CN110977821A - Multi-degree-of-freedom compliant micro gripper integrating multi-variable detection - Google Patents

Multi-degree-of-freedom compliant micro gripper integrating multi-variable detection Download PDF

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Publication number
CN110977821A
CN110977821A CN201911285184.XA CN201911285184A CN110977821A CN 110977821 A CN110977821 A CN 110977821A CN 201911285184 A CN201911285184 A CN 201911285184A CN 110977821 A CN110977821 A CN 110977821A
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rod
amplification
capacitive
supporting
guide
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CN110977821B (en
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李存尧
杨依领
宋帅官
吴高华
娄军强
李国平
崔玉国
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Ningbo University
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Ningbo University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/08Gripping heads and other end effectors having finger members
    • B25J15/10Gripping heads and other end effectors having finger members with three or more finger members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02Sensing devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B5/00Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

The multi-degree-of-freedom compliant micro gripper integrating multivariable detection comprises a capacitive displacement sensor, a capacitive force sensor, a piezoelectric micro-motion platform and a piezoelectric micro gripper, wherein the piezoelectric micro gripper is installed on the piezoelectric micro-motion platform, the capacitive displacement sensor and the capacitive pressure sensor are three-degree-of-freedom sensors with the same structure, the capacitive displacement sensor and the capacitive force sensor are installed on the piezoelectric micro gripper, the capacitive displacement sensor is used for detecting the displacement of a clamping end of the piezoelectric micro gripper, and the capacitive force sensor is used for detecting the external interference force applied to the piezoelectric micro gripper and the clamping force of the clamping end; the piezoelectric micro-motion platform comprises a base, an amplifying mechanism and a working platform; a plurality of amplifying mechanisms are fixedly connected to the base, the working platform is installed on the amplifying mechanisms, and the amplifying mechanisms are uniformly distributed along the circumferential direction of the supporting disc and fixedly connected to the outer side face of the supporting disc. The invention has six degrees of freedom, can realize the operation of complex tasks, and has stable and reliable work.

Description

Multi-degree-of-freedom compliant micro gripper integrating multi-variable detection
Technical Field
The invention relates to an actuating mechanism, in particular to a multi-degree-of-freedom compliant micro-gripper integrating multivariate detection.
Background
In recent years, with the rapid development of the microelectronic industry, micro mechanical structures are more and more abundant, so that the requirements for micro mechanical assembly are more and more strict, and great challenges are brought to the quality and efficiency of micro assembly and micro operation. The micro-clamper is a key part of a micro-machine or a micro-electro-mechanical system as an actuating mechanism, and plays an important role in the fields of precision mechanical engineering, micro-machine assembly, micro-machining, precision optical engineering, optical fiber butt joint and the like. The micro-gripper can be used to grasp tiny objects, and its performance and quality will directly affect the effect of the micro-operating system.
The driving method of the micro-gripper can be mainly divided into electromagnetic driving, electrothermal driving, piezoelectric driving, memory alloy driving and electrostatic driving. Compared with the advantages and disadvantages of the piezoelectric micro-gripper, the piezoelectric micro-gripper has the advantages of high dynamic response speed, stable output displacement, large output force, high precision and high resolution, and the micro-gripper driven by the piezoelectric micro-gripper becomes a research hotspot. In addition, when the tasks of micro-operation and micro-assembly are carried out, the clamped object is irregular in shape and large in size, so that the phenomenon of relative sliding between the chuck and the clamped object is caused, the operation precision is further influenced, and the clamped object is also damaged. Therefore, there is a need for a micro-gripper with translational output and high resolution. In the clamping process, in order to keep the clamping precision and the clamping effectiveness, the clamping force and the clamping displacement of the clamping device need to be detected and feedback controlled. The operation space of the micro-gripper is limited, the whole size cannot be too large, the tail end clamping arm of the micro-gripper is required to have a large movement range, the existing micro-gripper has more single freedom and two degrees of freedom, the stroke is small, and the operation requirement cannot be well met.
Disclosure of Invention
The invention provides a multi-degree-of-freedom compliant micro-gripper integrating multivariate detection to overcome the defects of the prior art. The micro-gripper is stable in clamping, can realize the operation of complex tasks, and has various motion postures and larger stroke.
The technical scheme of the invention is as follows:
the multi-degree-of-freedom compliant micro gripper integrating multivariable detection comprises a capacitive displacement sensor, a capacitive force sensor, a piezoelectric micro-motion platform and a piezoelectric micro gripper, wherein the piezoelectric micro gripper is installed on the piezoelectric micro-motion platform, the capacitive displacement sensor and the capacitive pressure sensor are three-degree-of-freedom sensors with the same structure, the capacitive displacement sensor and the capacitive force sensor are installed on the piezoelectric micro gripper, the capacitive displacement sensor is used for detecting the displacement of a clamping end of the piezoelectric micro gripper, and the capacitive force sensor is used for detecting the external interference force applied to the piezoelectric micro gripper and the clamping force of the clamping end; the piezoelectric micro-motion platform comprises a base, an amplifying mechanism and a working platform; a plurality of amplifying mechanisms are fixedly connected to the base, the working platform is installed on the amplifying mechanisms, and the amplifying mechanisms are uniformly distributed along the circumferential direction of the supporting disc and fixedly connected to the outer side face of the supporting disc.
