CN111065211A - 3D printing manufacturing method of microstrip filter - Google Patents
3D printing manufacturing method of microstrip filter Download PDFInfo
- Publication number
- CN111065211A CN111065211A CN201911343527.3A CN201911343527A CN111065211A CN 111065211 A CN111065211 A CN 111065211A CN 201911343527 A CN201911343527 A CN 201911343527A CN 111065211 A CN111065211 A CN 111065211A
- Authority
- CN
- China
- Prior art keywords
- printing
- temperature
- fired ceramic
- low
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000010146 3D printing Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000919 ceramic Substances 0.000 claims abstract description 59
- 238000007639 printing Methods 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000005245 sintering Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Producing Shaped Articles From Materials (AREA)
Abstract
The invention discloses a 3D printing manufacturing method of a microstrip filter, which comprises the following steps: s1: designing a substrate printing graph and a metal line printing graph according to the circuit graph of the microstrip filter; s2: printing a pattern according to the substrate by using a 3D printer, extruding the low-temperature co-fired ceramic slurry as a printing material from a nozzle and depositing the printing material on a workbench to form a low-temperature co-fired ceramic substrate; s3: curing the low-temperature co-fired ceramic substrate on the workbench in an infrared heating mode; s4: printing a pattern according to the metal circuit by using a 3D printer, and spray-printing nano silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form the metal circuit; s5: and sintering the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit by using a vacuum sintering furnace. The method is simple and easy to master, can reduce the production cost and provides a solution for the rapid manufacture and individuation creation of the microstrip filter.
Description
Technical Field
The invention relates to the field of additive manufacturing, in particular to a 3D printing manufacturing method of a microstrip filter.
Background
The parallel coupling microstrip filter is widely applied to microwave circuits due to the simple structure. However, the traditional microstrip filter is manufactured by adopting a printed circuit process, and the printed circuit process is complex and long in period, so that the microstrip filter is not suitable for application of rapid principle verification.
In recent years, with the rapid development of 3D printing technology, it is possible to apply the 3D printing technology to the field of electronic device manufacturing. Compared with the traditional process, the 3D printing technology can simplify the process, reduce the production cost, optimize the structure and the performance and realize the personalized creation of the microstrip filter.
Therefore, the present invention provides a 3D printing method for manufacturing a microstrip filter to solve the above technical problems.
Disclosure of Invention
Technical problem to be solved
The invention aims to solve the technical problems of complex process, long period and high production cost in the prior art.
(II) technical scheme
The invention provides a 3D printing manufacturing method of a microstrip filter, which comprises the following steps:
s1: designing a substrate printing graph and a metal line printing graph according to the circuit graph of the microstrip filter;
s2: printing a pattern according to the substrate by using a 3D printer, extruding the low-temperature co-fired ceramic slurry as a printing material from a nozzle and depositing the printing material on a workbench to form a low-temperature co-fired ceramic substrate;
s3: curing the low-temperature co-fired ceramic substrate on the workbench in an infrared heating mode;
s4: printing a pattern according to the metal circuit by using a 3D printer, and spray-printing nano silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form the metal circuit;
s5: and sintering the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit by using a vacuum sintering furnace.
Further, in step S1, the substrate print pattern and the metal wiring print pattern are designed in consideration of sintering shrinkage of the low-temperature co-fired ceramic substrate to scale the print pattern size.
Further, in steps S2 and S4, the 3D printer used is a multi-material inkjet type 3D printer.
Further, the multi-material inkjet type 3D printer is equipped with 2 or more high-viscosity piezoelectric inkjet heads.
Further, in step S5, the low-temperature co-fired ceramic substrate on which the metal wiring has been sprayed is left to stand at normal temperature for 24 hours before sintering.
Further, after standing at normal temperature, sintering according to five processes:
stage I: the temperature is increased from normal temperature to 450 ℃ within 800 min;
stage II: maintaining at 450 deg.C for 200 min;
stage III: the temperature rises from 450 ℃ to 850 ℃ within 400 min;
stage IV: maintaining at 850 deg.C for 400 min;
a V section: the temperature is reduced from 850 ℃ to the normal temperature within 1000 min.
