KR101537795B1 - Method for fabricating light emitting diode packang and light emitting diode package - Google Patents

Method for fabricating light emitting diode packang and light emitting diode package Download PDF

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Publication number
KR101537795B1
KR101537795B1 KR1020090027310A KR20090027310A KR101537795B1 KR 101537795 B1 KR101537795 B1 KR 101537795B1 KR 1020090027310 A KR1020090027310 A KR 1020090027310A KR 20090027310 A KR20090027310 A KR 20090027310A KR 101537795 B1 KR101537795 B1 KR 101537795B1
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KR
South Korea
Prior art keywords
dicing
substrate
molding
led
mark
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KR1020090027310A
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Korean (ko)
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KR20100108969A (en
Inventor
김방현
박병규
김오석
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서울반도체 주식회사
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Priority to KR1020090027310A priority Critical patent/KR101537795B1/en
Publication of KR20100108969A publication Critical patent/KR20100108969A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an LED package by using a dicing alignment mark of a substrate and a dicing mark of a molding portion formed on the substrate so as to immediately determine whether the molding portion has been formed at an accurate position with respect to the substrate. do.

To this end, a method of manufacturing an LED package according to the present invention includes: preparing a substrate provided with a dicing alignment mark; Molding a molding part having a dicing mark on the substrate; And dicing the substrate in a package unit so that the dicing alignment mark and the dicing mark are aligned with each other.

Dicing, mark, housing, substrate, tolerance, groove, defect, discrimination, contact, exposure, molding

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting diode

The present invention relates to a method of manufacturing an LED package and an LED package thereof, and more particularly, to a method of manufacturing an LED package, and more particularly, To an LED package manufacturing method and an LED package that can easily determine whether a substrate with a molding part is defective before mounting an LED chip.

In general, a light emitting diode (LED) is a device in which electrons and holes meet at a PN junction by applying a current, and the LED emits light with a low voltage and a low current It has many advantages over existing light sources such as continuous light emission and low power consumption.

In particular, LEDs are widely used for various display devices, backlight sources, etc. Recently, a technique has been developed for emitting white light by using three LED chips emitting red light, green light and blue light, respectively, or by converting wavelength using phosphors And the application range is expanded by the illumination device.

The above-described LED is usually fabricated in a package structure. In the LED package manufacturing process, for example, a substrate on which a wiring pattern including a plurality of lead frame patterns is formed is prepared. This substrate is provided with a dicing alignment mark for the dicing process. Next, one or more molding portions are formed on the substrate by, for example, an injection molding process. This molding part is cut together with the substrate by a dicing process to become a housing of various LED packages. The molding portion has a plurality of cavities, each of which exposes a lead frame or an electrode pattern of each LED package that is divided after dicing. An LED chip is mounted on the cavity, and the LED chip and the lead frame or the electrode pattern are electrically connected by wiring. Usually, the LED chip mounting and wiring process is performed before the dicing process. By the dicing process, the substrate and the moldings thereon are cut together to produce several individual LED packages.

Conventionally, since only the dicing alignment mark on the substrate is used as a reference for dicing, accurate dicing can not be achieved. That is, although the originally intended dicing line matches the above dicing alignment mark, there may be an error in the molding part. This error leads to defects in the finally fabricated LED package, which results in a decrease in production yield. Also, it was impossible to discriminate whether the molding part was formed at the correct position with respect to the substrate before the dicing step by using only the dicing alignment mark. If it is possible to determine in advance whether the position of the molding part is defective with respect to the substrate, the cause of the defect can be corrected in advance, and the time and economic waste caused when the continuous process is performed using the defective material can be reduced.

An object of the present invention is to provide an LED package manufacturing method which can easily determine whether a molding part is formed at an accurate position with respect to a substrate before a LED chip is mounted by a dicing alignment mark formed on the substrate and a dicing mark formed on the molding part. .

According to another aspect of the present invention, there is provided an LED package, wherein the polarity of the LED package can be easily determined according to a shape of a groove formed at an edge of the housing, the shape being indicative of a direction of a cathode or an anode.

According to an aspect of the present invention, there is provided a method of manufacturing an LED package capable of identifying a defect, the method comprising: preparing a substrate having a dicing alignment mark; Molding a molding part having a dicing mark on the substrate; And dicing the substrate in a package unit so that the dicing alignment mark and the dicing mark are aligned with each other.

