CN111081848B - Method for manufacturing light-emitting device - Google Patents
Method for manufacturing light-emitting device Download PDFInfo
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- CN111081848B CN111081848B CN201911423320.7A CN201911423320A CN111081848B CN 111081848 B CN111081848 B CN 111081848B CN 201911423320 A CN201911423320 A CN 201911423320A CN 111081848 B CN111081848 B CN 111081848B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 19
- 239000000084 colloidal system Substances 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000007723 die pressing method Methods 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 238000003825 pressing Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000006872 improvement Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- -1 dispensing Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a manufacturing method of a light-emitting device, which comprises the following steps: arranging a plurality of light-emitting elements on a substrate, and covering the upper surface and four side surfaces of each light-emitting element with a light-transmitting layer and/or a light-converting layer; using a mould to obtain a lens on the outer surface of the light transmission layer and/or the light conversion layer through mould pressing and packaging, and obtaining square colloids on the edge of the substrate through mould pressing and packaging, wherein a groove is formed between every two adjacent square colloids; increasing a difference in refractive index of light between an upper surface of the square colloid and a bottom surface of the trench; and identifying the groove by using a cutting machine, cutting, and dividing the light-emitting element into independent light-emitting devices. According to the invention, when the lenses are molded, the square colloid is molded at the edge of the substrate, the grooves corresponding to the interval positions between the adjacent lenses are manufactured, the grooves are used as the positioning grooves, the positioning grooves attached to the substrate are not relied on, the accuracy of the cutting position is improved, and the condition that the lenses are cut and scratched can be avoided even if the position of the molded lenses deviates.
Description
Technical Field
The invention belongs to the technical field of light emitting diode manufacturing, and particularly relates to a manufacturing method of a light emitting device.
Background
The light emitting diode has the advantages of long service life, low driving current, energy conservation, environmental protection and the like, is widely applied to the fields of common illumination, plant lamps, backlight sources, car lamps and the like, gradually becomes a new generation of illumination tool, and has a great promotion space in the technical aspect compared with the traditional light source.
At present, the existing method for manufacturing the light emitting diode module comprises the following steps: 1. arranging the light-emitting elements on the substrate with the positioning grooves in an array mode; 2. packaging by adopting processes of coating, dispensing, powder spraying, fluorescent sheets and the like; 3. molding a lens; 4. the cutting machine identifies the positioning groove attached to the substrate for cutting, and divides the arranged light-emitting elements into single light-emitting devices.
Although the manufacturing method has the advantages of simple process and low cost, the condition of cutting and scratching the lens often occurs when the cutting position is inaccurate or the position of the molded lens deviates, and the yield and the reliability of the light-emitting device are directly reduced.
Disclosure of Invention
In order to overcome the technical defects, the invention provides a manufacturing method of a light-emitting device, which can improve the accuracy of a cutting position.
In order to solve the problems, the invention is realized according to the following technical scheme:
a method for manufacturing a light-emitting device comprises the following steps:
arranging a plurality of light-emitting elements on a substrate, and covering the upper surface and four side surfaces of each light-emitting element with a light-transmitting layer and/or a light-converting layer;
using a mould to mold and package the outer surface of the light transmission layer and/or the light conversion layer to obtain a lens, and simultaneously mold and package the edge of the substrate to obtain square colloids, wherein a groove is arranged between every two adjacent square colloids;
increasing a difference in refractive index of light between an upper surface of the square colloid and a bottom surface of the trench;
and identifying the groove by using a cutting machine, cutting, and dividing the light-emitting element into independent light-emitting devices.
Compared with the prior art, the invention has the beneficial effects that: when the mould pressing lens, at the square colloid of edge mould pressing of base plate, combine follow-up increase the upper surface of square colloid with the process that the refractivity between the bottom surface of slot is poor produces and the corresponding slot of interval position between the adjacent lens to the slot is as the constant head tank, does not rely on the subsidiary constant head tank of base plate, can improve the accuracy of cutting position, even the position of mould pressing lens takes place the skew, also can avoid the emergence of the condition of cutting fish tail lens, has advantages such as preparation simple process, practicality height, with low costs.
As a further improvement of the present invention, the arranging of the plurality of light emitting elements on the substrate specifically includes:
the light-emitting elements are arranged on the substrate in an M × N unit array, wherein M is larger than or equal to 2, N is larger than or equal to 2, and each unit comprises at least one light-emitting element.
