CN111010808A - Manufacturing method of PCB - Google Patents
Manufacturing method of PCB Download PDFInfo
- Publication number
- CN111010808A CN111010808A CN201911419009.5A CN201911419009A CN111010808A CN 111010808 A CN111010808 A CN 111010808A CN 201911419009 A CN201911419009 A CN 201911419009A CN 111010808 A CN111010808 A CN 111010808A
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- copper foil
- bonding sheet
- thickness
- double
- sided
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a PCB, and relates to the technical field of printed circuit boards. The manufacturing method comprises the following steps: milling the bonding sheet into a hollow bonding sheet frame; providing a plurality of substrates, sequentially overlapping the bonding sheet frame and the copper foil on one side or two sides of the substrate respectively, and laminating to obtain a single-side laminated plate and a double-side laminated plate; the thickness of the copper foil is changed by electroplating, etching or pasting a copper block on the surface of the copper foil; superposing the single-sided laminated board and the double-sided laminated board with the prepreg and the daughter board, and laminating to obtain a mother board; and milling off the part of the mother board corresponding to the bonding sheet frame. According to the invention, the laminated plate is obtained by laminating the copper foil, the bonding sheet frame and the substrate, a carrier is provided for the copper foil, the copper foil is kept flat, the copper foil is prevented from being damaged, and the outer copper foil of the manufactured PCB product is provided with a step part protruding towards the inner layer; secondly, a plurality of PCB plates can be superposed at one time, after lamination, the bonding sheet frame part is cut, the carrier is removed, and a plurality of PCB finished products can be obtained after one-time lamination.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a PCB.
Background
Along with the rapid development of the PCB industry, the product structure is gradually upgraded, diversification and complication are realized, the manufacturing difficulty is greatly improved, and the energy type thick copper PCB product is provided at present, the design of the energy type thick copper PCB product requires that the golden fingers and other parts are plated with thick copper towards the inner side of the PCB, and aims to realize the efficient transmission of current and simultaneously realize the smooth surface of the outer layer so as to meet the requirements of inserting and pulling of the golden fingers of finished products and welding of devices. The structure is special and novel, and is a trend of energy type PCB products towards small volume and large density development, but due to the particularity of the structure, the manufacturing process has great difficulty, the traditional process cannot realize the processing of the structure, and the upgrading and the improvement on the manufacturing method of the traditional process are needed.
Disclosure of Invention
The invention aims to provide a manufacturing method of a PCB (printed circuit board), which can be used for pressing a plurality of PCBs at one time and enables copper foils on the surface of the PCB to form local inward areas with different thicknesses.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of fabricating a PCB, comprising:
milling the bonding sheet into a hollow bonding sheet frame;
providing a plurality of substrates, sequentially overlapping the bonding sheet frame and the copper foil on one side or two sides of the substrate respectively, and laminating to obtain a single-side laminated plate and a double-side laminated plate;
the thickness of the copper foil is changed by electroplating, etching or pasting a copper block on the surface of the copper foil;
superposing the single-sided laminated plate and the double-sided laminated plate with a prepreg and a daughter board, and laminating to obtain a mother board;
and milling a part of the mother board corresponding to the bonding sheet frame.
Wherein the bond pad frame includes inwardly projecting ears corresponding to the tool holes.
Correspondingly, before the single-sided plate, the double-sided plate, the prepreg and the daughter board are superposed, the method further comprises the following steps:
and arranging the tool holes in the areas corresponding to the lug parts on the single-side laminating plate and the double-side laminating plate.
Further, before the single side or the double sides of the substrate are sequentially overlapped with the bonding sheet frame and the copper foil, the method further comprises the following steps:
and one or two surfaces of the bonding sheet frame are overlapped on the substrate, and a glue accommodating groove is milled along the inner frame of the bonding sheet frame.
Further, the bonding sheet frame and the copper foil are sequentially overlapped on one side or two sides of the substrate, and the method further comprises the following steps:
and laminating a glue blocking gasket in the hollow part of the bonding sheet frame.
Wherein, the thickness of copper foil is changed by electroplating, etching or pasting a copper block on the surface of the copper foil, comprising:
the surface of the copper foil is pasted with a protective film, the protective film is windowed corresponding to an area needing to change the thickness on the copper foil, and the thickness of the copper foil is changed through electroplating or etching;
or, a copper block is locally adhered to the surface of the copper foil to increase the thickness of the copper foil.