In the present embodiment, the LED package manufacturing method includes: mounting the LED chip on the substrate before the dicing step; Connecting the bonding wires so that the mounted LED chips are electrically connected; And forming an encapsulant to cover the LED chip and the bonding wire. The step of molding the molding part may be formed by filling the groove formed in the lead frame of the substrate with an injection material and having a partial contact surface with the groove.

According to another aspect of the present invention, there is provided an LED package comprising: a substrate; and an LED package manufactured by dividing a molding part formed on the substrate into a plurality of LED packages by a dicing process, the LED packages being separated from the substrate by the dicing process; And a housing separated by the molding part by the dicing step, wherein the housing is provided with a groove used as a dicing mark in the edge by the dicing step.

In this embodiment, if the groove indicates the direction of the cathode or the anode, the lead frames are provided with chip alignment grooves for determining the mounting positions of the LED chips. The chip alignment groove includes a contact surface partially in contact with the housing and an exposed surface exposed to the outside. Further, the chip alignment groove is filled with an injection material during injection molding of the molding part.

According to the embodiment of the present invention, it is possible to easily determine whether or not the molding portion is formed at the correct position with respect to the substrate, depending on whether or not the dicing alignment marks of the substrate match the dicing marks of the injection- . Accordingly, it is possible to determine whether the molding portion is defective in position with respect to the substrate before mounting the LED chip, and it is possible to reduce the time and economic waste caused when the next process is performed using the defective material.

In addition, according to the embodiment of the present invention, since the chip alignment groove defining the mounting position of the LED chip is filled with the molding material at the time of molding, there is an effect that the bonding difference between the substrate and the molding part can be immediately discriminated.

According to the embodiment of the present invention, the grooves formed at the corners of one side of the housing indicate the direction of the cathode or the anode, so that the polarity can be easily discriminated.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

FIG. 1 is a view showing a substrate to which the present invention is applied, FIG. 2 is a view showing a state where the molding part is formed on the substrate shown in FIG. 1, and FIG. 3 is a cross- FIG. 4 is a perspective view showing the lead frames shown in FIG. 3. FIG.

A method of manufacturing an LED package according to the present invention will now be described. First, a substrate 2 as shown in FIG. 1 is prepared. The substrate 2 has lead frames or electrode patterns. The substrate 2 has a longitudinal pattern 2a and a lateral pattern 2b formed therebetween so as to be divided into a single LED package unit, for example, with lead frames 22 and 23 interposed therebetween, The spacing patterns 2c are formed so that the spacers 22 and 33 are spaced apart from each other. A plurality of longitudinal patterns 2a, lateral patterns 2b, and spacing patterns 2c are formed on the substrate 2 to manufacture a plurality of LED packages. In order to reduce the tolerance of the substrate 2 at the time of dicing, a dicing alignment mark 2d is formed by etching, for example, in the outer portion of the substrate 2. The dicing alignment mark 2d is well shown in FIG.

Next, the molding part 21 is formed on the substrate 2 by, for example, an injection molding process. The molding part 21 is formed by injecting an injection material into a mold having a shape as shown in FIG. 2. The molding part 21 is cut along with the substrate 2 by a dicing process, And becomes the housing of the LED package. The molding part 21 has a plurality of cavities, each of which exposes the lead frames 22 and 23 of each LED package to be divided after dicing. The transverse pattern 2b and the spacing pattern 2c described above are filled with an injection material used for molding the molding part 21 and the upper surface and the bottom surface of the spacing pattern 2c filled with the injection material are filled with the lead frames 22 23, respectively. The lead frames 22 and 23 are supported by the injection molding part 21. Particularly, the molding part 21 is formed with a dicing mark 211, and the dicing mark 211 is formed on the molding part 21, depending on whether it is aligned with the dicing alignment mark 2d of the substrate 2, It is possible to visually confirm whether or not the substrate 21 has been formed at the correct position with respect to the substrate 2. In addition, it is possible to determine whether the molding unit 21 is defective in position with respect to the substrate 2 before mounting the LED chip, and it is possible to reduce the time and economic wastage caused in the next process.

Next, the first and second LED chips 24a and 24b are mounted on the bottom surface of the cavity provided in the molding part 21. Next, 3, the first LED chip 24a is mounted on the first lead frame 22 and the second LED chip 24b is mounted on the second lead frame 23 However, the present invention is not limited to this, and it is also conceivable to mount one LED chip or more LED chips on any one of the first and second lead frames 22 and 23 .

