CN111009484B - Wafer cleaning device and wafer cleaning method - Google Patents
Wafer cleaning device and wafer cleaning method Download PDFInfo
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- CN111009484B CN111009484B CN201911336436.7A CN201911336436A CN111009484B CN 111009484 B CN111009484 B CN 111009484B CN 201911336436 A CN201911336436 A CN 201911336436A CN 111009484 B CN111009484 B CN 111009484B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning device and a wafer cleaning method, and belongs to the technical field of semiconductors. Wafer cleaning apparatus, comprising: the wafer cleaning device comprises a wafer supporting table, a first cleaning component and a second cleaning component, wherein the wafer supporting table is provided with a plurality of fixing components for fixing a wafer to be cleaned, and each fixing component is provided with a first magnetic part; the driving component is used for driving the wafer supporting platform to rotate around the axis of the wafer supporting platform; the wafer supporting table comprises a first magnetic component and a second magnetic component, wherein the first magnetic component and the second magnetic component are arranged on one side of the wafer supporting table and have the same or opposite magnetism, and when the wafer supporting table rotates to enable one fixing component in the fixing components to move to be close to the second magnetic component, the second magnetic component interacts with the first magnetic component of the fixing component, so that a gap is formed between the fixing component and the wafer. The invention can fully clean the wafer and reduce the residue of liquid medicine and particles.
Description
Technical Field
The present invention relates to the field of semiconductor technology, and more particularly, to a wafer cleaning apparatus and a wafer cleaning method.
Background
The wafer manufacturing process generally includes many processes such as photolithography, ion implantation, etching, vapor deposition, etc. After the relevant processes, the wafer is usually cleaned to remove impurities on the wafer surface. If the wafer is not cleaned sufficiently and impurities remain on the surface of the wafer, the wafer may be damaged in the next process, resulting in scrapping. Therefore, a process of cleaning the wafer is very important.
The cleaning of the wafer is to sequentially finish the processes of chemical cleaning, deionized water washing, spin-drying and the like in a sealed working chamber, so that the influence caused by human operation factors in each step can be reduced. In the cleaning process, the wafer is fixed on the wafer supporting table through the fixing assembly, the wafer supporting table rotates, the cleaning liquid nozzle sprays cleaning liquid medicine to the surface of the wafer to be cleaned, and due to the rotation and spraying effects, the surface of the wafer can be in contact with the uniform cleaning liquid medicine, and the wafer is dried through high-speed rotation.
However, the above cleaning process is prone to the following problems: the area of the edge of the wafer, which is in contact with the fixed component, can not be contacted with the cleaning liquid medicine, so that the wafer can not be thoroughly cleaned; and residue of the chemical liquid and aggregation of particles are easily formed in this region.
Disclosure of Invention
The invention aims to provide a wafer cleaning device and a wafer cleaning method, which can fully clean a wafer and reduce residues of liquid medicine and particles.
In order to solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, an embodiment of the present invention provides a wafer cleaning apparatus, including:
the wafer cleaning device comprises a wafer supporting table, a cleaning device and a cleaning device, wherein the wafer supporting table is provided with a plurality of fixing components for fixing a wafer to be cleaned, and each fixing component is provided with a first magnetic part;
the driving component is used for driving the wafer supporting platform to rotate around the axis of the wafer supporting platform;
the wafer supporting table is arranged on one side of the wafer supporting table, the first magnetic component and the second magnetic component are the same or opposite in magnetism, when the wafer supporting table rotates to enable one fixing component in the fixing components to move to be close to the second magnetic component, the second magnetic component interacts with the first magnetic component of the fixing component, and therefore a gap is formed between the fixing component and the wafer.
Optionally, the method further comprises: and a cleaning solution nozzle for spraying a cleaning solution to the surface of the wafer to be cleaned.
Optionally, the method further comprises: a drying gas nozzle for drying the cleaned wafer.
Optionally, the securing assembly comprises:
a support shaft fixed to the wafer support table;
the fixed part is sleeved on the supporting shaft and can rotate around the supporting shaft, the fixed part comprises a substrate and two teeth arranged on one side of the center of the wafer supporting table, and a clamping groove used for fixing a wafer to be cleaned is formed between the two teeth.
Optionally, the fixing part has magnetism and is formed as the first magnetic component; or
The first magnetic component is arranged on the fixing part.
