CN111155167A - Electroplating device - Google Patents
Electroplating device Download PDFInfo
- Publication number
- CN111155167A CN111155167A CN202010034356.2A CN202010034356A CN111155167A CN 111155167 A CN111155167 A CN 111155167A CN 202010034356 A CN202010034356 A CN 202010034356A CN 111155167 A CN111155167 A CN 111155167A
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- electroplating
- container
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- plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating device, which comprises an electroplating container for containing electroplating solution, a cathode piece arranged in the electroplating container, an anode piece arranged in the electroplating container, a direct current power supply and a temperature control component, wherein the anode of the direct current power supply is electrically connected with the anode piece, and the cathode of the direct current power supply is electrically connected with the cathode piece; the plating container is arranged in the temperature control part, and the temperature control part controls the temperature of the plating solution; the anode member includes a first anode member disposed on a first side of the cathode member and a second anode member disposed on a second side of the cathode member facing away from the first anode member. Through adopting above-mentioned technical scheme, first anode spare and second anode spare can be electroplated the both sides of cathode spare simultaneously, have increased the cladding material area of cathode spare, and the temperature of temperature control part control plating solution conveniently carries out the contrast experiment under the different temperatures.
Description
Technical Field
The invention relates to the field of electrochemical equipment, in particular to an electroplating device.
Background
In the fields of nuclear physics and nuclear chemistry, actinide materials are widely applied to the fields of fission ionization chamber preparation, radioactive source preparation, medical radioactive isotopes and the like.
The prior method for preparing the actinide metal elements is to use an electrodeposition method, which is also called electroplating, wherein the electrodeposition method is a method that an anode and a cathode are respectively connected with a positive electrode and a negative electrode of a direct current power supply, and the anode and the cathode are placed into an electrolyte solution to form a loop so that metal complex ions in the electrolyte solution are deposited on the surface of the cathode to prepare the actinide metal elements in the electrolyte solution. The method for preparing the actinide metal elements by adopting the electrodeposition method has the unique advantages of high deposition efficiency, uniform and firm coating, simple equipment, convenient operation, easy control of reaction conditions and the like.
Before the actinide metal is subjected to the large-scale electrodeposition operation, different electroplating process parameters (such as temperature) need to be tested according to different application scenes so as to select the optimal electroplating process parameter combination. The traditional experimental device for the actinide metal electrodeposition adopts a rotary platinum electrode as an anode and an aluminum foil as a cathode, and the actinide metal in the solution is deposited on the aluminum foil after the device is electrified. Above-mentioned electrodeposition experimental apparatus only can carry out single face deposit to the aluminium foil, and actinide metallic element's preparation inefficiency and experimental apparatus structure are complicated, and the plating solution is changed the loaded down with trivial details and the temperature of uncontrollable plating solution of step. In order to overcome the defect that only one-side deposition can be carried out on a plated part, the prior art has an actinide metal electrodeposition experimental device capable of carrying out double-side deposition, and the prior double-side deposition electrodeposition experimental device has the disadvantages of complex structure, small volume of an electroplating bath, complicated replacement steps of the electroplating solution and incapability of directly controlling the temperature of the electroplating solution.
Therefore, there is a need in the art for a plating apparatus that can perform double-sided electrodeposition, can easily replace plating solutions and electrodes, can hold a large amount of plating solutions, and can control the temperature of the plating solutions.
Disclosure of Invention
An object of an embodiment of the present invention is to provide an electroplating apparatus, which includes an electroplating container for containing an electroplating solution, a cathode member disposed in the electroplating container, an anode member disposed in the electroplating container, a dc power supply, and a temperature control member, wherein a positive electrode of the dc power supply is electrically connected to the anode member, and a negative electrode of the dc power supply is electrically connected to the cathode member; the plating container is arranged in the temperature control part, and the temperature control part controls the temperature of the plating solution; the anode member includes a first anode member disposed on a first side of the cathode member and a second anode member disposed on a second side of the cathode member facing away from the first anode member.
