CN111114041A - Composite material with high-thermal-conductivity graphite-copper interpenetrating structure and preparation method thereof - Google Patents
Composite material with high-thermal-conductivity graphite-copper interpenetrating structure and preparation method thereof Download PDFInfo
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- CN111114041A CN111114041A CN202010015201.4A CN202010015201A CN111114041A CN 111114041 A CN111114041 A CN 111114041A CN 202010015201 A CN202010015201 A CN 202010015201A CN 111114041 A CN111114041 A CN 111114041A
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- heat
- copper
- conductivity graphite
- silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Abstract
The composite material with the high-thermal-conductivity graphite-copper interpenetrating structure and the preparation method thereof can solve the technical problems of disordered graphite crystal orientation and small radial thermal conductivity in the composite material. The high-heat-conductivity graphite sheet comprises a layer of high-heat-conductivity graphite sheet and silver-copper solder particles, wherein the thickness of the layer of high-heat-conductivity graphite sheet is 150 mu m, the upper surface of the high-heat-conductivity graphite sheet is coated with a layer of silver-copper solder particles with the thickness of about 100 mu m, and then a layer of high-heat-conductivity graphite sheet with the thickness of 150 mu m is placed; and extruding the high-heat-conductivity graphite sheet-copper composite material coated with the multi-layer silver-copper solder so that partial particles of the silver-copper solder can penetrate through the graphite sheets of the two adjacent layers to realize the contact of the silver-copper solder in the longitudinal direction. And carrying out vacuum brazing on the extruded high-heat-conductivity graphite sheet-copper composite material, so that the silver-copper solder is melted and sintered together, and the preparation of the high-heat-conductivity graphite-copper interpenetrating structure composite material is realized, thereby solving the problem of small radial heat conductivity under the condition of keeping the graphite crystal orientation.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a composite material with a high-thermal-conductivity graphite-copper interpenetrating structure and a preparation method thereof.
Background
The graphite crystal which has the most ideal effect on the thermal conductivity is a graphene material, the thermal conductivity of the graphene material along the plane direction is extremely high, and the thermal conductivity of the graphene material in the direction perpendicular to the plane direction is extremely low. However, the commonly used heat conducting materials are mainly concentrated on the composite materials filled with graphite materials to improve the radial heat conductivity of the composite materials, but the problem of disordered graphite crystal orientation or the problem of small graphite radial heat conductivity is not solved in the preparation of most composite materials, so that the heat generated by a heat source is difficult to conduct timely and the normal use of devices is ensured.
The problem of disordered graphite crystal orientation or the problem of small graphite radial thermal conductivity is not well solved in the preparation of the existing composite material, so that the coordination of the material thermal conductivity in all directions is difficult to realize, the heat generated by a heat source is timely conducted in all directions, and the normal use of a device is ensured.
Disclosure of Invention
The composite material with the high-thermal-conductivity graphite-copper interpenetrating structure and the preparation method thereof can solve the technical problems of disordered graphite crystal orientation and small radial thermal conductivity in the composite material.
In order to achieve the purpose, the invention adopts the following technical scheme:
a composite material with a high-heat-conductivity graphite-copper interpenetrating structure comprises a plurality of layers of high-heat-conductivity graphite sheets and silver-copper solder particles, wherein each layer of high-heat-conductivity graphite sheet is 150 mu m, a layer of silver-copper solder particles with the particle size of about 100 mu m is coated on the upper surface of each layer of high-heat-conductivity graphite sheet, then a layer of high-heat-conductivity graphite sheet with the particle size of 150 mu m is placed on the upper surface of each layer of high-heat-conductivity graphite sheet, and the number of times of circulating the operation process is determined according to the required thickness of the.
A preparation method of a composite material with a high-heat-conductivity graphite-copper interpenetrating structure extrudes the high-heat-conductivity graphite sheet-copper composite material coated with multiple layers of silver-copper solder, so that partial particles of the silver-copper solder can penetrate through the graphite sheets of two adjacent layers, and the silver-copper solder is contacted in the longitudinal direction.
And carrying out vacuum brazing on the extruded high-heat-conductivity graphite sheet-copper composite material, so that the silver-copper solder is melted and sintered together, and the preparation of the high-heat-conductivity graphite-copper interpenetrating structure composite material is realized, thereby solving the problem of small radial heat conductivity under the condition of keeping the graphite crystal orientation.
According to the technical scheme, the high-thermal-conductivity graphite-copper interpenetrating structure is prepared by connecting the longitudinal structures of the graphite sheets by using copper, so that the thermal conductivity effect is greatly improved, the heat generated by a heat source can be timely conducted by extremely high thermal conductivity, the device is protected from failure due to overhigh temperature, and the normal use and high reliability of the device are guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the extruded structure of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
In fig. 1, 1 is a high thermal conductive graphite sheet, and 2 is silver-copper solder particles. Fig. 2 is a schematic diagram of the internal structure of the high thermal conductivity graphite sheet-copper composite material after sintering.
