CN111148418A - Shielding film and manufacturing method thereof - Google Patents
Shielding film and manufacturing method thereof Download PDFInfo
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- CN111148418A CN111148418A CN201811308137.8A CN201811308137A CN111148418A CN 111148418 A CN111148418 A CN 111148418A CN 201811308137 A CN201811308137 A CN 201811308137A CN 111148418 A CN111148418 A CN 111148418A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
Abstract
The invention discloses a shielding film and a manufacturing method thereof, wherein the shielding film comprises a base material layer, at least one polymer layer, two shielding layers and two wave-absorbing layers, the base material layer is connected with the polymer layer or is connected with the polymer layer through one wave-absorbing layer, one surface of the base material layer, facing the polymer layer, is provided with a plurality of grooves, one surface of the polymer layer, far away from the base material layer, is provided with a plurality of grooves, and shielding materials are filled in the grooves to form the shielding layers. When the substrate layer is connected with the polymer layer, the wave-absorbing layer at least covers the shielding layer, or at least covers the shielding layer and one surface of the polymer layer with the groove; when the substrate layer is connected with the polymer layer through a wave absorbing layer, the wave absorbing layer covers the wave absorbing shielding layer and one surface of the substrate layer with the groove.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to a shielding film and a manufacturing method thereof.
Background
With the development of technology, radio frequency devices are widely used. Common radio frequency equipment such as industrial electrical equipment, broadcast television transmitting towers, wireless communication networks, high-voltage transmission lines, household appliances and the like can transmit electromagnetic wave energy outwards during working to generate electromagnetic radiation, the electromagnetic radiation can affect human bodies or machines, the degree of the electromagnetic radiation is directly related to the energy of the electromagnetic radiation, the energy generated by the electromagnetic radiation depends on the frequency of the electromagnetic radiation, the electromagnetic radiation can be arranged into a plurality of levels from low to high according to the frequency, the higher the frequency is, the larger the energy generated by the electromagnetic radiation is, and the overlarge electromagnetic radiation energy can damage physiological tissue molecules of the human bodies. Nowadays, radio frequency devices are equipped in a large number in places where people are moving, the frequency spectrum range is continuously widened, the intensity is multiplied, if electromagnetic radiation exceeds the limit which can be born by human bodies or machines, electromagnetic pollution is formed, the electromagnetic pollution not only can interfere electronic devices, but also can threaten human health, and is a 'stealth killer' with serious harm, and the electromagnetic pollution becomes the fifth pollution following atmospheric pollution, water pollution, solid waste pollution and noise pollution. The most effective solution to the problem of electromagnetic pollution is to use electromagnetic shielding technology, including absorption and reflection electromagnetic shielding, and to use electromagnetic shielding materials to shield the electromagnetic waves. Different application fields have different requirements on electromagnetic shielding materials. In the occasions needing visual observation, transparent electromagnetic shielding materials are needed, and the application fields comprise medical electromagnetic isolation room observation windows, communication equipment transparent electromagnetic shielding elements, aerospace equipment optical windows, advanced optical instrument optical windows, security facility electromagnetic leakage prevention optical windows, liquid crystal display screens, mobile phone touch screens, vehicle-mounted transparent antennas and the like. In the prior art, in order to realize transparent electromagnetic shielding, a transparent electromagnetic shielding film is generally used. The transparent shielding film can reflect electromagnetic radiation back to the space, causing secondary pollution to the space environment, and cannot thoroughly prevent and treat electromagnetic pollution. The transparent metal oxide film mainly made of indium tin oxide is widely applied to visible light transparent occasions, but the transparent wave band is narrow, although the microwave shielding wave band is wide, the shielding capability is weak, the material is hard, the flexibility is poor, and the surface bonding cannot be well carried out. In addition, the requirements for shielding strength are different for different application scenarios. Under the condition of higher shielding requirement, the existing shielding film has poorer shielding effect and cannot meet the corresponding requirement.