According to an embodiment of the present invention, the plating container includes a container body for containing a plating solution and a container lid provided at an opening of the container body.
According to an embodiment of the present invention, the electroplating apparatus further includes an electrode fixing member penetratingly disposed on the container cover, the electrode fixing member includes a first electrode fixing member, a second electrode fixing member and a third electrode fixing member, wherein a first end portion of the first electrode fixing member is fixedly connected to the first anode member; the first end part of the second electrode fixing part is fixedly connected with the second anode part; the first end of the third electrode fixing part is fixedly connected with the cathode part.
According to an embodiment of the present invention, a second end portion of the first electrode holder opposite to the first end portion thereof and a second end portion of the second electrode holder opposite to the first end portion thereof are electrically connected to a positive electrode of the dc power supply, and a second end portion of the third electrode holder opposite to the first end portion thereof is electrically connected to a negative electrode of the dc power supply.
According to an embodiment of the present invention, the plating apparatus further includes a state detection member penetratingly provided on the container lid, and a state detection main unit, a first end portion of the state detection member being immersed in the plating liquid; the state detection host is electrically connected to a second end portion of the state detection member opposite to the first end portion thereof.
According to an embodiment of the present invention, the condition detecting means includes a pH detecting member that detects a pH of the plating liquid, and a temperature detecting member; the temperature detecting member detects the temperature of the plating liquid.
According to the embodiment of the invention, the electroplating device further comprises a circulating pump, and a liquid inlet pipeline and a liquid outlet pipeline of the circulating pump are arranged in the electroplating liquid.
According to an embodiment of the invention, the rim of the container lid is provided with a vapour return bead.
According to an embodiment of the present invention, the temperature control member is a constant temperature water bath tank, the plating container is disposed in the constant temperature water bath tank, and the constant temperature water bath tank transmits heat to the plating container or absorbs heat from the liquid in the tank to complete temperature control of the plating solution.
By adopting the technical scheme, the invention mainly has the following technical effects:
1. the temperature control component is arranged, so that the temperature of the electroplating solution can be controlled, and the comparative experiment of electroplating is convenient to perform;
2. the two sides of the cathode piece are respectively provided with the anode piece, so that the two sides of the cathode piece can be electroplated, and the electroplating efficiency of the electroplating device is improved;
3. by arranging the circulating pump, the electroplating solution circulates and is stirred, so that the electroplating efficiency of the electroplating device is improved;
4. through setting up the electrode mounting, the electrode can submerge completely in the plating solution, has improved electroplating device's electroplating efficiency.
Drawings
Fig. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present invention.
In the figure: 1. an electroplating container; 11. a container body; 12. a container cover; 2. a cathode member; 3. an anode member; 31. a first anode member; 32. a second anode member; 4. a direct current power supply; 5. a temperature control component; 6. an electrode holder; 61. a first electrode fixing member; 62. a second electrode fixing member; 63. a third electrode fixing member; 7. a state detection section; 8. and (4) detecting the state of the host computer.
Detailed Description
The following description of the embodiments of the present invention is provided in connection with the accompanying drawings.
Referring to fig. 1, the present embodiment discloses an electroplating apparatus, which includes an electroplating container 1 for containing electroplating solution, a cathode member 2 disposed in the electroplating container 1, an anode member 3 disposed in the electroplating container 1, a dc power supply 4, and a temperature control member 5, wherein a positive electrode of the dc power supply 4 is electrically connected to the anode member 3, and a negative electrode of the dc power supply 4 is electrically connected to the cathode member 2; the plating vessel 1 is provided in a temperature control part 5, and the temperature control part 5 controls the temperature of the plating liquid in the plating vessel 1.
