CN111110194B - Brain imaging detection device - Google Patents
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- CN111110194B CN111110194B CN201911397376.XA CN201911397376A CN111110194B CN 111110194 B CN111110194 B CN 111110194B CN 201911397376 A CN201911397376 A CN 201911397376A CN 111110194 B CN111110194 B CN 111110194B
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Classifications
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- A61B5/00—Measuring for diagnostic purposes; Identification of persons
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- A61B5/0059—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence
- A61B5/0075—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence by spectroscopy, i.e. measuring spectra, e.g. Raman spectroscopy, infrared absorption spectroscopy
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- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
- A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
- A61B5/14553—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases specially adapted for cerebral tissue
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- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
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- A61B2576/00—Medical imaging apparatus involving image processing or analysis
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- A61B2576/026—Medical imaging apparatus involving image processing or analysis specially adapted for a particular organ or body part for the brain
Abstract
The embodiment of the application provides a brain imaging detection device. Wherein the brain imaging detection device can be worn on the head of a human body; the brain imaging detection device comprises a matrix, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the matrix; the brain imaging detection device further comprises a first electric actuating cover and a second electric actuating cover, wherein the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are mutually enclosed, and the electric actuating films can be opened after being electrified so as to form light paths on the surfaces of the light emitting unit and the detecting unit. The application simplifies the detection structure of the brain imaging detection device and solves the problem of complex detection structure of the brain imaging detection device.
Description
Technical Field
The application relates to the field of flexible electronics, in particular to a brain imaging detection device.
Background
Functional near infrared spectroscopy (fNIRS) is a recently emerging non-invasive brain function imaging technique, and mainly uses the difference characteristics of oxyhemoglobin and deoxyhemoglobin in brain tissue on near infrared light absorptivity of 600-900 nm at different wavelengths to directly detect hemodynamic activity of cerebral cortex in real time. The neural activity of the brain is countered by observing this hemodynamic change.
The functional near infrared spectrum imaging technology has become an important research means in the field of neuroscience, and has important value in the fields of scientific research and clinical application. When detecting the brain of a detected person by using near infrared spectrum brain imaging, the hairs which obstruct the measurement are required to be separated, the probe and the detector are placed at the specified part of the head, a great amount of preparation time is required, if the interference of the human hair cannot be eliminated, the optical signals cannot be effectively collected, and the measurement sensitivity and the data collection accuracy are directly affected.
In the related art, two layers of parts for pulling hair are designed on a headgear of a near-infrared brain imaging detection device, wherein the outer layer is a sleeve with a plurality of pulling pieces, and the inner layer is a detection end of a probe which is driven by a rotating part and can rotate at a small angle; when the human body needs to carry out near infrared spectrum brain imaging detection, the head cover is worn, the sleeve is contacted with the hair, the pulling-out piece is controlled to be opened outwards and pulled out most of the hair, and then the small-amplitude rotation of the detection end of the probe is controlled manually or/and mechanically and automatically, so that the hair can be further separated, and the probe is fully contacted with the scalp. In the above scheme, the above scheme is realized by a rotating part for controlling the rotation of the probe and a sleeve sleeved on the periphery of the detection end, which results in complex detection structure of the brain imaging detection device.
Disclosure of Invention
Based on the above, the embodiment of the application provides a brain imaging detection device, which is used for solving the problem of complex detection structure of the brain imaging detection device in the related art.
In a first aspect, embodiments of the present application provide a brain imaging detection apparatus that is wearable to a head of a human body; the brain imaging detection device comprises a matrix, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the matrix; the brain imaging detection device further comprises a first electric actuating cover and a second electric actuating cover, wherein the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are mutually enclosed, and the electric actuating films can be opened after being electrified so as to form light paths on the surfaces of the light emitting unit and the detection unit.
In one embodiment, the first electrically actuated shield is electrically connected to the light emitting unit; and/or the second electrically actuated shroud is electrically connected to the detection unit.
In one embodiment, the plurality of electrically actuated films of the first electrically actuated cover are disposed around the center of the light emitting unit, and a portion of the plurality of electrically actuated films away from the center of the light emitting unit is connected to an edge of a surface of the light emitting unit; and/or a plurality of electrically actuated films of the second electrically actuated cover are arranged around the center of the detection unit, and the positions of the plurality of electrically actuated films far away from the center of the detection unit are connected to the edge of the surface of the detection unit.
In one embodiment, the electrically actuated membrane is fan-shaped or triangular.
In one embodiment, the electrically actuated membrane comprises one of: silver nano-catalyst modified Nafion composite membrane, platinum nano-catalyst modified Nafion composite membrane, gold nano-catalyst modified Nafion composite membrane.