Further, the thickness of the low-temperature co-fired ceramic substrate is 290 μm, and the dielectric constant is 9.0; the metal line thickness is 25 μm.
Further, according to the sintering shrinkage of the low-temperature co-fired ceramic substrate, the X direction of the printed pattern is enlarged by 10%, and the Y direction of the printed pattern is enlarged by 14%.
Further, in step S3, the low-temperature co-fired ceramic substrate on the stage was heat-cured for 2 hours using a 30W infrared heating lamp.
Furthermore, two high-viscosity piezoelectric ink-jet heads are adopted for the low-temperature co-fired ceramic slurry and the nano silver metal ink to pass through respectively.
(III) advantageous effects
The technical scheme of the invention has the following advantages:
in the 3D printing manufacturing method of the microstrip filter, a substrate printing graph and a metal line printing graph are designed according to a circuit graph of the microstrip filter; printing a pattern on the substrate by using a 3D printer, extruding the low-temperature co-fired ceramic slurry as a printing material from a nozzle and depositing the printing material on a workbench to form the low-temperature co-fired ceramic substrate, and simplifying the traditional process and more quickly finishing the formation of the low-temperature co-fired ceramic substrate by adopting a 3D printing technology; the infrared heating mode is used for curing the low-temperature co-fired ceramic substrate on the workbench, and can be used for promoting the solidification of the low-temperature co-fired ceramic substrate more quickly, so that the speed of the whole manufacturing process is accelerated; printing a pattern by using a 3D printer according to the metal circuit, and spray-printing nano silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form the metal circuit, wherein the micro-strip filter integrally adopts a 3D printing mode, so that the complex operation flow in the traditional process is simplified; the method comprises the steps of sintering the low-temperature co-fired ceramic substrate with the sprayed metal circuit by using a vacuum sintering furnace, spraying and printing the low-temperature co-fired ceramic substrate by using multi-material 3D printing equipment, and then spraying and printing the microstrip circuit on the low-temperature co-fired ceramic substrate, so that the parallel coupling microstrip filter can be rapidly manufactured, the process flow is simplified, the production cost is reduced, the structure and the performance are optimized, and the personalized creation of the microstrip filter is realized.
Drawings
Fig. 1 is a schematic step view of a 3D printing method for manufacturing a microstrip filter according to the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the 3D printing manufacturing method of the microstrip filter provided by the invention includes the following steps:
s1: designing a substrate printing graph and a metal line printing graph according to the circuit graph of the microstrip filter;
s2: printing a pattern according to the substrate by using a 3D printer, extruding the low-temperature co-fired ceramic slurry as a printing material from a nozzle and depositing the printing material on a workbench to form a low-temperature co-fired ceramic substrate;
s3: curing the low-temperature co-fired ceramic substrate on the workbench in an infrared heating mode;
s4: printing a pattern according to the metal circuit by using a 3D printer, and spray-printing nano silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form the metal circuit;
s5: and sintering the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit by using a vacuum sintering furnace.
In the embodiment, the overall structure of the microstrip filter is completed by adopting a 3D printing technology, the forming speed is faster than that of the traditional forming process, the operation method is simpler, the microstrip filter is not as complex as the traditional forming process, the production period is shortened, the production cost is reduced, and meanwhile, the problem that the traditional process cannot meet the requirement of personalized creation is solved. Wherein, the low-temperature co-fired ceramic slurry can also be condensed into LTCC ceramic slurry.
Specifically, in step S1, the sintering shrinkage of the low-temperature co-fired ceramic substrate is considered during designing the substrate printed pattern and the metal line printed pattern to scale the printed pattern size, so as to ensure that the quality of the finally formed microstrip filter meets the expected requirements.
Specifically, in steps S2 and S4, the 3D printer used is a multi-material inkjet 3D printer, and the multi-material inkjet 3D printer can provide more options for manufacturing multi-style microstrip filters.
Specifically, the multi-material inkjet 3D printer is equipped with more than 2 high-viscosity piezoelectric inkjet heads, and can prevent contamination between materials.