Wherein, the copper foil surface pastes the protecting film, the protecting film is corresponding to the regional windowing that needs to change thickness on the copper foil, includes:
the surface of the copper foil is pasted with an anti-plating film, and the windowing area of the anti-plating film corresponds to the area of the copper foil needing to change the thickness and has the same size;
correspondingly, the thickness of the copper foil is changed by electroplating or etching, specifically:
the thickness of the copper foil in the windowed area is increased by electroplating.
Wherein, the copper foil surface pastes the protecting film, the protecting film is corresponding to the regional windowing that needs to change thickness on the copper foil, includes:
the surface of the copper foil is pasted with a corrosion-resistant film, and the windowing area of the corrosion-resistant film corresponds to the area, needing to change the thickness, of the copper foil and has the same size;
correspondingly, the thickness of the copper foil is changed by electroplating or etching, specifically:
the thickness of the copper foil in the windowed area is reduced by etching.
The sizes of the outer frame of the bonding sheet frame, the substrate and the copper foil are the same.
Wherein, will single face adds the plywood, two-sided adds plywood and prepreg, daughter board coincide, include:
providing two single-sided laminated boards, wherein one sides of the two single-sided laminated boards with copper foils are arranged oppositely;
if one double-sided laminated board is included between the two single-sided laminated boards, a prepreg and a daughter board are stacked between the single-sided laminated board and the double-sided laminated board;
if at least two double-sided laminated boards are arranged between the two single-sided laminated boards, prepregs and daughter boards are stacked between the single-sided laminated boards and the double-sided laminated boards and between two adjacent double-sided laminated boards.
The invention has the beneficial effects that:
the laminated plate is obtained by laminating the copper foil, the bonding sheet frame and the substrate, a carrier is provided for the copper foil, a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged; moreover, the effect of different thicknesses of local areas can be obtained on the copper foil, and the method can be used for the subsequent product manufacturing process, so that the outer copper foil of the PCB product is provided with a step part protruding towards the inner layer; secondly, the laminated board of the single-sided copper foil and the double-sided copper foil is used for the laminated board of the PCB, a plurality of boards required by the PCB can be laminated at one time, the frame part of the bonding sheet is cut after lamination, the carrier is removed, a plurality of PCB finished products can be obtained through one-time lamination, and the copper foil can be prevented from wrinkling in the browning and laminating processes.
Drawings
FIG. 1 is a schematic view of a bonding sheet frame according to one embodiment of the present invention;
FIG. 2 is a flow chart of a method for fabricating a PCB according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating steps of a method for fabricating a PCB according to an embodiment of the invention;
FIG. 4 is a schematic view of another bonding sheet frame according to the second embodiment of the present invention;
FIG. 5 is a flowchart of a method for manufacturing a PCB according to a second embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating steps of a method for manufacturing a PCB according to a second embodiment of the present invention;
fig. 7 is a schematic diagram of a glue-accommodating groove on a substrate according to a second embodiment of the invention.
In the figure:
1-a bonding sheet frame; 11-an outer frame; 12-an inner frame; 13-ear;
2-a substrate;
31-copper foil; 32-copper blocks;
4-a protective film; 5-glue containing groove; 6-glue blocking gasket; 7-a prepreg; 8-daughter boards;
91-adding a laminate on one side; 92-double-sided laminating plate.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
Example one
The embodiment provides a method for manufacturing a PCB, which is suitable for manufacturing a PCB product with a surface copper layer partially protruding inwards and having a step, and a plurality of PCB products can be obtained through one-time pressing.
As shown in fig. 2, the manufacturing method includes the following steps:
and S11, milling the bonding sheet into a hollow bonding sheet frame.
As shown in fig. 1, the bonding sheet frame 1 is a rectangular frame, and an outer frame 11 thereof has the same size as the substrate used in the subsequent step and the copper foil to be processed. According to the size of the copper foil to be processed, the appropriate frame width is set, on one hand, the firm bonding between the substrate and the copper foil needs to be ensured, and on the other hand, the flowing glue during pressing needs to be reduced.
And S12, providing a plurality of substrates, sequentially overlapping the bonding sheet frame and the copper foil on one side or two sides of the substrate respectively, and laminating to obtain a single-side laminated plate and a double-side laminated plate.