Disclosure of Invention
In view of the above, the main object of the present invention is to provide a shielding film, which includes a wave-absorbing shielding unit layer and at least one reinforcing unit layer, where the reinforcing unit layer is disposed on one side of the wave-absorbing shielding unit layer;
the wave-absorbing shielding unit layer comprises a substrate layer, a first shielding layer and a first wave-absorbing layer, the substrate layer is provided with a first surface and a second surface which are opposite, the first surface is provided with a plurality of grooves, shielding materials are filled in the grooves to form communicated conductive grids to form the first shielding layer, and the first wave-absorbing layer at least partially covers the first shielding layer or at least partially covers the first shielding layer and the substrate layer;
the reinforced unit layer comprises a polymer layer, a second shielding layer and a second wave-absorbing layer, wherein a plurality of grooves are formed in one side, far away from the wave-absorbing shielding unit layer, of the polymer layer, shielding materials are filled in the grooves to form communicated conductive grids to form the second shielding layer, and at least part of the second wave-absorbing layer covers the second shielding layer or at least part of the second shielding layer and the polymer layer.
Preferably, the grid is periodic, or aperiodic, or random, and the grid pattern of the first shielding layer and the grid pattern of the second shielding layer are the same or different.
Preferably, the width, height, spacing distance of the grooves and cross section of the grooves are the same or differ at least one from each other on the substrate layer side and the polymer layer side.
Preferably, the height of the grooves ranges from 500nm to 10 μm, the width of the grooves ranges from 500nm to 10 μm, and the separation distance of the grooves ranges from 500nm to 500 μm.
Preferably, the cross section of the groove is square, rectangular or trapezoidal.
Preferably, one side of the mesh is planar, convex or concave.
Preferably, the height of the shielding layer is smaller than the depth of the groove, or equal to the depth of the groove, or larger than the depth of the groove.
Preferably, the first surface of the base material layer is further provided with a polymer layer.
Preferably, the polymer layer is a transparent heat-curable glue or a light-curable glue.
Preferably, the substrate layer adopts flexible macromolecular materials such as transparent heat-curable glue, photocuring glue or PET, PC, the shielding layer adopts metal, graphite alkene or titanium nanotube material, the layer of absorbing adopts titanium carbide or graphite alkene material.
Preferably, the shielding film comprises a protective layer, and the protective layer at least covers the wave-absorbing layer on the groove side of the polymer layer.
The invention also discloses a manufacturing method of the shielding film, which is characterized by comprising the following steps:
(A) manufacturing a graphical grid groove on a substrate by a laser direct writing technology;
(B) placing the substrate in an electroforming tank, and manufacturing a metal template by an electroforming technology;
(C) directly imprinting the patterned grid groove on a flexible substrate by using a metal template as a mother board and utilizing a nano imprinting technology, or coating a curing adhesive layer on the substrate, imprinting on the curing adhesive layer, and forming the patterned grid groove after curing;
(D) filling conductive slurry into the grooves by adopting a blade coating technology, and filling wave-absorbing materials into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers;
(E) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing; (F) and D, repeating the step D, manufacturing a shielding layer rear wave absorbing layer of the strengthening unit layer, and manufacturing a shielding film.
Preferably, the step (D) is to fill the conductive paste into the grooves by using a blade coating technique, further to improve conductivity, place the conductive paste into an electrodeposition bath, continue to deposit metal in the grooves, and then place the wave-absorbing layer on the conductive mesh layer by using a blade coating or transfer technique.