Specifically, in step S5, the low-temperature co-fired ceramic substrate on which the metal wiring has been sprayed is left to stand at normal temperature for 24 hours before sintering. The low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit is allowed to stand at normal temperature, so that the metal circuit can be stably fixed on the low-temperature co-fired ceramic substrate, and the influence on the quality of a final product caused by displacement in the sintering process is prevented.
Specifically, after standing at normal temperature, sintering is carried out according to five processes:
stage I: the temperature is increased from normal temperature to 450 ℃ within 800 min;
stage II: maintaining at 450 deg.C for 200 min;
stage III: the temperature rises from 450 ℃ to 850 ℃ within 400 min;
stage IV: maintaining at 850 deg.C for 400 min;
a V section: the temperature is reduced from 850 ℃ to the normal temperature within 1000 min.
And sintering the substrate by five stages of processes to finally form the microstrip filter on the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit.
Specifically, the thickness of the low-temperature co-fired ceramic substrate is 290 μm, and the dielectric constant is 9.0; the metal lines are 25 μm thick.
Specifically, according to the sintering shrinkage of the low-temperature co-fired ceramic substrate, the X direction of the printed graph is enlarged by 10%, the Y direction of the printed graph is enlarged by 14%, the size of the printed graph is zoomed, and the final product can meet the expected quality requirement.
Specifically, in step S3, the low-temperature co-fired ceramic substrate on the stage was heat-cured for 2h using a 30W infrared heating lamp.
Specifically, two high-viscosity piezoelectric ink-jet heads are adopted for respectively passing through low-temperature co-fired ceramic slurry and nano silver metal ink.
The following is a specific embodiment provided by the present invention, comprising the steps of:
a. and designing a substrate printing graph and a metal line printing graph according to the circuit graph of the microstrip filter. The microstrip filter is a 4-order parallel coupling band-pass filter, the thickness of the low-temperature co-fired ceramic substrate is 290 mu m, the dielectric constant is 9.0, and the thickness of the metal wire is 25 mu m. According to the shrinkage of the low-temperature co-fired ceramic, the X direction of a printed graph is enlarged by 10 percent, and the Y direction of the printed graph is enlarged by 14 percent;
b. printing a graph according to the substrate by using a multi-material ink-jet type 3D printer, extruding and depositing low-temperature co-fired ceramic slurry on a workbench from a heating type high-viscosity piezoelectric ink-jet head to form a low-temperature co-fired ceramic substrate;
c. heating and curing the low-temperature co-fired ceramic substrate layer on the workbench for 2h by using a 30W infrared heating lamp (arranged 30cm above a working platform of the 3D printer);
d. printing a graph by using a multi-material ink-jet type 3D printer according to the metal circuit, and carrying out jet printing on the nano silver metal ink on the surface of the low-temperature co-fired ceramic substrate from another high-viscosity piezoelectric ink-jet head to form the metal circuit;
e. and sintering the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit by using a vacuum sintering furnace. The sintering process comprises the following steps: standing at normal temperature for 24h before sintering, and sintering according to a 5-stage method, wherein the temperature in the first stage is increased from normal temperature to 450 ℃ within 800min, the temperature in the second stage is maintained at 450 ℃ for 200min, the temperature in the third stage is increased from 450 ℃ to 850 ℃ within 400min, the temperature in the fourth stage is maintained at 850 ℃ for 400min, and the temperature in the third stage is decreased from 850 ℃ to normal temperature within 1000 min.
In conclusion, compared with the traditional process, the 3D printing manufacturing method of the microstrip filter provided by the invention is faster, simplifies the process flow, can reduce the production cost and provides a solution for individuation creation.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A3D printing manufacturing method of a microstrip filter is characterized by comprising the following steps:
s1: designing a substrate printing graph and a metal line printing graph according to the circuit graph of the microstrip filter;
s2: printing a pattern according to the substrate by using a 3D printer, extruding the low-temperature co-fired ceramic slurry as a printing material from a nozzle and depositing the printing material on a workbench to form a low-temperature co-fired ceramic substrate;
s3: curing the low-temperature co-fired ceramic substrate on the workbench in an infrared heating mode;
s4: printing a pattern according to the metal circuit by using a 3D printer, and spray-printing nano silver metal ink serving as a printing material on the surface of the cured low-temperature co-fired ceramic substrate to form the metal circuit;
s5: and sintering the low-temperature co-fired ceramic substrate with the sprayed and printed metal circuit by using a vacuum sintering furnace.