Providing a plurality of substrates 2, as shown in fig. 3, sequentially overlapping the bonding sheet frame 1 and the copper foil 31 on one surface of a part of the substrates 2, and laminating to obtain a single-surface laminated plate 91; and sequentially overlapping the bonding sheet frame 1 and the copper foil 31 on both sides of the other part of the substrate 2, and laminating to obtain a double-sided laminated board 92.
The substrate 2 is a carrier of the copper foil 31, and is bonded to the copper foil 31 via the bonding sheet frame 1, and the other region of the copper foil 31 is not bonded to the substrate 2. The substrate 2 can be a high-temperature-resistant cured resin plate, a metal plate or a copper-clad plate.
And S13, changing the thickness of the copper foil by electroplating, etching or pasting a copper block on the surface of the copper foil.
In one embodiment, the surface of the copper foil is coated with a protective film, the protective film is windowed corresponding to the area of the copper foil needing to change the thickness, and the thickness of the copper foil is changed by electroplating or etching. The type of protective film 4 is selected for the process of plating or etching of the subsequent step.
Specifically, the surface of the copper foil 31 is pasted with a plating-resistant film, and the windowing area of the plating-resistant film corresponds to the area of the copper foil 31, where the thickness needs to be changed, and the windowing area and the area are the same in size. Further, the windowed area of the plating resist film corresponds to an area on the copper foil 31 where the thickness of the copper foil needs to be increased by electroplating. The thickness of the copper foil 31 is selected according to the minimum thickness of the copper layer on the PCB, and the copper foil in the windowed area is increased by electroplating to form a stepped bump on the copper foil 31. And (5) removing the plating resistant film.
In another embodiment, the copper foil is partially adhered with a copper block to increase the thickness of the copper foil. Specifically, the copper block 32 and the copper foil 31 are bonded by a conductive bonding material on the surface of the copper foil 31 of the single-sided laminated board 91 and the double-sided laminated board 92 respectively, aiming at the local area needing to increase the thickness of the copper foil, so as to form the stepped bump.
And S14, overlapping the single-sided laminated board and the double-sided laminated board with a prepreg and a daughter board, and pressing to obtain the mother board.
Before lamination, the surfaces of the copper foils 3 of the single-sided laminate board 91 and the double-sided laminate board 92 are browned.
Providing two single-sided laminated plates 91, wherein one sides of the two single-sided laminated plates 91 with the copper foils 31 are oppositely arranged; if one double-sided laminate 92 is included between the two single-sided laminates 91; then, laminating a prepreg 7 and a daughter board 8 between the single-sided laminated board 91 and the double-sided laminated board 92 according to product requirements; if at least two double-sided laminated boards 92 are arranged between the two single-sided laminated boards 91, respectively stacking a prepreg 7 and a daughter board 8 between the single-sided laminated board 91 and the double-sided laminated board 92 and between two adjacent double-sided laminated boards 92; and pressing to obtain the mother board.
The daughter board includes a single or multiple core boards.
And S15, milling the part of the motherboard corresponding to the bonding sheet frame.
In this embodiment, the milling cutter is moved along the inner frame 12 of the bonding sheet frame 1 to mill away a portion of the mother board corresponding to the bonding sheet frame 1. Since the copper foil 31 and the substrate 2 are not bonded to the portion other than the bonding sheet frame 1, the substrate 2 can be peeled off after the bonding sheet frame 1 is milled.
After the substrate 2 of the double-sided laminated board 92 is peeled off by taking the double-sided laminated board 92 as a partition, two PCB finished products can be obtained from the upper part and the lower part of each double-sided laminated board 92.
In the embodiment, the laminated plate is obtained by laminating the copper foil, the bonding sheet frame and the substrate, a carrier is provided for the copper foil, a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged, so that the effect of different thicknesses of local areas can be obtained on the copper foil, and the laminated plate is used for a subsequent product manufacturing process to enable the outer copper foil of a PCB product to have a step part protruding towards an inner layer; secondly, the laminated board of the single-sided copper foil and the double-sided copper foil is used for the laminated board of the PCB, a plurality of boards required by the PCB can be laminated at one time, the frame part of the bonding sheet is cut after lamination, the carrier is removed, a plurality of PCB finished products can be obtained through one-time lamination, and the copper foil can be prevented from wrinkling in the browning and laminating processes.
Example two
In this embodiment, an improvement is made on the basis of the above embodiment, and as shown in fig. 5, the improved manufacturing method includes the following steps:
s21, milling the bonding sheets into a hollow bonding sheet frame including inwardly projecting ears corresponding to the tool holes.