In one embodiment, the substrate comprises one of: a polydimethylsiloxane film and a polyurethane film.
In one embodiment, the brain imaging detection apparatus further includes: the flexible circuit board is provided with a conductive circuit and a plurality of combined conductive patterns, and the light-emitting unit and the detection unit are arranged on one surface of the flexible circuit board, which is provided with the combined conductive patterns, and are electrically connected with the conductive circuit through the corresponding combined conductive patterns.
In one embodiment, the plurality of combined conductive patterns and the conductive lines are respectively arranged on two opposite sides of the flexible circuit board; and the flexible circuit board is provided with a via hole corresponding to each combined conductive pattern, and each combined conductive pattern is electrically connected with the conductive circuit through the corresponding via hole.
In one embodiment, the substrate is provided with a groove, a plurality of through holes are formed in the bottom of the groove, the flexible circuit board is embedded in the groove, and one surface, far away from the plurality of combined conductive patterns, of the flexible circuit board is attached to the bottom of the groove.
In one embodiment, the flexible circuit board comprises one of: polyimide-based copper-clad laminate, polyethylene terephthalate-based copper-clad laminate, and polybutylene terephthalate-based copper-clad laminate.
According to the brain imaging detection device provided by the embodiment of the application, the plurality of electric actuation films are respectively arranged on the surfaces of the light-emitting unit and the detection unit, and can be opened after being electrified so as to form the light path on the surfaces of the light-emitting unit and the detection unit, so that the detection structure of the brain imaging detection device is simplified, and the problem of complex detection structure of the brain imaging detection device is solved.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more thorough understanding of the other features, objects, and advantages of the application.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings required for the description of the embodiments will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
Fig. 1 is a schematic structural view of a brain imaging detection apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a first electrically actuated shroud according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a second electrically actuated shroud according to an embodiment of the present application;
fig. 4 is a schematic structural view of a brain imaging detection apparatus according to a preferred embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. All other examples, based on examples in this application, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the application.
It is apparent that the drawings in the following description are only some examples or embodiments of the present application, and it is apparent to those of ordinary skill in the art that the present application may be applied to other similar situations according to the drawings without inventive effort. Moreover, it should be appreciated that while such a development effort might be complex and lengthy, it would nevertheless be a routine undertaking of design, fabrication, or manufacture for those of ordinary skill having the benefit of this disclosure, and thus should not be construed as having the benefit of this disclosure.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Unless defined otherwise, technical or scientific terms used in the claims and specification should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "a" and "an" and "the" and similar referents used in the specification and claims are not to be construed to limit the scope of the application, which is defined in the singular or the plural. The word "comprising" or "comprises", and the like, is intended to mean that elements or items that are immediately preceding the word "comprising" or "comprising", are included in the word "comprising" or "comprising", and equivalents thereof, but do not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in the present specification and claims, the term "plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
In an embodiment of the present application, there is provided a brain imaging detection apparatus that can be worn to the head of a human body. Fig. 1 is a schematic structural view of a brain imaging detection device according to an embodiment of the present application, and as shown in fig. 1, the brain imaging detection device includes a base 10, a light emitting unit 20, and a detecting unit 30, wherein the light emitting unit 20 and the detecting unit 30 are disposed inside the base 10; the brain imaging detection device further includes a first electrically-actuated cover 40 and a second electrically-actuated cover 50, the first electrically-actuated cover 40 is disposed on the surface of the light-emitting unit 20, and the second electrically-actuated cover 50 is disposed on the surface of the detecting unit 30; the first and second electrically actuated shields 40 and 50 respectively include a plurality of electrically actuated films surrounding each other, which can be opened after being energized to form an optical path at the surfaces of the light emitting unit 20 and the detecting unit 30.
In this embodiment, the first electrically-actuated cover 40 is disposed on the surface of the light-emitting unit 20, and the second electrically-actuated cover 50 is disposed on the surface of the detecting unit 30, and the first electrically-actuated cover 40 and the second electrically-actuated cover 50 respectively include a plurality of electrically-actuated films that are mutually enclosed, and the plurality of electrically-actuated films can be opened after being electrified, so that hairs on the surfaces of the light-emitting unit 20 and the detecting unit 30 are moved, so that light paths can be formed on the surfaces of the light-emitting unit 20 and the detecting unit 30 when the light-emitting unit 20 and the detecting unit 30 are operated, interference of the hairs during detection is avoided, and sensitivity and accuracy of detection of the brain imaging detection device are improved.