When the operator turns on the direct current power supply 4, the cathode member 2, the anode member 3 and the plating solution form a loop together, and metal complex ions in the plating solution are deposited on the surface of the cathode member 2, so that a coating is formed on the surface of the cathode member 2. When the electroplating work is executed, an operator performs a comparison experiment under different electroplating solution temperature conditions by adjusting the temperature of the electroplating solution through the temperature control part 5 after completing one electroplating work, and determines the optimal electroplating temperature (for example, the temperature of the electroplating solution with the highest electroplating efficiency, the temperature of the electroplating solution most suitable for large-scale electroplating, and the like) under the condition of using the current electrode material and the current electroplating solution composition according to the result of the comparison experiment. Similarly, the operator can also ensure the temperature of the plating solution to be constant through the temperature control component 5, replace one of the anode member 3, the cathode member 2 and the components of the plating solution, perform a comparison experiment under different anode members 3, a comparison experiment under different cathode members 2 and/or a comparison experiment under different components of the plating solution, and further determine the material of the anode member 3, the material of the cathode member 2 and the components of the plating solution with the highest plating efficiency under the current temperature condition of the plating solution.
In order to improve the work efficiency of the electroplating device, the anode member 3 in this embodiment includes the first anode member 31 disposed on the first side surface of the cathode member 2 and the second anode member 32 disposed on the second side surface of the cathode member 2 away from the first anode member 31, the first anode member 31 and the second anode member 32 are respectively disposed on two sides of the cathode member 2, after the power is turned on, metal complex ions in the electroplating solution are respectively deposited on two sides of the cathode member 2 under the driving of the first anode member 31 and the second anode member 32, and then both sides of the cathode member 2 can be electroplated, the area of the plating layer on the cathode member 2 is increased, thereby improving the electroplating efficiency of the electroplating device.
Preferably, the plating container 1 in this embodiment includes a container body 11 and a container cover 12, the container cover 12 is disposed at the opening of the container body 11, when an operator replaces the plating solution, the plating solution can be replaced by opening the container cover 12, and the plating solution replacement process is convenient and quick. The material of the container cover is not limited, and preferably, in order to prolong the service life of the container cover 12, the container cover 12 in this embodiment is made of corrosion-resistant polytetrafluoroethylene material.
In order to quickly mount the anode member 3 and the cathode member 2 in the plating container 1, the plating apparatus further includes an electrode mount 6, the electrode mount 6 being penetratingly disposed on the container lid 12, the electrode mount 6 including a first electrode mount 61, a second electrode mount 62, and a third electrode mount 63, wherein a first end of the first electrode mount 61 is fixedly connected to the first anode member 31; a first end of the second electrode holder 62 is fixedly connected to the second anode member 32; the first end of the third electrode fixing member 63 is fixedly connected with the cathode member 2; a second end portion of the first electrode holder 61 opposite to the first end portion thereof and a second end portion of the second electrode holder 62 opposite to the first end portion thereof are electrically connected to a positive electrode of the dc power supply 4, and a second end portion of the third electrode holder 63 opposite to the first end portion thereof is electrically connected to a negative electrode of the dc power supply 4. After the electrode is connected with the electrode fixing part 6, the electrode can be completely immersed in the electroplating solution, so that the electroplating efficiency of the electroplating device is increased, wherein the cathode is completely immersed in the electroplating solution, so that the area of a coating can be increased, and the electroplating efficiency of the electroplating device is improved.
The temperature control unit 5 in this embodiment controls the temperature of the plating liquid, and the plating apparatus further includes a state detection unit 7 and a state detection host 8 in order to acquire state information such as the specific temperature and pH of the plating liquid. The state detection unit 7 is penetratingly provided on the container cover 12, a first end of the state detection unit 7 is immersed in the plating solution, a second end of the state detection unit 7 opposite to the first end thereof is electrically connected to the state detection host 8, the state detection unit 7 detects state information such as temperature and pH of the plating solution and transmits the state information to the state detection host 8, and the state detection host 8 receives and displays the state information. The condition detecting means 7 is not limited herein, and preferably, the condition detecting means 7 in the present embodiment includes a pH detecting member for detecting the pH of the plating liquid and a temperature detecting member for detecting the temperature of the plating liquid.