A method of manufacturing a shielding film, comprising the steps of:
(A) manufacturing a mask plate by adopting a laser direct writing technology;
(B) coating photoresist on the conductive substrate, forming a patterned grid in the photoresist layer by a mask exposure technology, and fully developing to expose the conductive substrate;
(C) metal deposition is realized at the exposed groove of the conductive substrate by adopting a selective electrodeposition technology, and no metal deposition exists in the coverage area of other photoresists;
(D) removing the photoresist on the conductive base material, coating a layer of ultraviolet curing adhesive on the metal substrate, covering the flexible substrate on the curing adhesive, curing, and demolding to form a patterned conductive layer;
(E) transferring the wave-absorbing layer onto the conductive layer by a transfer technology to manufacture a wave-absorbing shielding unit layer;
(F) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing;
(G) conductive slurry is filled into the grooves by adopting a blade coating technology, and then wave-absorbing materials are filled into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers and manufacture shielding films.
Compared with the prior art, the shielding film disclosed by the invention has the advantages that: the shielding film has better transparent property and flexibility, and compared with the structure of a single-layer film, a shielding layer and a wave-absorbing layer are additionally arranged, so that the shielding property and the wave-absorbing property are stronger; compared with the structure of a multilayer film, the structure does not need to be attached to the film, and the firmness degree is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a first preferred embodiment of a shielding film of the present invention.
FIG. 2 is a schematic cross-sectional view of a first variation of a first preferred embodiment of a shielding film of the present invention.
FIG. 3 is a schematic cross-sectional view of a second variation of the first preferred embodiment of a shielding film of the present invention.
FIG. 4 is a schematic cross-sectional view of a third variation of the first preferred embodiment of the shielding film of the present invention.
FIG. 5 is a schematic cross-sectional view of a fourth variation of the first preferred embodiment of the shielding film of the present invention.
FIG. 6 is a schematic cross-sectional view of a second preferred embodiment of a shielding film of the present invention.
Detailed Description
Referring to fig. 1, a reinforced shielding film according to a first preferred embodiment of the present invention includes a substrate layer 10, a polymer layer 20, a first shielding layer 31, a first wave-absorbing layer 41, a second shielding layer 32, and a second wave-absorbing layer 42. The substrate layer 10 has a first surface 11 and a second surface 12 opposite to each other, and the first surface 11 has a plurality of first grooves 111; the polymer layer 20 has a first surface 21 and a second surface 22 opposite to each other, and the first surface 21 has a plurality of second grooves 211. The first grooves 111 are uniformly distributed on the first surface 11, and the first grooves 111 form a mutually communicated grid on the first surface 11; the second grooves 211 are evenly distributed on the first surface 21, and the second grooves 211 form a mutually connected grid on the first surface 21. The grid may be periodic or aperiodic. The substrate layer 10 is connected to the second surface 22 of the polymer layer 20 through the first surface 11. The substrate layer 10, the first shielding layer 31 and the first wave-absorbing layer 41 together form a wave-absorbing shielding unit layer. The polymer layer 20, the second shielding layer 32 and the second wave-absorbing layer 42 together form the reinforcing unit layer.
It is worth noting that under the condition that the spacing distance of the grooves is the same, when the width of the grooves is 500nm, the light transmittance of the shielding film is good, the shielding performance is poor, when the width is 10um, the light transmittance is poor, the shielding performance is good, and the preferable width of the grooves is 5 μm, so that the balance between the light transmittance and the shielding performance is realized. When the widths of the grooves are the same, the larger the interval of the grooves is, the better the light transmittance is, the poorer the shielding performance is, the smaller the interval of the grooves is, the poorer the light transmittance is, the better the shielding performance is, and the interval distance of the grooves is set to be in the range of 500nm to 500 μm, preferably 250 μm.
The first shielding layer 31 is formed by the shielding material filled in the first groove 111, and the second shielding layer 32 is formed by the shielding material filled in the second groove 211. Specifically, the first shielding layer 31 includes a plurality of first shielding strips 311, the number of the first shielding strips 311 is the same as that of the first grooves 111, the first shielding strips 311 are respectively disposed inside the first grooves 111, and the height of the first shielding strips 311 is smaller than the depth of the first grooves 111; the second shielding layer 32 includes a plurality of second shielding strips 321, the second shielding strips 321 are the same as the second grooves 211 in number, the second shielding strips 321 are respectively disposed inside the second grooves 211, and the height of the second shielding strips 321 is less than the depth of the second grooves 211. As shown in fig. 1, the side of the shielding strip away from the second surface 12 is a plane, but the side is not limited to be disposed as a plane, and the side of the shielding strip away from the second surface 12 may be a convex side or a concave side.
