CN110977051B - Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product - Google Patents
Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product Download PDFInfo
- Publication number
- CN110977051B CN110977051B CN201911377549.1A CN201911377549A CN110977051B CN 110977051 B CN110977051 B CN 110977051B CN 201911377549 A CN201911377549 A CN 201911377549A CN 110977051 B CN110977051 B CN 110977051B
- Authority
- CN
- China
- Prior art keywords
- motor
- positioning
- screw rod
- product
- fixed plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000009713 electroplating Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims description 40
- 238000007599 discharging Methods 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to an electroplating anti-mixing method and an anti-mixing mark processing device for a semiconductor packaging product, which comprises the following steps: and processing the side edges of the lead frame of the packaged product to be electroplated by using a numerical control cutter to form a mark, and distinguishing product batches through the mark. The invention utilizes the numerical control cutter to process and treat the side edge of the lead frame of the packaged product to be electroplated to form the mark, and the mark is used for distinguishing batches of the product, so that the product is simple and effective, the mixed batch of the product is stopped from the product itself, and the method does not influence the structure and performance of the product because the side edge of the lead frame belongs to the part to be discarded in the post-treatment process.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an electroplating anti-mixing method and an anti-mixing mark processing device for a semiconductor packaging product.
Background
In the semiconductor packaging process, products are required to be distinguished from assembly batches due to different chip types, different chip batches, different production equipment machines, different production processes, different production materials, different turnover frame capacities and the like, and products of different assembly batches cannot be mixed with each other, so that the products are required to be accurately distinguished in the processing process.
At present, in order to prevent the products from being mixed in batches in the electroplating processing process, the modes of memory resolution, waste lead frame isolation and the like are generally adopted, but anti-mixing treatment cannot be accurately carried out on different batches of products with the same appearance, once the product batches are mixed, serious misjudgment is caused on the quality of the products, the screening of the products, the tracking of the products and the like, and serious economic loss is brought to manufacturers. Moreover, along with the requirement of environmental protection, the existing packaging factories generally do not perform electroplating treatment by themselves, but adopt a mode of outsourcing treatment to intensively entrust products to be electroplated to relevant electroplating manufacturers for treatment, and when the electroplating manufacturers receive electroplating orders of products in different batches of different packaging manufacturers, the anti-mixing management and control in the electroplating process is more complex and difficult.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an electroplating anti-mixing method for a semiconductor packaging product and an anti-mixing mark processing device.
In order to achieve the technical purpose, the technical scheme of the invention is as follows:
A method for preventing the electroplating of semiconductor package products from being mixed features that a numerical control cutter is used to process the side edge of the lead frame of the packaged product to be electroplated to form a mark, and the batches of products are distinguished by said mark.
Preferably, the mark is a line mark, a digital mark or a graphic mark.
Based on the method, the electroplating anti-mixing mark processing device for the semiconductor packaging product is designed and comprises a numerical control cutter, a carrying workpiece, a rack, a feeding mechanism, a positioning mechanism and a discharging mechanism, wherein the feeding mechanism, the positioning mechanism and the discharging mechanism are arranged on the rack; the carrying workpiece is used for accommodating a product to be electroplated; the feeding mechanism conveys the carrying workpiece to the lower part of the numerical control cutter and enables the side face of the lead frame of the product to be electroplated to face the cutter head of the numerical control cutter, the positioning mechanism is used for accurately positioning the carrying workpiece to enable the carrying workpiece to be matched with the machining area of the numerical control cutter, the numerical control cutter is used for machining marks on the side edge of the frame of the product to be electroplated, and the blanking mechanism conveys the machined product to be electroplated to the blanking position from the lower part of the numerical control cutter.
