CN111007070A - 贴装有部件的基板检查方法及检查装置 - Google Patents
贴装有部件的基板检查方法及检查装置 Download PDFInfo
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- CN111007070A CN111007070A CN201911270860.6A CN201911270860A CN111007070A CN 111007070 A CN111007070 A CN 111007070A CN 201911270860 A CN201911270860 A CN 201911270860A CN 111007070 A CN111007070 A CN 111007070A
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- component
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
- G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0008—Industrial image inspection checking presence/absence
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10024—Color image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10028—Range image; Depth image; 3D point clouds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Quality & Reliability (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140181723A KR101622628B1 (ko) | 2014-12-16 | 2014-12-16 | 부품이 실장된 기판 검사방법 및 검사장치 |
KR10-2014-0181723 | 2014-12-16 | ||
CN201580068879.6A CN107110789B (zh) | 2014-12-16 | 2015-12-16 | 贴装有部件的基板检查方法及检查装置 |
Related Parent Applications (1)
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---|---|---|---|
CN201580068879.6A Division CN107110789B (zh) | 2014-12-16 | 2015-12-16 | 贴装有部件的基板检查方法及检查装置 |
Publications (1)
Publication Number | Publication Date |
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CN111007070A true CN111007070A (zh) | 2020-04-14 |
Family
ID=56103927
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911270860.6A Pending CN111007070A (zh) | 2014-12-16 | 2015-12-16 | 贴装有部件的基板检查方法及检查装置 |
CN201580068879.6A Active CN107110789B (zh) | 2014-12-16 | 2015-12-16 | 贴装有部件的基板检查方法及检查装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580068879.6A Active CN107110789B (zh) | 2014-12-16 | 2015-12-16 | 贴装有部件的基板检查方法及检查装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10330609B2 (zh) |
EP (1) | EP3236200B1 (zh) |
KR (1) | KR101622628B1 (zh) |
CN (2) | CN111007070A (zh) |
WO (1) | WO2016099154A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110291855B (zh) | 2017-02-13 | 2021-09-14 | 株式会社高迎科技 | 检查在印刷电路板贴装的部件的装置、其运转方法及计算机可读记录介质 |
KR102249225B1 (ko) | 2017-12-28 | 2021-05-10 | 주식회사 고영테크놀러지 | 기판에 삽입된 커넥터에 포함된 복수의 핀의 삽입 상태를 검사하는 방법 및 기판 검사 장치 |
US11328407B2 (en) | 2018-02-26 | 2022-05-10 | Koh Young Technology Inc. | Method for inspecting mounting state of component, printed circuit board inspection apparatus, and computer readable recording medium |
KR102182698B1 (ko) * | 2019-01-11 | 2020-11-24 | 한화정밀기계 주식회사 | 전자부품 인식장치 및 전자부품 인식방법 |
CN109870466B (zh) * | 2019-01-25 | 2021-06-01 | 深圳市华星光电半导体显示技术有限公司 | 用于显示装置***线路区匹配缺陷点与线路编号的方法 |
Citations (6)
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CN1982841A (zh) * | 2005-12-14 | 2007-06-20 | 株式会社高永科技 | 三维形状测量装置及方法 |
CN101061770A (zh) * | 2004-11-19 | 2007-10-24 | 索尼爱立信移动通讯股份有限公司 | 用于屏蔽印刷电路板上电元件的电磁屏蔽罩 |
US20100092041A1 (en) * | 2008-10-13 | 2010-04-15 | Koh Young Technology Inc. | Method of measuring a three-dimensional shape |
US20100290696A1 (en) * | 2009-05-13 | 2010-11-18 | Koh Young Technology Inc. | Method of measuring measurement target |
US20110002529A1 (en) * | 2009-07-03 | 2011-01-06 | Koh Young Technology Inc. | Method for inspecting measurement object |
WO2011049190A1 (ja) * | 2009-10-24 | 2011-04-28 | 株式会社Djtech | 外観検査装置及び印刷半田検査装置 |
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JPH06347232A (ja) * | 1993-06-04 | 1994-12-20 | Mitsubishi Heavy Ind Ltd | プリント基板外観検査装置 |
KR970058512A (ko) * | 1995-12-01 | 1997-07-31 | 구자홍 | 부품장착 상태 자동 검사장치 및 방법 |
JP2004177377A (ja) * | 2002-11-29 | 2004-06-24 | Hitachi Ltd | 検査方法および検査装置 |
JP2004340832A (ja) | 2003-05-16 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 回路基板の外観検査方法及び回路基板の外観検査装置 |
JP4563205B2 (ja) * | 2005-02-08 | 2010-10-13 | 富士機械製造株式会社 | 実装された電子部品の検査方法及び装置 |
JP4539355B2 (ja) | 2005-02-08 | 2010-09-08 | オムロン株式会社 | 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置 |
DE102010030883B4 (de) * | 2009-07-03 | 2018-11-08 | Koh Young Technology Inc. | Vorrichtung zur Prüfung einer Platte und Verfahren dazu |
KR101133976B1 (ko) * | 2009-12-07 | 2012-04-05 | 주식회사 고영테크놀러지 | 3차원 검사방법 및 이를 이용한 3차원 검사장치 |
KR101144749B1 (ko) * | 2010-01-29 | 2012-05-24 | 주식회사 고영테크놀러지 | 소자의 불량 검사방법 |
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2014
- 2014-12-16 KR KR1020140181723A patent/KR101622628B1/ko active IP Right Grant
-
2015
- 2015-12-16 US US15/536,213 patent/US10330609B2/en active Active
- 2015-12-16 CN CN201911270860.6A patent/CN111007070A/zh active Pending
- 2015-12-16 EP EP15870321.5A patent/EP3236200B1/en active Active
- 2015-12-16 CN CN201580068879.6A patent/CN107110789B/zh active Active
- 2015-12-16 WO PCT/KR2015/013814 patent/WO2016099154A1/ko active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
KR101622628B1 (ko) | 2016-05-20 |
US20170363548A1 (en) | 2017-12-21 |
EP3236200A1 (en) | 2017-10-25 |
EP3236200B1 (en) | 2019-09-04 |
CN107110789A (zh) | 2017-08-29 |
US10330609B2 (en) | 2019-06-25 |
EP3236200A4 (en) | 2018-07-18 |
CN107110789B (zh) | 2020-01-07 |
WO2016099154A1 (ko) | 2016-06-23 |
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Address after: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Applicant after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Applicant before: KOH YOUNG TECHNOLOGY Inc. |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Han Guoshouershi Applicant after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Applicant before: Gaoying Technology Co.,Ltd. |
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CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200414 |
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RJ01 | Rejection of invention patent application after publication |