The first absorbing layer 41 comprises a plurality of first absorbing strips 411, the number of the first absorbing strips 411 is the same as that of the first shielding strips 311, the first absorbing strips 411 respectively cover the first shielding strips 311, the first absorbing strips 411 are respectively arranged in the first grooves 111, the first absorbing strips 411 are tightly combined with the first shielding strips 311, and the first absorbing strips 411 are simultaneously contacted with the second surface 22; the second wave-absorbing layer 42 comprises a plurality of second wave-absorbing strips 421, the second wave-absorbing strips 421 are the same as the second shielding strips 321 in quantity, the second wave-absorbing strips 421 cover the second shielding strips 321 respectively, the second wave-absorbing strips 421 are arranged in the second grooves 211 respectively, the second wave-absorbing strips 421 are tightly combined with the second shielding strips 321, and the light transmittance is ensured while the electromagnetic radiation absorption rate is improved.
Further, the shielding film further includes a second protective layer 52 disposed on the first surface 21 side, the second protective layer 52 includes a plurality of second protective strips 521, the number of the second protective strips 521 is the same as that of the second wave-absorbing strips 421, the second protective strips 521 respectively cover the second wave-absorbing strips 421, and the second protective strips 521 respectively protect the second wave-absorbing strips 421.
Preferably, the substrate layer 10 is made of transparent heat-curable adhesive, light-curable adhesive or transparent flexible polymer materials such as PET and PC, and has good light transmittance and strong flexibility. The polymer layer 20 is made of transparent thermal curing glue or light curing glue. The first shielding layer 31 and the second shielding layer 32 are made of metal, graphene or titanium nanotubes. The first wave absorbing layer 41 and the second wave absorbing layer 42 are made of titanium carbide or graphene.
As shown in fig. 2, a first variation of the first preferred embodiment of the shielding film is different in that a second wave-absorbing layer, in which a second wave-absorbing layer 42A covers the first surface 21, a surface of the second wave-absorbing layer 42A contacting the polymer layer 20 is provided with a plurality of second protrusions 421A, the number of the second protrusions 421A is the same as that of the second grooves 211, the second protrusions 421A and the second grooves 211 are respectively disposed correspondingly to fill the remaining space in the second grooves 211, and the second protrusions 421A are respectively connected to the second shielding strips 321 in a contacting manner. The second protective layer 52A is disposed on one side of the second wave-absorbing layer 42A away from the polymer layer 20 and connected to the second wave-absorbing layer 42A. The second wave-absorbing layer 42A completely covers the first surface 21, so that electromagnetic wave absorption can be more comprehensively and effectively realized, and the shielding effect is improved.
Fig. 3 shows a second variant of the first preferred embodiment of the shielding film, which differs in the second shielding layer and the second absorbing layer. The second shielding layer 32B in this variation includes a plurality of second shielding strips 321B, the number of the second shielding strips 321B is the same as that of the second grooves 211, the second shielding strips 321B are respectively disposed inside the second grooves 211, and the height of the second shielding strips 321B is equal to the depth of the second grooves 211. The second wave-absorbing layer 42B is disposed on the first surface 21, and the second wave-absorbing layer 42B is connected to the polymer layer 20 and the second shielding layer 32B. The second protective layer 52B is disposed on one side of the second wave-absorbing layer 42B away from the polymer layer 20 and connected to the second wave-absorbing layer 42B. The first surface 21 is flat, the structure of the second wave-absorbing layer 42B is simplified, the manufacturing process of the shielding film is simplified, the manufacturing cost is reduced, and the manufacturing efficiency is improved.
