CN110996647A

CN110996647A - Five-axis linkage chip mounter

Info

Publication number: CN110996647A
Application number: CN201911415145.7A
Authority: CN
Inventors: 易瑞璋
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-10

Abstract

The invention discloses a five-axis linkage chip mounter, which comprises an XYZ motion system, a fourth rotating shaft, a fifth rotating shaft and a chip mounter head, wherein the fourth rotating shaft, the fifth rotating shaft and the chip mounter head are arranged on the XYZ motion system, the fifth rotating shaft is arranged on a rotating frame, the rotating frame is fixedly connected with the fourth rotating shaft, the chip mounter head is arranged on the fifth rotating shaft, the chip mounter head is provided with a plurality of chip mounter units which are distributed along the circumferential direction of a chip mounter head body, a camera device is arranged on the rotating frame, and the camera device is positioned. In the material taking and mounting process, the patch unit positioned at the lowest part of the patch machine head takes materials/patches, and the patch unit at the top carries out visual processing, so that each patch unit can obtain visual processing in the whole material taking and mounting process, and the rapid and accurate mounting effect is ensured.

Description

Five-axis linkage chip mounter

Technical Field

The invention relates to the technical field of electronics, in particular to a chip mounter.

Background

At present, the subsides of traditional chip mounter dress head adopts the suction nozzle parallel structure more, though there are a plurality of suction nozzle axles that move up and down side by side and need each independent rotation, but because of getting material position and subsides the position often not corresponding with the suction nozzle interval, so under the general condition, can only have 4 synchronous (simultaneous) linkages, that is to say, when a Z (suction nozzle) axle is getting material or subsides the material in-process, other Z (suction nozzle) axle is in idle state, only wait for this Z (suction nozzle) axle to accomplish the work of getting the material or subsides, the work of getting the material or subsides just can be carried out to adjacent Z (suction nozzle) axle side by side, this operating efficiency who has wasted the machine greatly.

Moreover, since there may be a positional deviation when the chip head (suction nozzle) sucks the component, in order to correct (compensate) the deviation of the mounting position, the conventional chip mounter needs to mount a camera at a position below the chip head (suction nozzle), form the camera and the visual detection module into a visual processing system, and correct (compensate) the deviation through an algorithm. In the material taking process, because of relative position interference, the bottom camera cannot synchronously carry out vision processing work, and only in the middle period of the process of moving to the mounting position after material taking, the vision processing work is carried out at a certain position, so that the operation efficiency of the machine is reduced.

In addition, because the head of the paster is provided with a plurality of suction nozzle structures which move up and down in parallel and need to rotate independently, the whole head structure is complicated, large in size and extremely heavy, the load of a moving motor (motor) and the load of a portal frame need to be greatly consumed, and the stability of the machine is reduced.

Disclosure of Invention

The technical problems solved by the invention are as follows: the operating efficiency of the chip mounter is improved.

In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a five-axis linkage chip mounter, includes XYZ motion system, installs fourth rotation axis, the paster aircraft nose on XYZ motion system, the setting is erect to the fourth rotation axis, the chip mounter still includes the fifth rotation axis that the level set up, and the fifth rotation axis is installed on the swivel mount, swivel mount and fourth rotation axis fixed connection, and the paster aircraft nose is installed on the fifth rotation axis, and the paster aircraft nose is equipped with a plurality of paster units along paster aircraft nose body circumference distribution, is equipped with camera device on the swivel mount, and camera device is located the top of paster aircraft nose.

The movement of the chip mounting unit is controlled by five linked shafts (three shafts of an XYZ movement system, a fourth rotation shaft and a fifth rotation shaft), and the five movement shafts enable the chip mounting unit to move and rotate to a component feeder to take materials or move and rotate to a printed circuit board to mount.

In the process of material taking and mounting, a camera device positioned above a chip mounter head performs synchronous visual processing on components, for example, when material taking is performed, a chip mounter unit positioned at the lowermost part of the chip mounter head performs visual processing when material taking is performed, and a chip mounter unit positioned at the uppermost part of the chip mounter head performs visual processing; when mounting, the patch unit located at the bottom of the patch machine head is used for mounting, the patch unit located at the top of the patch machine head is used for visual processing, so that the whole process of taking materials and mounting is realized, each patch unit can be visually processed, and the quick and accurate mounting effect is ensured.

Compared with the traditional chip mounter with the suction nozzle parallel structure, the five-axis linkage chip mounter has the advantage that the operation efficiency is improved. In addition, the paster head which is matched with the fourth rotating shaft and the fifth rotating shaft to operate in the invention turns the traditional paster head into a simple one, optimizes the paster head structure with light weight, reduces the machine cost, is beneficial to improving the working efficiency and the operating speed of the machine, ensures stable pasting precision and improves the cost performance.

Drawings

The invention is further described below with reference to the accompanying drawings:

fig. 1 is a schematic diagram of a five-axis linkage chip mounter;

fig. 2 is a schematic view of the applicator head 60 of fig. 1.