Compared with the brain imaging detection device in the related art, the brain imaging detection device provided by the embodiment solves the problem that the detection structure of the brain imaging detection device in the related art is complex and simplifies the structure of the brain imaging detection device in the related art in a mode that the rotating part of the probe and the sleeve sleeved on the periphery of the detection end are used for shifting hairs on the surfaces of the light-emitting unit and the detection unit; compared with the manual or mechanical brain imaging detection device in the related art, the brain imaging detection device provided by the embodiment has the beneficial effects of being faster and more convenient, and has better application prospect.
In the present embodiment, the inner side of the base 10 is the side that contacts the head of the human body.
In one embodiment, the first electrically actuated shield 40 is electrically connected to the light emitting unit 20; and/or the second electrically actuated housing 50 is electrically connected to the detection unit 30.
In the present embodiment, by electrically connecting the first electrically actuated cover 40 to the light emitting unit 20, it is achieved that the first electrically actuated cover 40 can be synchronously opened when the light emitting unit 20 emits light; by electrically connecting the second electrically actuated housing 50 to the detection unit 30, it is achieved that the second electrically actuated housing 50 can be opened synchronously when the detection unit 30 enters the detection state.
Fig. 2 is a schematic structural view of the first electrically actuated cover 40 according to an embodiment of the present application, as shown in fig. 2, in one embodiment, a plurality of electrically actuated films 60 of the first electrically actuated cover 40 are disposed around the center of the light emitting unit 20, and a portion of the plurality of electrically actuated films 60 away from the center of the light emitting unit 20 is connected to an edge of a surface of the light emitting unit 20.
Fig. 3 is a schematic view of the structure of the second electrically-actuated cover 50 according to an embodiment of the present application, as shown in fig. 3, in one embodiment, a plurality of electrically-actuated films 60 of the second electrically-actuated cover 50 are disposed around the center of the detecting unit 30, and a portion of the plurality of electrically-actuated films 60 away from the center of the detecting unit 30 is connected to an edge of the surface of the detecting unit 30.
In the above-described embodiment, the plurality of electrically actuated films 60 enclosed with each other may be arranged as shown in fig. 2 or 3, wherein a square in fig. 2 and 3 represents the upper surface of the detecting unit 30 or the light emitting unit 20, and an entire split circle represents the first electrically actuated cover 40 or the second electrically actuated cover 50, and wherein a sector represents the electrically actuated film 60. In this embodiment, the plurality of electrically actuated films 60 are mutually enclosed to form the first electrically actuated cover 40 or the second electrically actuated cover 50 which has no gap basically, and after being electrified, the electrically actuated covers are opened, so that the hair on the surface of the light emitting unit 20 or the surface of the detecting unit 30 is moved, and the sensitivity and the accuracy of the detection of the brain imaging detection device are further improved.
Alternatively, the shape of the electrically-actuated film 60 is not limited to the shape shown in fig. 2 or 3, but may be other shapes such as a triangle, and particularly, may be a shape capable of being enclosed into a closed image, wherein the shapes of the first electrically-actuated cover 40 and the second electrically-actuated cover 50 are not limited to the shape shown in fig. 2 or 3, and may be changed according to the shape of the electrically-actuated film 60, for example, the shapes of the first electrically-actuated cover 40 and the second electrically-actuated cover 50 may be elliptical, polygonal, and the like.
In one embodiment, the electrically actuated membrane includes, but is not limited to, one of the following: silver nano-catalyst modified Nafion composite membrane, platinum nano-catalyst modified Nafion composite membrane, gold nano-catalyst modified Nafion composite membrane. By adopting the composite membrane as the electric actuating cover, the composite membrane can generate larger deformation under the action of a lower electric field, and has the advantages of simple actuating mode, high efficiency, low actuating voltage, safe operation, light weight and the like.
In one embodiment, the substrate 10 includes, but is not limited to, one of the following: polydimethylsiloxane (PDMS) films or Polyurethane (PU) films.
In the embodiment, the polyurethane film is a nontoxic and environment-friendly polymer elastomer film, and has the characteristics of high strength, wear resistance, good elasticity, weather resistance, environment friendliness, no toxicity, recoverability and decomposition. The polyurethane film has the excellent performances of high light transmittance, no yellowing, weather resistance, high adhesion, high elongation, high elasticity and the like, so that the polyurethane film can be specially designed to be compounded with various thermoplastic adhesive films, including polycarbonate, polymethacrylic acid and the like, and forms a high-grade sputtering-free bulletproof, explosion-proof and explosion-proof glass interlayer, and the characteristics of light weight, thinness and high impact resistance are fully exerted. The polydimethylsiloxane film belongs to a high molecular elastic polymer film, and is prepared by taking polydimethylsiloxane as a raw material through a special process. Due to the characteristics of the polydimethylsiloxane material, certain specific properties of the polydimethylsiloxane film, such as elasticity, low Young modulus, excellent gas permeability, chemical stability, thermal stability, low-temperature flexibility (-excellent performance kept at 60-200 ℃), full transparency and biocompatibility, are provided. The substrate 10 made of the polydimethylsiloxane film or the polyurethane film realizes the folding of the substrate 10, greatly enhances the practicability and the plasticity of the substrate 10, and enables the brain imaging detection device to realize planarization or curved surface.