Fig. 4 shows a third variant of the first preferred embodiment of the shielding film, which differs in the second shielding layer and the second absorbing layer. The second shielding layer 32C in this variation includes a plurality of second shielding strips 321C, the number of the second shielding strips 321C is the same as that of the second grooves 211, the second shielding strips 321C are respectively disposed inside the second grooves 211, the height of the second shielding strips 321C is greater than the depth of the second grooves 211, and a portion of the second shielding strips 321C extending out of the second grooves 211 is a second protrusion 3211C. The second wave-absorbing layer 42C covers the first surface 21, and a surface of the second wave-absorbing layer 42C in contact with the polymer layer 20 is provided with a plurality of second recesses 421C, the number of the second recesses 421C is the same as that of the second protrusions 3211C, and the second recesses 421C and the second protrusions 3211C are respectively and correspondingly and tightly combined. The second protective layer 52C is disposed on one side of the second wave-absorbing layer 42C far from the first surface 21 and connected to the second wave-absorbing layer 42C.
Fig. 5 shows a fourth variant of the first preferred embodiment of the shielding film, which differs in the first absorbing layer. In this variation, the first wave-absorbing layer 41A covers the first surface 11, and a surface of the first wave-absorbing layer 41A contacting the substrate layer 10 has a plurality of first protrusions 411A, the number of the first protrusions 411A is the same as that of the first grooves 111, the first protrusions 411A and the first grooves 111 are respectively disposed correspondingly, the remaining space in the first grooves 111 is filled, and meanwhile, the first protrusions 411A are respectively connected to the first shielding strips 311 in a contacting manner. The first surface 11 of the substrate layer 10 is connected to the second surface 22 of the polymer layer 20 through the first wave-absorbing layer 41A.
It should be noted that the modifications of the shielding film in the first preferred embodiment are not limited to the above four, and more modifications can be combined by changing the forms of the first shielding layer and the first absorbing layer, for example, the forms of the second shielding layer and the second absorbing layer in the second and third modifications, and changing the forms of the second shielding layer and the second absorbing layer.
Fig. 6 shows a second preferred embodiment of the shielding film, which is distinguished by a substrate layer. The substrate layer 10A in this embodiment includes a first substrate layer 101A and a first polymer layer 102A, the first substrate layer 101A and the first polymer layer 102A are tightly bonded to form a bonding surface, a side of the first polymer layer 102A away from the bonding surface is a first surface 11A, a side of the first substrate layer 101A away from the bonding surface is a second surface 12A, the first surface 11A has a plurality of first grooves 111A, and the first surface 11A is connected to the second surface 22. The first shielding layer 31 and the first absorbing layer 41 are disposed in combination with the first polymer layer 102A. It is noted that the second preferred embodiment can be modified as the first preferred embodiment.
The invention also discloses a manufacturing method of the shielding film, which can be divided into the following four modes.
In a first aspect, a doctor blade technique for producing a shielding film includes the steps of:
(A) manufacturing a graphical grid groove on a substrate by a laser direct writing technology;
(B) placing the substrate in an electroforming tank, and manufacturing a metal template by an electroforming technology;
(C) directly imprinting the patterned grid groove on a flexible substrate by using a metal template as a mother board and utilizing a nano imprinting technology, or coating a curing adhesive layer on the substrate, imprinting on the curing adhesive layer, and forming the patterned grid groove after curing;
(D) filling conductive slurry into the grooves by adopting a blade coating technology, and filling wave-absorbing materials into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers;
(E) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing; (F) and D, repeating the step D, manufacturing a shielding layer rear wave absorbing layer of the strengthening unit layer, and manufacturing a shielding film.