Preferably, the carrying workpiece comprises a horizontal bottom plate, wherein vertical baffles are arranged on three sides of the horizontal bottom plate, and the top edges of the vertical baffles on the opposite side groups are provided with turnover edges facing the direction of the horizontal bottom plate; the frame comprises a feeding platform and a discharging platform, wherein the feeding platform and the discharging platform are arranged in parallel, four corners of the feeding platform are connected with four corners of the discharging platform through supporting columns, and a group of side edges of the feeding platform along the length direction are provided with barrier strips; the feeding mechanism comprises a first guide rail, a first motor, a first screw rod nut and a first push rod, wherein the first guide rail is horizontally arranged on a central line of the feeding platform along the length direction, the first motor is arranged on the feeding platform, an output shaft is connected with one end of the first screw rod, the first screw rod is arranged in the first guide rail, the first screw rod nut is sleeved on the first screw rod, the top surface of the first screw rod nut is connected with the bottom of the first push rod, and the first push rod is horizontally arranged and perpendicular to the first guide rail; The positioning mechanism comprises a positioning motor, a first positioning cylinder and a second positioning cylinder, wherein the positioning motor and the second positioning cylinder are oppositely arranged and are respectively arranged at the end parts of the two barrier strips, which are far away from the first motor, the first positioning cylinder is arranged on the side edge of the feeding platform between the positioning motor and the second positioning cylinder, the output shaft of the positioning motor is connected with the first positioning strip, the piston end of the first positioning cylinder is connected with the second positioning strip, and the piston end of the second positioning cylinder is connected with the third positioning strip; the numerical control cutter is arranged on the blanking mechanism, and the cutter head is downward; The blanking mechanism comprises a horizontal connecting plate, a first fixed plate, a second fixed plate, two vertical guide posts, a second motor, a second screw rod nut, two horizontal supporting rods, a sliding connecting plate, a third motor, a third screw rod nut, a second push rod and a positioning sensor, wherein the horizontal connecting plate is horizontally connected to the side edge of the blanking platform below the positioning mechanism, a sliding groove is formed in the middle line of the horizontal connecting plate along the feeding direction, the first fixed plate and the second fixed plate are horizontally arranged and parallel to each other, the bottom surface of the first fixed plate is higher than the top surface of the feeding platform, the top surface of the second fixed plate is lower than the top surface of the blanking platform, The top of the two vertical guide posts are respectively connected to the bottom surface of the first fixed plate, the bottom of the two vertical guide posts are respectively connected to the top surface of the second fixed plate, the second motor is arranged on the top surface of the first fixed plate, the output shaft vertically penetrates out of the first fixed plate downwards, the second screw rod is vertically arranged, the top end of the second motor is connected with the output shaft of the second motor through a coupler, the bottom end of the second motor is fixed on the top surface of the second fixed plate through a bearing, the second screw rod nut is sleeved on the second screw rod, the two horizontal support rods are oppositely arranged, the sliding connection plate is vertically arranged, the middle part of the back surface of the second motor is connected with the second screw rod nut, the two sides of the front surface of the second motor are respectively connected with one ends of the two horizontal support rods, the two ends of the second motor are sleeved on the two vertical guide posts respectively, the third motor is installed on the bottom surface of the second fixed plate, the output shaft is horizontally arranged and faces the blanking platform, the third screw rod is horizontally arranged, one end of the third screw rod is connected with the output shaft of the third motor through a coupler, the other end of the third screw rod is fixed on the bottom surface of the horizontal connecting plate through a bearing, the third screw rod nut is sleeved on the third screw rod, the top surface of the third screw rod is connected with the bottom surface of the second push rod, the third screw rod nut is embedded in the sliding groove, the second push rod is horizontally arranged and protrudes out of the upper surface of the blanking platform vertically to the third screw rod, and the positioning sensor is installed on the side surface of the first fixed plate, facing the positioning mechanism.
From the above description, it can be seen that the present invention has the following advantages:
The invention utilizes the numerical control cutter to process and treat the side edge of the lead frame of the packaged product to be electroplated to form the mark, and the mark is used for distinguishing batches of the product, so that the product is simply and effectively prevented from being mixed, and the method does not influence the structure and the performance of the product because the side edge of the lead frame belongs to the part which needs to be abandoned in the post-treatment process.
