CN111110194A - Brain imaging detection device - Google Patents
Brain imaging detection device Download PDFInfo
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- CN111110194A CN111110194A CN201911397376.XA CN201911397376A CN111110194A CN 111110194 A CN111110194 A CN 111110194A CN 201911397376 A CN201911397376 A CN 201911397376A CN 111110194 A CN111110194 A CN 111110194A
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Abstract
The embodiment of the application provides a brain imaging detection device. Wherein the brain imaging detection device can be worn to the head of a human body; the brain imaging detection device comprises a base body, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the base body; the brain imaging detection device further comprises a first electric actuating cover and a second electric actuating cover, the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are arranged in a surrounding mode, and the electric actuating films can burst after being electrified so as to form light paths on the surfaces of the light emitting unit and the detecting unit. Through the brain imaging detection device and the brain imaging detection method, the detection structure of the brain imaging detection device is simplified, and the problem that the detection structure of the brain imaging detection device is complex is solved.
Description
Technical Field
The application relates to the field of flexible electronics, in particular to a brain imaging detection device.
Background
Functional near-infrared spectroscopy (fNIRS) is a non-invasive brain functional imaging technology emerging in recent years, and is mainly used for detecting hemodynamic activity of cerebral cortex in real time and directly by utilizing the difference characteristic of oxyhemoglobin and deoxyhemoglobin in brain tissue to near-infrared light absorption rates with different wavelengths of 600-900 nm. The brain's neural activity is inferred by observing this hemodynamic change.
The functional near infrared spectrum imaging technology becomes an important research means in the field of neuroscience, and has important value in the fields of scientific research and clinical application. When the brain of a detected person is detected by utilizing near infrared spectrum brain imaging, hairs which obstruct measurement need to be separated, a probe and a detector need to be placed at a specified position of the head, a large amount of preparation time needs to be spent, and if the interference of human hairs cannot be eliminated, optical signals cannot be effectively acquired, so that the measurement sensitivity and the data acquisition accuracy are directly influenced.
In the related technology, two layers of hair poking components are designed on a head cover of the near-infrared brain imaging detection device, the outer layer is a sleeve with a plurality of poking components, and the inner layer is a detection end of a probe which is driven by a rotating part and can rotate at a small angle; when a human body needs to carry out near infrared spectrum brain imaging detection, the head cover is worn, the sleeve is in contact with hair, the poking piece is controlled to be opened outwards and pokes most of the hair, and then the small-amplitude rotation of the detection end of the probe is manually or/and mechanically and automatically controlled, so that the hair can be further separated, and the probe is enabled to be in contact with the scalp completely. In the above scheme, the rotating part for controlling the rotation of the probe and the sleeve sleeved on the periphery of the detection end are also required to realize the above scheme, which results in a complex detection structure of the brain imaging detection device.
Disclosure of Invention
Based on this, the embodiments of the present application provide a brain imaging detection apparatus, so as to solve the problem in the related art that the detection structure of the brain imaging detection apparatus is complex.
In a first aspect, embodiments of the present application provide a brain imaging detection apparatus, which can be worn on the head of a human body; the brain imaging detection device comprises a base body, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the base body; the brain imaging detection device further comprises a first electric actuating cover and a second electric actuating cover, the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are mutually surrounded, and the electric actuating films can burst open after being electrified so as to form light paths on the surfaces of the light-emitting unit and the detecting unit.
In one embodiment, the first electrically actuated cover is electrically connected to the light emitting unit; and/or the second electrically actuated cover is electrically connected to the detection unit.
In one embodiment, the plurality of electric actuating films of the first electric actuating cover are arranged around the center of the light-emitting unit, and the parts of the plurality of electric actuating films far away from the center of the light-emitting unit are connected to the edge of the surface of the light-emitting unit; and/or the plurality of electric actuating films of the second electric actuating cover are arranged around the center of the detection unit, and the parts of the plurality of electric actuating films far away from the center of the detection unit are connected with the edges of the surface of the detection unit.
In one embodiment, the electrically actuated membrane is fan-shaped or triangular in shape.
In one embodiment, the electrically actuated membrane comprises one of: a Nafion composite membrane modified by a silver nano-catalyst, a Nafion composite membrane modified by a platinum nano-catalyst and a Nafion composite membrane modified by a gold nano-catalyst.
In one embodiment, the substrate comprises one of: polydimethylsiloxane films, polyurethane films.