As shown in fig. 4, in one embodiment, the brain imaging detection apparatus further includes: the flexible circuit board 80, the flexible circuit board 80 is provided with a conductive circuit and a plurality of combined conductive patterns, and the light emitting unit 20 and the detecting unit 30 are arranged on one surface of the flexible circuit board 80 with the plurality of combined conductive patterns and are electrically connected with the conductive circuit through the corresponding combined conductive patterns respectively.
By combining the flexible circuit board 80 in the above embodiment and the substrate 10 made of the polydimethylsiloxane film or the polyurethane film in the above embodiment, free bending, winding and folding of the brain imaging detection device can be realized, the brain imaging detection device can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved; meanwhile, the flexible circuit board 80 can also greatly reduce the volume and weight of the brain imaging detection device; and the flexible circuit board 80 has the advantages of good heat dissipation, good solderability, easy assembly and connection, low comprehensive cost and the like.
In one embodiment, the opposite sides of the flexible circuit board 80 are respectively provided with a plurality of combined conductive patterns and conductive traces; a via is provided on the flexible circuit board 80 corresponding to each of the bonding conductive patterns, and each of the bonding conductive patterns is electrically connected to the conductive trace through the corresponding via.
In this embodiment, by disposing the conductive traces and the plurality of combined conductive patterns on opposite sides of the flexible circuit board 80, and disposing the vias to electrically connect the conductive traces and the plurality of combined conductive patterns, and disposing the light emitting unit 20 and the detecting unit 30 on the combined conductive patterns and electrically connecting the combined conductive patterns, the arrangement density of the light emitting unit 20 and the detecting unit 30 in the unit area can be increased, and the illumination intensity in the unit area can also be increased.
In the present embodiment, in order to enhance uniformity of illumination intensity per unit area, the light emitting units 20 and the detecting units 30 may be arranged on the combined conductive pattern in an array manner.
In this embodiment, to achieve good conductivity of the via, a conductive metal may be plated within the via, which may be, but is not limited to, copper, aluminum, gold, nickel, zinc, silver, iron, or alloys thereof.
In this embodiment, the light emitting unit 20 may be, but is not limited to, a dual wavelength LED light source, a three wavelength LED light source, or other light emitting units 20 capable of transmitting different light wavelengths, and by the light emitting units 20 capable of transmitting different light wavelengths, the detection of the concentration of oxygen, hemoglobin and deoxyhemoglobin in blood of the active area of the brain of the human body by different light waves can be achieved.
As shown in fig. 4, in one embodiment, a groove 11 is disposed on the substrate 10, a plurality of through holes 70 are disposed at the bottom of the groove 11, a flexible circuit board 80 is embedded in the groove 11, and a surface of the flexible circuit board 80 away from the plurality of combined conductive patterns is attached to the bottom of the groove 11.
In this embodiment, by providing the plurality of through holes 70 at the bottom of the groove 11 of the base body 10, heat dissipation of the flexible circuit board 80 is improved, and heat dissipation of the brain imaging detection device is achieved without a heat sink and a radiator, so that weight of the brain imaging detection device is reduced, production cost is reduced, and heat dissipation effect is improved. Preferably, the through holes 70 are uniformly distributed at the bottom of the groove 11, arranged in an array of through holes 70.
As shown in fig. 4, in this embodiment, after the surface of the flexible circuit board 80 away from the plurality of bonding conductive patterns is attached to the bottom of the groove 11, the flexible circuit board 80 may be further encapsulated with the same material as the substrate 10. For example, the encapsulation process may be to pour liquid polydimethylsiloxane or polyurethane into the recess 11 to expose the upper surfaces of the light emitting unit 20 and the detecting unit 30, and then cure under a certain temperature condition (e.g., 50 to 100 ℃). The packaging structure can strengthen the integrity of the brain imaging detection device, improve the resistance to external impact and vibration, improve the insulation between internal elements and circuits, avoid the linear exposure of the elements and the circuits, and improve the waterproof and dampproof performances of the device.
