warp wheel set are driven by the second driving device, except that the first driving device and the second driving device are in different positions, specifically, the first driving device and the second driving device are arranged in central symmetry.
Latitudinal direction wheelset 6 includes parallel arrangement's first latitudinal direction wheelset 601, second latitudinal direction wheelset 602, third latitudinal direction wheelset 603 and fourth latitudinal direction wheelset 604 in proper order. The first latitudinal wheel set 601 and the second latitudinal wheel set 602 are arranged the same as the first longitudinal wheel set 501 and the second longitudinal wheel set 502; the third and fourth latitudinal wheel groups 603 and 604 are the same as the third and fourth warp wheel groups 503 and 504, and the description thereof is omitted. The driving wheels of the first latitudinal wheel set 601 and the second latitudinal wheel set 602 are both driven by a third driving device, and simultaneously, the driving wheels of the third latitudinal wheel set 603 and the fourth latitudinal wheel set 604 are both driven by a fourth driving device, and the third driving device and the fourth driving device are arranged in a central symmetry manner.
In order to facilitate the better direction change of the cutting lines 8 on the wire mesh frame 401, a first guide wheel 701 is disposed below the driving wheel in the warp-wise wheel group 5, and a first guide wheel 701 is disposed below the driven wheel in the weft-wise wheel group 6, in this embodiment, the included angles between the axle of the first guide wheel 701 and the axles of the driving wheel in the warp-wise wheel group 5 and the driven wheel in the weft-wise wheel group 6 are both 45 degrees. In the present embodiment, the included angles between the second guide wheel 702 and the driven wheels in the warp wheel set 5 and the wheel axles of the driven wheels in the weft wheel set 6 are both 45 degrees, that is, the wheel axles of the first guide wheel 701 and the second guide wheel 702 are vertically disposed. In addition, the first guide wheel 701 and the second guide wheel 702 are both fixedly connected with the wire mesh frame 401 through a guide wheel fixing seat.
The wire inlet wheel 402 and the wire outlet wheel 403 are fixed on the side edge of the wire mesh frame 401 through a guide wheel fixing seat, the wire inlet wheel 402 is located on one side close to a driven wheel in the second warp-wise wheel group 502, and meanwhile, the wire outlet wheel 403 is located on one side close to a driving wheel of the first weft-wise wheel group 601.
The cutting line 8 sequentially passes through the second warp wheel group 502, the first guide wheel 701, the third weft wheel group 603, the third warp wheel group 503, the second weft wheel group 602, the first guide wheel 701, the first warp wheel group 501, the fourth weft wheel group 604, the fourth warp wheel group 504, the first weft wheel group 601 and the wire mesh frame 401 through the wire guide wheel 403, namely, the cutting line 8 passes through the warp wheel group 5 and the weft wheel group 6 to form 4 groups of # -shaped cutting wire frames, and can simultaneously square four silicon rods.
Referring to fig. 7 and 8, the hoisting device 9 includes a vertically arranged hoisting frame 901 and a lifting assembly fixed on the hoisting frame 901. Specifically, two guide rails 902 are arranged on the lifting frame 901 in parallel along the vertical direction, the lifting assembly includes a lifting driving device and a ball screw 903, the ball screw 903 is fixed on the lifting frame 901 and located between the two guide rails 902, and one end of the ball screw 903 is connected to an output end of the lifting driving device through a coupling. Ball 903 passes through screw nut and sliding base 904 fixed connection, just sliding base 904 is last to have set firmly elevator slide 905, gauze frame 401 links firmly with elevator slide 905, that is to say, elevator motor drive elevator slide 905 drives cutting assembly 4 along the motion of vertical direction, produces the square operation of the ascending displacement in order to realize crystal silicon in vertical direction.
In order to protect the ball screw 903 more effectively, an organ cover is attached to both sides of the lifter slider 905 and the ball screw 903.