In the electroplating process, stir the plating solution and can improve electroplating device's electroplating efficiency, the purpose of stirring makes the plating solution flow, the convection current of plating solution with higher speed, make near metal complex ion that consumes of negative pole in time supply, electroplating device in this embodiment still includes the circulating pump, the pipeline of circulating pump stretches into in the plating solution from container lid 12, the pipeline of circulating pump includes liquid inlet pipe way and drain pipe, liquid inlet pipe way and drain pipe way get into container body 11 through an opening of container lid 12 in this embodiment, the plating solution circulates under the drive of circulating pump and flows, thereby electroplating process in-process plating solution flow has been realized, thereby the plating solution can carry out the convection current and improve electroplating device's electroplating efficiency. Preferably, the circulating pump in this embodiment is a peristaltic pump, and the peristaltic pump can accurately control the liquid inlet speed and the liquid outlet speed, thereby controlling the convection degree of the electroplating solution.
In order to prevent the plating solution from being lost due to evaporation, a vapor return ring is disposed at the edge of the container lid 12, and the vapor return ring can reduce the loss of the plating solution due to evaporation, thereby reducing the loss of the plating solution.
Preferably, the electroplating apparatus in this embodiment is used for preparing actinide metal elements, and therefore, the electroplating solution in this embodiment is uranyl nitrate electroplating solution, the first anode member 31 and the second anode member 32 are both made of platinum, and the cathode member 2 is made of stainless steel material. Because the uranyl nitrate electroplating solution is acidic, in order to prolong the service life of the electroplating device, the container cover 12 is made of polytetrafluoroethylene material, and the polytetrafluoroethylene has good corrosion resistance.
By adopting the technical scheme, the electroplating device in the embodiment mainly has the following technical effects: the device is convenient and quick to mount and dismount, an operator can quickly set up the electroplating test device, the cathode piece 2 and the anode piece 3 are very quick and convenient to mount and dismount, and the mounting time of the electroplating device is saved; the temperature control part 5 is used for controlling the temperature of the electroplating solution, so that a comparison experiment can be more conveniently carried out; the electroplating container 1 has large volume and contains more electroplating solution, and can prepare more actinide metal elements by one-time electroplating; the two sides of the cathode piece 2 can be electroplated simultaneously by arranging the two anode pieces 3, so that the area of the coating on the cathode piece 2 is increased, and the electroplating efficiency is improved.
The above embodiments are only for illustrating the invention and are not to be construed as limiting the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, therefore, all equivalent technical solutions also belong to the scope of the invention, and the scope of the invention is defined by the claims.
Claims (9)
1. An electroplating apparatus, comprising:
the electroplating container (1), the electroplating container (1) is used for containing electroplating liquid;
a cathode member (2), the cathode member (2) being disposed in the plating container (1);
an anode member (3), the anode member (3) being disposed in the plating container (1); and
a direct current power supply (4), wherein the positive electrode of the direct current power supply (4) is electrically connected with the anode piece (3), and the negative electrode of the direct current power supply (4) is electrically connected with the cathode piece (2);
the method is characterized in that:
the anode member (3) includes:
a first anode piece (31), the first anode piece (31) being arranged at a first side of the cathode piece (2); and
a second anode piece (32), the second anode piece (32) being arranged at a second side of the cathode piece (2) facing away from the first anode piece (31);
the plating apparatus further comprises a temperature control part (5), the plating container (1) is disposed in the temperature control part (5), and the temperature control part (5) controls the temperature of the plating solution.
2. A plating apparatus according to claim 1, wherein:
the plating container (1) includes:
a container body (11), wherein the container body (11) is used for containing electroplating solution; and
the container cover (12), the container cover (12) sets up in the opening of container body (11).
3. A plating apparatus according to claim 2, characterized in that:
the plating apparatus further includes:
an electrode mount (6), the electrode mount (6) being penetratingly disposed on the container lid (12), the electrode mount (6) comprising:
a first electrode holder (61), wherein a first end of the first electrode holder (61) is fixedly connected with the first anode member (31);
a second electrode holder (62), a first end of the second electrode holder (62) being fixedly connected to the second anode member (32); and
and the first end part of the third electrode fixing part (63) is fixedly connected with the cathode piece (2).