In a second mode, the manufacturing of the shielding film by the knife coating technology and the transfer technology comprises the following steps:
(A) manufacturing a graphical grid groove on a substrate by a laser direct writing technology;
(B) placing the substrate in an electroforming tank, and manufacturing a metal template by an electroforming technology;
(C) directly imprinting the patterned grid groove on a flexible substrate by using a metal template as a mother board and utilizing a nano imprinting technology, or coating a curing adhesive layer on the substrate, imprinting on the curing adhesive layer, and forming the patterned grid groove after curing;
(D) filling conductive slurry into the grooves by adopting a blade coating technology, and then transferring the wave-absorbing material into the grooves to manufacture wave-absorbing shielding unit layers by adopting a transfer technology;
(E) manufacturing a reinforced unit layer by adopting the steps (A) to (D);
(F) and adhering the reinforced unit layer to one side of the wave-absorbing shielding unit layer to manufacture a shielding film.
In a third mode, the manufacturing of the shielding film by the metal deposition growth technology and the transfer technology comprises the following steps:
(A) manufacturing a mask plate by adopting a laser direct writing technology;
(B) coating photoresist on the conductive substrate, forming a patterned grid in the photoresist layer by a mask exposure technology, and fully developing to expose the conductive substrate;
(C) metal deposition is realized at the exposed groove of the conductive substrate by adopting a selective electrodeposition technology, and no metal deposition exists in the coverage area of other photoresists;
(D) removing the photoresist on the conductive base material, coating a layer of ultraviolet curing adhesive on the metal substrate, covering the flexible substrate on the curing adhesive, curing, and demolding to form a patterned conductive layer;
(E) transferring the wave-absorbing layer onto the conductive layer by a transfer technology to manufacture a wave-absorbing shielding unit layer;
(F) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing;
(G) conductive slurry is filled into the grooves by adopting a blade coating technology, and then wave-absorbing materials are filled into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers and manufacture shielding films.
In a fourth aspect, a filling technique and a growing technique are combined to manufacture the shielding film, including the steps of:
(A) manufacturing a graphical grid groove on a substrate by a laser direct writing technology;
(B) placing the substrate in an electroforming tank, and manufacturing a metal template by an electroforming technology;
(C) directly imprinting the patterned grid groove on a flexible substrate by using a metal template as a mother board and utilizing a nano imprinting technology, or coating a curing adhesive layer on the substrate, imprinting on the curing adhesive layer, and forming the patterned grid groove after curing;
(D) filling the conductive slurry into the groove by adopting a blade coating technology, placing the conductive slurry into an electro-deposition groove for further improving the conductivity, and continuously depositing metal in the groove;
(E) placing the wave-absorbing layer on the conductive grid layer by blade coating or transfer technology to manufacture a wave-absorbing shielding unit layer;
(E) manufacturing a reinforced unit layer by adopting the steps (A) to (E);
(F) and adhering the reinforced unit layer to one side of the wave-absorbing shielding unit layer to manufacture a shielding film.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A shielding film, comprising: the wave-absorbing shielding unit layer is arranged on one side of the wave-absorbing shielding unit layer;
the wave-absorbing shielding unit layer comprises a substrate layer, a first shielding layer and a first wave-absorbing layer, the substrate layer is provided with a first surface and a second surface which are opposite, the first surface is provided with a plurality of grooves, shielding materials are filled in the grooves to form communicated conductive grids to form the first shielding layer, and the first wave-absorbing layer at least partially covers the first shielding layer or at least partially covers the first shielding layer and the substrate layer;
the reinforced unit layer comprises a polymer layer, a second shielding layer and a second wave-absorbing layer, wherein a plurality of grooves are formed in one side, far away from the wave-absorbing shielding unit layer, of the polymer layer, shielding materials are filled in the grooves to form communicated conductive grids to form the second shielding layer, and at least part of the second wave-absorbing layer covers the second shielding layer or at least part of the second shielding layer and the polymer layer.