Example four
Referring to fig. 9, winding assembly 10 sets up in the both sides that play to rise device 9, winding assembly 10 is including receiving a line section of thick bamboo 1001 and a section of thick bamboo of paying out, receive a line section of thick bamboo 1001 and a section of thick bamboo of paying out and set up along the horizontal direction, and both all are on a parallel with gauze frame 401 and set up, receive a line section of thick bamboo 1001 and a section of thick bamboo of paying out are located the different sides that play to rise device 9, and simultaneously, receive a line section of thick bamboo 1001 and a section of thick bamboo department of paying out all are provided with wire winding drive arrangement and winding arrangement drive arrangement, wire winding drive arrangement drive receives a line section of thick bamboo 1001 and a section of thick bamboo rotation realization. Simultaneously, in order to guarantee the rate of tension of line 8 all be provided with the tension control subassembly between wire winding subassembly 10 and the play to rise device 9, be provided with tension drive component, tension pulley 1002, calandria wheel 1003 on the tension control subassembly, tension pulley 1002 perpendicular to gauze frame 401 sets up, tension drive component drive tension pulley 1002 is rotatory, reaches the purpose of tensioning line 8 of cut, the setting of calandria wheel 1003 slope is used for realizing the line 8 switching-over of cut.
The cutting line 8 sequentially passes through the pay-off drum, the wire arranging wheel 1003, the tension wheel 1002, the wire inlet wheel 402, the warp wheel set 5 and the weft wheel set 6, leaves the wire net frame 401 through the wire outlet wheel 403, and then is collected and released by the tension wheel 1002 and the wire arranging wheel 1003 to the wire collecting drum 1001.
The rotary working table 2, the crystal wire detection device 3, the cutting assembly 4, the winding assembly 10 and the lifting assembly are connected with a control box 11 at the lifting assembly through data transmission lines, measured data and cutting data are transmitted and stored, and a cutting database is established.
In addition, the invention also provides a use method of the crystal silicon vertical squarer, which comprises the following steps:
positioning of crystal silicon and crystal wire detection
The method comprises the following steps that crystalline silicon to be cut is placed on a crystalline silicon fixing assembly 202 of an upper feeding area and a lower feeding area, the crystalline silicon is adjusted through a locking cylinder 204 to be arranged along the vertical direction, and a second rotary motor is started to drive the crystalline silicon to synchronously rotate so as to be matched with a crystalline silicon detection device 3 to carry out crystalline silicon line detection on the crystalline silicon;
secondly, after the crystal silicon crystal line is detected, rotating the rotary worktable for 180 degrees, conveying the crystal silicon to be cut to a cutting area, and waiting for cutting;
third, trimming the skins
Starting a winding driving device and a winding displacement driving device, enabling a cutting line 8 on a wire mesh frame 401 to generate displacement in the horizontal direction, starting a lifting device 9, enabling the cutting line 8 to generate displacement in the vertical direction at the same time, and performing edge skin cutting operation on the crystalline silicon to finish the squaring of the crystalline silicon;
fourth, blanking operation
The rotary worktable 2 rotates 180 degrees, and the crystal silicon with the cut area being cut is rotated to the upper blanking area to carry out blanking operation.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (10)
1. The utility model provides a vertical squaring machine of brilliant silicon, its characterized in that, includes fuselage base (1), it expects unit and cutting unit from top to bottom to be provided with along the direction of delivery of crystalline silicon on fuselage base (1), go up unloading unit and include rotary worktable (2) and be located crystalline silicon detection device (3) of rotary worktable (2) both sides, cutting unit includes cutting component (4), wire winding subassembly (10) and plays to rise device (9), cutting component (4) set up in rotary worktable's (2) top and play to rise device (9) and be connected in order to cut the crystalline silicon that is located rotary worktable (2), wire winding subassembly (10) set up in the both sides that rise device (9), and the crystalline silicon that is located rotary worktable (2) is carried to the cutting area, carries out the squaring operation through cutting component (4).
2. The vertical squaring machine for crystal silicon according to claim 1, characterized in that a feeding and discharging area and a cutting area are arranged on the rotary table (2) along the conveying direction of the crystal silicon, a rotary rotating shaft is arranged at the center of the rotary table, at least one group of crystal silicon fixing assemblies (202) are arranged on the feeding and discharging area and the cutting area, the feeding and discharging area and the cutting area are symmetrically arranged by taking the rotary rotating shaft (201) as a symmetry axis, a first rotary motor is arranged below the rotary table (2) to drive the rotary table (2) to rotate 180 degrees around the rotary rotating shaft (201), and the mutual exchange of the feeding and discharging area and the cutting area is realized.
3. The vertical squaring machine of crystalline silicon of claim 2, characterized in that, last unloading district and cutting district all are provided with four fixed subassemblies of crystalline silicon (202), the fixed subassembly of four fixed subassemblies of crystalline silicon (202) of crystalline silicon is located four angles of rectangle, fixed subassembly of crystalline silicon (202) is including fixed block (203) and the locking cylinder (204) that are used for supporting crystalline silicon, fixed block (203) are located the top of locking cylinder and with locking cylinder clearance fit, the piston end of locking cylinder (204) is equipped with the spherical surface of floating (205) admittedly, and its periphery cover is equipped with slew bearing (206), rotates crystalline silicon through rotatory fixed block (203) to be in vertical direction with the adjustment crystalline silicon through the contained angle of adjustment fixed block (203) and horizontal plane.