Optionally, the second magnetic component is a conductive coil, and the wafer cleaning apparatus further includes: and the power supply module is used for providing an electric signal for the conductive coil.
Optionally, the rotation speed of the wafer support table is not greater than 800rpm.
An embodiment of the present invention further provides a wafer cleaning method applied to the above wafer cleaning apparatus, including:
placing a wafer to be cleaned on the wafer supporting table, and fixing the wafer by using a fixing component;
the driving component drives the wafer supporting platform to rotate;
and when the wafer supporting table rotates to enable one fixing assembly in the plurality of fixing assemblies to move to be close to the second magnetic part, the first magnetic part and the second magnetic part interact with each other, so that a gap is formed between the fixing assembly and the wafer.
Optionally, the method further comprises:
and drying the cleaned wafer by using a drying gas nozzle.
Optionally, the drying gas nozzle and the cleaning liquid nozzle are alternately operated at a predetermined frequency.
The embodiment of the invention has the following beneficial effects:
in the scheme, the fixing assemblies are provided with the first magnetic components, the wafer supporting table is provided with the second magnetic components on one side, the magnetism of the first magnetic components is the same as or opposite to that of the second magnetic components, when the wafer supporting table rotates to enable one fixing assembly in the plurality of fixing assemblies to move to be close to the second magnetic components, the second magnetic components interact with the first magnetic components of the fixing assemblies, and gaps are generated between the fixing assemblies and the wafer under the action of magnetic force, so that when the wafer is cleaned, cleaning liquid medicine can fully clean the contact area of the edge of the wafer and the fixing assemblies, and the residue of the liquid medicine and particles is reduced; meanwhile, the area of the fixing component contacted with the wafer is also cleaned by the liquid medicine, so that the next wafer is prevented from being polluted.
Drawings
FIG. 1 is a schematic view of a wafer cleaning apparatus according to the related art;
FIG. 2 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a second magnetic component in accordance with an embodiment of the present invention;
FIG. 4 is a schematic view of a fixing assembly according to an embodiment of the invention.
The reference numerals are explained below:
1. wafer support platform
2. Fixing assembly
3. Supporting shaft
4. Movable part
5. Second magnetic member
6. Drive assembly
7. Wafer
9. Fixing part
10. Clamping groove
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
As shown in fig. 1, in the prior art, when a wafer is cleaned, a wafer 7 to be cleaned is fixed on a wafer supporting platform 1 through a fixing component 2, a driving component 6 drives the wafer supporting platform 1 to rotate, a cleaning liquid nozzle sprays cleaning liquid medicine to the surface of the wafer 7 to be cleaned, due to the rotation and spraying effects, the surface of the wafer 7 can be in contact with the uniform cleaning liquid medicine, and then the wafer is dried through high-speed rotation, wherein the direction indicated by an arrow is the rotation direction of the wafer supporting platform 1.
However, the above cleaning process is liable to have the following problems: the area of the edge of the wafer 7 contacted with the fixed component 2 can not be contacted with the cleaning liquid medicine, so that the wafer 7 can not be thoroughly cleaned; and residue of the chemical liquid and aggregation of particles are easily formed in this region.
The embodiment of the invention provides a wafer cleaning device and a wafer cleaning method, which can be used for fully cleaning a wafer and reducing residues of liquid medicine and particles.
An embodiment of the present invention provides a wafer cleaning apparatus, as shown in fig. 2, including:
the wafer cleaning device comprises a wafer supporting table 1, wherein a plurality of fixing components 2 used for fixing a wafer 7 to be cleaned are arranged on the wafer supporting table 1, and a first magnetic part is arranged on each fixing component 2;
the driving component 6 is used for driving the wafer supporting table 1 to rotate around the axis of the wafer supporting table;
and the second magnetic component 5 is arranged on one side of the wafer supporting table 1, the magnetism of the first magnetic component is the same as or opposite to that of the second magnetic component 5, and when the wafer supporting table 1 rotates to enable one fixing component in the plurality of fixing components 2 to move to be close to the second magnetic component 5, the second magnetic component 5 interacts with the first magnetic component of the fixing component, so that a gap is generated between the fixing component and the wafer.