4. A plating apparatus according to claim 3, characterized in that:
a second end portion of the first electrode holder (61) opposite to the first end portion thereof and a second end portion of the second electrode holder (62) opposite to the first end portion thereof are electrically connected to a positive electrode of the direct current power supply (4), and a second end portion of the third electrode holder (63) opposite to the first end portion thereof is electrically connected to a negative electrode of the direct current power supply (4).
5. A plating apparatus according to claim 2, characterized in that:
the plating apparatus further includes:
a state detection member (7), wherein the state detection member (7) is penetratingly provided on the container lid (12), and a first end portion of the state detection member (7) is immersed in the plating liquid; and
and a state detection host (8), wherein the state detection host (8) is electrically connected with a second end part of the state detection component (7) opposite to the first end part of the state detection component.
6. A plating apparatus according to claim 5, characterized in that:
the state detection means (7) includes:
a pH detecting member that detects a pH of the plating liquid; and
a temperature detection member that detects a temperature of the plating liquid.
7. A plating apparatus according to claim 1, wherein:
the plating apparatus further includes:
and the liquid inlet pipeline and the liquid outlet pipeline of the circulating pump are arranged in the electroplating liquid.
8. A plating apparatus according to claim 2, characterized in that:
the edge of the container cover (12) is provided with a steam backflow ring.
9. A plating apparatus according to claim 1, wherein:
the temperature control part (5) is a constant temperature water bath box, the electroplating container (1) is arranged in the constant temperature water bath box, and the constant temperature water bath box transmits heat or absorbs heat to the electroplating container (1) through liquid in the box so as to complete temperature control of the electroplating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010034356.2A CN111155167A (en) | 2020-01-13 | 2020-01-13 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010034356.2A CN111155167A (en) | 2020-01-13 | 2020-01-13 | Electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111155167A true CN111155167A (en) | 2020-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010034356.2A Pending CN111155167A (en) | 2020-01-13 | 2020-01-13 | Electroplating device |
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| CN (1) | CN111155167A (en) |
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| US20050230264A1 (en) * | 2004-04-02 | 2005-10-20 | Richard Lacey | Electroplating solution and method for electroplating |
| CN102337578A (en) * | 2010-07-19 | 2012-02-01 | 北大方正集团有限公司 | Double-sided plating tank, sheet and plating method |
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| CN207227578U (en) * | 2017-01-23 | 2018-04-13 | 东莞市若美电子科技有限公司 | Improved circuit board plating cylinder body |
| CN207699704U (en) * | 2017-12-27 | 2018-08-07 | 上海曲达科技有限公司 | A kind of gilding structure of edge connector for circuit board |
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| CN209493648U (en) * | 2018-10-22 | 2019-10-15 | 中国原子能科学研究院 | A kind of electric deposition device for electro-deposition uranium paillon protective layer |
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2020
- 2020-01-13 CN CN202010034356.2A patent/CN111155167A/en active Pending
Patent Citations (8)
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| CN1288979A (en) * | 2000-09-20 | 2001-03-28 | 华东师范大学 | Technology process and equiment for depositing permalloy film electrically |
| US20050230264A1 (en) * | 2004-04-02 | 2005-10-20 | Richard Lacey | Electroplating solution and method for electroplating |
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| CN207227578U (en) * | 2017-01-23 | 2018-04-13 | 东莞市若美电子科技有限公司 | Improved circuit board plating cylinder body |
| CN207121656U (en) * | 2017-06-05 | 2018-03-20 | 贵州理工学院 | Magnetic agitation electroplanting device under a kind of supercritical fluid |
| CN207699704U (en) * | 2017-12-27 | 2018-08-07 | 上海曲达科技有限公司 | A kind of gilding structure of edge connector for circuit board |
| CN209493648U (en) * | 2018-10-22 | 2019-10-15 | 中国原子能科学研究院 | A kind of electric deposition device for electro-deposition uranium paillon protective layer |
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