As shown in fig. 4, the bonding sheet frame 1 includes, in addition to the rectangular frame portion, one or more inwardly protruding ear portions 13, and the ear portions 13 are disposed corresponding to tool holes used when the copper foil 31 is pressed into the laminate. Before step S26, the tool holes are opened in the areas corresponding to the ears 13 on the single-sided laminated board 91 and the double-sided laminated board 92, so that the ears 13 of the cured bonding sheet frame 1 are located between the tool holes on the copper foil 31 and the substrate 2, and thus, the liquid medicine entering the gap between the substrate 2 and the copper foil 31 in the subsequent wet process (such as browning of the surface of the copper foil) can be prevented.
And S22, laminating one or two surfaces of the bonding sheet frame on the substrate, and milling a glue accommodating groove along the inner frame of the bonding sheet frame.
As shown in fig. 7, a glue receiving groove 5 smaller than the single side of the inner frame 12 is milled on the substrate 2 according to the size of the inner frame 12 of the bonding sheet frame 1, for receiving the melted resin of the bonding sheet frame 1 during the pressing, and preventing the resin from flowing into the hollow area, which causes excessive bonding of the copper foil 31 and the substrate 2.
And S23, providing a plurality of substrates, sequentially overlapping the bonding sheet frame and the copper foil on one side or two sides of the substrate respectively, and laminating to obtain a single-side laminated plate and a double-side laminated plate.
As shown in fig. 6, the adhesive-blocking pad 6 is laminated into the hollow portion of the bonding sheet frame 1, so as to effectively support the copper foil 31, and the size of the adhesive-blocking pad 6 is equal to or slightly smaller than the hollow portion of the bonding sheet frame 1.
And S24, attaching a corrosion-resistant film to the surface of the copper foil, wherein the windowing area of the corrosion-resistant film corresponds to the area, needing to change the thickness, of the copper foil, and the windowing area and the size of the corrosion-resistant film are the same.
The subsequent step requires etching, according to which the protective film 4 is selected as a resist film.
Specifically, the windowed area of the resist film corresponds to an area on the copper foil 3 where a reduced thickness is required.
S25, the thickness of the copper foil in the windowed region is reduced by etching.
The thickness of the copper foil 3 is selected according to the maximum thickness of the copper layer on the PCB, and the copper foil in the windowed area is reduced by etching to form a stepped convex groove on the copper foil 3.
The resist film is removed.
And S26, overlapping the single-sided laminated board and the double-sided laminated board with a prepreg and a daughter board, and pressing to obtain the mother board.
And S27, milling the part of the motherboard corresponding to the bonding sheet frame.
In the embodiment, the tool holes of the copper foil corresponding to the inward lugs are added to the bonding sheet frame on the first aspect, so that liquid medicine in a subsequent wet process is prevented from entering a gap between the substrate and the copper foil, and unnecessary thickness change of the copper foil is avoided; in the second aspect, a glue containing groove is formed in the substrate, so that the phenomenon that the laminating gummosis enters a region which is not bonded in the middle of the plate is avoided; in the third aspect, the glue blocking gasket is overlapped in the hollow part of the bonding sheet frame to fill the gap between the copper foil and the substrate, so that the copper foil is supported, the copper foil is prevented from being damaged, and the glue flowing is further blocked; in the fourth aspect, the copper foil thickness can be changed by selecting the way of etching to reduce copper according to specific production conditions. The above four aspects can be combined and used in the same embodiment according to production requirements, and one or more of the aspects can also be selected.
In other embodiments, the methods of the two embodiments can be combined, a copper foil with a central thickness is selected, the thickness of the copper foil is increased by electroplating in a local area, and the thickness of the copper foil is reduced by etching in the local area.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
milling the bonding sheet into a hollow bonding sheet frame;
providing a plurality of substrates, sequentially overlapping the bonding sheet frame and the copper foil on one side or two sides of the substrate respectively, and laminating to obtain a single-side laminated plate and a double-side laminated plate;
the thickness of the copper foil is changed by electroplating, etching or pasting a copper block on the surface of the copper foil;
superposing the single-sided laminated plate and the double-sided laminated plate with a prepreg and a daughter board, and laminating to obtain a mother board;
and milling a part of the mother board corresponding to the bonding sheet frame.