4. The vertical squarer for crystalline silicon according to claim 3, characterized in that crystal line detection devices (3) are symmetrically arranged on both sides of the rotary table (2), the crystal wire detection device (3) comprises a detection base (301), a detection support (302) and clamping jaws (303) arranged in pairs, the detection base (301) is connected with the machine body base (1) in a sliding way through a longitudinal feed screw arranged along the crystal silicon conveying direction, the detection support (302) is positioned above the detection base (301), which is connected with a detection base (301) in a sliding way through a transverse feed screw rod which is vertical to the conveying direction of the crystal silicon, a clamping jaw (303) is positioned on a detection bracket (302), the two clamping jaws (302) are oppositely arranged to form a space for containing the crystalline silicon, and a crystal wire detection device (304) is arranged between the two clamping jaws (302) to detect the crystal wire of the crystalline silicon.
5. The vertical squarer for crystalline silicon according to claim 4, characterized in that a cutting assembly (4) is arranged above the cutting area, the cutting assembly (4) is slidably connected with a vertically arranged lifting device (9), and a winding assembly (10) is arranged on two sides of the lifting device (9) and is matched with the cutting assembly (4).
6. The vertical squaring machine for crystalline silicon according to claim 5, characterized in that the cutting assembly (4) comprises a wire mesh frame (401) and a warp wheel set (5) and a weft wheel set (6) which are vertically staggered on the wire mesh frame (401), the warp wheel set (5) and the weft wheel set (6) are both arranged in parallel to the wire mesh frame (401), the warp wheel set (5) and the weft wheel set (6) are the same in number and are not positioned in the same plane, the warp wheel set (5) and the weft wheel set (6) are respectively driven by a wire mesh driving device, a guide wheel set (7) is arranged below the wire mesh frame (401), a wire inlet wheel (402) and a wire outlet wheel (403) are arranged on two adjacent side faces of the wire mesh frame, and the wire inlet wheel (402) and the wire outlet wheel (403) are respectively positioned at one ends of the warp wheel set (5) and the weft wheel set (6) which are adjacent, the cutting lines (8) form a plurality of groups of # -shaped cutting line frames through the warp wheel sets (5), the weft wheel sets (6) and the guide wheel sets (7) and cut a plurality of groups of crystal silicon simultaneously.
7. The vertical squarer for crystalline silicon according to claim 6, characterized in that the lifting device (9) comprises a vertically arranged lifting frame (901) and a lifting assembly fixed on the lifting frame (901), the lifting frame (901) is provided with two guide rails (902) in parallel along the vertical direction, the lifting assembly comprises a lifting driving device and a ball screw (903), the output end of the lifting driving device is connected with the ball screw (903), the ball screw (903) is arranged between the two guide rails (902) and is fixedly connected with a sliding base (904) through a screw nut to drive the sliding base (904) to generate vertical displacement, a lifting slider (905) is fixedly arranged on the sliding base (904), and the cutting assembly (4) is connected with the lifting device (9) through the lifting slider (905) in a sliding manner.
8. The vertical squarer for crystalline silicon according to claim 7, characterized in that the winding assembly (10) comprises a take-up drum (1001) and a pay-off drum, the take-up drum (1001) and the pay-off drum are arranged along a horizontal direction and parallel to the wire mesh frame (401), the take-up drum (1001) and the pay-off drum are positioned on different sides of the lifting device (9), and a winding driving device and a winding displacement driving device are arranged at the take-up drum (1001) and the pay-off drum.
9. The vertical squarer for crystalline silicon according to claim 8, characterized in that the rotary table (2), the crystal line detection device (3), the cutting assembly (4), the winding assembly (10) and the lifting device (9) are all connected with a control box (11) at the lifting device (9) through data transmission lines.