Chip alignment grooves for defining the mounting positions of the LED chips are formed in the first and second lead frames 22 and 23, respectively. That is, the first lead frame 22 is provided with a first chip alignment groove 221 for determining the position where the first LED chip 24a is to be mounted, and the second lead frame 23 is provided with a second LED chip 24b are to be mounted. The first and second chip alignment grooves 221 and 231 are respectively formed at positions in contact with the molding part 21 injection molded on the substrate 2. That is, the first and second chip alignment grooves 221 and 231 are respectively formed with a contact surface that is in contact with the molding portion 21 and an exposed surface that is exposed to the outside. Accordingly, if the engaging dimensions of the molding part 21 and the first and second lead frames 22 and 23 are different, there is a chip alignment groove in which the molding material 21 is not filled with the injection molding material, It is possible to visually confirm whether or not the substrate 21 is formed in a defective position with respect to the substrate 2. Further, by adjusting the lengths of the first and second chip alignment grooves 221 and 231, it is possible to directly detect the connection failure between the substrate 2 and the molding part 21 when the molding part 21 is molded .

4, the first chip alignment groove 221 is formed at the center of the three edges of the first lead frame 22 except for the edge facing the second lead frame 23, The first LED chip 24a is mounted so as to be spaced apart from the alignment groove 221 by a predetermined distance. The second chip alignment groove 231 is formed at the center of the three edges of the second lead frame 23 except for the edge facing the first lead frame 22 and the second chip alignment groove 231 The second LED chip 24b is mounted so as to be spaced apart by a predetermined distance from the reference.

Next, the first and second LED chips 24a and 24b mounted on the first and second lead frames 22 and 23 are connected to the first to fourth bonding wires W1, W2, W3 and W4, respectively. . The first and second LED chips 24a and 24b are connected to the first lead frame 22 and the second lead frame 23 by the first to fourth bonding wires W1, W2, W3 and W4, The first and second LED chips 24a and 24b may be electrically connected to the first and second lead frames 22 and 23 by a single bonding wire . However, when one bonding wire is used, the submounts having different polarities from the bottom surfaces of the first and second LED chips 24a and 24b should be provided.

Next, an encapsulant 25 is formed in the cavity to cover the first and second LED chips 24a and 24b and the first to fourth bonding wires W1, W2, W3 and W4. The encapsulant 25 may include at least one phosphor.

Further, an optical member (not shown) may be further provided on the sealing material 25, and the optical member may be a fresnel lens.

Next, the substrate 2 is diced in a package unit by a dicing process so that the dicing alignment marks 2d of the substrate 2 and the dicing marks 211 of the molding unit 21 are aligned, LED packages are manufactured, and the manufactured LED packages are as shown in Fig.

5, the LED package according to the present invention includes lead frames 22, 23 separated from the substrate 2 by a dicing process, and a lead frame 22, 23 separated from the molding part 21 by a dicing process. (21a).

The housing 21a is provided with grooves 211a and 211b used as dicing marks 211 in a dicing step at one edge. Further, the grooves 211a and 211b may be a mark or a shape indicating the direction of the cathode or the anode. Thus, the position of the polarity can be easily grasped.

The housing 21a has a cavity, and the cavity exposes the lead frames 22 and 23. The housing 21a supports the lead frames 22 and 23 and the housing 21a is provided with chip alignment grooves 221 and 22 formed in the lead frames 22 and 23 by, 231, and an exposed surface exposed to the outside without being in contact with the housing 21a. The chip alignment grooves 221 and 231 are filled with the injection material when the housing 21a is molded. This makes it possible to easily discriminate whether the housing 21a is formed at the correct position on the substrate 2 in the single LED package or the first and second LED chips 24a and 24b on the lead frames 22 and 23. [ , And 24b are mounted at the correct positions, respectively.

The first and second LED chips 24a and 24b mounted at a predetermined distance from the first and second chip alignment grooves 221 and 231 formed in the housing 21a are connected to the lead frames 22 and 23, And are connected by wires W1, W2, W3 and W4. The first LED chip 24a mounted on the first lead frame 22 is electrically connected to the first lead frame 22 by the first bonding wire W1 and the second bonding wire W2 is electrically connected to the first lead frame 22 by the first bonding wire W1, The second lead frame 23 is electrically connected to the second lead frame 23 via the second lead frame 23. The second LED chip 24b mounted on the second lead frame 23 is electrically connected to the first lead frame 22 by a third bonding wire w3 and electrically connected to the fourth bonding wire W4, The first lead frame 23 and the second lead frame 23 are electrically connected to each other.