In the embodiment, the fixing assemblies are provided with first magnetic components, one side of the wafer supporting table is provided with a second magnetic component, the first magnetic components and the second magnetic components have the same or opposite magnetism, when the wafer supporting table rotates to enable one fixing assembly in the fixing assemblies to move to be close to the second magnetic component, the second magnetic component interacts with the first magnetic component of the fixing assembly, and a gap is generated between the fixing assembly and the wafer under the action of magnetic force, so that when the wafer is cleaned, cleaning liquid medicine can fully clean the contact area of the edge of the wafer and the fixing assembly, and liquid medicine and particle residues are reduced; meanwhile, the area of the fixing component contacted with the wafer is also cleaned by the liquid medicine, so that the next wafer is prevented from being polluted.
Optionally, the wafer cleaning apparatus further includes: and a cleaning solution nozzle for spraying a cleaning solution to the surface of the wafer to be cleaned. The cleaning solution nozzle may be disposed above the center of the wafer support table 1 and connected to a cleaning solution pipe for spraying a cleaning solution to the wafer 7 to clean the wafer 7.
Wherein the driving assembly 6 may be a rotary motor. In other embodiments of the present invention, the driving unit 6 may be other driving units capable of driving the wafer support table 1 to rotate, and the present embodiment is not limited to the specific type of the driving unit 6, and the present invention is intended to cover any driving unit capable of rotating the wafer support table 1.
Optionally, the wafer cleaning apparatus further includes: a drying gas nozzle for drying the cleaned wafer. The dry gas nozzle may be fixedly installed on the wafer support table 1.
In one embodiment, as shown in fig. 3, the second magnetic member 5 is fixed to one side of the wafer supporting stage 1 by the movable portion 4. The second magnetic component 5 may be a conductive coil, and the wafer cleaning apparatus further includes: and a power supply module for providing an electrical signal to the conductive coil, wherein the polarity of the second magnetic part 5 can be controlled by inputting the electrical signal to the conductive coil. Of course, in the technical solution of the present invention, the second magnetic component 5 is not limited to the conductive coil, and may also be other magnetic components such as a magnet. In practical applications, the position of the second magnetic component 5 can be moved by the movable portion 4, so that the fixed component 2 can be ensured to be spaced from the wafer and not affect the stability of the wafer when approaching the second magnetic component 5.
In a specific embodiment, as shown in fig. 4, the fixing assembly 2 comprises:
a support shaft 3 fixed to the wafer support table 1;
the cover is established fixed part 9 on the back shaft 3, the fixed part can wind the back shaft is rotatory, fixed part 9 includes the basement and sets up the basement is towards two teeth of wafer supporting bench center one side, form the draw-in groove 10 that is used for the fixed wafer of treating the washing between two teeth.
The fixing portion 9 itself may have magnetism and be formed as the first magnetic member; alternatively, the first magnetic member is provided on the fixing portion 9. When the first magnetic component is additionally arranged on the fixing portion 9, the first magnetic component can be fixed at the bottom of the fixing portion 9 and coaxial with the fixing portion 9, and when the first magnetic component is subjected to magnetic force to form displacement, the first magnetic component drives the fixing portion 9 to displace and a gap is formed between the wafer and the fixing portion 9.
When the wafer is cleaned, the wafer 7 to be cleaned is fixed on the wafer supporting table 1 through the fixing component 2, the driving component 6 is started, the driving component 6 drives the wafer supporting table 1 to rotate, the cleaning liquid nozzle sprays cleaning liquid medicine to the surface of the wafer 7 to be cleaned, taking 6 fixing components 2 arranged on the wafer supporting table 1 as an example, in the rotating process of the wafer supporting table 1, 6 fixing components 2 sequentially pass through the second magnetic component 5, when one fixing component 2 is close to the second magnetic component 5, the first magnetic component and the second magnetic component 5 on the fixing component 2 interact with each other, under the action of magnetic force, the fixing component 9 is displaced and rotates around the supporting shaft 3, a gap is formed between the fixing component 9 and the wafer 7, so that the cleaning liquid medicine sprayed by the cleaning liquid nozzle can clean the area between the wafer 7 and the fixing component 9, the edge of the wafer 7 and the fixing component can be better cleaned, and the cleaning effect is effectively improved.
The polarities of the first magnetic part and the second magnetic part can be the same, so that a gap can be generated between the fixing piece 9 and the wafer 7 under the combined action of like-pole repulsion and rotation; the polarities of the first magnetic part and the second magnetic part may also be opposite, so that a gap may be generated between the fixing member 9 and the wafer 7 under the combined action of opposite attraction and rotation.