10. The use method of the crystalline silicon vertical squarer of claim 9, comprising the steps of:
s1: positioning of crystal silicon and crystal line detection
The method comprises the following steps that crystalline silicon to be cut is placed on a crystalline silicon fixing assembly (202) in an upper feeding area and a lower feeding area, the crystalline silicon is adjusted to be arranged along the vertical direction through a locking air cylinder (204), and a first rotary motor drives a fixing block (203) to rotate so as to be matched with a crystalline line detection device (3) to carry out crystalline line detection on the crystalline silicon;
s2: after the crystal line of the crystal silicon is detected, the rotary worktable (2) rotates 180 degrees, and the crystal silicon to be cut is conveyed to a cutting area to wait for cutting;
s3: operation of squaring
The winding driving device, the winding displacement driving device and the lifting device (9) are started, the cutting line (8) positioned on the wire mesh frame (401) generates displacement in the horizontal direction and the vertical direction, and the edge skin cutting operation is carried out on the crystalline silicon to finish the squaring of the crystalline silicon;
s4: operation of blanking
And rotating the rotary worktable (2) for 180 degrees, transferring the crystal silicon with the cut area being cut to the upper blanking area, and performing blanking operation.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113043488A (en) * | 2021-04-21 | 2021-06-29 | 曲靖阳光能源硅材料有限公司 | Crystal silicon vertical squarer and use method thereof |
CN113134918A (en) * | 2021-04-21 | 2021-07-20 | 曲靖阳光能源硅材料有限公司 | Novel monocrystalline silicon double-rod double-station squaring machine |
CN113601738A (en) * | 2021-07-16 | 2021-11-05 | 宇泽半导体(云南)有限公司 | Processing method for processing rectangular photovoltaic cell silicon wafer by using native single crystal silicon rod |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216243A (en) * | 1993-01-18 | 1994-08-05 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPH07308920A (en) * | 1994-05-19 | 1995-11-28 | Tokyo Seimitsu Co Ltd | Method and equipment for aligning orientation of crystal on occasion of cutting single-crystal material |
JPH10272620A (en) * | 1997-03-31 | 1998-10-13 | Tokyo Seimitsu Co Ltd | Crystal material processing device |
KR20000011968U (en) * | 1998-12-11 | 2000-07-05 | 윤종용 | Robot Arm for Wafer Cassette Holding |
US20080003708A1 (en) * | 2006-06-30 | 2008-01-03 | Hitoshi Hoshino | Method of processing sapphire substrate |
JP2014202736A (en) * | 2013-04-03 | 2014-10-27 | 東芝Itコントロールシステム株式会社 | Crystal orientation measurement and processing system |
CN105583957A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Horizontal monocrystal silicon single-rod squarer |
CN205394859U (en) * | 2016-03-03 | 2016-07-27 | 青岛高测科技股份有限公司 | Excellent squaring machine of vertical list of monocrystalline silicon |
CN105818285A (en) * | 2016-05-23 | 2016-08-03 | 上海日进机床有限公司 | Silicon rod squarer |
CN205497834U (en) * | 2016-04-20 | 2016-08-24 | 重庆四和晶工科技有限公司 | Tight clamping structure in squaring machine silicon rod top |
CN207156183U (en) * | 2017-09-21 | 2018-03-30 | 重庆四和晶工科技有限公司 | A kind of squaring silicon bar machine cutting head device |
CN108656375A (en) * | 2018-05-11 | 2018-10-16 | 青岛高测科技股份有限公司 | A kind of two line excavation machine of silicon single crystal rod |
CN208148230U (en) * | 2018-02-09 | 2018-11-27 | 天通日进精密技术有限公司 | Squaring silicon bar equipment and flaw-piece discharge mechanism |
CN208148231U (en) * | 2018-02-09 | 2018-11-27 | 天通日进精密技术有限公司 | Silicon rod multi-wire saw equipment and silicon rod movement system |
CN110126107A (en) * | 2018-02-09 | 2019-08-16 | 浙江集英精密机器有限公司 | Silicon rod conversion equipment, squaring silicon bar equipment and squaring silicon bar method |
CN110561629A (en) * | 2019-08-27 | 2019-12-13 | 大连昊霖智能装备有限公司 | cutting head is used in processing of two stick in single crystal silicon rod squarer |