In one embodiment, the brain imaging detection apparatus further comprises: the light-emitting unit and the detection unit are arranged on one surface of the flexible circuit board, provided with the plurality of combined conductive patterns, and are electrically connected with the conductive circuit through the corresponding combined conductive patterns.
In one embodiment, the two opposite surfaces of the flexible circuit board are respectively provided with the plurality of combined conductive patterns and the conductive circuit; and a through hole is arranged on the flexible circuit board corresponding to each combined conductive pattern, and each combined conductive pattern is electrically connected with the conductive circuit through the corresponding through hole.
In one embodiment, a groove is formed in the substrate, a plurality of through holes are formed in the bottom of the groove, the flexible circuit board is embedded in the groove, and one surface, far away from the plurality of combined conductive patterns, of the flexible circuit board is attached to the bottom of the groove.
In one embodiment, the flexible wiring board includes one of: polyimide-based copper clad laminates, polyethylene glycol terephthalate-based copper clad laminates and polybutylene terephthalate-based copper clad laminates.
The brain imaging detection device provided by the embodiment of the application sets up a plurality of electrically actuated films respectively through the surface at luminescence unit and detection unit, and a plurality of electrically actuated films can bloom after the circular telegram to form the light path on luminescence unit and detection unit's surface, simplified brain imaging detection device's detection structure, solved brain imaging detection device's the complicated problem of detection structure.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more thorough understanding of the application.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in related arts, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a brain imaging detection apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a first electrically actuated cover according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a second electrically actuated cover according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a brain imaging detection device according to a preferred embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. All other examples, which can be obtained by a person skilled in the art without making any inventive step based on the examples in this application, are within the scope of protection of this application.
It is obvious that the drawings in the following description are only examples or embodiments of the application, from which the application can also be applied to other similar scenarios without inventive effort for a person skilled in the art. Moreover, it should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Unless otherwise defined, technical or scientific terms used in the claims and the specification should have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. The use of the terms "a" and "an" and "the" and similar referents in the context of describing and claiming the application are not to be construed as limiting in any way, but rather as indicating the singular or plural. The word "comprise" or "comprises", and the like, means that the element or item appearing before the word "comprises" or "comprising" covers the element or item listed after the word "comprising" or "comprises" and its equivalent, and does not exclude other elements or items. "connected" or "connected" and similar terms are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in the specification and claims of this application, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
The embodiment of the application provides a brain imaging detection device which can be worn on the head of a human body. Fig. 1 is a schematic structural diagram of a brain imaging detection device according to an embodiment of the present application, as shown in fig. 1, the brain imaging detection device includes a base 10, a light emitting unit 20, and a detecting unit 30, where the light emitting unit 20 and the detecting unit 30 are both disposed inside the base 10; the brain imaging detection device further comprises a first electric actuating cover 40 and a second electric actuating cover 50, wherein the first electric actuating cover 40 is arranged on the surface of the light-emitting unit 20, and the second electric actuating cover 50 is arranged on the surface of the detection unit 30; the first and second electric actuating covers 40 and 50 respectively include a plurality of electric actuating films which are arranged to surround each other, and the plurality of electric actuating films can be frayed after being energized to form a light path on the surfaces of the light emitting unit 20 and the detecting unit 30.
In the embodiment, the first electrically actuated cover 40 is disposed on the surface of the light emitting unit 20, the second electrically actuated cover 50 is disposed on the surface of the detecting unit 30, and the first electrically actuated cover 40 and the second electrically actuated cover 50 respectively include a plurality of electrically actuated films which are mutually surrounded, and the electrically actuated films can be frayed after being electrified, so as to move hair on the surfaces of the light emitting unit 20 and the detecting unit 30, so that the surfaces can form an optical path when the light emitting unit 20 and the detecting unit 30 work, thereby avoiding interference of hair during detection, and improving the sensitivity and accuracy of detection of the brain imaging detecting device.
Compared with the brain imaging detection device in the related art, the brain imaging detection device provided by the embodiment solves the problem of complex detection structure of the brain imaging detection device in the related art and simplifies the structure of the brain imaging detection device by controlling the rotating part of the probe to rotate and the sleeve sleeved on the periphery of the detection end to shift the hair on the surfaces of the light emitting unit and the detection unit; compared with a manual or mechanical brain imaging detection device in the related art, the brain imaging detection device provided by the embodiment has the advantages of being quicker and more convenient, and has better application prospect.