2. The method of manufacturing according to claim 1, wherein:
the bond pad frame includes inwardly projecting ears corresponding to the tool holes.
3. The method of claim 2, wherein before laminating the single-sided laminate sheet and the double-sided laminate sheet with the prepreg and the daughter board, the method further comprises:
and arranging the tool holes in the areas corresponding to the lug parts on the single-side laminating plate and the double-side laminating plate.
4. The method of claim 1, further comprising, before the laminating the bonding sheet frame and the copper foil on one or both sides of the substrate in sequence:
and one or two surfaces of the bonding sheet frame are overlapped on the substrate, and a glue accommodating groove is milled along the inner frame of the bonding sheet frame.
5. The method of claim 1, wherein the bonding sheet frame and the copper foil are laminated in order on one side or both sides of the substrate, further comprising:
and laminating a glue blocking gasket in the hollow part of the bonding sheet frame.
6. The method of claim 1, wherein the step of changing the thickness of the copper foil by plating, etching or pasting a copper block on the surface of the copper foil comprises:
the surface of the copper foil is pasted with a protective film, the protective film is windowed corresponding to an area needing to change the thickness on the copper foil, and the thickness of the copper foil is changed through electroplating or etching;
or, a copper block is locally adhered to the surface of the copper foil to increase the thickness of the copper foil.
7. The manufacturing method of claim 6, wherein the surface of the copper foil is pasted with a protective film, and the protective film is windowed corresponding to an area needing to change the thickness of the copper foil, and the manufacturing method comprises the following steps:
the surface of the copper foil is pasted with an anti-plating film, and the windowing area of the anti-plating film corresponds to the area of the copper foil needing to change the thickness and has the same size;
correspondingly, the thickness of the copper foil is changed by electroplating or etching, specifically:
the thickness of the copper foil in the windowed area is increased by electroplating.
8. The manufacturing method of claim 6, wherein the surface of the copper foil is pasted with a protective film, and the protective film is windowed corresponding to an area needing to change the thickness of the copper foil, and the manufacturing method comprises the following steps:
the surface of the copper foil is pasted with a corrosion-resistant film, and the windowing area of the corrosion-resistant film corresponds to the area, needing to change the thickness, of the copper foil and has the same size;
correspondingly, the thickness of the copper foil is changed by electroplating or etching, specifically:
the thickness of the copper foil in the windowed area is reduced by etching.
9. The method of manufacturing according to claim 1, wherein:
the outer frame of the bonding sheet frame, the substrate and the copper foil have the same size.
10. The method of claim 1, wherein laminating the single-sided laminate sheet and the double-sided laminate sheet with a prepreg sheet and a daughter board comprises:
providing two single-sided laminated boards, wherein one sides of the two single-sided laminated boards with copper foils are arranged oppositely;
if one double-sided laminated board is included between the two single-sided laminated boards, a prepreg and a daughter board are stacked between the single-sided laminated board and the double-sided laminated board;
if at least two double-sided laminated boards are arranged between the two single-sided laminated boards, prepregs and daughter boards are stacked between the single-sided laminated boards and the double-sided laminated boards and between two adjacent double-sided laminated boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911419009.5A CN111010808B (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911419009.5A CN111010808B (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of PCB |
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| CN111010808A true CN111010808A (en) | 2020-04-14 |
| CN111010808B CN111010808B (en) | 2022-05-13 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038718A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Ultra-thin PCB laminating process |
| CN114679849A (en) * | 2022-05-07 | 2022-06-28 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier and manufacturing method thereof |
| CN114786333A (en) * | 2022-05-07 | 2022-07-22 | 深圳市柳鑫实业股份有限公司 | Copper foil carrier for manufacturing rear half-embedded circuit of fine circuit |
| CN114828448A (en) * | 2022-05-07 | 2022-07-29 | 深圳市柳鑫实业股份有限公司 | Preparation method of copper foil carrier and copper foil carrier |
| CN114940006A (en) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier manufacturing method and copper foil carrier |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114786333B (en) * | 2022-05-07 | 2024-05-17 | 深圳市柳鑫实业股份有限公司 | Copper foil carrier for manufacturing fine circuit rear half-buried circuit |
| CN114828448B (en) * | 2022-05-07 | 2024-05-17 | 深圳市柳鑫实业股份有限公司 | Preparation method of copper foil carrier and copper foil carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111010808B (en) | 2022-05-13 |
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