The symbols in the drawings illustrate that:

10. an X-axis motion module;

20. a Y-axis motion module;

30. a Z-axis motion module; 31. a lifting seat;

40. a fourth rotation axis; 41. a fourth motor; 42. a first rotary air pipe joint; 43. a gas conduit;

50. a fifth rotation axis; 51. a rotating frame; 52. a fifth motor; 53. a second rotary air pipe joint;

60. a paster machine head; 61. a paster head body; 62. a connecting structure; 63. a suction nozzle;

70. a camera device;

80. a chip mounter platform; 81. a gantry; 82. a circuit board conveying device; 84. a component feeder.

Detailed Description

As shown in fig. 1, a five-axis linkage chip mounter includes an XYZ motion system, a fourth rotation axis 40 installed on the XYZ motion system, and a chip mounter 60, where the fourth rotation axis is vertically disposed, the chip mounter further includes a fifth rotation axis 50 horizontally disposed, the fifth rotation axis is installed on a rotation frame 51, the rotation frame is fixedly connected to the fourth rotation axis, the chip mounter is installed on the fifth rotation axis, the chip mounter is provided with a plurality of chip mounting units circumferentially distributed along a chip mounter body, a camera device 70 is disposed on the rotation frame, and the camera device is located above the chip mounter.

The XYZ motion system comprises an X-axis motion module 10, a Y-axis motion module 20 and a Z-axis motion module 30, wherein the Y-axis motion module is installed on the X-axis motion module, and the Z-axis motion module is installed on the Y-axis motion module. Alternatively, the X-axis motion module, the Y-axis motion module and the Z-axis motion module all adopt screw rod mechanisms driven by motors.

The XYZ motion system is arranged on a portal frame 81 which is arranged on a chip mounter platform 80, and a circuit board conveying device 82 is arranged on the chip mounter platform, is positioned below the chip mounter head 60 and penetrates through the portal frame. Specifically, the X-axis movement module 10 is disposed on the gantry 81, and the Y-axis movement module 20 is disposed on the beam that is disposed on the gantry.

A fourth motor 41 is installed on the lifting seat 31 of the Z-axis movement module 30 and is used for driving the fourth rotating shaft 40. The fifth rotation shaft 50 is driven by a fifth motor 52, which is mounted on a rotation frame 51. The actions of the three motors, the fourth motor and the fifth motor of the X-axis movement module 10, the Y-axis movement module 20 and the Z-axis movement module 30 are controlled by the main control unit.

In operation, the mounter head 60 is moved to the component feeder by driving the XYZ movement system, and the mounter unit thereof sucks a component from the component feeder. The circuit board conveying device 82 conveys the circuit board to the lower side of the chip mounter 60, and the chip mounter performs chip mounting on the circuit board under the drive of the XYZ motion system, the fourth rotation axis 40, and the fifth rotation axis 50.

As shown in fig. 2, alternatively, the number of the patch units is even, and the even number of the patch units are uniformly distributed along the circumference of the body 61 of the patch machine head. Specifically, the number of patch units may be twelve. When the chip mounting unit of the chip mounting machine head 60 adsorbs the components, the fifth rotating shaft 50 drives the chip mounting machine head to rotate in sequence, and the suction nozzle is right above the components at the rotating angle each time until each chip mounting unit adsorbs the components; the patch unit located at the top of the patch machine head 60 is vertically aligned with the camera device 70, the camera device performs visual processing on the components on the patch unit, and the patch unit located at the bottom of the patch machine head 60 adsorbs the components. When all the chip units adsorb the components, one half of the components on the chip units are subjected to visual processing, and the other half of the components on the chip units are not subjected to visual processing. Then, the mounter head 60 moves to above the circuit board by driving the XYZ movement system, and the mounter head 60 mounts the circuit board by the linkage of the XYZ movement system, the fourth rotation axis 40, and the fifth rotation axis 50. The chip mounter head attaches the components which have undergone visual processing to the circuit board, and in the attaching process, the camera device 70 performs visual processing on the components which are located on the chip mounter unit at the top of the chip mounter head, and the components are not subjected to visual processing in the above-mentioned adsorption process. Thus, under the rotation of the fifth rotation shaft 50, the half of the components that have been subjected to the vision processing in the adsorption process are first attached to the circuit board, and simultaneously, the half of the components that have not been subjected to the vision processing in the adsorption process are subjected to the vision processing by the image pickup device, and then the components that have been subjected to the vision processing in the attachment process are attached to the circuit board again. Therefore, in the whole process of taking materials and mounting, each surface mounting unit can be visually processed, and the quick and accurate mounting effect is ensured.

As an option, the camera device 70 is an industrial camera, the camera device and the visual inspection module form a visual processing system, the visual inspection module is one of the functional modules of the main control unit, and the offset of the component on the patch unit is corrected (compensated) through an algorithm, so as to ensure the accuracy of the position where the component is attached to the circuit board.