Furthermore, each amplifying structure comprises a first piezoelectric stacking driver, a second piezoelectric stacking driver, a first guide amplifying rod, a second guide amplifying rod, a third guide amplifying rod, a first support rod, a second support rod and a support chassis;
the second guide amplification rod is arranged below the first guide amplification rod and the third guide amplification rod, a second piezoelectric stack driver connected with the second guide amplification rod and the second support chassis is arranged between the second guide amplification rod and the second support chassis, a first piezoelectric stack driver and a first support rod connected with the first guide amplification rod and the second support rod are arranged between the first guide amplification rod and the second support chassis, the second guide amplification rod and the first support rod are respectively connected with the first guide amplification rod through flexible hinges, the second guide amplification rod and the second support rod are respectively connected with the third guide amplification rod through flexible hinges, and the tail end of the third guide amplification rod is fixedly connected with a spherical hinge.
Furthermore, the piezoelectric micro clamp comprises a first clamping unit, a second clamping unit and a third clamping unit, the three clamping units are connected and uniformly distributed along the circumferential direction, the first clamping unit and the second clamping unit have the same structure and can independently output displacement, the third clamping unit is different from the first clamping unit or the second clamping unit in structure, and the third clamping unit does not output displacement.
Compared with the prior art, the invention has the beneficial effects that:
1. the compliant micro-gripper of the present invention has a total of six degrees of freedom. The piezoelectric micro-motion platform has four degrees of freedom, can realize translational output along the direction of a z axis, and can rotate clockwise and anticlockwise around the connecting line of the top points of each spherical hinge and the parallel line of the top points of each spherical hinge; and the piezoelectric micro clamp arranged on the piezoelectric micro platform is provided with two movable clamping arms, so that two-degree-of-freedom output can be realized, and the piezoelectric micro clamp can be independently driven and controlled.
2. The piezoelectric micro clamp provided by the invention is provided with three clamping parts, so that the clamping is more stable, the relative slippage phenomenon between the chuck and the operated object is prevented, and the operation of complex tasks is realized.
3. The invention integrates the large-scale detection of the position, the clamping force and the external interference force in three directions, can carry out real-time detection, is convenient for carrying out micro-operation, and improves the precision and the efficiency. When measuring each variable, two or more sensors are arranged at different positions, and if the measuring range of one sensor is exceeded, the other sensor can be used for measuring.
Drawings
FIG. 1 is a perspective view from the front side of a multi-degree-of-freedom compliant micro-gripper with integrated multivariate detection of the present invention;
FIG. 2 is a perspective view of the multi-degree of freedom compliant micro-gripper of the present invention with integrated multivariate detection as seen from the gripping end;
FIG. 3 is a schematic view of a decoupling mechanism of the piezoelectric micro-gripper of the present invention;
FIG. 4 is an overall schematic view of three magnifying mechanisms disposed on the support disk;
FIG. 5 is a schematic plan view of a single enlarged mechanism;
FIG. 6 is a perspective view of a piezoelectric micro-gripper;
FIG. 7 is a front view of a piezoelectric micro-gripper;
FIG. 8 is a schematic view of a clamping unit of a piezoelectric micro-gripper;
FIG. 9 is an overall schematic diagram of a three-degree-of-freedom capacitive/force sensor;
FIG. 10 is a schematic diagram of an electrode layout of a three-degree-of-freedom capacitive/force sensor;
FIG. 11 is a functional schematic of an enlarged mechanism having four double-slit flexible hinges;
figure 12 is a schematic diagram of the wire-cutting principle of a piezoelectric micro-jaw with eight leaf-hinge plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 5, the multi-variable detection integrated multi-degree-of-freedom compliant micro gripper in the present embodiment includes a capacitive displacement sensor 5, a capacitive pressure sensor 6, a piezoelectric micro-motion platform and a piezoelectric micro clamp 4, where the piezoelectric micro clamp is mounted on the piezoelectric micro-motion platform, the capacitive displacement sensor 5 and the capacitive pressure sensor 6 are both three-degree-of-freedom sensors with the same structure, the capacitive displacement sensor 5 and the capacitive pressure sensor 6 are mounted on the piezoelectric micro clamp 4, the capacitive displacement sensor 5 is used for detecting displacement of a clamping end of the piezoelectric micro clamp 4, and the capacitive pressure sensor 6 is used for detecting external interference force applied to the piezoelectric micro clamp 4 and clamping force of the clamping end; the piezoelectric micromotion platform comprises a base 1, an amplification mechanism 2 and a working platform 3; the base 1 is fixedly connected with a plurality of amplification mechanisms 2, the working platform 3 is installed on the amplification mechanisms 2, and the amplification mechanisms 2 are uniformly distributed along the circumferential direction of the supporting disc 219 and fixedly connected to the outer side face of the supporting disc 219.
Further, as shown in fig. 4 and 5, each of the amplifying structures 2 includes a first piezoelectric stack driver 214, a second piezoelectric stack driver 215, a first guiding amplifying rod 211, a second guiding amplifying rod 212, a third guiding amplifying rod 213, a first supporting rod 216, a second supporting rod 217, and a supporting base frame 218; the second guide amplification rod 212 is arranged below the first guide amplification rod 211 and the third guide amplification rod 213, the second piezoelectric stack driver 215 connected with the second guide amplification rod 212 and the supporting bottom frame 218 is arranged between the first guide amplification rod 211 and the supporting bottom frame 218, the first piezoelectric stack driver 214 and the first supporting rod 216 connected with the first guide amplification rod 211 and the supporting bottom frame 218 are arranged between the first guide amplification rod 211 and the supporting bottom frame 218, the second guide amplification rod 212 and the first supporting rod 216 are respectively connected with the first guide amplification rod 211 through flexible hinges B, the second guide amplification rod 212 and the second supporting rod 217 are respectively connected with the third guide amplification rod 213 through flexible hinges B, and the tail end of the third guide amplification rod 213 is fixedly connected with a spherical hinge A.
