CN111142341A - Environment-friendly high-stability aqueous photoresist stripping liquid for panels and preparation method thereof - Google Patents
Environment-friendly high-stability aqueous photoresist stripping liquid for panels and preparation method thereof Download PDFInfo
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- CN111142341A CN111142341A CN201911403997.4A CN201911403997A CN111142341A CN 111142341 A CN111142341 A CN 111142341A CN 201911403997 A CN201911403997 A CN 201911403997A CN 111142341 A CN111142341 A CN 111142341A
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 56
- 239000007788 liquid Substances 0.000 title claims abstract description 13
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000004094 surface-active agent Substances 0.000 claims abstract description 22
- 239000002994 raw material Substances 0.000 claims abstract description 19
- 239000008367 deionised water Substances 0.000 claims abstract description 18
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 150000001412 amines Chemical class 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 239000003755 preservative agent Substances 0.000 claims abstract description 13
- 230000002335 preservative effect Effects 0.000 claims abstract description 13
- VTLLEYMBCVXROX-UHFFFAOYSA-N 1-(3-phenylprop-2-enyl)-4,5-dihydroimidazole Chemical compound C(C=CC1=CC=CC=C1)N1C=NCC1 VTLLEYMBCVXROX-UHFFFAOYSA-N 0.000 claims abstract description 11
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 claims abstract description 11
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000012964 benzotriazole Substances 0.000 claims abstract description 11
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 11
- CCTFMNIEFHGTDU-UHFFFAOYSA-N 3-methoxypropyl acetate Chemical compound COCCCOC(C)=O CCTFMNIEFHGTDU-UHFFFAOYSA-N 0.000 claims description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 9
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 9
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 9
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 claims description 9
- 239000002736 nonionic surfactant Substances 0.000 claims description 9
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 7
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 claims description 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000706 filtrate Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 229940074391 gallic acid Drugs 0.000 claims description 3
- 235000004515 gallic acid Nutrition 0.000 claims description 3
- 229940102253 isopropanolamine Drugs 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- -1 polyoxypropylene Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 229940043237 diethanolamine Drugs 0.000 claims 2
- 229960004418 trolamine Drugs 0.000 claims 2
- 229940031098 ethanolamine Drugs 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 13
- 238000005260 corrosion Methods 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 9
- 238000009472 formulation Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- CJFMJEUEUPHGHU-UHFFFAOYSA-N (5-methoxy-1h-indol-2-yl)-[4-(2-methylbenzimidazol-1-yl)piperidin-1-yl]methanone Chemical group CC1=NC2=CC=CC=C2N1C(CC1)CCN1C(=O)C1=CC2=CC(OC)=CC=C2N1 CJFMJEUEUPHGHU-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
Abstract
The embodiment of the invention discloses an environment-friendly high-stability aqueous photoresist stripping solution for a panel and a preparation method thereof, wherein the raw materials for preparing the environment-friendly high-stability aqueous photoresist stripping solution for the panel comprise 25-70 parts by weight of organic solvent, 10-50 parts by weight of organic amine, 0.1-5 parts by weight of preservative, 0.1-5 parts by weight of surfactant and 10-35 parts by weight of deionized water. The aqueous photoresist stripping solution for the environment-friendly high-stability panel provided by the embodiment of the invention utilizes the organic solvent, the organic amine and the deionized water to dissolve and remove the photoresist, and the benzotriazole, 1-hydroxy benzotriazole, cinnamyl imidazoline and benzimidazole are used in a matching manner, so that the problem of metal corrosion possibly caused when the photoresist is removed can be effectively avoided. The surface tension of the stripping liquid can be reduced by adding the surfactant, so that the solvent can clean the deep hole when the deep hole is stripped.
Description
Technical Field
The invention relates to the field of chemical etching, in particular to an environment-friendly high-stability aqueous photoresist stripping liquid for a panel, and a preparation method and application thereof.
Background
The photoresist is also called as photoresist and mainly comprises three components of photosensitive resin, sensitizer and solvent. After the photosensitive resin is irradiated by light, the photocuring reaction can be quickly carried out in an exposure area, so that the physical properties of the material, particularly the solubility, the affinity and the like are obviously changed. The required fine pattern is transferred from the mask plate to a processed substrate through the processes of exposure, development, etching, diffusion, ion implantation, metal deposition and the like, and the residual photoresist of the unexposed part is cleaned by photoresist removing stripping liquid, so that the whole pattern transfer process is completed.
At present, the stripping liquid is easy to cause panel corrosion when in use, which brings inconvenience to people and becomes a problem to be solved urgently.