2. The microstrip filter 3D printing fabrication method according to claim 1, wherein in step S1, the substrate print pattern and the metal line print pattern are designed taking into account sintering shrinkage of the low temperature co-fired ceramic substrate to scale print pattern size.
3. The microstrip filter 3D printing fabrication method of claim 1 wherein in steps S2 and S4, the 3D printer used is a multi-material inkjet 3D printer.
4. The microstrip filter 3D printing fabrication method according to claim 3 wherein the multi-material inkjet 3D printer is equipped with more than 2 high viscosity piezoelectric inkjet heads.
5. The microstrip filter 3D printing fabrication method according to claim 1, wherein in step S5, the low temperature co-fired ceramic substrate with the sprayed metal lines is left to stand at room temperature for 24 hours before sintering.
6. The microstrip filter 3D printing fabrication method of claim 5, wherein after standing at room temperature, sintering is performed according to five stages:
stage I: the temperature is increased from normal temperature to 450 ℃ within 800 min;
stage II: maintaining at 450 deg.C for 200 min;
stage III: the temperature rises from 450 ℃ to 850 ℃ within 400 min;
stage IV: maintaining at 850 deg.C for 400 min;
a V section: the temperature is reduced from 850 ℃ to the normal temperature within 1000 min.
7. The 3D printing method for manufacturing a microstrip filter according to claim 1, wherein the thickness of the low temperature co-fired ceramic substrate is 290 μm, the dielectric constant is 9.0; the metal line thickness is 25 μm.
8. The microstrip filter 3D printing fabrication method according to claim 2, wherein the printed pattern is enlarged by 10% in X-direction and 14% in Y-direction according to the sintering shrinkage of the low temperature co-fired ceramic substrate.
9. The microstrip filter 3D printing fabrication method according to claim 1, wherein in step S3, the low temperature co-fired ceramic substrate on the stage is heat cured for 2h using a 30W infrared heating lamp.
10. The microstrip filter 3D printing fabrication method according to claim 4, wherein two high viscosity piezoelectric inkjet heads are used for passing the low temperature co-fired ceramic paste and the nano silver metallic ink, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911343527.3A CN111065211A (en) | 2019-12-24 | 2019-12-24 | 3D printing manufacturing method of microstrip filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911343527.3A CN111065211A (en) | 2019-12-24 | 2019-12-24 | 3D printing manufacturing method of microstrip filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111065211A true CN111065211A (en) | 2020-04-24 |
Family
ID=70302710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911343527.3A Pending CN111065211A (en) | 2019-12-24 | 2019-12-24 | 3D printing manufacturing method of microstrip filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111065211A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113213950A (en) * | 2021-05-18 | 2021-08-06 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
| CN114230321A (en) * | 2021-12-08 | 2022-03-25 | 山东工业陶瓷研究设计院有限公司 | Preparation method of LTCC substrate |
| CN114980539A (en) * | 2022-05-30 | 2022-08-30 | 青岛理工大学 | Batch manufacturing method for manufacturing high-precision ceramic-based circuit based on composite micro-nano additive |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407296A (en) * | 2013-07-29 | 2013-11-27 | 南京鼎科纳米技术研究所有限公司 | Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting |
| CN106747476A (en) * | 2016-11-28 | 2017-05-31 | 贵州航天计量测试技术研究所 | A kind of many nozzle printing integrated manufacturing methods of LTCC wave filters |
| CN108811355A (en) * | 2018-06-03 | 2018-11-13 | 西安瑞特三维科技有限公司 | Based on 3D printing integration system for base material and the device and process of inner surface metal line |