Screw holes are formed in the support chassis 218, and screws may be used to connect the base 1 to the support chassis 218 through the first, second, and third screw holes C1, C2, and C3.
As shown in fig. 11, the slits of the enlargement mechanism 2 are obtained by wire cutting, and for convenience of description, the flexible hinges B are divided into a first flexible hinge B1, a second flexible hinge B2, a third flexible hinge B3, and a fourth flexible hinge B4; and are double-notch flexible hinges.
The area enclosed by the first guide amplifying rod 211, the first support rod 216, the first flexible hinge B1, the support chassis 218 and the support disc 219 is a first cutting gap; the area surrounded by the first support rod 216, the second support rod 217, the first guide amplifying rod 211, the second guide amplifying rod 212, the third guide amplifying rod 213, the support underframe 218, the first flexible hinge B1, the second flexible hinge B2, the third flexible hinge B3 and the fourth flexible hinge B4 is a second cutting gap; the circular area enclosed by the center of the support disc 219 is the third cutting slit.
As shown in fig. 5 and 11, in the working condition of a single amplification mechanism, preferably, three amplification mechanisms 2 having the same structure are uniformly distributed on the support disc 219 and are defined as a first amplification mechanism 21, a second amplification mechanism 22 and a third amplification mechanism 23 for convenience of description, and the first amplification mechanism 21 is taken as an example, and the amplification mechanism includes a two-stage amplification mechanism and a three-stage amplification mechanism. The second-stage amplification mechanism is composed of a second piezoelectric stack driver 215, a first guide amplification rod 211, a second guide amplification rod 212, a third guide amplification rod 213, a first support rod 216, a second support rod 217, a second flexible hinge B2, a third flexible hinge B3 and a fourth flexible hinge B4, and in the second-stage amplification process, the first guide amplification rod 211, the first support rod 216 and the second support rod 217 cannot move and are only used for supporting other rod pieces, so that when the second piezoelectric stack driver 215 is electrified and elongated, the second guide amplification rod 212 moves and rotates around the second flexible hinge B2 which connects the first guide amplification rod 211 and the second guide amplification rod 212, and the first-stage amplification can be realized; then the second guiding amplifying lever 212 rotates so that the third guiding amplifying lever 213 rotates around the third flexible hinge B3 connecting the second guiding amplifying lever 212 and the third guiding amplifying lever 213, thereby realizing the second-stage amplification. In addition, the three-stage amplification mechanism is composed of a first piezoelectric stack driver 214, a second piezoelectric stack driver 215, a first guide amplification rod 211, a second guide amplification rod 212, a third guide amplification rod 213, a first support rod 216, a second support rod 217, a support chassis 218, a first flexible hinge B1, a second flexible hinge B2, a third flexible hinge B3 and a fourth flexible hinge B4 which are connected with the first guide amplification rod 211, the second support rod 216, the second support rod 217 and the second piezoelectric stack driver 215, wherein the support chassis 218, the first support rod 216, the second support rod 217 and the second piezoelectric stack driver 215 are not moved and are only used for supporting other rod pieces in the three-stage amplification process, so that when the first piezoelectric stack driver 214 is electrified and elongated, the first guide amplification rod 211 rotates around the first flexible hinge B1 which is connected with the first guide amplification rod 211 and the first support rod 216, so as to realize; then, the first guide amplification rod 211 rotates to enable the second guide amplification rod 212 to rotate around a second flexible hinge B2 connecting the first guide amplification rod 211 and the second guide amplification rod 212 in the next step, and secondary amplification is achieved; finally, the rotation of the second guiding amplifying rod 212 enables the third guiding amplifying rod 213 to rotate around the fourth flexible hinge B4 connecting the third guiding amplifying rod 213 and the second supporting rod 217, and three-level amplification is achieved. In addition to the two-stage amplification mechanism and the three-stage amplification mechanism operating independently, they can also cooperate, when the first piezoelectric stack driver 214 and the second piezoelectric stack driver 215 are simultaneously energized, first energizing and extending the first piezoelectric stack driver 214 causes the first pilot amplification rod 211 to rotate around the first flexible hinge B1 connecting the first pilot amplification rod 211 and the first support rod 216, and then energizing and extending the second piezoelectric stack driver 215 causes the second pilot amplification rod 212 to rotate around the second flexible hinge B2 connecting the second pilot amplification rod 211 and the second pilot amplification rod 212. In this case, the second guiding amplifying rod 212 is stressed upwards by the extension of the second piezoelectric stack driver 215 and stressed downwards by the rotation of the first guiding amplifying rod 211, which can increase the amplification factor cooperatively, so that the working platform 3 has a larger working range. The piezoelectric micromotion platform does translational motion along the z axis. At the moment, the three piezoelectric stack drivers work simultaneously, and when the three piezoelectric stack drivers are electrified, deformed and elongated, and the deformation elongation is the same, the three amplifying mechanisms 2 all move, and then the output quantity is transmitted to the working platform 3 through the three spherical hinges A, so that the working platform 3 can be translated and output along the z axis.