In the present embodiment, the inner side of the base 10 is a side that contacts the head of the human body.
In one embodiment, the first electrically actuated cover 40 is electrically connected to the light emitting unit 20; and/or the second electrically actuated cover 50 is electrically connected to the detection unit 30.
In the present embodiment, by electrically connecting the first electric actuation cover 40 to the light emitting unit 20, it is realized that the first electric actuation cover 40 can be opened synchronously when the light emitting unit 20 emits light; by electrically connecting the second electrically actuated cover 50 to the detecting unit 30, it is achieved that the second electrically actuated cover 50 is able to burst open synchronously when the detecting unit 30 enters the detecting state.
Fig. 2 is a schematic structural diagram of the first electric actuating cover 40 according to an embodiment of the present disclosure, and as shown in fig. 2, in an embodiment, the plurality of electric actuating films 60 of the first electric actuating cover 40 are disposed around the center of the light emitting unit 20, and portions of the plurality of electric actuating films 60 away from the center of the light emitting unit 20 are connected to edges of the surface of the light emitting unit 20.
Fig. 3 is a schematic structural diagram of the second electric actuating cap 50 according to the embodiment of the present application, and as shown in fig. 3, in one embodiment, a plurality of electric actuating membranes 60 of the second electric actuating cap 50 are disposed around the center of the detecting unit 30, and portions of the plurality of electric actuating membranes 60 away from the center of the detecting unit 30 are connected to edges of the surface of the detecting unit 30.
In the above embodiment, the plurality of electrically actuated membranes 60 surrounding each other may be arranged as shown in fig. 2 or 3, wherein the square in fig. 2 and 3 represents the upper surface of the detecting unit 30 or the light emitting unit 20, and the whole of the split circle represents the first electrically actuated cover 40 or the second electrically actuated cover 50, wherein the fan shape represents the electrically actuated membranes 60. In the embodiment, the hair on the surface of the light emitting unit 20 or the hair on the surface of the detecting unit 30 can be moved by surrounding the plurality of electric actuating films 60 to form the first electric actuating cover 40 or the second electric actuating cover 50 without gaps, and the first electric actuating cover 40 or the second electric actuating cover 50 is unfolded after being electrified, so that the detection sensitivity and the detection accuracy of the brain imaging detection device are further improved.
Alternatively, the shape of the electric actuating film 60 is not limited to the shape shown in fig. 2 or fig. 3, and may also be other shapes such as triangle, especially a shape capable of enclosing a closed image, wherein the shapes of the first electric actuating cover 40 and the second electric actuating cover 50 are also not limited to the shapes shown in fig. 2 or fig. 3, and the shapes may be changed according to the shape change of the electric actuating film 60, for example, the shapes of the first electric actuating cover 40 and the second electric actuating cover 50 may also be oval, polygonal, and the like.
In one embodiment, the electrically actuated membrane includes, but is not limited to, one of: a Nafion composite membrane modified by a silver nano-catalyst, a Nafion composite membrane modified by a platinum nano-catalyst and a Nafion composite membrane modified by a gold nano-catalyst. By adopting the composite membrane as the electric actuating cover, the composite membrane can generate larger deformation under the action of a lower electric field, and has the advantages of simple actuating mode, high efficiency, low actuating voltage, safe operation, light weight and the like.
In one embodiment, the substrate 10 includes, but is not limited to, one of the following: polydimethylsiloxane (PDMS) film or Polyurethane (PU) film.
In this embodiment, the polyurethane film is a non-toxic environment-friendly polymer elastomer film, and has the characteristics of high strength, wear resistance, good elasticity, weather resistance, environmental protection, non-toxicity, recycling and decomposition. And the polyurethane film has the excellent performances of high light transmission, no yellowing, weather resistance, high adhesion, high elongation length, high elasticity and the like, so the polyurethane film can be specially designed to be compounded with various thermoplastic films, including polycarbonate, polymethacrylic acid and the like, to form a high-grade splash-free bulletproof, explosion-proof and explosion-proof glass interlayer, and the characteristics of lightness, thinness and high impact resistance are fully exerted. The polydimethylsiloxane film is prepared by taking polydimethylsiloxane as a raw material through a special process, and belongs to a high-molecular elastic polymer film. Due to the characteristics of the polydimethylsiloxane material, the polydimethylsiloxane film is endowed with certain specific properties, such as elasticity, low Young modulus, excellent gas permeability, chemical stability, thermal stability, low-temperature flexibility (-60-200 ℃ keeps excellent performance), full transparency and biocompatibility. The base body 10 made of the polydimethylsiloxane film or the polyurethane film realizes the folding of the base body 10, greatly enhances the practicability and plasticity of the base body 10, and enables the brain imaging detection device to realize planarization or curved surface.
