CN111136586A - Surface treatment method for radar signal acquisition, generation and processing module structure - Google Patents
Surface treatment method for radar signal acquisition, generation and processing module structure Download PDFInfo
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- CN111136586A CN111136586A CN201911377464.3A CN201911377464A CN111136586A CN 111136586 A CN111136586 A CN 111136586A CN 201911377464 A CN201911377464 A CN 201911377464A CN 111136586 A CN111136586 A CN 111136586A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/083—Deburring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a surface treatment method for a radar signal acquisition, generation and processing module structure, which comprises the following steps of; the first step is as follows: pretreatment of the surface of the module structure, wherein a worker wipes the surface of the module structure in a reciprocating manner through soft cloth, and the second step is as follows: optimizing the module processing environment by arranging a suction fan in the processing area; this radar signal gathers and produces processing module structure surface treatment method, through the mode that adopts the preliminary treatment, come to handle the module surface, and through the processing mode of shot-blasting machine and planarization processing, make the burr and the edges and corners on module surface get rid of, and make the module surface form the smooth surface, the follow-up processing operation of being convenient for, at last through adding heat dissipation layer and protective layer, come to protect the module, the life of extension module, it is too simple to have solved its surface treatment method of current module structure simultaneously, easily cause the influence to subsequent installation work, and can't add the problem of heat dissipation and protective layer.
Description
Technical Field
The invention relates to the technical field of radar signal acquisition module production, in particular to a surface treatment method for a radar signal acquisition, generation and processing module structure.
Background
Radar, which finds objects and determines their spatial position by radio, is also called radio positioning, and is an electronic device that detects objects by electromagnetic waves, and the radar emits electromagnetic waves to irradiate the objects and receive their echoes, thereby obtaining information about the distance, rate of change of distance (radial velocity), azimuth, altitude, etc., from the objects to the point of emission of the electromagnetic waves, and the radar signal occupies a typical frequency band from 500 mhz to 18 ghz, and the operating frequency of millimeter wave radar reaches 40 ghz or even higher, and a radar reconnaissance system cannot know exactly which radar will operate in advance, nor can it know the frequency of the signals emitted by these radars.
In the radar signal acquisition process, need use the information processing module, the information processing module need handle its surface, make things convenient for the staff to carry out subsequent installation, the processing method on its surface of current modular structure is simpler, the effect of processing is not good, cause the influence to subsequent installation work, and current modular structure is when handling the surface, can't add heat dissipation and protective layer, make the module can't obtain comprehensive protection, modular structure's life has been shortened, therefore, we have proposed a radar signal acquisition and have produced processing module structure surface treatment method, in order to solve the problem that above-mentioned content exists.
Disclosure of Invention
Technical problem to be solved
The invention aims to provide a surface treatment method for a radar signal acquisition, generation and processing module structure, which aims to solve the problems that the surface treatment method of the existing module structure is too simple, the subsequent installation work is easily influenced, and a heat dissipation layer and a protective layer cannot be added.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth;
the second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again;
the third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges;
the fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Preferably, in the first step, the number of times of wiping is more than five times, and the wiping coverage area of the soft cloth is more than the force application area of the staff.
Preferably, in the second step, dust is prevented from falling on the surface of the module structure, thereby not affecting the subsequent processing steps.
Preferably, in the third step, the shot blasting machine may be one of a drum type, a chain plate type, a turntable type, a trolley type, a squirrel cage type and a hanging type shot blasting machine.
Preferably, in the fourth step, the planarization treatment may be one of acid washing or sanding.
Preferably, in the fourth step, the acid-washed material is dilute sulfuric acid, and the mass concentration of the acid-washed material is less than 5 mol/L.
Preferably, in the fourth step, the sandpaper is sponge sandpaper, and the specification of the sponge sandpaper is 2000 meshes.
Preferably, in the fifth step, the graphene layer is made of graphene nanoplatelets, and the graphene nanoplatelets are subjected to modification treatment
Preferably, in the sixth step, the graphene microchip can be protected to prevent the surface of the module structure from directly contacting with the outside, so as to be oxidized.
Advantageous effects
Compared with the prior art, the invention provides a surface treatment method for a radar signal acquisition, generation and processing module structure, which has the following beneficial effects:
1. according to the surface treatment method for the radar signal acquisition, generation and treatment module structure, the surface of a module is treated in a pretreatment mode, burrs and edges on the surface of the module are removed in a treatment mode of a shot blasting machine and leveling processing, and the surface of the module forms a smooth surface, so that subsequent processing operation is facilitated.