In the present embodiment, the size of the groove 11 may be selected to be identical to the size of the flexible wiring board 80, and the top of the groove 11 is flush with the upper surfaces of the light emitting unit 20 and the detecting unit 30 provided on the flexible wiring board 80 so that the flexible wiring board 80 is closely fitted with the groove 11.
In the present embodiment, the flexible wiring board 80 includes, but is not limited to, one of the following: polyimide (PI) based copper clad laminate, polyethylene terephthalate (polyethylene glycol terephthalate, PET) based copper clad laminate or polybutylene terephthalate (polybutylene terephthalate, PBT) based copper clad laminate.
Polyimide is one of organic polymer materials with optimal comprehensive performance, has high temperature resistance reaching 400 ℃ or higher, long-term use temperature range of-200-300 ℃, has no obvious melting point in part, and is a high-insulation material. The polyethylene terephthalate is prepared by the prior synthesis of the dihydroxyethyl terephthalate by the exchange of dimethyl terephthalate and ethylene glycol or the esterification of terephthalic acid and ethylene glycol, has excellent physical and mechanical properties in a wider temperature range, can reach 120 ℃ after long-term use, has excellent electrical insulation property, and has better electrical property even under high temperature and high frequency. Polybutylene terephthalate is a milky translucent to opaque semi-crystalline thermoplastic polyester, has high heat resistance, can work for a long time at 140 ℃, and has the advantages of toughness, fatigue resistance, self-lubrication, low friction coefficient and the like.
In this embodiment, the heat resistance of the flexible circuit board 80 can be improved by using a polyimide-based copper-clad plate, a polyethylene terephthalate-based copper-clad plate, or a polybutylene terephthalate-based copper-clad plate.
Alternatively, in this embodiment, the polyimide-based copper-clad plate, the polyethylene terephthalate-based copper-clad plate, or the polybutylene terephthalate-based copper-clad plate may be a single-sided copper-clad plate or a double-sided copper-clad plate.
In the brain imaging detection device in the embodiment of the application, the first electric actuating cover 40 is prepared on the surface of the light emitting unit 20, and/or the second electric actuating cover 50 is prepared on the surface of the detecting unit 30, under the condition of electrifying, the plurality of electric actuating films 60 in the first electric actuating cover 40 can automatically shift the hair on the surface of the light emitting unit 20, and the plurality of electric actuating films 60 in the second electric actuating cover 50 can automatically shift the hair on the surface of the detecting unit 30, so that the interference of the hair during detection is avoided, and the sensitivity and the accuracy of the device are improved. Meanwhile, compared with the manual or mechanical hair pulling device in the related art, the device is simpler in structure, faster and more convenient.
The preparation of the brain imaging detection apparatus in the embodiment of the present application is described and illustrated below in a preferred embodiment.
Example 1
A polyimide-based double-sided copper-clad plate with a thickness of 75 micrometers is selected as the flexible circuit board 80, and then a picosecond pulse laser with a wavelength of 355nm is adopted to etch a via array with a diameter of 100 micrometers on the flexible circuit board 80. Then, the combined conductive patterns corresponding to the light emitting unit 20 and the detecting unit 30 are etched on one side of the flexible circuit board 80, the conductive circuit pattern having a width of 200 μm is etched on the other side of the flexible circuit board 80, and a copper layer is plated inside the via hole through which the plurality of combined conductive patterns and the conductive circuit of the flexible circuit board 80 are electrically connected.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are mounted on the combined conductive pattern area of the flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then the fan-shaped electric actuating film 60 composed of Nafion composite film modified by platinum nano catalyst is selected, as shown in fig. 2 and 3, four pieces of the fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit on the other surface of the flexible circuit board 80 through the through holes.
Selecting a polyurethane film as a substrate 10, pouring the substrate 10 with the groove 11 by using a mold, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then etching an array of through holes 70 at the bottom of the groove 11 of the substrate 10 by using picosecond pulse laser with the wavelength of 355nm, wherein the diameter of the through holes 70 is 200 microns, the distance between the through holes 70 is 1mm, then embedding the flexible circuit board 80 in the substrate 10, wherein the other surface of the flexible circuit board 80 with a conductive circuit is attached to the bottom of the groove 11 of the substrate 10, and then packaging the flexible circuit board 80 by using liquid polyurethane, namely pouring the liquid polyurethane into the groove 11, and solidifying the liquid polyurethane at 50-100 ℃, wherein the upper surfaces of the light-emitting unit 20 and the detection unit 30 are exposed, and the upper surfaces of the light-emitting unit 20 and the detection unit 30 are the same as the surface of the substrate 10.