The device provided by the invention has the advantages of simple structure, capability of realizing identification of the side edge of the lead frame of the product to be electroplated, safe operation, high reliability and low production cost.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
Fig. 2 is a schematic exploded view of the present invention.
Detailed Description
One embodiment of the present invention will be described in detail with reference to fig. 1 to 2, but does not limit the claims of the present invention in any way.
A method for preventing the electroplating of semiconductor package products from being mixed features that a numerical control cutter is used to process the side edge of lead frame of the packaged product to be electroplated to form a mark, and the mark is used to distinguish product batches.
Based on the method, the electroplating anti-mixing mark processing device for the semiconductor packaging product is designed.
As shown in fig. 1 and 2, a processing device for electroplating anti-mixing marks of a semiconductor packaging product is designed, and comprises a carrying workpiece 1, a rack 2, a feeding mechanism 3, a positioning mechanism 4, a numerical control cutter 5 and a discharging mechanism 6 which are arranged on the rack; the carrying workpiece 1 is used for accommodating a product 7 to be electroplated; the feeding mechanism 3 conveys the carrying workpiece 1 to the lower part of the numerical control cutter 5, the side face of the lead frame of the product 7 to be electroplated faces the cutter head of the numerical control cutter 5, the positioning mechanism 4 is used for accurately positioning the carrying workpiece to enable the carrying workpiece to be matched with the machining area of the numerical control cutter, the numerical control cutter 5 is used for machining marks on the side edge of the lead frame of the product 7 to be electroplated, and the discharging mechanism 6 conveys the machined product 7 to be electroplated to the discharging position from the lower part of the numerical control cutter 5.
According to the scheme, the specific design is as follows:
The carrying workpiece 1 comprises a horizontal bottom plate 101, wherein vertical baffles 102 are arranged on three sides of the horizontal bottom plate 101, and the top edges of the vertical baffles 102 on the opposite side groups are provided with turnover edges 1021 facing the direction of the horizontal bottom plate 101;
the frame 2 comprises a feeding platform 201 and a discharging platform 202, wherein the feeding platform 201 and the discharging platform 202 are arranged in parallel, four corners of the feeding platform are connected with four corners of the discharging platform through supporting columns 203, and a group of side edges of the feeding platform 201 along the length direction are provided with barrier strips 2011;
The feeding mechanism 3 comprises a first guide rail 301, a first motor 302, a first screw rod nut 303 and a first push rod 304, wherein the first guide rail 301 is horizontally arranged on the central line of the feeding platform along the length direction, the first motor 302 is arranged on the feeding platform 101, an output shaft is connected with one end of the first screw rod, the first screw rod is arranged in the first guide rail, the first screw rod nut 303 is sleeved on the first screw rod, the top surface of the first screw rod nut is connected with the bottom of the first push rod 304, and the first push rod 304 is horizontally arranged and perpendicular to the first guide rail 301;
The positioning mechanism 4 comprises a positioning motor 401, a first positioning cylinder 402 and a second positioning cylinder 403, the positioning motor 401 and the second positioning cylinder 403 are oppositely arranged and are respectively arranged at the end parts of the two baffle strips 2011 far away from the first motor 302, the first positioning cylinder 402 is arranged on the side edge of the feeding platform 101 between the positioning motor 401 and the second positioning cylinder 403, an output shaft of the positioning motor 401 is connected with a first positioning strip 404, a piston end of the first positioning cylinder 402 is connected with a second positioning strip 405, a piston end of the second positioning cylinder 403 is connected with a third positioning strip 406, and the first positioning strip 404, the second positioning strip 405 and the third positioning strip 406 are used for positioning a carrying workpiece from three directions;
The numerical control cutter 5 is arranged on the blanking mechanism 6 (in the example in the figure, the numerical control cutter 5 is arranged on the side surface of the first fixed plate 602 facing the positioning mechanism through the fixed rod 501, and can be fixed at other positions as long as the processing requirement of the numerical control cutter on the lead frame of the product to be electroplated can be met), and the cutter head is downward; the numerical control cutter can be selected from commercial products according to the requirements, so long as the requirements of marking on the side edge of the lead frame of the product to be electroplated can be met, and the structure of the numerical control cutter is not repeated here;