2. Through adding heat dissipation layer and protective layer, come to protect the module, prolong the life of module, solved its surface treatment method of current modular structure simultaneously too simple, easily cause the influence to subsequent installation work, and can't add the problem of heat dissipation and protective layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth;
the second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again;
the third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges;
the fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example two:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again;
the third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges;
the fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example three:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again; dust can be prevented from falling on the surface of the module structure, so that subsequent processing steps are not affected, and the processing environment of the module is optimized.
The third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges;
the fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example four:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again; dust can be prevented from falling on the surface of the module structure, so that subsequent processing steps are not affected, and the processing environment of the module is optimized.
The third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges; the shot blasting machine can be one of a drum type shot blasting machine, a chain plate type shot blasting machine, a rotary table type shot blasting machine, a trolley type shot blasting machine, a squirrel cage type shot blasting machine and a hanging type shot blasting machine, and is convenient for workers to select and use the plurality of shot blasting machines.
The fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example five:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again; dust can be prevented from falling on the surface of the module structure, so that subsequent processing steps are not affected, and the processing environment of the module is optimized.
The third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges; the shot blasting machine can be one of a drum type shot blasting machine, a chain plate type shot blasting machine, a rotary table type shot blasting machine, a trolley type shot blasting machine, a squirrel cage type shot blasting machine and a hanging type shot blasting machine, and is convenient for workers to select and use the plurality of shot blasting machines.
The fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated; the leveling can be one of pickling or abrasive paper and polish, and the staff of being convenient for selects the mode of planarization to be suitable for different processing environment, the material of pickling is dilute sulfuric acid, and the volume concentration of its material is less than 5mol/L, can carry out the leveling to the module surface, and can not lead to the fact the acid attack to the surface of module, and the material of abrasive paper is sponge abrasive paper, and its specification is 2000 meshes, can carry out meticulous polishing to the surface of module.
The fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example six:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again; dust can be prevented from falling on the surface of the module structure, so that subsequent processing steps are not affected, and the processing environment of the module is optimized.
The third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges; the shot blasting machine can be one of a drum type shot blasting machine, a chain plate type shot blasting machine, a rotary table type shot blasting machine, a trolley type shot blasting machine, a squirrel cage type shot blasting machine and a hanging type shot blasting machine, and is convenient for workers to select and use the plurality of shot blasting machines.
The fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated; the leveling can be one of pickling or abrasive paper and polish, and the staff of being convenient for rotates the mode of planarization to be suitable for different processing environment, the material of pickling is dilute sulfuric acid, and the volume concentration of its material is less than 5mol/L, can carry out the leveling to the module surface, and can not lead to the fact the acid attack to the surface of module, and the material of abrasive paper is sponge abrasive paper, and its specification is 2000 meshes, can carry out meticulous polishing to the surface of module.
The fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat; the graphene layer is made of graphene micro-sheets, and the graphene micro-sheets are subjected to modification treatment, so that the heat transfer and heat conduction performance of the graphene micro-sheets can be improved.
And a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
Example seven:
a radar signal acquisition, generation and processing module structure surface processing method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth; the number of times of wiping is more than five, and the wiping coverage area of the soft cloth is more than the force application area of a worker, so that the situation that the surface of the module is polluted because fingers of the worker contact the surface of the module in the wiping process is avoided.
The second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again; dust can be prevented from falling on the surface of the module structure, so that subsequent processing steps are not affected, and the processing environment of the module is optimized.
The third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges; the shot blasting machine can be one of a drum type shot blasting machine, a chain plate type shot blasting machine, a rotary table type shot blasting machine, a trolley type shot blasting machine, a squirrel cage type shot blasting machine and a hanging type shot blasting machine, and is convenient for workers to select and use the plurality of shot blasting machines.
The fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated; the leveling can be one of pickling or abrasive paper and polish, and the staff of being convenient for rotates the mode of planarization to be suitable for different processing environment, the material of pickling is dilute sulfuric acid, and the volume concentration of its material is less than 5mol/L, can carry out the leveling to the module surface, and can not lead to the fact the acid attack to the surface of module, and the material of abrasive paper is sponge abrasive paper, and its specification is 2000 meshes, can carry out meticulous polishing to the surface of module.
The fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat; the graphene layer is made of graphene micro-sheets, and the graphene micro-sheets are subjected to modification treatment, so that the heat transfer and heat conduction performance of the graphene micro-sheets can be improved.