The paster head 60 comprises a paster head body 61 connected with the fifth rotating shaft 50, a plurality of connecting structures 62 extending to the periphery of the paster head body, and a plurality of suction nozzles 63 matched with the connecting structures in a one-to-one manner, wherein any suction nozzle and the corresponding connecting structure form the paster unit, and any paster unit is provided with an electromagnetic valve for controlling the suction nozzle to suck and blow, namely the suction and blowing actions of each paster unit are independently controlled by the main control unit through the corresponding electromagnetic valve.

The fourth rotating shaft 40 is hollow, the fifth rotating shaft 50 is hollow, the head body 61 of the chip mounter is provided with a gas circulation structure, the connection structure 62 is provided with a gas flow passage, the head end of the fourth rotating shaft is provided with a first rotary gas pipe joint 42, the head end of the fifth rotating shaft is provided with a second rotary gas pipe joint 53, the tail end of the fourth rotating shaft is connected with the second rotary gas pipe joint 53 at the head end of the fifth rotating shaft through a gas pipe 43, and the chip mounter is connected to the tail end of the fifth rotating shaft. The pipeline connected with the vacuum device or the air pump (controlled by the main control unit) vacuumizes air to the first rotary air pipe joint 42, and vacuums air to the air circulation structure of the paster head body 61 through the fourth rotary shaft 40, the air pipeline 43, the second rotary air pipe joint 53 and the fifth rotary shaft 50, and the air circulation structure disperses the vacuum to each connection structure 62 and then enters the corresponding suction nozzle 63.

A first group of wires from the lifting seat 31 of the Z-axis motion module 30 are connected with a second group of wires through a first conductive slip ring, and a first part of wires in the second group of wires are connected with the camera device 70 and the fifth motor 52; and a second part of the second group of wires is connected with a third group of wires through a second conductive slip ring, and the third group of wires is connected with each electromagnetic valve of the paster head 60. Any group of wires are divided into a power supply wire and a signal wire, the power supply wire is connected with a power supply, and the signal wire is connected with the main control unit. The first conductive slip ring is disposed at a pivot of the lifting seat 31 and the fourth rotating shaft 40, and the second conductive slip ring is disposed at a pivot of the rotating frame 51 and the fifth rotating shaft 50.

The invention skillfully integrates the machine (mechanical part), the electricity (motor circuit), the gas (vacuum gas circuit) and the vision (vision processing), all five shafts on the upper part of the machine can synchronously and coordinately move at any time under the control of the main control unit, and synchronously and visually process components in the processes of material taking and mounting, thereby achieving the linkage of five shafts and vision.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.

Claims

1. A five-axis linkage chip mounter comprises an XYZ motion system, a fourth rotating shaft (40) installed on the XYZ motion system, and a chip mounter head (60), wherein the fourth rotating shaft is vertically arranged, and the five-axis linkage chip mounter is characterized in that: the chip mounter still includes fifth rotation axis (50) that the level set up, and the fifth rotation axis is installed on swivel mount (51), swivel mount and fourth rotation axis fixed connection, and the paster aircraft nose is installed on the fifth rotation axis, and the paster aircraft nose is equipped with a plurality of paster units along paster aircraft nose body circumference distribution, is equipped with camera device (70) on the swivel mount, and camera device is located the top of paster aircraft nose.

2. The mounter according to claim 1, wherein: the fourth rotation axis (40) is driven by a fourth motor (41), the fifth rotation axis (50) is driven by a fifth motor (52), the fourth motor is mounted on an XYZ motion system, and the fifth motor is mounted on a rotating frame (51).

3. The mounter according to claim 1, wherein: the number of the paster units is even, and the even number of paster units are uniformly distributed along the circumferential direction of the paster nose body (61).

4. The mounter according to claim 1, wherein: the paster head (60) comprises a paster head body (61) connected with a fifth rotating shaft (50), a plurality of connecting structures (62) extending to the periphery of the paster head body, and a plurality of suction nozzles (63) matched with the connecting structures in a one-to-one mode, wherein any suction nozzle and the corresponding connecting structure form the paster unit, and any paster unit is provided with an electromagnetic valve for controlling the suction nozzle to suck and blow air.

5. The mounter according to claim 4, wherein: fourth rotation axis (40) cavity, fifth rotation axis (50) cavity, paster aircraft nose body (61) are equipped with the gas circulation structure, and connection structure (62) are equipped with the gas flow channel, and the head end of fourth rotation axis is equipped with first rotatory air pipe connector (42), and the head end of fifth rotation axis is equipped with second rotatory air pipe connector (53), and the tail end of fourth rotation axis passes through gas pipeline (43) to be connected with second rotatory air pipe connector (53) of the head end of fifth rotation axis, paster aircraft nose body coupling is at the tail end of fifth rotation axis.

6. The mounter according to claim 4, wherein: the lead wire from the XYZ motion system is connected with the camera device (70), the fifth motor (52) and the electromagnetic valve through the conductive slip ring.

7. The mounter according to claim 1, wherein: the XYZ motion system is arranged on a portal frame (81), the portal frame is arranged on a chip mounter platform (80), and a circuit board conveying device (82) is arranged on the chip mounter platform, is positioned below a chip mounter head (60) and penetrates through the portal frame.