Disclosure of Invention
Therefore, the embodiment of the invention provides an environment-friendly high-stability aqueous photoresist stripping liquid for a panel, and a preparation method and application thereof, so as to solve the problem that the stripping liquid in the prior art is easy to cause panel corrosion and bring inconvenience to people when in use.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
according to a first aspect of the embodiments of the present invention, an environment-friendly high-stability aqueous photoresist stripping solution for a panel is provided, raw materials for preparing the environment-friendly high-stability aqueous photoresist stripping solution for a panel include, by weight, 25 to 70 parts of an organic solvent, 10 to 50 parts of organic amine, 0.1 to 5 parts of a preservative, 0.1 to 5 parts of a surfactant, and 10 to 35 parts of deionized water.
Further, the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel comprise the following components in parts by weight: 42.5 parts of organic solvent, 30 parts of organic amine, 2.55 parts of preservative, 1.5 parts of surfactant and 22.5 parts of deionized water.
Further, the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel also comprise the following components in parts by weight: 2.5 parts of benzotriazole and 3 parts of 1-hydroxy benzotriazole.
Further, the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel comprise the following components in parts by weight: 20 parts of diethylene glycol monobutyl ether, 18.5 parts of methoxypropyl acetate, 12 parts of diethanolamine, 10 parts of triethanolamine, 8 parts of hexamethyl phosphoric triamide, 1.2 parts of cinnamyl imidazoline, 0.8 part of benzimidazole, 1.5 parts of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 22.5 parts of deionized water.
Further, the organic solvent comprises any one or the combination of more than two of N-methyl pyrrolidone, N-dimethyl acetamide, diethylene glycol monobutyl ether and methoxypropyl acetate.
Further, the organic amine comprises any one or a combination of more than two of N, N-dimethylformamide, diethanolamine, triethanolamine, hexamethylphosphoric triamide, isopropanolamine and ethanolamine.
Further, the preservative comprises any one or the combination of more than two of hydroxyethylidene diphosphonic acid, cinnamyl imidazoline, benzimidazole, methyl benzotriazole, gallic acid and catechol.
Further, the surfactant comprises one or the combination of more than two of polyoxypropylene ether, gemini nonionic surfactant and tetrabutylammonium bromide.
According to a second aspect of the embodiments of the present invention, there is provided a method for preparing an environment-friendly aqueous photoresist stripper for a high-stability panel, comprising the following steps:
step one, weighing all components according to raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel;
step two, mixing and stirring the organic solvent, the organic amine and the deionized water, and uniformly stirring to obtain a mixture for later use;
and step three, sequentially adding a preservative and a surfactant into the mixture, uniformly stirring, filtering, and collecting filtrate to obtain the aqueous photoresist stripping solution for the environment-friendly high-stability panel.
According to a third aspect of the embodiments of the present invention, an application of an environment-friendly aqueous photoresist stripper for a high-stability panel to cleaning a photoresist in a deep hole is provided.
The embodiment of the invention has the following advantages: the embodiment of the invention provides an environment-friendly high-stability aqueous photoresist stripping liquid for a panel, and a preparation method and application thereof, wherein the photoresist is dissolved and removed by using an organic solvent, organic amine and deionized water, and the benzotriazole, 1-hydroxy benzotriazole, cinnamyl imidazoline and benzimidazole are matched for use to prevent corrosion of base metal, so that the corrosion of metal aluminum can be inhibited, the corrosion of metal copper can be prevented, the compatibility is good, and the problem that the stripping liquid in the prior art is easy to cause panel corrosion and bring inconvenience to people when in use is effectively solved; in addition, the surface tension of the stripping liquid can be reduced by adding the surfactant, so that the solvent can clean the deep hole when encountering deep hole stripping, and the effect is more obvious particularly when the mass percent of the surfactant is 1.5%.
Drawings
FIG. 1 is a graph showing the peeling effect at a surfactant concentration of 0.5% by mass in the first example;
FIG. 2 is a graph showing the peeling effect at a surfactant concentration of 1.0% by mass in the first example;
FIG. 3 is a graph showing the peeling effect at a surfactant concentration of 1.5% by mass in the first example;
FIG. 4 is a graph showing the peeling effect when the surfactant concentration is 2.0% by mass in the first example.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that unless otherwise specified, technical terms or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention pertains, and experimental materials in the following examples are commercially available unless otherwise specified, and the experimental methods described are general experimental methods unless otherwise specified.
In view of the deficiencies in the prior art, the inventor of the present invention has made extensive studies and extensive practices to propose the technical solution of the present invention, and further explains the technical solution, the implementation process and the principle thereof, etc.
One aspect of the embodiment of the invention provides an environment-friendly high-stability aqueous photoresist stripping solution for a panel, which is prepared from the following raw materials, by weight, 25-70 parts of an organic solvent, 10-50 parts of organic amine, 0.1-5 parts of a preservative, 0.1-5 parts of a surfactant and 10-35 parts of deionized water.