As shown in fig. 4, in one embodiment, the brain imaging detection apparatus further comprises: the flexible printed circuit board 80 is provided with a conductive circuit and a plurality of combined conductive patterns, and the light emitting unit 20 and the detecting unit 30 are arranged on one surface of the flexible printed circuit board 80, which is provided with the plurality of combined conductive patterns, and are electrically connected with the conductive circuit through the corresponding combined conductive patterns.
By combining the flexible circuit board 80 in the above embodiment and the substrate 10 made of the polydimethylsiloxane film or the polyurethane film in the above embodiment, the brain imaging detection device can be freely bent, wound and folded, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved; meanwhile, the flexible circuit board 80 can greatly reduce the volume and weight of the brain imaging detection device; and the flexible circuit board 80 has the advantages of good heat dissipation and weldability, easy assembly and connection, low comprehensive cost and the like.
In one embodiment, the opposite sides of the flexible wiring board 80 are respectively provided with a plurality of combined conductive patterns and conductive lines; a via hole is provided on the flexible wiring board 80 corresponding to each combined conductive pattern, and each combined conductive pattern is electrically connected to the conductive line through the corresponding via hole.
In this embodiment, the conductive lines and the combined conductive patterns are respectively disposed on two opposite sides of the flexible printed circuit board 80, the via holes are disposed to electrically connect the conductive lines and the combined conductive patterns, and the light emitting unit 20 and the detecting unit 30 are disposed on the combined conductive patterns and electrically connected to the combined conductive patterns, so that the arrangement density of the light emitting unit 20 and the detecting unit 30 in a unit area can be increased, and the illumination intensity in the unit area can be increased.
In the present embodiment, in order to enhance the uniformity of the illumination intensity per unit area, the light emitting unit 20 and the detecting unit 30 may be arranged in an array on the bonding conductive pattern.
In this embodiment, in order to achieve good conductivity of the via, a conductive metal may be electroplated within the via, which may be, but is not limited to, copper, aluminum, gold, nickel, zinc, silver, iron, or alloys thereof.
In the present embodiment, the light emitting unit 20 may be, but is not limited to, a dual-wavelength LED light source, a three-wavelength LED light source, or other light emitting units 20 capable of emitting different wavelengths of light, and the detection of oxygen and hemoglobin and deoxyhemoglobin concentrations in blood of an active region of a brain of a human body by different wavelengths of light may be achieved through the light emitting units 20 capable of emitting different wavelengths of light.
As shown in fig. 4, in one embodiment, a groove 11 is formed on the substrate 10, a plurality of through holes 70 are formed at the bottom of the groove 11, the flexible printed circuit 80 is embedded in the groove 11, and a surface of the flexible printed circuit 80 away from the plurality of combined conductive patterns is attached to the bottom of the groove 11.
In this embodiment, the plurality of through holes 70 are disposed at the bottom of the groove 11 of the substrate 10, so that the heat dissipation of the flexible circuit board 80 is improved, and meanwhile, the heat sink and the heat radiator are not needed to realize the heat dissipation of the brain imaging detection device, thereby reducing the weight of the brain imaging detection device, reducing the production cost and improving the heat dissipation effect. Preferably, the through holes 70 are evenly distributed at the bottom of the recess 11, arranged in an array of through holes 70.
As shown in fig. 4, in this embodiment, after the surface of the flexible wiring board 80 away from the bonding conductive patterns is attached to the bottom of the groove 11, the flexible wiring board 80 may be encapsulated by using the same material as the base 10. For example, the encapsulation process may be to pour liquid polydimethylsiloxane or polyurethane into the groove 11 to expose the upper surfaces of the light emitting unit 20 and the detecting unit 30, and then cure under certain temperature conditions (e.g., 50 ℃ to 100 ℃). The packaging structure can strengthen the integrity of the brain imaging detection device, improve the resistance to external impact and vibration, improve the insulation between internal elements and circuits, avoid the linear exposure of the elements and the circuits, and improve the waterproof and moisture-proof performances of devices.