The blanking mechanism 6 comprises a horizontal connecting plate 601, a first fixed plate 602, a second fixed plate 603, two vertical guide posts 604, a second motor 605, a second screw rod 606, a second screw rod nut 607, two horizontal supporting rods 608, a sliding connecting plate 609, a third motor 610, a third screw rod 611, a third screw rod nut 612, a second push rod 613 and a positioning sensor 614, wherein the horizontal connecting plate 601 is horizontally connected to the side edge of the blanking platform 202 below the positioning mechanism 4, a chute 6011 is arranged on the middle line of the horizontal connecting plate 601 along the feeding direction, the first fixed plate 602 and the second fixed plate 603 are horizontally arranged and parallel to each other, the bottom surface of the first fixed plate 602 is higher than the top surface of the feeding platform 201, the top surface of the second fixed plate 603 is lower than the top surface of the blanking platform 202, the tops of the two vertical guide posts 604 are respectively connected to the bottom surface of the first fixed plate 602, the bottoms are respectively connected to the top surfaces of the second fixed plate 603, the second motor 605 is arranged on the top surface of the first fixed plate 602, the output shaft vertically penetrates out of the first fixed plate 602 downwards, the second screw rod 606 is vertically arranged, the top end is connected with the output shaft of the second motor 605 through a coupler, the bottom end is fixed on the top surface of the second fixed plate 603 through a bearing, the second screw rod nut 607 is sleeved on the second screw rod 606, two horizontal supporting rods 608 are oppositely arranged, a sliding connection plate 609 is vertically arranged, the middle part of the back surface is connected with the second screw rod nut 607, the two sides of the front surface are respectively connected with one ends of the two horizontal supporting rods 608, the two ends are respectively sleeved on the two vertical guide posts 604, a third motor 610 is arranged on the bottom surface of the second fixed plate 603, the output shaft is horizontally arranged and faces the feeding platform 202, one end of the third screw rod 611 is horizontally arranged, one end is connected with the output shaft of the third motor 610 through a coupler, the other end is fixed on the bottom surface of the horizontal connection plate 601 through a bearing, the third screw nut 612 is sleeved on the third screw 611, the top surface of the third screw nut 612 is connected with the bottom surface of the second push rod 613, the third screw nut 612 is embedded in the chute, the second push rod 613 is horizontally arranged and perpendicular to the third screw 611 and protrudes out of the upper surface of the blanking platform 202, and the positioning sensor 614 is arranged on the side surface of the first fixing plate 602 facing the positioning mechanism 4.
The working principle of the invention is as follows:
placing and arranging a product to be electroplated vertically in a carrying workpiece 1;
Placing the object-carrying workpiece on a loading platform, wherein the side edge of the opening faces to a barrier strip close to a positioning motor;
the first motor drives the first push rod to horizontally move along the first guide rail through the first screw rod and the first screw rod nut, so that the object carrying workpiece is pushed to horizontally move from the feeding platform to the two horizontal support rods, and when the positioning sensor senses the object carrying workpiece, the first motor stops working;
the positioning motor, the first positioning cylinder and the second positioning cylinder respectively drive the first positioning strip, the second positioning strip and the third positioning strip to position the carrying workpiece, wherein the positioning motor positions and compresses the product to be electroplated according to the quantity of the product to be electroplated in the carrying workpiece;
The numerical control cutter sequentially processes the side edges of the lead frames of the products to be electroplated in the object-carrying workpiece to form marks until the processing of the lead frames of all the products to be electroplated is completed, and the stepping processing in the processing process is realized by the numerical control cutter;
The second motor drives the sliding connecting plate to move downwards through the second screw rod and the second screw rod nut, so as to drive the sliding connecting plate to move up and down along the second screw rod, further drive the two horizontal supporting rods to move downwards, and stop moving when the sliding connecting plate moves onto the horizontal connecting plate;
The third motor drives the second push rod to horizontally move towards the blanking platform through the third screw rod and the third screw rod nut, and then drives the pushing object carrying workpiece to horizontally move from the horizontal supporting rod to the blanking platform, so that blanking is completed.