The piezoelectric micro-motion platform rotates. For ease of illustration, the ball hinge a is divided into a first ball hinge a1, a second ball hinge a2, and a third ball hinge B3. At this time, if only one piezoelectric stack driver works, the rotation motion is one: the second piezoelectric stack driver 215 in the first amplifying mechanism 21 is electrified, deformed and extended, and the output displacement is transmitted to the working platform 3 through the first spherical hinge a1, so that the working platform 3 can rotate around a connecting line of vertexes corresponding to the second spherical hinge a2 and the third spherical hinge A3; and (2) rotating movement II: the second piezoelectric stack driver 215 in the second amplifying mechanism 22 is electrified, deformed and extended, and the output displacement is transmitted to the working platform 3 through the second spherical hinge a2, so that the working platform 3 can rotate around a connecting line of vertexes corresponding to the first spherical hinge a1 and the third spherical hinge A3; and (3) rotating movement: the second piezoelectric stack driver 215 in the third amplifying mechanism 23 is electrically deformed and extended, and the output displacement is transmitted to the working platform 3 through the third spherical hinge A3, so that the working platform 3 can rotate around the connecting line of the corresponding vertexes of the first spherical hinge a1 and the second spherical hinge a 2.
If two piezoelectric drivers work simultaneously, the rotation movement is four: the first amplification mechanism 21 and the second amplification mechanism 22 work simultaneously, and output displacement is transmitted to the working platform 3 through the first spherical hinge A1 and the second spherical hinge A2, so that the working platform 3 can rotate around a parallel line of connecting points corresponding to the first spherical hinge A1 and the second spherical hinge A2 at the third spherical hinge A3; and (5) rotating: the second amplification mechanism 22 and the third amplification mechanism 23 work simultaneously, and output displacement is transmitted to the working platform 3 through the second spherical hinge A2 and the third spherical hinge A3, so that the working platform 3 can rotate on the first spherical hinge A1 around a connecting line of vertexes corresponding to the second spherical hinge A2 and the third spherical hinge; and (6) rotating movement six: the first amplification mechanism 21 and the third amplification mechanism 23 work simultaneously, and the output displacement is transmitted to the working platform 3 through the first spherical hinge A1 and the third spherical hinge A3, so that the working platform 3 can rotate around a parallel line of a connecting line of vertexes corresponding to the first spherical hinge A1 and the third spherical hinge A3 at the second spherical hinge A2.
Further, the piezoelectric micro-motion platform can be comprehensively obtained, and can realize forward and reverse rotation of a connecting line of corresponding vertexes of the first spherical hinge A1 and the second spherical hinge A2, a connecting line of corresponding vertexes of the second spherical hinge A2 and the third spherical hinge A3, a connecting line of corresponding vertexes of the first spherical hinge A1 and the third spherical hinge A3 and parallel lines thereof, and also can realize translation output along the z axis; further, the piezoelectric micro-motion stage has 4 degrees of freedom, which can provide more degrees of freedom for the piezoelectric micro-gripper 4.
As shown in fig. 6 and 7, the piezoelectric micro-gripper 4 includes a first clamping unit 41, a second clamping unit 42, and a third clamping unit 43, the three clamping units are connected and uniformly arranged along the circumferential direction, the first clamping unit 41 and the second clamping unit 42 have the same structure and can independently output displacement, the third clamping unit 43 has a different structure from the first clamping unit 41 or the second clamping unit 42, and the third clamping unit 43 does not output displacement.
Preferably, as shown in fig. 7, the first clamping unit 41 comprises a supporting frame 411, a supporting rod three 415, a flexible parallelogram mechanism one 416 and a supporting bottom rod 412, a supporting rod four 417, a movable clamping part 418 and a clamping amplification mechanism; the supporting rod III 415 and the supporting bottom rod 412 are respectively connected with the supporting frame 411, the supporting frame 411 is fixedly connected to the upper surface of the working platform 3, the clamping amplification mechanism is fixedly connected to the supporting bottom rod 412, the clamping amplification mechanism is connected with the flexible parallelogram mechanism I416 through a flexible hinge, the output end of the flexible parallelogram mechanism I416 is respectively connected with the supporting rod IV 417 and the movable clamping part 418, the capacitive pressure sensor 6 is arranged between the supporting rod IV 417 and the movable clamping part 418, and the capacitive displacement sensor 5 is arranged between the supporting rod III 415 and the flexible parallelogram mechanism I416.
Further, as shown in fig. 7, the clamping amplification mechanism is a bridge amplification mechanism, and the bridge amplification mechanism comprises a pair of support arms 414 arranged longitudinally and two sets of guide amplification rod assemblies 413 arranged transversely; a piezoelectric stack driver III 419 is fixedly connected between the two supporting arms 414, the piezoelectric stack driver III 419 deforms in the transverse direction, the two groups of guide amplification rod assemblies 413 are respectively positioned on two sides of the piezoelectric stack driver III 419, and the guide amplification rod assembly 413 on each side is provided with an upper side rod, a middle rod and a lower side rod; one end of the upper side rod and the lower side rod is connected with the middle rod through a flexible hinge B, the other end of the upper side rod and the lower side rod is connected with the support arm 414 through a flexible hinge B, and the middle rod is parallel to the third 419 piezoelectric stack driver; the middle rod of one group of guide amplifying rod assemblies 413 is fixedly connected with the supporting bottom rod 412, and the middle rod of the other group of guide amplifying rod assemblies 413 is used as an output piece of the amplifying mechanism and is connected with a first flexible parallelogram mechanism 416 through an output flexible hinge D.