In this embodiment, the size of the groove 11 may be set to be the same as the size of the flexible printed circuit board 80, and the top of the groove 11 is flush with the upper surfaces of the light emitting unit 20 and the detecting unit 30 disposed on the flexible printed circuit board 80, so that the flexible printed circuit board 80 is closely fitted to the groove 11.
In the present embodiment, the flexible wiring board 80 includes, but is not limited to, one of the following: polyimide (PI) based copper clad laminate, polyethylene glycol terephthalate (PET) based copper clad laminate, or polybutylene terephthalate (PBT) based copper clad laminate.
Polyimide is one of organic polymer materials with the best comprehensive performance, resists high temperature of more than 400 ℃, has a long-term use temperature range of-200 to 300 ℃, has no obvious melting point on part, and is a high-insulation material. The polyethylene glycol terephthalate is exchanged by dimethyl terephthalate and glycol ester or is esterified by terephthalic acid and glycol to synthesize the dihydroxyethyl terephthalate, has excellent physical and mechanical properties in a wider temperature range, can reach 120 ℃ after long-term use, has excellent electrical insulation, and has better electrical properties even at high temperature and high frequency. The polybutylene terephthalate is milky translucent to opaque semi-crystalline thermoplastic polyester, has high heat resistance, can work for a long time at 140 ℃, and has the advantages of toughness, fatigue resistance, self-lubrication, low friction coefficient and the like.
In this embodiment, a polyimide-based copper clad laminate, a polyethylene glycol terephthalate-based copper clad laminate, or a polybutylene terephthalate-based copper clad laminate is used, so that the heat resistance of the flexible circuit board 80 can be improved.
Optionally, in this embodiment, the polyimide-based copper-clad plate, the polyethylene glycol terephthalate-based copper-clad plate, or the polybutylene terephthalate-based copper-clad plate may be a single-sided copper-clad plate, or a double-sided copper-clad plate.
In the brain imaging detection device in the embodiment of the application, the first electric actuating cover 40 is prepared on the surface of the light emitting unit 20, and/or the second electric actuating cover 50 is prepared on the surface of the detection unit 30, under the condition of electrifying, the plurality of electric actuating films 60 in the first electric actuating cover 40 can automatically dial hairs on the surface of the light emitting unit 20, and the plurality of electric actuating films 60 in the second electric actuating cover 50 can automatically dial hairs on the surface of the detection unit 30, so that the interference of hairs during detection is avoided, and the sensitivity and the accuracy of the device are improved. Meanwhile, compared with a manual or mechanical type hair poking device in the related art, the device has the advantages of simpler structure, higher speed and convenience.
The preparation of the brain imaging detection device in the embodiments of the present application will be described and illustrated below with reference to preferred embodiments.
Example one
A polyimide-based double-sided copper-clad plate with the thickness of 75 microns is selected as a flexible circuit board 80, and then picosecond pulse laser with the wavelength of 355nm is adopted to etch a via hole array with the diameter of 100 microns on the flexible circuit board 80. Then, a combined conductive pattern corresponding to the light emitting unit 20 and the detecting unit 30 is etched on one surface of the flexible circuit board 80, a conductive circuit pattern with a width of 200 micrometers is etched on the other surface of the flexible circuit board 80, a copper layer is electroplated inside the via hole, and the combined conductive patterns and the conductive circuit of the flexible circuit board 80 are electrically connected through the via hole.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, attaching the light emitting unit 20 and a detecting unit 30 in a combined conductive pattern area of a flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a platinum nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detecting unit 30, and electrically connecting electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive lines on the other surface of the flexible circuit board 80 through via holes respectively.
Selecting a polyurethane film as a matrix 10, pouring the matrix 10 with the groove 11 by using a mould, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then, picosecond pulse laser with the wavelength of 355nm is adopted to etch a through hole 70 array at the bottom of the groove 11 of the substrate 10, the diameter of the through hole 70 is 200 micrometers, the distance between the through holes 70 is 1mm, then the flexible circuit board 80 is embedded in the substrate 10, wherein the other side of the flexible circuit board 80 with the conductive circuit is attached to the bottom of the groove 11 of the substrate 10, then the flexible circuit board 80 is encapsulated by liquid polyurethane, namely, by pouring liquid polyurethane into the groove 11 and curing the liquid polyurethane at 50-100 ℃, as shown in fig. 4, the upper surfaces of the light emitting unit 20 and the detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same in height as the surface of the base 10.