CN209851343U (en) * | 2019-03-21 | 2019-12-27 | 重庆四和晶工科技有限公司 | Silicon rod squaring machine take-up and pay-off device |
CN110900329A (en) * | 2019-12-26 | 2020-03-24 | 青岛高测科技股份有限公司 | Rotary full-automatic crystal bar squaring, grinding and polishing all-in-one machine |
CN111844490A (en) * | 2019-04-30 | 2020-10-30 | 天通日进精密技术有限公司 | Multi-station squaring equipment and cutting method thereof |
CN211968001U (en) * | 2020-02-26 | 2020-11-20 | 青岛高测科技股份有限公司 | Vertical squaring machine for crystalline silicon |
CN212498398U (en) * | 2020-03-30 | 2021-02-09 | 天通日进精密技术有限公司 | Silicon rod squaring machine |
-
2020
- 2020-02-26 CN CN202010120837.5A patent/CN111203991A/en active Pending
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216243A (en) * | 1993-01-18 | 1994-08-05 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPH07308920A (en) * | 1994-05-19 | 1995-11-28 | Tokyo Seimitsu Co Ltd | Method and equipment for aligning orientation of crystal on occasion of cutting single-crystal material |
JPH10272620A (en) * | 1997-03-31 | 1998-10-13 | Tokyo Seimitsu Co Ltd | Crystal material processing device |
KR20000011968U (en) * | 1998-12-11 | 2000-07-05 | 윤종용 | Robot Arm for Wafer Cassette Holding |
US20080003708A1 (en) * | 2006-06-30 | 2008-01-03 | Hitoshi Hoshino | Method of processing sapphire substrate |
JP2014202736A (en) * | 2013-04-03 | 2014-10-27 | 東芝Itコントロールシステム株式会社 | Crystal orientation measurement and processing system |
CN105583957A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Horizontal monocrystal silicon single-rod squarer |
CN205394859U (en) * | 2016-03-03 | 2016-07-27 | 青岛高测科技股份有限公司 | Excellent squaring machine of vertical list of monocrystalline silicon |
CN205497834U (en) * | 2016-04-20 | 2016-08-24 | 重庆四和晶工科技有限公司 | Tight clamping structure in squaring machine silicon rod top |
CN105818285A (en) * | 2016-05-23 | 2016-08-03 | 上海日进机床有限公司 | Silicon rod squarer |
CN207156183U (en) * | 2017-09-21 | 2018-03-30 | 重庆四和晶工科技有限公司 | A kind of squaring silicon bar machine cutting head device |
CN208148230U (en) * | 2018-02-09 | 2018-11-27 | 天通日进精密技术有限公司 | Squaring silicon bar equipment and flaw-piece discharge mechanism |
CN208148231U (en) * | 2018-02-09 | 2018-11-27 | 天通日进精密技术有限公司 | Silicon rod multi-wire saw equipment and silicon rod movement system |
CN110126107A (en) * | 2018-02-09 | 2019-08-16 | 浙江集英精密机器有限公司 | Silicon rod conversion equipment, squaring silicon bar equipment and squaring silicon bar method |
CN108656375A (en) * | 2018-05-11 | 2018-10-16 | 青岛高测科技股份有限公司 | A kind of two line excavation machine of silicon single crystal rod |
CN209851343U (en) * | 2019-03-21 | 2019-12-27 | 重庆四和晶工科技有限公司 | Silicon rod squaring machine take-up and pay-off device |
CN111844490A (en) * | 2019-04-30 | 2020-10-30 | 天通日进精密技术有限公司 | Multi-station squaring equipment and cutting method thereof |
CN110561629A (en) * | 2019-08-27 | 2019-12-13 | 大连昊霖智能装备有限公司 | cutting head is used in processing of two stick in single crystal silicon rod squarer |
CN110900329A (en) * | 2019-12-26 | 2020-03-24 | 青岛高测科技股份有限公司 | Rotary full-automatic crystal bar squaring, grinding and polishing all-in-one machine |
CN211968001U (en) * | 2020-02-26 | 2020-11-20 | 青岛高测科技股份有限公司 | Vertical squaring machine for crystalline silicon |
CN212498398U (en) * | 2020-03-30 | 2021-02-09 | 天通日进精密技术有限公司 | Silicon rod squaring machine |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113043488A (en) * | 2021-04-21 | 2021-06-29 | 曲靖阳光能源硅材料有限公司 | Crystal silicon vertical squarer and use method thereof |
CN113134918A (en) * | 2021-04-21 | 2021-07-20 | 曲靖阳光能源硅材料有限公司 | Novel monocrystalline silicon double-rod double-station squaring machine |
CN113134918B (en) * | 2021-04-21 | 2022-04-01 | 曲靖阳光新能源股份有限公司 | Novel monocrystalline silicon double-rod double-station squaring machine |
CN113601738A (en) * | 2021-07-16 | 2021-11-05 | 宇泽半导体(云南)有限公司 | Processing method for processing rectangular photovoltaic cell silicon wafer by using native single crystal silicon rod |
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