As shown in fig. 7, the piezoelectric micro-gripper 4 can be divided into three clamping units, namely a first clamping unit 41, a second clamping unit 42 and a third clamping unit 43, and adjacent single clamping units are preferably arranged at 120 degrees. The first clamping unit 41 is the same as the second clamping unit 42 and can be driven and controlled independently; the third clamping unit 43 is different from the first clamping unit 41 and the second clamping unit 42, and the third clamping unit 43 is fixed.
Piezo stack driver three 419 deforms in the transverse direction and, when assembled, piezo stack driver three 419 is secured to the bridge amplification mechanism by screws. Two groups of guide amplifying rod assemblies are respectively positioned on two sides of the third 419 of the piezoelectric stack driver, and the two sides of the piezoelectric stack driver are respectively divided into an upper side rod, a middle rod and a lower side rod; one end of the upper side rod and the lower side rod is connected with the middle rod through a flexible hinge B, the other end of the upper side rod and the lower side rod is connected with the support arm 414 through a flexible hinge B, and the middle rod is hinged with the piezoelectric stack driver III 419 through the upper side rod and the lower side rod and is parallel to the piezoelectric stack driver III 419; the middle rod of the other group of guide amplifying rod assemblies is fixed with the supporting bottom rod 412, and the middle rod of the one group of guide amplifying rod assemblies is connected with a first flexible parallelogram mechanism 416 as an output piece of the amplifying mechanism. One end of the flexible parallelogram mechanism 416 is connected with a support bar four 417 and a movable clamping part 418.
Further, as shown in fig. 8, the third clamp unit 43 includes a support bottom rod 431, a decoupling mechanism 432, and a fixed clamp member 433; the supporting bottom rod 431 is connected with the supporting frame 411, the supporting bottom rod 431 is connected with a decoupling mechanism 432, the decoupling mechanism 432 is of a structure symmetrical about a central line and comprises a mouth-shaped platform 4321, supporting short-side rods 4322, supporting side rods 4323, a supporting upper rod 4324 and a supporting bottom rod 4325, the supporting short-side rods 4322, the supporting bottom rod 4325, the supporting side rods 4323 and the supporting upper rod 4324 are sequentially connected to form a frame body, the mouth-shaped platform 4321 is connected with the frame body through four flexible parallelogram mechanisms II, and the mouth-shaped platform 4321 is connected with a fixed clamping part 433.
As shown in fig. 8, four second flexible parallelogram mechanisms are uniformly arranged at corners of the second edge type platform 4321, each second flexible parallelogram mechanism is a parallelogram mechanism composed of leaf-shaped hinge thin plates E, a follower block 4326 is respectively installed at opposite corners of the parallelogram mechanism, and a capacitive force sensor 6 is arranged between the frame and two adjacent leaf-shaped hinge thin plates E in each parallelogram mechanism. Above-mentioned technical scheme has big centre gripping scope, has great stroke. The output displacement driven by the piezoelectric stack driver is amplified and guided by the bridge type amplifying mechanism and the parallelogram mechanism, so that the large-stroke and six-degree-of-freedom output of the piezoelectric micro clamp 4 is ensured.
As shown in fig. 7, 8 and 12, the piezoelectric micro-gripper is obtained by wire cutting, and the area enclosed by the support frame 411, the support bottom rod 412, the first flexible parallelogram mechanism 416, the bridge amplification mechanism and the flexible hinge D is a first cutting slit; the area enclosed by the clamping component 418, the first flexible parallelogram mechanism 416, the flexible hinge D, the bridge amplification mechanism and the support bottom rod 412 is a second cutting gap; the area surrounded by the third support rod 415, the support frame 411, the first flexible parallelogram mechanism 416 and the fourth support rod 417 is a third cutting gap; the area enclosed by the support bar four 417, the flexible parallelogram mechanism one 416 and the clamping part 418 is a fourth cutting slit; the area enclosed by the upper side rod, the middle rod, the lower side rod, the support arm 414 and the flexible hinge B connected between the support arm and the support arm is a fifth cutting gap; the area inside the first flexible parallelogram mechanism 416 is a sixth cutting slit, the cutting of the clamping unit 41 is completed at this time, and the cutting of the clamping unit 42 is completed in the same way; the area enclosed by the support bottom rod 431, the decoupling mechanism 432 and the fixed clamping component 433 is a seventh cutting slit.
For convenience of illustration, as shown in fig. 12, the leaf-type flexible hinge plate E is divided into a first leaf-type hinge plate E1, a second leaf-type hinge plate E2, a third leaf-type hinge plate E3, a fourth leaf-type hinge plate E4, a fifth leaf-type hinge plate E5, a sixth leaf-type hinge plate E6, a seventh leaf-type hinge plate E7, and an eighth leaf-type hinge plate E8, which have the same structure.