And a sixth step: the processing of nanometer protective layer installs the surface at graphite alkene microchip with the mode of nano-material layer through the coating, can protect graphite alkene microchip, prevents modular structure's surface and external direct contact to the oxidation can prolong the life of module.
The specific operation flow is as follows:
with soft cloth on modular structure's surface clean repeatedly, and open the suction fan and carry out dustless processing near modular structure, prevent that the dust from dropping on modular structure's surface once more, put into the shot-blasting machine with the module after that, polish its surface, deburring and edges and corners, treat the module polishing back that finishes, carry out the planarization through dilute sulfuric acid or sponge abrasive paper to the surface of module and handle, make the surface of module form the smooth surface, install the surface at the module with the graphite alkene microchip after that, install the surface at graphite alkene with the nanometer protective layer after that, protect the module, prevent module and external direct contact, thereby by the oxidation.
This radar signal gathers and produces processing module structure surface treatment method, through the mode that adopts the preliminary treatment, come to handle the module surface, and through the processing mode of shot-blasting machine and planarization processing, make the burr and the edges and corners on module surface get rid of, and make the module surface form the smooth surface, the follow-up processing operation of being convenient for, at last through adding heat dissipation layer and protective layer, come to protect the module, the life of extension module, it is too simple to have solved its surface treatment method of current module structure simultaneously, easily cause the influence to subsequent installation work, and can't add the problem of heat dissipation and protective layer.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A radar signal acquisition, generation and processing module structure surface processing method is characterized by comprising the following steps: the method comprises the following steps:
the first step is as follows: pretreating the surface of the module structure, wherein workers perform reciprocating wiping on the surface of the module structure through soft cloth;
the second step is that: optimizing a module processing environment, namely performing dust-free treatment on the processing area of the module structure by arranging a suction fan in the processing area to prevent dust from falling on the surface of the module structure again;
the third step: cleaning the surface of the module structure, namely putting the module structure into a shot blasting machine, polishing the surface of the module structure, and removing burrs and edges;
the fourth step: the module structure is subjected to planarization treatment, and the polished module structure is subjected to planarization treatment, so that the surface of the module structure is a smooth surface, and the subsequent processing work is facilitated;
the fifth step: the processing of the heat dissipation layer of the module structure is realized by installing the graphene layer on the surface of the module structure, so that the module structure can conveniently transfer heat;
and a sixth step: and (3) processing a nano protective layer, namely mounting the nano material layer on the surface of the graphene microchip in a coating mode.
2. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the first step, the wiping times are more than five times, and the wiping coverage area of the soft cloth is more than the force application area of a worker.
3. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the second step, dust can be prevented from falling on the surface of the module structure, thereby not affecting the subsequent processing steps.
4. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the third step, the shot blasting machine can be one of a drum type, a chain plate type, a rotary table type, a trolley type, a squirrel cage type and a hanging type shot blasting machine.
5. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the fourth step, the planarization treatment may be one of acid washing or sanding.
6. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the fourth step, the acid-washed material is dilute sulfuric acid, and the mass concentration of the acid-washed material is less than 5 mol/L.
7. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: and in the fourth step, the sand paper is made of sponge sand paper, and the specification of the sponge sand paper is 2000 meshes.
8. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the fifth step, the graphene layer is made of graphene micro-sheets, and the graphene micro-sheets are subjected to modification treatment.
9. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: in the sixth step, the graphene microchip can be protected, and the surface of the module structure is prevented from being directly contacted with the outside, so that the graphene microchip is oxidized.
10. The method for processing the surface of the radar signal acquisition, generation and processing module structure according to claim 1, wherein the method comprises the following steps: the specific operation flow is as follows:
with soft cloth on modular structure's surface clean repeatedly, and open the suction fan and carry out dustless processing near modular structure, prevent that the dust from dropping on modular structure's surface once more, put into the shot-blasting machine with the module after that, polish its surface, deburring and edges and corners, treat the module polishing back that finishes, carry out the planarization through dilute sulfuric acid or sponge abrasive paper to the surface of module and handle, make the surface of module form the smooth surface, install the surface at the module with the graphite alkene microchip after that, install the surface at graphite alkene with the nanometer protective layer after that, protect the module, prevent module and external direct contact, thereby by the oxidation.
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| CN112782694A (en) * | 2021-01-22 | 2021-05-11 | 重庆秦嵩科技有限公司 | Radar signal processing method and system based on multi-core DSP |
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