Example two
A polyimide-based double-sided copper-clad plate with a thickness of 75 micrometers is selected as the flexible circuit board 80, and then a picosecond pulse laser with a wavelength of 355nm is adopted to etch a via array with a diameter of 100 micrometers on the flexible circuit board 80. Then, the combined conductive patterns corresponding to the light emitting unit 20 and the detecting unit 30 are etched on one side of the flexible circuit board 80 by using steps of masking, exposing, chemical etching and the like, conductive circuit patterns with a width of 200 micrometers are etched on the other side of the flexible circuit board 80, copper layers are electroplated inside the through holes, and a plurality of combined conductive patterns and conductive circuits of the flexible circuit board 80 are electrically connected through the through holes.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are mounted on the combined conductive pattern area of the flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then the fan-shaped electric actuating film 60 composed of Nafion composite film modified by platinum nano catalyst is selected, as shown in fig. 2 and 3, four pieces of the fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit on the other surface of the flexible circuit board 80 through the through holes.
Selecting a polyurethane film as a substrate 10, pouring the substrate 10 with the groove 11 by using a mold, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then etching an array of through holes 70 at the bottom of the groove 11 of the substrate 10 by using picosecond pulse laser with the wavelength of 355nm, wherein the diameter of the through holes 70 is 200 microns, the distance between the through holes 70 is 1mm, then embedding the flexible circuit board 80 in the substrate 10, wherein the other surface of the flexible circuit board 80 with a conductive circuit is attached to the bottom of the groove 11 of the substrate 10, and then packaging the flexible circuit board 80 by using liquid polyurethane, namely pouring the liquid polyurethane into the groove 11, and solidifying the liquid polyurethane at 50-100 ℃, wherein the upper surfaces of the light-emitting unit 20 and the detection unit 30 are exposed, and the upper surfaces of the light-emitting unit 20 and the detection unit 30 are the same as the surface of the substrate 10.
Example III
A polyimide-based double-sided copper-clad plate with a thickness of 75 micrometers is selected as the flexible circuit board 80, and then a picosecond pulse laser with a wavelength of 355nm is adopted to etch a via array with a diameter of 100 micrometers on the flexible circuit board 80. Then, the combined conductive patterns corresponding to the light emitting unit 20 and the detecting unit 30 are etched on one side of the flexible circuit board 80 by using steps of masking, exposing, chemical etching and the like, conductive circuit patterns with a width of 200 micrometers are etched on the other side of the flexible circuit board 80, copper layers are electroplated inside the through holes, and a plurality of combined conductive patterns and conductive circuits of the flexible circuit board 80 are electrically connected through the through holes.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are attached to the combined conductive pattern area of the flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then the fan-shaped electric actuating film 60 composed of the Nafion composite film modified by the gold nano catalyst is selected, as shown in fig. 2 and 3, four pieces of the fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit on the other surface of the flexible circuit board 80 through the through holes.
Selecting a polyurethane film as a substrate 10, printing the substrate 10 with the groove 11 by adopting a 3D printing technology, wherein the size of the groove 11 is the same as that of a flexible circuit board 80, then etching a through hole 70 array at the bottom of the groove 11 of the substrate 10 by adopting picosecond pulse laser with the wavelength of 355nm, wherein the diameter of the through hole 70 is 200 microns, the distance between the through holes 70 is 1mm, then embedding the flexible circuit board 80 into the substrate 10, wherein the other surface of the flexible circuit board 80 with a conductive circuit is attached to the bottom of the groove 11 of the substrate 10, and then packaging the flexible circuit board 80 by adopting liquid polyurethane, namely pouring the liquid polyurethane into the groove 11, solidifying the liquid polyurethane at 50-100 ℃, wherein the upper surfaces of a light emitting unit 20 and a detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same as the surface of the substrate 10 in height.
Example IV
A polyimide-based double-sided copper-clad plate with a thickness of 75 micrometers is selected as the flexible circuit board 80, and then a picosecond pulse laser with a wavelength of 355nm is adopted to etch a via array with a diameter of 100 micrometers on the flexible circuit board 80. Then, the combined conductive patterns corresponding to the light emitting unit 20 and the detecting unit 30 are etched on one side of the flexible circuit board 80 by using steps of masking, exposing, chemical etching and the like, conductive circuit patterns with a width of 200 micrometers are etched on the other side of the flexible circuit board 80, copper layers are electroplated inside the through holes, and a plurality of combined conductive patterns and conductive circuits of the flexible circuit board 80 are electrically connected through the through holes.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are mounted on the combined conductive pattern area of the flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then the fan-shaped electric actuating film 60 composed of the Nafion composite film modified by the silver nano catalyst is selected, as shown in fig. 2 and 3, four pieces of the fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit on the other surface of the flexible circuit board 80 through the through holes.