| CN108834319A (en) * | 2018-07-30 | 2018-11-16 | 北京大学东莞光电研究院 | A kind of 3D printing method of ceramic substrate multilayer circuit |
-
2019
- 2019-12-24 CN CN201911343527.3A patent/CN111065211A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407296A (en) * | 2013-07-29 | 2013-11-27 | 南京鼎科纳米技术研究所有限公司 | Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting |
| CN106747476A (en) * | 2016-11-28 | 2017-05-31 | 贵州航天计量测试技术研究所 | A kind of many nozzle printing integrated manufacturing methods of LTCC wave filters |
| CN108811355A (en) * | 2018-06-03 | 2018-11-13 | 西安瑞特三维科技有限公司 | Based on 3D printing integration system for base material and the device and process of inner surface metal line |
| CN108834319A (en) * | 2018-07-30 | 2018-11-16 | 北京大学东莞光电研究院 | A kind of 3D printing method of ceramic substrate multilayer circuit |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113213950A (en) * | 2021-05-18 | 2021-08-06 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
| CN113213950B (en) * | 2021-05-18 | 2023-02-14 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of ceramic packaging base |
| CN114230321A (en) * | 2021-12-08 | 2022-03-25 | 山东工业陶瓷研究设计院有限公司 | Preparation method of LTCC substrate |
| CN114980539A (en) * | 2022-05-30 | 2022-08-30 | 青岛理工大学 | Batch manufacturing method for manufacturing high-precision ceramic-based circuit based on composite micro-nano additive |
| CN114980539B (en) * | 2022-05-30 | 2023-09-05 | 青岛理工大学 | High-precision ceramic-based circuit batch manufacturing method based on composite micro-nano additive manufacturing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111065211A (en) | 3D printing manufacturing method of microstrip filter | |
| CN106211622B (en) | A kind of compound 3D printing method of embedded circuit board | |
| CN103828038B (en) | Circuit board, electronic installation and electronic module | |
| CN106747476A (en) | A kind of many nozzle printing integrated manufacturing methods of LTCC wave filters | |
| JP2015216319A (en) | Method for manufacturing ceramic electronic part | |
| CN111511121A (en) | Three-dimensional conductive circuit and preparation method thereof | |
| CN115052428B (en) | Manufacturing method of metal upright post in high-precision multilayer circuit board | |
| JP5074577B2 (en) | Method for manufacturing a ceramic multilayer circuit assembly and corresponding multilayer circuit assembly | |
| JP2005057140A (en) | Multilayer wiring board and its manufacturing method | |
| JP4911004B2 (en) | Conductor pattern forming ink, conductor pattern and wiring board | |
| CN113213950B (en) | Preparation method of ceramic packaging base | |
| CN107302830A (en) | It is a kind of be used for can be with the 3D printer of printing speed pcb board | |
| JP2011129787A (en) | Conductor pattern forming ink, conductor pattern, wiring board | |
| JP2011146540A (en) | Method of forming conductor pattern, wiring board, and liquid droplet ejecting device | |
| CN101227796B (en) | Method for manufacturing conduction circuit | |
| JP2011146485A (en) | Method of forming conductor pattern, wiring board, and liquid droplet ejecting device | |
| TW202412571A (en) | A high-precision multi-layer circuit board and its 3D printing preparation method | |
| JP2009138163A (en) | Ink for forming conductor pattern, conductor pattern, and wiring substrate | |
| JP2004355862A (en) | Paste for conductor, ceramic wiring board, and its manufacturing method | |
| CN114945249B (en) | Multi-layer functional circuit structure based on electrowetting and electrofluidic jet printing method thereof | |
| JP2013135140A (en) | Green sheet, ceramic multilayer substrate and method for manufacturing ceramic multilayer substrate | |
| JP4570423B2 (en) | Manufacturing method of electronic parts | |
| JP4610113B2 (en) | Manufacturing method of ceramic multilayer substrate | |
| JP2011049417A (en) | Ceramic circuit substrate, and method of manufacturing the same | |
| JP5076868B2 (en) | Wiring board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200424 |