As a further improvement of the invention, the light-transmitting layer comprises at least one colloid and the light-converting layer comprises a colloid and at least one phosphor.
As a further improvement of the present invention, the mold comprises: the light-emitting device comprises an upper die and a lower die, wherein the upper die is provided with arc-shaped grooves which correspond to the arrangement mode and the center position of the light-emitting elements one to one, square grooves are arranged at the edges of the arc-shaped grooves in an array mode, and the arc-shaped grooves and the center points of the square grooves which are located on the same straight line.
As a further improvement of the present invention, the lens obtained by molding and encapsulating the outer surface of the light transmitting layer and/or the light conversion layer is specifically:
and after the upper die and the lower die are used for die pressing and packaging, obtaining the arc-shaped lens at the position on the substrate corresponding to the arc-shaped groove of the upper die.
As a further improvement of the present invention, the molding and packaging at the edge of the substrate to obtain the square colloid specifically comprises:
and after the upper die and the lower die are used for die pressing and packaging, obtaining the square colloid on the substrate at the position corresponding to the square groove of the upper die.
As a further improvement of the present invention, the horizontal distance between two adjacent square colloids is less than or equal to the horizontal distance between two adjacent lenses.
As a further improvement of the present invention, increasing the difference in the refractive index between the upper surface of the square colloid and the bottom surface of the trench is specifically:
etching the edge of the substrate, wherein an etching reaction occurs on the bottom surface of the groove, and corroding the metal layer on the upper layer of the substrate except the covering surface of the square colloid to expose the non-metal layer on the lower layer.
As a further improvement of the present invention, increasing the difference in the refractive index between the upper surface of the square colloid and the bottom surface of the trench is specifically: and carrying out ink coating on the edge of the substrate, wherein the ink coating is carried out on the upper surfaces of the square colloids, and the bottom surfaces of the grooves between the square colloids are not coated with ink.
Drawings
Embodiments of the invention are described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a flow chart of a method of fabrication according to an embodiment;
FIG. 2 is a diagram illustrating a state of S21 in the second step of the embodiment;
FIG. 3 is a diagram illustrating a state of S22 in two steps according to the embodiment;
FIG. 4 is a diagram illustrating a state of S23 in the second step of the embodiment;
FIG. 5 is a diagram illustrating a state of S24 in the second step of the embodiment;
FIG. 6 is a diagram illustrating a state of S31 in the third step of the embodiment;
FIG. 7 is a diagram showing a state of S32 in the three steps of the embodiment;
FIG. 8 is a diagram illustrating a state of S33 in the third step of the embodiment;
FIG. 9 is a diagram illustrating a state of S34 in the third step of the embodiment;
FIG. 10 is a partially enlarged view illustrating an etching process of the edge of the substrate according to the third embodiment.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example one
The present embodiment provides a method for manufacturing a light emitting device, as shown in fig. 1, including the following steps:
and S11, arranging a plurality of light-emitting elements on the substrate, and covering the upper surface and four side surfaces of each light-emitting element with a light-transmitting layer and/or a light-converting layer.
And S12, obtaining the lens by mould pressing and packaging the outer surface of the light transmission layer and/or the light conversion layer by using a mould, obtaining square colloids by mould pressing and packaging the edges of the substrate, and forming grooves between the adjacent square colloids.
And S13, increasing the refractive index difference of the bottom surface of the groove or the upper surface of the rectangular colloid.
And S14, identifying the grooves by a cutting machine, cutting the grooves, and dividing the light-emitting elements into independent light-emitting devices.
In the above embodiment, the arranging the plurality of light emitting elements on the substrate specifically includes:
the light-emitting elements are arranged on the substrate in an M multiplied by N unit array, wherein M is larger than or equal to 2, N is larger than or equal to 2, each unit comprises at least one light-emitting element, and preferably, the value of M is 2-60, and the value of N is 2-60.
In the above embodiments, the light transmitting layer includes at least one colloid, the light converting layer includes a colloid and at least one phosphor, the colloid may be a colloid commonly used in the existing packaging process of the light emitting diode, such as silica gel, resin, etc., preferably, the colloid is silica gel, and the phosphor includes any one or more combinations of the phosphor, quantum dot, phosphor sheet, etc. that have been disclosed, such as: nitrogen oxide fluorescent powder, YAG series fluorescent powder, nitride fluorescent powder, aluminosilicate fluorescent powder and the like.