Preferably, the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel comprise the following components in parts by weight: 42.5 parts of organic solvent, 30 parts of organic amine, 2.55 parts of preservative, 1.5 parts of surfactant and 22.5 parts of deionized water.
In some embodiments, the raw materials for preparing the environmentally-friendly aqueous photoresist stripper for high-stability panels further comprise the following components in parts by weight: 2.5 parts of benzotriazole and 3 parts of 1-hydroxy benzotriazole.
Preferably, the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel comprise the following components in parts by weight: 20 parts of diethylene glycol monobutyl ether, 18.5 parts of methoxypropyl acetate, 12 parts of diethanolamine, 10 parts of triethanolamine, 8 parts of hexamethyl phosphoric triamide, 1.2 parts of cinnamyl imidazoline, 0.8 part of benzimidazole, 1.5 parts of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 22.5 parts of deionized water.
Preferably, the organic solvent comprises any one or a combination of more than two of N-methyl pyrrolidone, N-dimethyl acetamide, diethylene glycol monobutyl ether and methoxypropyl acetate.
Preferably, the organic amine includes any one or a combination of two or more of N, N-dimethylformamide, diethanolamine, triethanolamine, hexamethylphosphoric triamide, isopropanolamine and ethanolamine.
Preferably, the preservative comprises any one or the combination of more than two of hydroxyethylidene diphosphonic acid, cinnamyl imidazoline, benzimidazole, methyl benzotriazole, gallic acid and catechol.
Preferably, the surfactant comprises any one or a combination of more than two of polyoxypropylene ether, gemini nonionic surfactant and tetrabutylammonium bromide.
According to a second aspect of the embodiments of the present invention, there is provided a method for preparing an environment-friendly aqueous photoresist stripper for a high-stability panel, comprising the following steps:
step one, weighing all components according to raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel;
step two, mixing and stirring the organic solvent, the organic amine and the deionized water, and uniformly stirring to obtain a mixture for later use;
and step three, sequentially adding a preservative and a surfactant into the mixture, uniformly stirring, filtering, and collecting filtrate to obtain the aqueous photoresist stripping solution for the environment-friendly high-stability panel.
According to a third aspect of the embodiments of the present invention, an application of an environment-friendly aqueous photoresist stripper for a high-stability panel to cleaning a photoresist in a deep hole is provided.
In addition, the invention also provides application of the environment-friendly high-stability aqueous photoresist stripping liquid for panels in cleaning photoresist in deep holes.
The technical solution of the present invention is further described in detail by the following examples. However, the examples are chosen only for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
Example 1
The embodiment provides an environment-friendly aqueous photoresist stripping solution for a high-stability panel, which is prepared from the following raw materials in parts by weight: 20 parts of diethylene glycol monobutyl ether, 18.5 parts of methoxypropyl acetate, 12 parts of diethanolamine, 10 parts of triethanolamine, 8 parts of hexamethyl phosphoric triamide, 1.2 parts of cinnamyl imidazoline, 0.8 part of benzimidazole, 1.5 parts of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 22.5 parts of deionized water.
Example 2
The embodiment provides an environment-friendly aqueous photoresist stripping solution for a high-stability panel, which is prepared from the following raw materials in parts by weight: 10 parts of diethylene glycol monobutyl ether, 15 parts of methoxypropyl acetate, 3 parts of diethanolamine, 3 parts of triethanolamine, 4 parts of hexamethyl phosphoric triamide, 0.05 part of cinnamyl imidazoline, 0.05 part of benzimidazole, 0.1 part of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 10 parts of deionized water.
Example 3
The embodiment provides an environment-friendly aqueous photoresist stripping solution for a high-stability panel, which is prepared from the following raw materials in parts by weight: 30 parts of diethylene glycol monobutyl ether, 40 parts of methoxypropyl acetate, 15 parts of diethanolamine, 15 parts of triethanolamine, 20 parts of hexamethyl phosphoric triamide, 2.5 parts of cinnamyl imidazoline, 2.5 parts of benzimidazole, 5 parts of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 10 parts of deionized water.
Comparative example 1
The results of examples 1-3 are shown in the following table, wherein the control was a stripper selected from commercially available solutions.
| Formulation of | Corrosion resistance | Peeling effect |
| Component 1 | No corrosion was observed at all | Complete stripping |
| Component 2 | Almost no corrosion was observed | Almost complete peeling |
| Component 3 | Almost no corrosion was observed | Complete stripping |
| Control group | Corrosion occurs | More residue is left |
Where component 1 is the formulation of example 1, component 2 is the formulation of example 2, and component 3 is the formulation of example 3. The above results show that there is no or almost no corrosion observed with the formulations of the present application and that the glass is very effective.