In summary, the invention has the following advantages:
The invention utilizes the numerical control cutter to process and treat the side edge of the lead frame of the packaged product to be electroplated to form the mark, and the mark is used for distinguishing batches of the product, so that the product is simply and effectively prevented from being mixed, and the method does not influence the structure and the performance of the product because the side edge of the lead frame belongs to the part which needs to be abandoned in the post-treatment process.
The device provided by the invention has the advantages of simple structure, capability of realizing identification of the side edge of the lead frame of the product to be electroplated, safe operation, high reliability and low production cost.
It is to be understood that the foregoing detailed description of the invention is merely illustrative of the invention and is not limited to the embodiments of the invention. It will be understood by those of ordinary skill in the art that the present invention may be modified or substituted for elements thereof to achieve the same technical effects; as long as the use requirement is met, the invention is within the protection scope of the invention.
Claims (1)
1. The utility model provides a semiconductor packaging product electroplates prevents mixing sign processingequipment, includes numerical control cutter, its characterized in that: the device also comprises a carrying workpiece, a rack, a feeding mechanism, a positioning mechanism and a discharging mechanism which are arranged on the rack; the carrying workpiece is used for accommodating a product to be electroplated; the feeding mechanism conveys the object-carrying workpiece to the lower part of the numerical control cutter, the side surface of the lead frame of the product to be electroplated faces the cutter head of the numerical control cutter, the positioning mechanism is used for accurately positioning the object-carrying workpiece to be matched with the machining area of the numerical control cutter, the numerical control cutter is used for machining marks on the side edge of the lead frame of the product to be electroplated, and the blanking mechanism conveys the machined product to be electroplated to the blanking position from the lower part of the numerical control cutter;
the object carrying workpiece comprises a horizontal bottom plate, wherein vertical baffles are arranged on three side edges of the horizontal bottom plate, and the top edges of the vertical baffles on the opposite side edges are provided with turnover edges facing the direction of the horizontal bottom plate;
The frame comprises a feeding platform and a discharging platform, wherein the feeding platform and the discharging platform are arranged in parallel, four corners of the feeding platform are connected with four corners of the discharging platform through supporting columns, and a group of side edges of the feeding platform along the length direction are provided with barrier strips;
The feeding mechanism comprises a first guide rail, a first motor, a first screw rod nut and a first push rod, wherein the first guide rail is horizontally arranged on a central line of the feeding platform along the length direction, the first motor is arranged on the feeding platform, an output shaft is connected with one end of the first screw rod, the first screw rod is arranged in the first guide rail, the first screw rod nut is sleeved on the first screw rod, the top surface of the first screw rod nut is connected with the bottom of the first push rod, and the first push rod is horizontally arranged and perpendicular to the first guide rail;
The positioning mechanism comprises a positioning motor, a first positioning cylinder and a second positioning cylinder, wherein the positioning motor and the second positioning cylinder are oppositely arranged and are respectively arranged at the end parts of the two barrier strips, which are far away from the first motor, the first positioning cylinder is arranged on the side edge of the feeding platform between the positioning motor and the second positioning cylinder, the output shaft of the positioning motor is connected with the first positioning strip, the piston end of the first positioning cylinder is connected with the second positioning strip, and the piston end of the second positioning cylinder is connected with the third positioning strip;
the numerical control cutter is arranged on the blanking mechanism, and the cutter head is downward;