2. The shielding film of claim 1, wherein the grid is periodic, or aperiodic, or random, and the grid pattern of the first shielding layer and the grid pattern of the second shielding layer are the same or different.
3. The shielding film of claim 1, wherein the width, height, spacing distance of the grooves, and cross section of the grooves are the same or differ at least one of in the grooves on the substrate layer side and in the grooves on the polymer layer side.
4. The shielding film of claim 1, wherein the grooves have a height ranging from 500nm to 10 μ ι η, a width ranging from 500nm to 10 μ ι η, and a spacing distance ranging from 500nm to 500 μ ι η.
5. The shielding film of claim 1, wherein the grooves have a square, rectangular or trapezoidal cross-section.
6. The shielding film of claim 1, wherein one side of said mesh is planar, convex or concave.
7. The shielding film of claim 1, wherein a height of the shielding layer is less than a depth of the groove, or equal to the depth of the groove, or greater than the depth of the groove.
8. The shielding film of claim 1, wherein the substrate layer first surface is further provided with a polymer layer.
9. The double-sided shielding film of claim 8, wherein the polymer layer is a transparent heat-curable glue or a light-curable glue.
10. The shielding film of claim 1, wherein the substrate layer is made of transparent heat-curable adhesive, light-curable adhesive or flexible polymer materials such as PET and PC, the shielding layer is made of metal, graphene or titanium nanotube materials, and the wave-absorbing layer is made of titanium carbide or graphene materials.
11. The shielding film of claim 1, wherein said shielding film comprises a protective layer covering at least the absorbing layer on the grooved side of said polymer layer.
12. A method of manufacturing a shielding film, comprising the steps of:
(A) manufacturing a graphical grid groove on a substrate by a laser direct writing technology;
(B) placing the substrate in an electroforming tank, and manufacturing a metal template by an electroforming technology;
(C) directly imprinting the patterned grid groove on a flexible substrate by using a metal template as a mother board and utilizing a nano imprinting technology, or coating a curing adhesive layer on the substrate, imprinting on the curing adhesive layer, and forming the patterned grid groove after curing;
(D) filling conductive slurry into the grooves by adopting a blade coating technology, and filling wave-absorbing materials into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers;
(E) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing; (F) and D, repeating the step D, manufacturing a shielding layer rear wave absorbing layer of the strengthening unit layer, and manufacturing a shielding film.
13. The method of claim 11, wherein the step (D) is a step of filling the conductive paste into the grooves by a doctor-blade technique, and further to improve conductivity, the conductive paste is placed in an electrodeposition bath, metal is further deposited in the grooves, and then the wave-absorbing layer is placed on the conductive mesh layer by a doctor-blade or transfer technique.
14. A method of manufacturing a shielding film, comprising the steps of:
(A) manufacturing a mask plate by adopting a laser direct writing technology;
(B) coating photoresist on the conductive substrate, forming a patterned grid in the photoresist layer by a mask exposure technology, and fully developing to expose the conductive substrate;
(C) metal deposition is realized at the exposed groove of the conductive substrate by adopting a selective electrodeposition technology, and no metal deposition exists in the coverage area of other photoresists;
(D) removing the photoresist on the conductive base material, coating a layer of ultraviolet curing adhesive on the metal substrate, covering the flexible substrate on the curing adhesive, curing, and demolding to form a patterned conductive layer;
(E) transferring the wave-absorbing layer onto the conductive layer by a transfer technology to manufacture a wave-absorbing shielding unit layer;
(F) coating a curing adhesive layer on one side or the opposite side of the flexible substrate with the groove shape, stamping the curing adhesive layer, and forming a graphical grid groove after curing;
(G) conductive slurry is filled into the grooves by adopting a blade coating technology, and then wave-absorbing materials are filled into the grooves by adopting a secondary blade coating or transferring technology to manufacture wave-absorbing shielding unit layers and manufacture shielding films.
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Application publication date: 20200512 |