Comparative example 2
Based on example 1, the mass percent concentrations of the surfactants were adjusted to 0.5%, 1%, 1.5%, and 2%, respectively, and the mass percent concentrations of the remaining components were unchanged. Then, etching was performed, and the peeling effect was observed under a high power microscope.
In the above drawings, it is apparent that the cleaning shown in fig. 3 is most thorough and the cleaning effect is the best, that is, the cleaning effect is the best when the mass percentage concentration of the surfactant is 1.5%.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (10)
1. The utility model provides an environment-friendly high stability aqueous photoresist stripping liquid for panel which characterized in that: the raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel comprise 25-70 parts by weight of organic solvent, 10-50 parts by weight of organic amine, 0.1-5 parts by weight of preservative, 0.1-5 parts by weight of surfactant and 10-35 parts by weight of deionized water.
2. The environment-friendly high-stability aqueous photoresist stripping solution for panels as claimed in claim 1, wherein the raw materials for preparing the environment-friendly high-stability aqueous photoresist stripping solution for panels comprise the following components in parts by weight: 38.5 parts of organic solvent, 30 parts of organic amine, 2 parts of preservative, 1.5 parts of surfactant and 22.5 parts of deionized water.
3. The environment-friendly high-stability aqueous photoresist stripping solution for panels as claimed in claim 2, wherein the raw materials for preparing the environment-friendly high-stability aqueous photoresist stripping solution for panels further comprise the following components in parts by weight: 2.5 parts of benzotriazole and 3 parts of 1-hydroxy benzotriazole.
4. The environment-friendly high-stability aqueous photoresist stripping solution for panels as claimed in claim 1, wherein the raw materials for preparing the environment-friendly high-stability aqueous photoresist stripping solution for panels comprise the following components in parts by weight: 20 parts of diethylene glycol monobutyl ether, 18.5 parts of methoxypropyl acetate, 12 parts of diethanolamine, 10 parts of triethanolamine, 8 parts of hexamethyl phosphoric triamide, 1.2 parts of cinnamyl imidazoline, 0.8 part of benzimidazole, 1.5 parts of gemini nonionic surfactant, 2.5 parts of benzotriazole, 3 parts of 1-hydroxy benzotriazole and 22.5 parts of deionized water.
5. The environmental-friendly aqueous photoresist stripper for panels with high stability as claimed in claim 1, wherein: the organic solvent comprises any one or the combination of more than two of N-methyl pyrrolidone, N-dimethyl acetamide, diethylene glycol monobutyl ether and methoxypropyl acetate.
6. The environmental-friendly aqueous photoresist stripper for panels with high stability as claimed in claim 1, wherein: the organic amine comprises any one or the combination of more than two of N, N-dimethylformamide, diethanol amine, triethanol amine, hexamethyl phosphoric triamide, isopropanol amine and ethanol amine.
7. The environmental-friendly aqueous photoresist stripper for panels with high stability as claimed in claim 1, wherein: the preservative comprises any one or the combination of more than two of hydroxyethylidene diphosphonic acid, cinnamyl imidazoline, benzimidazole, methyl benzotriazole, gallic acid and catechol.
8. The environmental-friendly aqueous photoresist stripper for panels with high stability as claimed in claim 1, wherein: the surfactant comprises one or the combination of more than two of polyoxypropylene ether, gemini nonionic surfactant and tetrabutylammonium bromide.
9. A method for preparing the environmental-friendly aqueous photoresist stripper for panels with high stability as defined in any one of claims 1 to 8, comprising the steps of:
step one, weighing all components according to raw materials for preparing the aqueous photoresist stripping solution for the environment-friendly high-stability panel;
step two, mixing and stirring the organic solvent, the organic amine and the deionized water, and uniformly stirring to obtain a mixture for later use;
and step three, sequentially adding a preservative and a surfactant into the mixture, uniformly stirring, filtering, and collecting filtrate to obtain the aqueous photoresist stripping solution for the environment-friendly high-stability panel.
10. Use of the environmental-friendly high-stability aqueous photoresist stripper for panels as defined in any one of claims 1 to 8 for cleaning photoresist in deep holes.
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| CN201911403997.4A CN111142341A (en) | 2019-12-31 | 2019-12-31 | Environment-friendly high-stability aqueous photoresist stripping liquid for panels and preparation method thereof |
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| CN103676505A (en) * | 2013-12-23 | 2014-03-26 | 大连奥首科技有限公司 | Photoresist stripper for chip and preparation method and photoresist removing process thereof |
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