According to the invention, based on the working characteristics of the high-thermal-conductivity graphite sheet, the radial thermal conductivity in the overall structure of the composite material is improved by adding the composite material while the graphite crystal orientation is kept. The process is repeated using 150 μm graphite flakes 1 of high thermal conductivity, then coating with a 100 μm layer of silver brazing filler particles 2, and then placing a 150 μm layer of graphite flakes of high thermal conductivity, until the specified dimensional requirements are met, but the overall thickness dimension should be much smaller than the horizontal dimension. And then extruding the high-heat-conductivity graphite sheet-copper composite material coated with the multiple layers of silver-copper solder by using a press machine, so that partial particles of the silver-copper solder can penetrate through the graphite sheets of the two adjacent layers under the action of pressure, and the contact of the silver-copper solder in the longitudinal direction is realized. Finally, the extruded high-heat-conductivity graphite sheet-copper composite material is subjected to vacuum brazing, so that silver-copper solder is melted and sintered together, the preparation of the high-heat-conductivity graphite-copper interpenetrating composite material is realized, and the problem of small radial heat conductivity is solved while the graphite crystal orientation is kept.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. The composite material with the high-thermal-conductivity graphite-copper interpenetrating structure is based on high-thermal-conductivity graphite flakes and silver-copper solder particles, and is characterized in that: the high-heat-conductivity graphite sheet comprises a high-heat-conductivity graphite sheet (1) and n sheets, wherein the n sheets are overlapped, n is a natural number, and n is more than or equal to 2;
a layer of silver-copper solder particles (2) is smeared between the two adjacent high-heat-conductivity graphite sheets (1);
after the n high-heat-conductivity graphite sheets (1) are coated with silver-copper solder particles (2) and overlapped, the high-heat-conductivity graphite sheet-copper composite material is formed by extrusion synthesis;
and carrying out vacuum brazing on the extruded high-heat-conductivity graphite sheet-copper composite material so that the silver-copper solder is melted and sintered together.
2. The high thermal conductivity graphite-copper interpenetrating structural composite of claim 1, wherein: the thickness of the high-heat-conductivity graphite sheet (1) is 150 mu m, and the thickness of the silver-copper solder particles (2) coated on the upper surface of the high-heat-conductivity graphite sheet (1) is 100 mu m.
3. A preparation method of a composite material with a high-thermal-conductivity graphite-copper interpenetrating structure is characterized by comprising the following steps: the method comprises the following steps:
arranging n high-heat-conductivity graphite sheets (1); n is a natural number, and n is more than or equal to 2;
coating a layer of silver-copper solder particles (2) on the upper surface of the first layer of high-thermal-conductivity graphite sheet (1), and then placing a layer of high-thermal-conductivity graphite sheet (1);
sequentially coating silver-copper solder particles (2) according to a set range, and overlapping high-heat-conductivity graphite sheets (1);
extruding n layers of high-heat-conductivity graphite sheets (1) coated with silver-copper solder particles (2) so that partial particles of the silver-copper solder can penetrate through the adjacent two layers of graphite sheets to realize contact of the silver-copper solder in the longitudinal direction;
and (3) carrying out vacuum brazing on the n layers of extruded high-heat-conductivity graphite sheets (1) so that the silver-copper solder is melted and sintered together.
4. The preparation method of the composite material with the high-thermal-conductivity graphite-copper interpenetrating structure as claimed in claim 3, wherein:
the thickness of the high-heat-conductivity graphite sheet (1) is 150 mu m, and the thickness of the silver-copper solder particles (2) coated on the upper surface of the high-heat-conductivity graphite sheet (1) is 100 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010015201.4A CN111114041A (en) | 2020-01-07 | 2020-01-07 | Composite material with high-thermal-conductivity graphite-copper interpenetrating structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010015201.4A CN111114041A (en) | 2020-01-07 | 2020-01-07 | Composite material with high-thermal-conductivity graphite-copper interpenetrating structure and preparation method thereof |
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| CN111114041A true CN111114041A (en) | 2020-05-08 |
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| CN202010015201.4A Pending CN111114041A (en) | 2020-01-07 | 2020-01-07 | Composite material with high-thermal-conductivity graphite-copper interpenetrating structure and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113860903A (en) * | 2021-09-23 | 2021-12-31 | 中国电子科技集团公司第五十四研究所 | Preparation method of high-thermal-conductivity graphite-copper composite board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM504983U (en) * | 2015-02-17 | 2015-07-11 | Honmountech Co Ltd | Cold pressing graphite heat conduction device |
| CN106082186A (en) * | 2016-06-12 | 2016-11-09 | 南京航空航天大学 | A kind of heat conduction thin film of graphene nano carbon/carbon-copper composite material and preparation method thereof |
| CN107791616A (en) * | 2017-10-26 | 2018-03-13 | 北京科技大学 | A kind of preparation method of the multiple-layer laminated block composite material of copper/graphite film |
| US20180171161A1 (en) * | 2015-08-24 | 2018-06-21 | Panasonic Intellectual Property Management Co., Ltd. | Conductive coating composition, conductive material, method for manufacturing conductive coating composition, and method for manufacturing conductive material |
-
2020
- 2020-01-07 CN CN202010015201.4A patent/CN111114041A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM504983U (en) * | 2015-02-17 | 2015-07-11 | Honmountech Co Ltd | Cold pressing graphite heat conduction device |
| US20180171161A1 (en) * | 2015-08-24 | 2018-06-21 | Panasonic Intellectual Property Management Co., Ltd. | Conductive coating composition, conductive material, method for manufacturing conductive coating composition, and method for manufacturing conductive material |
| CN106082186A (en) * | 2016-06-12 | 2016-11-09 | 南京航空航天大学 | A kind of heat conduction thin film of graphene nano carbon/carbon-copper composite material and preparation method thereof |
| CN107791616A (en) * | 2017-10-26 | 2018-03-13 | 北京科技大学 | A kind of preparation method of the multiple-layer laminated block composite material of copper/graphite film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113860903A (en) * | 2021-09-23 | 2021-12-31 | 中国电子科技集团公司第五十四研究所 | Preparation method of high-thermal-conductivity graphite-copper composite board |
| CN113860903B (en) * | 2021-09-23 | 2023-01-24 | 中国电子科技集团公司第五十四研究所 | Preparation method of high-thermal-conductivity graphite-copper composite board |
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