In this embodiment, a non-contact torque is formed by magnetic force, so that a small gap is generated between the fixing member 9 and the wafer 7, and the stability of the wafer can be protected to a great extent.
In this embodiment, the rotation speed of the wafer support table 1 should not be too high, which may affect the stability of the wafer and the cleaning effect, and therefore the rotation speed of the wafer support table 1 is not greater than 800rpm; however, the rotational speed of the wafer support table 1 should not be too low, and if the rotational speed is too low, the cleaning efficiency is affected, so the rotational speed of the wafer support table 1 is not less than 300rpm.
An embodiment of the present invention further provides a wafer cleaning method applied to the above wafer cleaning apparatus, including:
placing a wafer to be cleaned on the wafer supporting table, and fixing the wafer by using a fixing assembly;
the driving component drives the wafer supporting table to rotate;
and when the wafer supporting table rotates to enable one fixing assembly in the plurality of fixing assemblies to move to be close to the second magnetic part, the first magnetic part and the second magnetic part interact with each other, so that a gap is formed between the fixing assembly and the wafer.
In this embodiment, the fixing assemblies are provided with first magnetic components, one side of the wafer supporting table is provided with second magnetic components, the magnetism of the first magnetic components is the same as or opposite to that of the second magnetic components, when the wafer supporting table rotates to enable one fixing assembly of the plurality of fixing assemblies to move to be close to the second magnetic components, the second magnetic components interact with the first magnetic components of the fixing assemblies, and gaps are generated between the fixing assemblies and the wafer under the action of magnetic force, so that when the wafer is cleaned, cleaning liquid can fully clean the contact area of the edge of the wafer and the fixing assemblies, and the residue of the liquid medicine and particles is reduced; meanwhile, the area of the fixing component contacted with the wafer is also cleaned by the liquid medicine, so that the next wafer is prevented from being polluted.
Optionally, the wafer cleaning method further includes:
and drying the cleaned wafer by using a drying gas nozzle.
Optionally, the drying gas nozzle and the cleaning liquid nozzle are alternately operated at a predetermined frequency. The drying gas nozzle performs a drying process on the wafer 7 cleaned by the cleaning liquid nozzle each time. Therefore, the surface of the wafer 7 can quickly reach a dry state after being cleaned for one time, and the cleaning liquid nozzle can immediately spray cleaning liquid, so that the cleaning efficiency can be improved, and different cleaning liquids can be prevented from contacting and reacting on the surface of the wafer 7 to generate new pollutants or damage the wafer 7, thereby ensuring the quality of the wafer 7.
When a wafer is cleaned, a wafer 7 to be cleaned is fixed on a wafer supporting table 1 through a fixing component 2, a driving component 6 is started, the driving component 6 drives the wafer supporting table 1 to rotate, a cleaning liquid nozzle sprays cleaning liquid medicine to the surface of the wafer 7 to be cleaned, taking 6 fixing components 2 arranged on the wafer supporting table 1 as an example, in the rotating process of the wafer supporting table 1, 6 fixing components 2 sequentially pass through a second magnetic component 5, when one fixing component 2 is close to the second magnetic component 5, the first magnetic component and the second magnetic component 5 on the fixing component 2 interact with each other, under the action of magnetic force, a fixing component 9 is displaced and rotates around a supporting shaft 3, a gap is formed between the fixing component 9 and the wafer 7, so that the cleaning liquid medicine sprayed by the cleaning liquid nozzle can clean the area between the wafer 7 and the fixing component 9, the edge of the wafer 7 and the fixing component can be better cleaned, and the cleaning effect is effectively improved.
The polarities of the first magnetic part and the second magnetic part can be the same, so that a gap can be generated between the fixing piece 9 and the wafer 7 under the combined action of like-pole repulsion and rotation; the polarities of the first magnetic part and the second magnetic part may also be opposite, so that under the combined action of opposite attraction and rotation, a gap is generated between the fixing piece 9 and the wafer 7.
In this embodiment, a non-contact torque is formed by magnetic force, so that a small gap is generated between the fixing member 9 and the wafer 7, and the stability of the wafer can be protected to a great extent.
In this embodiment, the rotation speed of the wafer support table 1 should not be too high, which may affect the stability of the wafer and the cleaning effect, and therefore the rotation speed of the wafer support table 1 is not greater than 800rpm; however, the rotational speed of the wafer support table 1 should not be too low, and if the rotational speed is too low, the cleaning efficiency is affected, so the rotational speed of the wafer support table 1 is not less than 300rpm.