Example two
A polyimide-based double-sided copper-clad plate with the thickness of 75 microns is selected as a flexible circuit board 80, and then picosecond pulse laser with the wavelength of 355nm is adopted to etch a via hole array with the diameter of 100 microns on the flexible circuit board 80. And then, etching combined conductive patterns corresponding to the light-emitting unit 20 and the detection unit 30 on one surface of the flexible circuit board 80 by adopting the steps of masking, exposing, chemically etching and the like, etching conductive circuit patterns with the width of 200 microns on the other surface of the flexible circuit board 80, electroplating a copper layer inside the through holes, and electrically connecting the combined conductive patterns and the conductive circuits of the flexible circuit board 80 through the through holes.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, attaching the light emitting unit 20 and a detecting unit 30 in a combined conductive pattern area of a flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a platinum nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detecting unit 30, and electrically connecting electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive lines on the other surface of the flexible circuit board 80 through via holes respectively.
Selecting a polyurethane film as a matrix 10, pouring the matrix 10 with the groove 11 by using a mould, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then, picosecond pulse laser with the wavelength of 355nm is adopted to etch a through hole 70 array at the bottom of the groove 11 of the substrate 10, the diameter of the through hole 70 is 200 micrometers, the distance between the through holes 70 is 1mm, then the flexible circuit board 80 is embedded in the substrate 10, wherein the other side of the flexible circuit board 80 with the conductive circuit is attached to the bottom of the groove 11 of the substrate 10, then the flexible circuit board 80 is encapsulated by liquid polyurethane, namely, by pouring liquid polyurethane into the groove 11 and curing the liquid polyurethane at 50-100 ℃, as shown in fig. 4, the upper surfaces of the light emitting unit 20 and the detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same in height as the surface of the base 10.
EXAMPLE III
A polyimide-based double-sided copper-clad plate with the thickness of 75 microns is selected as a flexible circuit board 80, and then picosecond pulse laser with the wavelength of 355nm is adopted to etch a via hole array with the diameter of 100 microns on the flexible circuit board 80. And then, etching combined conductive patterns corresponding to the light-emitting unit 20 and the detection unit 30 on one surface of the flexible circuit board 80 by adopting the steps of masking, exposing, chemically etching and the like, etching conductive circuit patterns with the width of 200 microns on the other surface of the flexible circuit board 80, electroplating a copper layer inside the through holes, and electrically connecting the combined conductive patterns and the conductive circuits of the flexible circuit board 80 through the through holes.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, attaching the light emitting unit 20 and a detection unit 30 in a combined conductive pattern area of a flexible circuit board 80, the distance between the light emitting unit 20 and the detection unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a gold nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detection unit 30, and electrically connecting electrodes of the light emitting unit 20, the detection unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive lines on the other surface of the flexible circuit board 80 through via holes respectively.
Selecting a polyurethane film as a substrate 10, printing the substrate 10 with the groove 11 by adopting a 3D printing technology, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then, picosecond pulse laser with the wavelength of 355nm is adopted to etch a through hole 70 array at the bottom of the groove 11 of the substrate 10, the diameter of the through hole 70 is 200 micrometers, the distance between the through holes 70 is 1mm, then the flexible circuit board 80 is embedded in the substrate 10, wherein the other side of the flexible circuit board 80 with the conductive circuit is attached to the bottom of the groove 11 of the substrate 10, then the flexible circuit board 80 is encapsulated by liquid polyurethane, namely, by pouring liquid polyurethane into the groove 11 and curing the liquid polyurethane at 50-100 ℃, as shown in fig. 4, the upper surfaces of the light emitting unit 20 and the detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same in height as the surface of the base 10.
Example four
A polyimide-based double-sided copper-clad plate with the thickness of 75 microns is selected as a flexible circuit board 80, and then picosecond pulse laser with the wavelength of 355nm is adopted to etch a via hole array with the diameter of 100 microns on the flexible circuit board 80. And then, etching combined conductive patterns corresponding to the light-emitting unit 20 and the detection unit 30 on one surface of the flexible circuit board 80 by adopting the steps of masking, exposing, chemically etching and the like, etching conductive circuit patterns with the width of 200 microns on the other surface of the flexible circuit board 80, electroplating a copper layer inside the through holes, and electrically connecting the combined conductive patterns and the conductive circuits of the flexible circuit board 80 through the through holes.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, attaching the light emitting unit 20 and a detecting unit 30 in a combined conductive pattern area of a flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a silver nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detecting unit 30, and electrically connecting electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive lines on the other surface of the flexible circuit board 80 through via holes respectively.