A region surrounded by the first leaf-shaped hinge thin plate E1, the second leaf-shaped hinge thin plate E2, the follow-up block 4326, the mouth-shaped platform 4321 and the supporting side rod 4323 is an eighth cutting slit; the area enclosed by the first leaf-shaped hinge thin plate E1, the second leaf-shaped hinge thin plate E2, the third leaf-shaped hinge thin plate E3, the fourth leaf-shaped hinge thin plate E4 and the follower block 4326 is a ninth cutting slit; a tenth cutting slit is formed in an area surrounded by the third leaf-shaped hinge thin plate E3, the fourth leaf-shaped hinge thin plate E4, the fifth leaf-shaped flexible hinge thin plate E5, the sixth leaf-shaped hinge thin plate E6, the follower block 4326, the mouth-shaped platform 4321 and the support bottom rod 4325; the area enclosed by the fifth leaf-shaped hinge sheet E5, the sixth leaf-shaped hinge sheet E6, the seventh leaf-shaped hinge sheet E7, the eighth leaf-shaped hinge sheet E8 and the follower block 4326 is an eleventh cut slit; a region surrounded by the seventh leaf-shaped hinge sheet E7, the eighth leaf-shaped hinge sheet E8, the follower block 4326, the support short side bar 4322, the fixed clamping part 433 and the mouth-shaped platform 4321 is a twelfth cutting slit, and the upper part of the decoupling mechanism 432 is line-cut according to the method from the eighth cutting slit to the twelfth cutting slit because the decoupling mechanism 432 is symmetrical about the center line; the middle die region of the die table 4321 is the thirteenth cutting slit. The structure adopts the linear cutting processing to adopt flexible hinged joint, have no friction, the direction precision is high, guarantee high machining precision's advantage.
When the micro-gripper works, taking the first clamping unit 41 as an example, the piezoelectric stack driver III 419 is electrified to deform and extend, the supporting arms 414 on the two sides of the piezoelectric stack driver III 419 are pushed outwards, the guide amplifying rod component 413 rotates around the flexible hinge B, so that the flexible parallelogram mechanism I416 hinged with the guide amplifying rod component moves along with the guide amplifying rod component 413, the output displacement is amplified for one time through the bridge type amplifying mechanism, and then amplified for the second time through the flexible parallelogram mechanism I416, so that the clamping arms are driven and controlled, and the degree of freedom of the movable clamping component 418 in the corresponding displacement direction is ensured. Since both the first and second holding units 41 and 42 have the bridge amplification mechanism, the piezoelectric micro-gripper 4 is ensured to have two degrees of freedom in directions. Since the piezoelectric micro-gripper 4 has three gripping members and can achieve driving and control of the two movable gripping members 418, the piezoelectric micro-gripper 4 is more stable when operating on small objects.
Further, in each parallelogram mechanism connected to the short support side bars 4322 of the frame, the connecting lines of the two diagonal follower blocks 4326 are arranged diagonally upward and crosswise, and in each parallelogram mechanism connected to the support side bars 4323 of the frame, the connecting lines of the two diagonal follower blocks 4326 are arranged diagonally downward and crosswise. So set up, simple structure, reasonable in design, convenient operation.
As shown in fig. 9 and 10, the capacitive displacement sensor 5 and the capacitive force sensor 6 provided in the four flexible parallelogram mechanisms ii have the following specific structures: the capacitive displacement sensor 5 and the capacitive force sensor 6 comprise an upper element 51 and a lower element 52; a columnar capacitive sensor is fixedly connected to the middle of the upper element 51, the lower element 52 is a hollow column, the columnar capacitive sensor is sleeved in the hollow column, four second electrodes G2 are fixedly and radially distributed on the inner cylindrical surface of the hollow column, the length of each second electrode G2 is smaller than that of the columnar capacitive sensor, four first electrodes G1 are fixedly and uniformly distributed on the upper end surface of the lower element 52 adjacent to the lower end surface of the upper element 51, a third electrode G3 corresponding to the first electrode G1 is arranged on the lower end surface of the upper element 51, the third electrode G3 covers the first electrode G1 of the lower element 51 in size, and the upper element is separated from the columnar capacitive sensor;
in the first clamping unit 41 and the second clamping unit 42, the outer end face of the upper element 51 of the capacitive displacement sensor 5 is connected with a third supporting rod 415, and the bottom end face of the lower element 51 is connected with a first flexible parallelogram mechanism 416; the outer end face of the upper element 51 of the capacitive force sensor 6 is connected with a support rod four 417, and the bottom end face of the lower element 52 is connected with a movable clamping part 418;
or the outer end face of the upper element 51 is connected with a first flexible parallelogram mechanism 416, and the bottom end face of the lower element 51 of the capacitive displacement sensor 5 is connected with a third support rod 415; the outer end surface of the upper element 51 of the capacitive force sensor 6 is connected to the movable clamping member 418, and the bottom end surface of the lower element 52 is connected to the support bar four 417.
In the third clamp unit 43, the outer end surface of the upper element 51 of the capacitive force sensor 6 is connected to the frame, and the bottom end surface of the lower element 52 is connected to the leaf-shaped flexible hinge sheet E.