Unless defined otherwise, technical or scientific terms used herein should have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A wafer cleaning apparatus, comprising:
the wafer cleaning device comprises a wafer supporting table, a first cleaning component and a second cleaning component, wherein the wafer supporting table is provided with a plurality of fixing components for fixing a wafer to be cleaned, and each fixing component is provided with a first magnetic part;
the driving assembly is used for driving the wafer supporting platform to rotate around the axis of the wafer supporting platform;
a cleaning solution nozzle for spraying a cleaning solution to the surface of the wafer to be cleaned;
the second magnetic component is arranged on one side of the wafer supporting platform, the magnetism of the first magnetic component is the same as or opposite to that of the second magnetic component, when the wafer supporting platform rotates to enable one fixing component in the plurality of fixing components to move to be close to the second magnetic component, the second magnetic component interacts with the first magnetic component of the fixing component, so that a gap is formed between the fixing component and the wafer, and the cleaning liquid medicine sprayed by the cleaning liquid nozzle can clean the region between the wafer and the fixing component;
the second magnetic component is fixed on one side of the wafer supporting table through a movable part.
2. The wafer cleaning apparatus as recited in claim 1, further comprising: a drying gas nozzle for drying the cleaned wafer.
3. The wafer cleaning apparatus of claim 1, wherein the retaining assembly comprises:
a support shaft fixed on the wafer support platform;
the cover is established fixed part on the back shaft, the fixed part can wind the back shaft is rotatory, the fixed part includes the basement and sets up the basement orientation two teeth of wafer supporting bench center one side, form the draw-in groove that is used for fixed treating abluent wafer between two teeth.
4. The wafer cleaning apparatus according to claim 3,
the fixing part has magnetism and is formed into the first magnetic component; or
The first magnetic component is arranged on the fixing part.
5. The wafer cleaning apparatus as claimed in claim 1, wherein the second magnetic component is a conductive coil, the wafer cleaning apparatus further comprising: and the power supply module is used for providing an electric signal for the conductive coil.
6. The wafer cleaning apparatus according to claim 1, wherein the rotation speed of the wafer support table is not more than 800rpm.
7. A wafer cleaning method applied to the wafer cleaning apparatus according to any one of claims 1 to 6, comprising:
placing a wafer to be cleaned on the wafer supporting table, and fixing the wafer by using a fixing assembly;
the driving component drives the wafer supporting table to rotate;
and when the wafer supporting table rotates to enable one fixing assembly of the plurality of fixing assemblies to move to be close to the second magnetic part, the first magnetic part and the second magnetic part interact with each other, so that a gap is formed between the fixing assembly and the wafer, and a cleaning liquid sprayed by the cleaning liquid nozzle can clean a region between the wafer and the fixing assembly.
8. The wafer cleaning method as claimed in claim 7, further comprising:
and drying the cleaned wafer by using a drying gas nozzle.
9. A method for cleaning wafers as claimed in claim 8 wherein the dry gas nozzles and the cleaning liquid nozzles are operated alternately at a predetermined frequency.
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| CN201911336436.7A CN111009484B (en) | 2019-12-23 | 2019-12-23 | Wafer cleaning device and wafer cleaning method |
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| CN113457796B (en) * | 2021-06-30 | 2022-12-27 | 北京格林意锐医药科技有限责任公司 | Medicinal material grinding device for bio-pharmaceuticals |
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| CN103715128A (en) * | 2013-12-30 | 2014-04-09 | 上海集成电路研发中心有限公司 | Adjustable wafer fixing device and method and wafer cleaning platform |
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| JP3395696B2 (en) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | Wafer processing apparatus and wafer processing method |
| JP4621038B2 (en) * | 2005-02-18 | 2011-01-26 | Ｏｋｉセミコンダクタ株式会社 | Semiconductor wafer cleaning method and semiconductor wafer cleaning apparatus |
| CN102945820B (en) * | 2012-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | Disk holding device |
| US10658221B2 (en) * | 2017-11-14 | 2020-05-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer cleaning apparatus and method for cleaning semiconductor wafer |
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| CN103715128A (en) * | 2013-12-30 | 2014-04-09 | 上海集成电路研发中心有限公司 | Adjustable wafer fixing device and method and wafer cleaning platform |
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