Selecting a polyurethane film as a substrate 10, printing the substrate 10 with the groove 11 by adopting a 3D printing technology, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then, picosecond pulse laser with the wavelength of 355nm is adopted to etch a through hole 70 array at the bottom of the groove 11 of the substrate 10, the diameter of the through hole 70 is 200 micrometers, the distance between the through holes 70 is 1mm, then the flexible circuit board 80 is embedded in the substrate 10, wherein the other side of the flexible circuit board 80 with the conductive circuit is attached to the bottom of the groove 11 of the substrate 10, then the flexible circuit board 80 is encapsulated by liquid polyurethane, namely, by pouring liquid polyurethane into the groove 11 and curing the liquid polyurethane at 50-100 ℃, as shown in fig. 4, the upper surfaces of the light emitting unit 20 and the detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same in height as the surface of the base 10.
EXAMPLE five
Selecting a polyimide-based single-sided copper-clad plate with the thickness of 75 microns as a flexible circuit board 80, etching a combined conductive pattern corresponding to the light-emitting unit 20 and the detection unit 30 on one side of the flexible circuit board 80 by adopting picosecond pulse laser with the wavelength of 355nm, etching a conductive circuit pattern with the width of 200 microns on the side, provided with a plurality of combined conductive patterns, of the flexible circuit board 80, and electrically connecting the combined conductive patterns with the conductive circuit.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, mounting the light emitting unit 20 and a detecting unit 30 in a combined conductive pattern area, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a platinum nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detecting unit 30, and electrically connecting electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive circuits respectively through combined conductive patterns.
Selecting a polyurethane film as a matrix 10, pouring the matrix 10 with the groove 11 by using a mould, wherein the size of the groove 11 is the same as that of the flexible circuit board 80, then, picosecond pulse laser with the wavelength of 355nm is adopted to etch a through hole 70 array at the bottom of the groove 11 of the substrate 10, the diameter of the through hole 70 is 200 micrometers, the distance between the through holes 70 is 1mm, then the flexible circuit board 80 is embedded in the substrate 10, wherein the other surface of the flexible circuit board 80 with a plurality of combined conductive patterns is attached to the bottom of the groove 11 of the substrate 10, and then the flexible circuit board 80 is encapsulated by liquid polyurethane, namely, by pouring liquid polyurethane into the groove 11 and curing the liquid polyurethane at 50-100 ℃, as shown in fig. 4, the upper surfaces of the light emitting unit 20 and the detecting unit 30 are exposed, and the upper surfaces of the light emitting unit 20 and the detecting unit 30 are the same in height as the surface of the base 10.
EXAMPLE six
A polyimide-based double-sided copper-clad plate with the thickness of 75 microns is selected as a flexible circuit board 80, and then picosecond pulse laser with the wavelength of 355nm is adopted to etch a via hole array with the diameter of 100 microns on the flexible circuit board 80. And then, etching combined conductive patterns corresponding to the light-emitting unit 20 and the detection unit 30 on one surface of the flexible circuit board 80 by adopting the steps of masking, exposing, chemically etching and the like, etching conductive circuit patterns with the width of 200 microns on the other surface of the flexible circuit board 80, electroplating a copper layer inside the through holes, and electrically connecting the combined conductive patterns and the conductive circuits of the flexible circuit board 80 through the through holes.
Selecting a dual-wavelength LED light source as a light emitting unit 20, wherein the wavelengths are 660nm and 850nm respectively, attaching the light emitting unit 20 and a detecting unit 30 in a combined conductive pattern area of a flexible circuit board 80, the distance between the light emitting unit 20 and the detecting unit 30 is 2cm, selecting a fan-shaped electric actuating film 60 composed of a Nafion composite film modified by a silver nano catalyst, as shown in FIGS. 2 and 3, selecting four fan-shaped electric actuating films 60 to form a first electric actuating cover 40 and/or a second electric actuating cover 50, covering the first electric actuating cover 40 on the upper surface of the light emitting unit 20, covering the second electric actuating cover 50 on the upper surface of the detecting unit 30, and electrically connecting electrodes of the light emitting unit 20, the detecting unit 30, the first electric actuating cover 40 and the second electric actuating cover 50 with conductive lines on the other surface of the flexible circuit board 80 through via holes respectively.