In the above embodiment, the mold includes: the upper die is provided with arc-shaped grooves which correspond to the arrangement mode and the center position of the light-emitting elements one by one, square grooves are arranged at the edges of the arc-shaped grooves in an array mode, and the center points of the arc-shaped grooves and the center points of the square grooves which are located on the same straight line.
In the above embodiment, the step of molding and encapsulating the outer surface of the light transmitting layer and/or the light conversion layer to obtain the lens specifically includes: and after the upper die and the lower die are used for mould pressing and packaging, obtaining the arc-shaped lens at the position on the substrate corresponding to the arc-shaped groove of the upper die.
In the above embodiment, the molding and packaging at the edge of the substrate to obtain the square colloid specifically includes: and after the square colloid is molded and packaged by using an upper die and a lower die, obtaining the square colloid at the position on the substrate corresponding to the square groove of the upper die.
In the above embodiment, the horizontal distance a between two adjacent square colloids is less than or equal to the horizontal distance b between two adjacent lenses so as not to damage the lenses, and a: b is 0.2 to 1.0, and more preferably a: b is 0.6 to 0.8.
In the above embodiment, the step of increasing the difference in refractive index between the bottom surface of the trench and the upper surface of the prism is specifically: the edge of the substrate is etched, the etching reaction is carried out on the bottom surface of the groove, the metal layer on the upper layer of the substrate except the covering surface of the square colloid is corroded, the non-metal layer on the lower layer is exposed, the light refractive index between the bottom surface of the groove and the upper surface of the square colloid is increased through etching, and the groove is used as a positioning groove of a subsequent cutting process and is easier to identify.
In the above embodiment, the processing of increasing the difference in refractive index between the bottom surface of the trench and the upper surface of the prism may be further performed by: the edge of the substrate is coated with ink, the ink is coated on the upper surface of the square colloid, the bottom surfaces of the grooves among the square colloids are not coated with ink, the light refractive index between the bottom surfaces of the grooves and the upper surface of the square colloid is increased through the ink coating, and the grooves are used as positioning grooves of a subsequent cutting process and are easier to identify.
Example two
The embodiment provides a manufacturing method of a light-emitting device, which comprises the following steps:
s21, as shown in fig. 2, 24 light emitting elements 101 are arranged on a substrate 102 at 4 × 6, and a light transmitting layer and/or a light converting layer is covered on the upper surface and four side surfaces of each light emitting element 101, and the main material of the light transmitting layer is silica gel.
S22, as shown in fig. 3, using a mold, molding and encapsulating the outer surface of the light transmitting layer and/or the light converting layer to obtain a lens 103, and molding and encapsulating the outer surface of the substrate 102 to obtain a square colloid 104, wherein a groove 105 is formed between adjacent square colloids 104.
S23, as shown in fig. 4, the upper surface of the square colloid is processed by increasing the difference of the refractive indexes of the light, and the edge of the substrate 102 is coated with ink, because the square colloid 104 blocks the ink, the ink is coated on the upper surface of the square colloid 104, and the bottom of the trench 105 between the square colloids 104 is not coated with ink, so that the difference of the refractive indexes of the light between the upper surface of the square colloid 104 and the bottom of the trench 105 is large, and the trench 105 can be used as a positioning groove for the subsequent cutting process.
S24, as shown in fig. 5, the positioning groove 105 is identified by a cutting machine, and the light emitting element 101 is divided into independent light emitting devices, wherein the number of times each substrate 102 needs to be cut is 5 × 7.
EXAMPLE III
The embodiment provides another method for manufacturing a light-emitting device, which comprises the following steps:
s31: as shown in fig. 6, 40 light emitting elements 201 are arranged on a metal substrate 202 in a 5 × 8 array, and a light transmitting layer is covered on the upper surface and four side surfaces of the light emitting elements 201, wherein the main material of the light transmitting layer is silica gel.
S32: as shown in fig. 7, a circular arc-shaped lens 203 is molded and encapsulated on the outer surface of the light-transmitting layer and a square colloid is molded and encapsulated on the edge of the metal substrate 202 at the same time by using a mold, and grooves 205 with equal intervals are formed between adjacent square colloids 204.