Selecting a polyurethane film as a substrate 10, printing the substrate 10 with the groove 11 by adopting a 3D printing technology, wherein the size of the groove 11 is the same as that of a flexible circuit board 80, then etching a through hole 70 array at the bottom of the groove 11 of the substrate 10 by adopting picosecond pulse laser with the wavelength of 355nm, wherein the diameter of the through hole 70 is 200 microns, the distance between the through holes 70 is 1mm, then embedding the flexible circuit board 80 into the substrate 10, wherein the other surface of the flexible circuit board 80 with a conductive circuit is attached to the bottom of the groove 11 of the substrate 10, and then packaging the flexible circuit board 80 by adopting liquid polyurethane, namely pouring the liquid polyurethane into the groove 11, solidifying the liquid polyurethane at 50-100 ℃, wherein the upper surfaces of a light emitting unit 20 and a detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same as the surface of the substrate 10 in height.
Example five
A polyimide-based single-sided copper-clad plate with the thickness of 75 micrometers is selected as the flexible circuit board 80, and a picosecond pulse laser with the wavelength of 355nm is adopted to etch bonding conductive patterns corresponding to the light-emitting unit 20 and the detection unit 30 on one side of the flexible circuit board 80, and also etch conductive circuit patterns with the width of 200 micrometers on one side of the flexible circuit board 80 with the bonding conductive patterns, and the bonding conductive patterns are electrically connected with the conductive circuits.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are mounted on the combined conductive pattern area, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then a fan-shaped electric actuating film 60 composed of Nafion composite film decorated by platinum nano catalyst is selected, as shown in fig. 2 and 3, four pieces of fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit through the combined conductive pattern.
Selecting a polyurethane film as a substrate 10, pouring the substrate 10 with the grooves 11 by using a mold, wherein the size of the grooves 11 is the same as that of a flexible circuit board 80, then etching an array of through holes 70 at the bottom of the grooves 11 of the substrate 10 by using picosecond pulse laser with the wavelength of 355nm, wherein the diameter of the through holes 70 is 200 microns, the distance between the through holes 70 is 1mm, then embedding the flexible circuit board 80 in the substrate 10, wherein the other surface of the flexible circuit board 80 with a plurality of combined conductive patterns is attached to the bottom of the grooves 11 of the substrate 10, and then packaging the flexible circuit board 80 by using liquid polyurethane, namely pouring the liquid polyurethane into the grooves 11, solidifying the liquid polyurethane at 50-100 ℃, wherein the upper surfaces of a light emitting unit 20 and a detection unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detection unit 30 are the same as the surface of the substrate 10 in height.
Example six
A polyimide-based double-sided copper-clad plate with a thickness of 75 micrometers is selected as the flexible circuit board 80, and then a picosecond pulse laser with a wavelength of 355nm is adopted to etch a via array with a diameter of 100 micrometers on the flexible circuit board 80. Then, the combined conductive patterns corresponding to the light emitting unit 20 and the detecting unit 30 are etched on one side of the flexible circuit board 80 by using steps of masking, exposing, chemical etching and the like, conductive circuit patterns with a width of 200 micrometers are etched on the other side of the flexible circuit board 80, copper layers are electroplated inside the through holes, and a plurality of combined conductive patterns and conductive circuits of the flexible circuit board 80 are electrically connected through the through holes.
The dual wavelength LED light source is selected as the light emitting unit 20, the wavelengths are 660nm and 850nm, the light emitting unit 20 and the detecting unit 30 are mounted on the combined conductive pattern area of the flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, then the fan-shaped electric actuating film 60 composed of the Nafion composite film modified by the silver nano catalyst is selected, as shown in fig. 2 and 3, four pieces of the fan-shaped electric actuating film 60 are selected to form the first electric actuating cover 40 and/or the second electric actuating cover 50, the first electric actuating cover 40 is covered on the upper surface of the light emitting unit 20, the second electric actuating cover 50 is covered on the upper surface of the detecting unit 30, and the electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 are electrically connected with the conductive circuit on the other surface of the flexible circuit board 80 through the through holes.