Selecting a polydimethylsiloxane film as a substrate 10, printing the substrate 10 with grooves 11 by adopting a 3D printing technology, wherein the size of the grooves 11 is the same as that of a flexible circuit board 80, etching a through hole 70 array at the bottom of the grooves 11 of the substrate 10 by adopting picosecond pulse laser with the wavelength of 355nm, the diameter of the through holes 70 is 200 microns, the distance between the through holes 70 is 1mm, embedding the flexible circuit board 80 in the substrate 10, wherein the other surface of the flexible circuit board 80 with a conductive circuit is attached to the bottom of the grooves 11 of the substrate 10, packaging the flexible circuit board 80 by adopting liquid polydimethylsiloxane, namely pouring the liquid polydimethylsiloxane into the grooves 11, and curing the liquid polydimethylsiloxane at 50-100 ℃, as shown in figure 4, exposing the upper surfaces of a light-emitting unit 20 and a detecting unit 30, and further exposing the upper surface of the light-emitting unit 20, The upper surface of the sensing unit 30 is at the same height as the surface of the substrate 10.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A brain imaging detection apparatus wearable to a head of a human body; the brain imaging detection device comprises a base body, a light-emitting unit and a detection unit, wherein the light-emitting unit and the detection unit are both arranged on the inner side of the base body;
the brain imaging detection device is characterized by further comprising a first electric actuating cover and a second electric actuating cover, wherein the first electric actuating cover is arranged on the surface of the light-emitting unit, and the second electric actuating cover is arranged on the surface of the detection unit; the first electric actuating cover and the second electric actuating cover respectively comprise a plurality of electric actuating films which are mutually surrounded, and the electric actuating films can burst open after being electrified so as to form light paths on the surfaces of the light-emitting unit and the detecting unit.
2. The brain imaging detection device of claim 1, wherein the first electrically actuated mask is electrically connected to the light emitting unit; and/or the second electrically actuated cover is electrically connected to the detection unit.
3. The brain imaging detection device according to claim 1, wherein the plurality of electrically actuated membranes of the first electrically actuated cover are disposed around the center of the light emitting unit, and the portions of the plurality of electrically actuated membranes away from the center of the light emitting unit are connected to the edges of the surface of the light emitting unit; and/or the presence of a gas in the gas,
the plurality of electric actuating films of the second electric actuating cover are arranged around the center of the detection unit, and the parts of the plurality of electric actuating films far away from the center of the detection unit are connected with the edges of the surface of the detection unit.
4. The brain imaging detection device of claim 1, wherein the electrically actuated membrane is fan-shaped or triangular.
5. The brain imaging detection device of claim 1, wherein the electrically actuated membrane comprises one of: a Nafion composite membrane modified by a silver nano-catalyst, a Nafion composite membrane modified by a platinum nano-catalyst and a Nafion composite membrane modified by a gold nano-catalyst.
6. The brain imaging detection device of claim 1, wherein the base includes one of: polydimethylsiloxane films, polyurethane films.
7. The brain imaging detection device of claim 1, further comprising: the light-emitting unit and the detection unit are arranged on one surface of the flexible circuit board, provided with the plurality of combined conductive patterns, and are electrically connected with the conductive circuit through the corresponding combined conductive patterns.
8. The brain imaging detection device according to claim 7, wherein the plurality of combined conductive patterns and the conductive circuit are respectively disposed on two opposite surfaces of the flexible circuit board; and a through hole is arranged on the flexible circuit board corresponding to each combined conductive pattern, and each combined conductive pattern is electrically connected with the conductive circuit through the corresponding through hole.
9. The brain imaging detection device according to claim 7, wherein the base body is provided with a groove, the bottom of the groove is provided with a plurality of through holes, the flexible circuit board is embedded in the groove, and one surface of the flexible circuit board, which is far away from the plurality of combined conductive patterns, is attached to the bottom of the groove.
10. The brain imaging detection device of claim 7, wherein the flexible wiring board comprises one of: polyimide-based copper clad laminates, polyethylene glycol terephthalate-based copper clad laminates and polybutylene terephthalate-based copper clad laminates.
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