S33, as shown in fig. 8 and 10, the bottom surface of the trench is processed by increasing the difference in the refractive index of light by etching, and the edge of the metal substrate 202 is etched, the etching process is as shown in fig. 10, because of the protection of the square colloid 204, the etching reaction occurs at the bottom 206 of the trench 205 between the adjacent square colloids 204, the metal layer 207 on the upper layer of the metal substrate 202 except the covering surface of the square colloid 204 is corroded, the non-metal layer 208 on the lower layer is exposed, the difference in the refractive index of light between the upper surface of the square colloid 204 and the bottom 206 of the trench 205 is increased, and the trench 205 can be used as a positioning groove for the subsequent dicing process.
S34: as shown in fig. 9, the light emitting elements 201 are divided into individual light emitting devices by cutting using the dicing machine recognition positioning groove 205, wherein the number of times each metal substrate 202 needs to be cut is 6 × 9.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (8)
1. A method for manufacturing a light-emitting device is characterized by comprising the following steps:
arranging a plurality of light-emitting elements on a substrate, and covering the upper surface and four side surfaces of each light-emitting element with a light-transmitting layer and/or a light-converting layer;
using a mould to mold and package the outer surface of the light transmission layer and/or the light conversion layer to obtain a lens, and simultaneously mold and package the edge of the substrate to obtain square colloids, wherein a groove is arranged between every two adjacent square colloids; the mold comprises: the upper die is provided with arc-shaped grooves which correspond to the arrangement mode and the center position of the light-emitting elements one by one, square grooves are arranged at the edges of the arc-shaped grooves in an array mode, and the center points of the arc-shaped grooves and the square grooves which are positioned on the same straight line;
increasing a difference in refractive index of light between an upper surface of the square colloid and a bottom surface of the trench;
and identifying the groove by using a cutting machine, cutting, and dividing the light-emitting element into independent light-emitting devices.
2. The method of claim 1, wherein arranging a plurality of light emitting elements on the substrate is embodied as:
the light-emitting elements are arranged on the substrate in an M × N unit array, wherein M is larger than or equal to 2, N is larger than or equal to 2, and each unit comprises at least one light-emitting element.
3. The method of claim 1, wherein the light-transmitting layer comprises at least one colloid and the light-converting layer comprises at least one phosphor and a colloid.
4. The manufacturing method of claim 1, wherein the step of molding and encapsulating the outer surface of the light transmitting layer and/or the light conversion layer to obtain the lens comprises:
and after the upper die and the lower die are used for die pressing and packaging, obtaining the arc-shaped lens at the position on the substrate corresponding to the arc-shaped groove of the upper die.
5. The manufacturing method according to claim 1, wherein the molding and packaging at the edge of the substrate to obtain the square colloid is specifically:
and after the upper die and the lower die are used for die pressing and packaging, obtaining the square colloid on the substrate at the position corresponding to the square groove of the upper die.
6. The method according to claim 1, wherein a horizontal distance between two adjacent square colloids is smaller than or equal to a horizontal distance between two adjacent lenses.
7. The method according to claim 1, wherein increasing the difference in refractive index between the top surface of the square colloid and the bottom surface of the trench is specifically:
etching the edge of the substrate, wherein an etching reaction occurs on the bottom surface of the groove, and corroding the metal layer on the upper layer of the substrate except the covering surface of the square colloid to expose the non-metal layer on the lower layer.
8. The method according to claim 1, wherein increasing the difference in refractive index between the top surface of the square colloid and the bottom surface of the trench is specifically: and carrying out ink coating on the edge of the substrate, wherein the ink coating is carried out on the upper surfaces of the square colloids, and the bottom surfaces of the grooves between the square colloids are not coated with ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911423320.7A CN111081848B (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing light-emitting device |
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| CN201911423320.7A CN111081848B (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing light-emitting device |
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| CN111081848B true CN111081848B (en) | 2021-02-05 |
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| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| CN101870151A (en) * | 2009-04-27 | 2010-10-27 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method of optical element and impressing mould |
| CN202503030U (en) * | 2012-01-18 | 2012-10-24 | 广东德豪润达电气股份有限公司 | LED packaging structure |
| US20140009060A1 (en) * | 2012-06-29 | 2014-01-09 | Nitto Denko Corporation | Phosphor layer-covered led, producing method thereof, and led device |
| CN106157802A (en) * | 2016-06-28 | 2016-11-23 | 广州市金万正印刷材料有限公司 | There is the label material of network structure, in-mold labels and preparation method thereof and packing container |
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