The method comprises the steps of selecting a polydimethylsiloxane film as a substrate 10, printing the substrate 10 with the grooves 11 by adopting a 3D printing technology, wherein the size of the grooves 11 is the same as that of a flexible circuit board 80, etching an array of through holes 70 at the bottom of the grooves 11 of the substrate 10 by adopting picosecond pulse laser with the wavelength of 355nm, wherein the diameter of each through hole 70 is 200 microns, the distance between the through holes 70 is 1mm, embedding the flexible circuit board 80 into the substrate 10, bonding the other surface of the flexible circuit board 80 with a conductive circuit with the bottom of the grooves 11 of the substrate 10, and packaging the flexible circuit board 80 by adopting liquid polydimethylsiloxane, namely, pouring the liquid polydimethylsiloxane into the grooves 11, and solidifying the liquid polydimethylsiloxane at 50-100 ℃, wherein the upper surfaces of a light emitting unit 20 and a detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the upper surface of the detecting unit 30 are the same as the surface of the substrate 10, as shown in fig. 4.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (9)
1. A brain imaging detection device wearable to a head of a human body; the brain imaging detection device comprises a matrix, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the matrix;
the brain imaging detection device is characterized by further comprising a first electric actuating cover and a second electric actuating cover, wherein the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are mutually enclosed, the electric actuating films can deform after being electrified, and the electric actuating films can burst after being electrified so as to form light paths on the surfaces of the light emitting unit and the detection unit;
the first electric actuating cover is electrically connected with the light-emitting unit and can synchronously burst when the light-emitting unit emits light; and/or the second electrically actuated cover is electrically connected to the detection unit and is capable of synchronizing opening when the detection unit enters a detection state.
2. The brain imaging detection apparatus according to claim 1, wherein a plurality of electrically actuated films of the first electrically actuated cover are disposed around a center of the light emitting unit, and a portion of the plurality of electrically actuated films away from the center of the light emitting unit is connected to an edge of a surface of the light emitting unit; and/or the number of the groups of groups,
the plurality of electrically actuated films of the second electrically actuated cover are disposed around the center of the detection unit, and a portion of the plurality of electrically actuated films away from the center of the detection unit is connected to an edge of a surface of the detection unit.
3. The brain imaging detection apparatus according to claim 1, wherein said electrically actuated membrane is in the shape of a sector or triangle.
4. The brain imaging detection apparatus according to claim 1, wherein said electrically actuated membrane comprises one of: silver nano-catalyst modified Nafion composite membrane, platinum nano-catalyst modified Nafion composite membrane, gold nano-catalyst modified Nafion composite membrane.
5. The brain imaging detection apparatus according to claim 1, wherein said substrate comprises one of: a polydimethylsiloxane film and a polyurethane film.
6. The brain imaging detection apparatus according to claim 1, wherein said brain imaging detection apparatus further comprises: the flexible circuit board is provided with a conductive circuit and a plurality of combined conductive patterns, and the light-emitting unit and the detection unit are arranged on one surface of the flexible circuit board, which is provided with the combined conductive patterns, and are electrically connected with the conductive circuit through the corresponding combined conductive patterns.
7. The brain imaging detection apparatus according to claim 6, wherein the plurality of combined conductive patterns and the conductive traces are provided on opposite sides of the flexible wiring board, respectively; and the flexible circuit board is provided with a via hole corresponding to each combined conductive pattern, and each combined conductive pattern is electrically connected with the conductive circuit through the corresponding via hole.
8. The brain imaging detection device according to claim 6, wherein a groove is formed in the base body, a plurality of through holes are formed in the bottom of the groove, the flexible circuit board is embedded in the groove, and one surface, far away from the plurality of combined conductive patterns, of the flexible circuit board is attached to the bottom of the groove.
9. The brain imaging detection apparatus according to claim 6, wherein said flexible wiring board includes one of: polyimide-based copper-clad laminate, polyethylene terephthalate-based copper-clad laminate, and polybutylene terephthalate-based copper-clad laminate.
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| US9717298B1 (en) * | 2013-08-26 | 2017-08-01 | Raymond Louis Barrett, Jr. | MEMS valve actuator system |
| BR102015016171A8 (en) * | 2015-07-03 | 2018-02-27 | Pilkington Brasil Ltda | brake light device and its rear window glass mounting arrangement of a vehicle |
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| JP2015136380A (en) * | 2014-01-20 | 2015-07-30 | エーエムイー株式会社 | sleep state monitoring system |
| CN107946451A (en) * | 2016-10-12 | 2018-04-20 | 清华大学 | A kind of temperature sensing system |
| CN106725308A (en) * | 2016-11-28 | 2017-05-31 | 武汉资联虹康科技股份有限公司 | Near infrared spectrum Brian Imaging detection means with high sensitivity data acquisition |
| CN110072630A (en) * | 2016-12-14 | 2019-07-30 | 杜尔***股份公司 | Jet-printing head for being applied to coating agent on component |
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