An encapsulant 25 is formed to cover the first and second LED chips 24a and 24b and the first to fourth bonding wires W1, W2, W3 and W4. Further, an optical member may be further provided on the sealing material 25. The optical member may be formed with a Fresnel pattern and the bottom surface of the optical member is a light incidence surface spaced apart from the encapsulation material 25. The top surface of the optical member may be a flat light exit surface, It is also possible to use a lens having convex portions that narrow the directivity angle of the light emitted from the chips 24a and 24b to enable local illumination in a desired direction.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a substrate to which the present invention is applied.

2 is a view showing a state in which a molding part is formed on the substrate shown in Fig. 1; Fig.

Fig. 3 is a diagram showing a state in which an LED chip is mounted on the substrate shown in Fig. 2; Fig.

Fig. 4 is a perspective view showing the lead frames shown in Fig. 3; Fig.

Fig. 5 is a perspective view of an LED package manufactured by dicing the molding part with the substrate shown in Fig. 3; Fig.

Description of the Related Art

2: substrate 2d: dicing alignment mark

21: molding part 211: dicing mark

22, 23: lead frames 221, 231: first and second chip alignment grooves

24a, 24b: first and second LED chips 25: sealing material

Claims (8)

Preparing a substrate provided with a dicing alignment mark; Molding a molding part having a dicing mark on the substrate; And And dicing the substrate in a package unit so that the dicing alignment mark and the dicing mark are aligned with each other, The step of molding the molding part into the substrate Wherein the chip alignment groove formed in the lead frame of the substrate is filled with an injection material and is formed to have a partial contact surface with the chip alignment groove. The method according to claim 1, Before the dicing step, Mounting an LED chip on the substrate; Connecting the bonding wires so that the mounted LED chips are electrically connected; And And forming an encapsulant to cover the LED chip and the bonding wire. delete An LED package manufactured by dividing a substrate and a molding part formed on the substrate by a dicing process, Leadframes separated from the substrate by the dicing process; And And a housing separated by the molding part by the dicing step, Wherein the housing is provided with a groove used as a dicing mark in an edge thereof by the dicing step. The method of claim 4, Wherein the groove represents a direction of the cathode or the anode. The method of claim 4, Wherein the lead frames are provided with chip alignment grooves for determining mounting positions of the LED chips. The method of claim 6, Wherein the chip alignment groove comprises a contact surface partially in contact with the housing and an exposed surface exposed to the outside. The method of claim 7, Wherein the chip alignment groove is filled with an injection material during injection molding of the molding part.
KR1020090027310A 2009-03-31 2009-03-31 Method for fabricating light emitting diode packang and light emitting diode package KR101537795B1 (en)

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KR101537795B1 true KR101537795B1 (en) 2015-07-22

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201128812A (en) 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
AT513747B1 (en) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Assembly process for circuit carriers and circuit carriers
AT514599B1 (en) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Method for equipping electronic circuit boards with optical components
US10634325B2 (en) 2014-08-04 2020-04-28 Fuji Corporation Mounting device
JP6838528B2 (en) * 2017-08-31 2021-03-03 日亜化学工業株式会社 Substrate manufacturing method and light emitting device manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311916A (en) * 2003-02-21 2004-11-04 Kyocera Corp Package for light emitting element and light emitting device
JP2005175280A (en) * 2003-12-12 2005-06-30 Citizen Electronics Co Ltd Method for manufacturing package for electronic component
KR100643318B1 (en) * 2005-05-26 2006-11-10 럭스피아 주식회사 Very small light emitting diode package and manufacturing methods of it
JP2008235580A (en) * 2007-03-20 2008-10-02 Nichia Corp Manufacturing method of semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311916A (en) * 2003-02-21 2004-11-04 Kyocera Corp Package for light emitting element and light emitting device
JP2005175280A (en) * 2003-12-12 2005-06-30 Citizen Electronics Co Ltd Method for manufacturing package for electronic component
KR100643318B1 (en) * 2005-05-26 2006-11-10 럭스피아 주식회사 Very small light emitting diode package and manufacturing methods of it
JP2008235580A (en) * 2007-03-20 2008-10-02 Nichia Corp Manufacturing method of semiconductor device

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