As shown in fig. 9 and 10, a three-degree-of-freedom capacitive/force sensor includes an upper element 51 and a lower element 52. The middle part of the upper element 51 is fixedly connected with a columnar capacitance sensor, and the basic principle is as follows: the inner cylindrical surface of the lower element 52 is provided radially with four second electrodes G2 and at the end surfaces with four first electrodes G1, the lower end surface of the upper element 51 is provided with a corresponding third electrode G3, and the first electrode G1 is sized to cover the end surfaces of the lower element 52 and is spaced apart from the pillar-shaped capacitive sensor. The electrodes are uniformly distributed. When the upper element 51 moves along the x-axis, its four radial capacitances change; when the upper element 51 moves in the y-axis, its four radial capacitances change; when the upper element 51 moves along the z-axis, its four end face capacitances change. The expression for the capacitance is:
Figure BDA0002317781590000091
Figure BDA0002317781590000092
wherein epsilon is a constant, S is the area opposite to the capacitor plate, d is the distance of the capacitor plate, and k is the constant of the electrostatic force. The capacitance displacement/force sensor changes the capacitance by changing the distance between the electrodes, and the variation of the distance between the electrodes is calculated according to the variation of the capacitance. When the sensor is connected to the industrial personal computer through the PCI board card by the A/D, the industrial personal computer can detect the displacement or clamping force or external interference force to be measured by the sensor through the change of the capacitance. The displacement sensor and the force sensor have the same structure, and only have slightly different shapes and sizes. The sensor is based on the application number: 2010105369635 is optimized.
Further, two three-degree-of-freedom capacitive force sensors 6 are respectively arranged in the decoupling mechanism 432 of the micro-clamp between the leaf-shaped hinge thin plate E and the supporting upper rod 4324 and between the leaf-shaped hinge thin plate and the supporting short side rod 4322, and can detect external interference forces in the x, y and z directions in real time.
Further, two capacitive displacement sensors 5 are installed between the support bar 415 of the micro-gripper and the first flexible parallelogram mechanism 416, and two capacitive force sensors 6 are installed between the support bar 417 and the movable clamping member 418.
In practical use, the four degrees of freedom provided by the piezoelectric micro-motion platform at the lower part and the two degrees of freedom provided by the bridge type amplification mechanism in the two clamping parts of the piezoelectric micro-clamp 4 enable the multi-degree-of-freedom flexible micro-clamp disclosed by the invention to have six degrees of freedom altogether, a micro object can be operated more flexibly, a larger clamping range is possessed, and meanwhile, the three clamping parts enable the micro object to be more stable and reliable in the clamping process.
Further, the capacitive displacement sensor 5 installed on the micro clamp can clamp displacement, the capacitive force sensor 6 installed can measure the change of clamping force in the clamping process, each group is provided with two sensors, the problem that one end sensor cannot measure due to overranging is solved, and 4 capacitive force sensors in the decoupling mechanism 432 are shown in fig. 3, the influence of external interference force on the micro clamp in the directions of three degrees of freedom of x, y and z can be known in detail, and the operation process is more accurate and stable.
The present invention is not limited to the above embodiments, and any person skilled in the art can make many modifications and equivalent variations by using the above-described structures and technical contents without departing from the scope of the present invention.

Claims (10)

1. The multi-degree-of-freedom compliant micro gripper integrating multivariate detection is characterized in that: the piezoelectric micro clamp comprises a capacitive displacement sensor (5), a capacitive force sensor (6), a piezoelectric micro-motion platform and a piezoelectric micro clamp (4), wherein the piezoelectric micro clamp is arranged on the piezoelectric micro-motion platform, the capacitive displacement sensor (5) and the capacitive pressure sensor (6) are three-degree-of-freedom sensors with the same structure, the capacitive displacement sensor (5) and the capacitive force sensor (6) are arranged on the piezoelectric micro clamp (4), the capacitive displacement sensor (5) is used for detecting the displacement of a clamping end of the piezoelectric micro clamp (4), and the capacitive force sensor (6) is used for detecting the external interference force of the piezoelectric micro clamp (4) and the clamping force of the clamping end;
the piezoelectric micromotion platform comprises a base (1), an amplification mechanism (2) and a working platform (3); a plurality of amplification mechanisms (2) are fixedly connected to the base (1), the working platform (3) is installed on the amplification mechanisms (2), and the amplification mechanisms (2) are uniformly arranged along the circumferential direction of the supporting disc (219) and fixedly connected to the outer side face of the supporting disc (219).
2. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 1, wherein:
each amplifying structure (2) comprises a first piezoelectric stack driver (214), a second piezoelectric stack driver (215), a first guide amplifying rod (211), a second guide amplifying rod (212), a third guide amplifying rod (213), a first support rod (216), a second support rod (217) and a support bottom frame (218);
the second guide amplification rod (212) is arranged below the first guide amplification rod (211) and the third guide amplification rod (213), the second piezoelectric stack driver (215) connected with the second guide amplification rod is arranged between the second guide amplification rod (212) and the supporting bottom frame (218), the first piezoelectric stack driver (214) and the first supporting rod (216) connected with the first guide amplification rod are arranged between the first guide amplification rod (211) and the supporting bottom frame (218), the second guide amplification rod (212) and the first supporting rod (216) are respectively connected with the first guide amplification rod (211) through flexible hinges (B), the second guide amplification rod (212) and the second supporting rod (217) are respectively connected with the third guide amplification rod (213) through flexible hinges (B), and the tail end of the third guide amplification rod (213) is fixedly connected with a spherical hinge (A).
3. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 2, wherein:
the piezoelectric micro-gripper 4 comprises a first clamping unit 41, a second clamping unit 42 and a third clamping unit 43, the three clamping units are connected and uniformly distributed along the circumferential direction, the first clamping unit 41 and the second clamping unit 42 have the same structure and can independently output displacement, the third clamping unit 43 is different from the first clamping unit 41 or the second clamping unit 42 in structure, and the third clamping unit 43 does not output displacement.
4. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 3, wherein: the first clamping unit 41 comprises a support frame 411, a support rod three 415, a flexible parallelogram mechanism 416, a support bottom rod 412, a support rod four 417, a movable clamping part 418 and a clamping amplification mechanism; the supporting rod III 415 and the supporting bottom rod 412 are respectively connected with the supporting frame 411, the supporting frame 411 is fixedly connected to the upper surface of the working platform 3, the clamping amplification mechanism is fixedly connected to the supporting bottom rod 412, the clamping amplification mechanism is connected with the flexible parallelogram mechanism I416 through a flexible hinge, the output end of the flexible parallelogram mechanism I416 is respectively connected with the supporting rod IV 417 and the movable clamping part 418, the capacitive pressure sensor 6 is arranged between the supporting rod IV 417 and the movable clamping part 418, and the capacitive displacement sensor 5 is arranged between the supporting rod III 415 and the flexible parallelogram mechanism I416.
5. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 4, wherein: the clamping amplification mechanism is a bridge amplification mechanism, and the bridge amplification mechanism comprises a pair of support arms (414) which are longitudinally arranged and two groups of guide amplification rod assemblies (413) which are transversely arranged; a third piezoelectric stack driver (419) is fixedly connected between the two supporting arms (414), the third piezoelectric stack driver (419) deforms in the transverse direction, the two groups of guide amplification rod assemblies (413) are respectively positioned on two sides of the third piezoelectric stack driver (419), and the guide amplification rod assembly (413) on each side is provided with an upper side rod, a middle rod and a lower side rod; one end of the upper side rod and the lower side rod is connected with the middle rod through a flexible hinge (B), the other end of the upper side rod and the lower side rod is connected with the supporting arm (414) through a flexible hinge (B), and the middle rod is parallel to the third piezoelectric stack driver (419); the middle rod of one group of guide amplifying rod assemblies (413) is fixedly connected with the supporting bottom rod (412), and the middle rod of the other group of guide amplifying rod assemblies (413) is used as an output piece of the amplifying mechanism and is connected with the first flexible parallelogram mechanism (416) through an output flexible hinge (D1).
6. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 4 or 5, wherein: the third clamping unit (43) comprises a support bottom rod (431), a decoupling mechanism (432) and a fixed clamping component (433); the support bottom rod (431) is connected with the support frame (411), the support bottom rod (431) is connected with a decoupling mechanism (432), the decoupling mechanism (432) is a structure symmetrical about a central line, and comprises a mouth-shaped platform (4321), a support short side rod (4322), a support side rod (4323), a support upper rod (4324) and a support bottom rod (4325), the support short side rod (4322), the support bottom rod (4325), the support side rod (4323) and the support upper rod (4324) are sequentially connected into a frame body, the mouth-shaped platform (4321) is connected with the frame body through four flexible parallelogram mechanisms II, and the mouth-shaped platform (4321) is connected with the fixed clamping part (433).
7. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 6, wherein: two edge type platforms (4321) of four flexible parallelogram mechanisms are uniformly distributed at corners, each flexible parallelogram mechanism is a parallelogram mechanism composed of leaf-shaped hinge thin plates (E), a follow-up block (4326) is respectively arranged at opposite angles of the parallelogram mechanism, and a capacitance type force sensor (6) is arranged between the frame body and two adjacent leaf-shaped hinge thin plates (E) in each parallelogram mechanism.
8. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 7, wherein: in each parallelogram mechanism connected with the supporting short side rod (4322) of the frame body, the connecting lines of two follow-up blocks (4326) at the opposite angles are arranged obliquely upwards in a crossed mode, and in each parallelogram mechanism connected with the supporting side rod (4323) of the frame body, the connecting lines of two follow-up blocks (4326) at the opposite angles are arranged obliquely downwards in a crossed mode.
9. The integrated multivariable detection multi-degree-of-freedom compliant micro-gripper of claim 8, wherein: the capacitive displacement sensor (5) and the capacitive force sensor (6) comprise an upper element (51) and a lower element (52); a columnar capacitive sensor is fixedly connected to the middle of the upper element (51), the lower element (52) is a hollow column, the columnar capacitive sensor is sleeved in the hollow column, four second electrodes (G2) are fixedly and radially distributed on the inner cylindrical surface of the hollow column, the length of each second electrode (G2) is smaller than that of the columnar capacitive sensor, four first electrodes (G1) are fixedly and uniformly distributed on the upper end surface of the lower element (52) adjacent to the lower end surface of the upper element (51), a third electrode (G3) corresponding to the first electrode (G1) is arranged on the lower end surface of the upper element (51), and the third electrode (G1) of the lower element (51) is covered in size and separated from the columnar capacitive sensor;
in the first clamping unit (41) and the second clamping unit (42), the outer end face of an upper element (51) of a capacitive displacement sensor (5) is connected with a third supporting rod (415), and the bottom end face of a lower element (51) is connected with a first flexible parallelogram mechanism (416); the outer end face of an upper element (51) of the capacitive force sensor (6) is connected with a support rod four (417), and the bottom end face of a lower element (52) is connected with a movable clamping part (418); in the third clamping unit (43), the outer end face of the upper element (51) of the capacitance type force sensor (6) is connected with the frame body, and the bottom end face of the lower element (52) is connected with the leaf-shaped flexible hinge thin plate (E).
10. The integrated multivariable detection compliant multi-degree of freedom micro-gripper of claim 5, 6, 7, 8, or 9, wherein: the flexible hinge (B) is a double-notch flexible hinge.
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