The blanking mechanism comprises a horizontal connecting plate, a first fixed plate, a second fixed plate, two vertical guide posts, a second motor, a second screw rod nut, two horizontal supporting rods, a sliding connecting plate, a third motor, a third screw rod nut, a second push rod and a positioning sensor, wherein the horizontal connecting plate is horizontally connected to the side edge of the blanking platform below the positioning mechanism, a sliding groove is formed in the middle line of the horizontal connecting plate along the feeding direction, the first fixed plate and the second fixed plate are horizontally arranged and parallel to each other, the bottom surface of the first fixed plate is higher than the top surface of the feeding platform, the top surface of the second fixed plate is lower than the top surface of the blanking platform, the tops of the two vertical guide posts are respectively connected to the bottom surface of the first fixed plate, the bottoms of the two vertical guide posts are respectively connected to the top surface of the second fixed plate, the second motor is arranged on the top surface of the first fixed plate, the output shaft vertically penetrates out of the first fixed plate downwards, the top end of the second motor is connected with the output shaft of the second motor through a coupler, the bottom end of the second motor is fixed on the top surface of the second fixed plate through a bearing, the second screw nut is sleeved on the second screw, the two horizontal supporting rods are oppositely arranged, the sliding connection plate is vertically arranged, the middle part of the back surface of the second motor is connected with the second screw nut, the two sides of the front surface of the second motor are respectively connected with one ends of the two horizontal supporting rods, the two ends of the second motor are respectively sleeved on the two vertical guide posts, the third motor is arranged on the bottom surface of the second fixed plate, the output shaft of the third motor is horizontally arranged and faces the blanking platform, one end of the third motor is horizontally arranged through the coupler, the other end of the third motor is fixed on the bottom surface of the horizontal connection plate through the bearing, the third screw rod nut is sleeved on the third screw rod, the top surface of the third screw rod nut is connected with the bottom surface of the second push rod, the third screw rod nut is embedded in the sliding groove, the second push rod is horizontally arranged and perpendicular to the third screw rod and protrudes out of the upper surface of the blanking platform, and the positioning sensor is arranged on the side surface of the first fixing plate, facing the positioning mechanism;
The electroplating anti-mixing method applied to the electroplating anti-mixing mark processing device of the semiconductor packaging product comprises the following steps: processing the side edges of the lead frame of the packaged product to be electroplated by using the numerical control cutter to form a mark, and distinguishing product batches through the mark; the identification is a linear identification, a digital identification or a graphic identification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911377549.1A CN110977051B (en) | 2019-12-27 | 2019-12-27 | Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911377549.1A CN110977051B (en) | 2019-12-27 | 2019-12-27 | Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110977051A CN110977051A (en) | 2020-04-10 |
| CN110977051B true CN110977051B (en) | 2024-07-02 |
Family
ID=70078090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911377549.1A Active CN110977051B (en) | 2019-12-27 | 2019-12-27 | Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110977051B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153810B (en) * | 2022-12-26 | 2023-12-15 | 安徽飞悦芯科智能设备制造有限公司 | Anti-mixing method for full-automatic chip plastic packaging system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211360908U (en) * | 2019-12-27 | 2020-08-28 | 无锡电基集成科技有限公司 | Anti-mixing mark processing device for electroplating of semiconductor packaging product |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163544B (en) * | 2011-01-25 | 2013-05-08 | 日月光半导体（昆山）有限公司 | Package carrier strip and method for preventing mixing thereof |
| JP5514947B1 (en) * | 2013-10-31 | 2014-06-04 | 浦谷商事株式会社 | In-mold removable marking device |
| KR102252156B1 (en) * | 2014-07-08 | 2021-05-17 | 엘지이노텍 주식회사 | Light emitting device package |
| CN208758808U (en) * | 2018-09-12 | 2019-04-19 | 昆山卓研智能科技有限公司 | Offline full-automatic mark equipment |
-
2019
- 2019-12-27 CN CN201911377549.1A patent/CN110977051B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211360908U (en) * | 2019-12-27 | 2020-08-28 | 无锡电基集成科技有限公司 | Anti-mixing mark processing device for electroplating of semiconductor packaging product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110977051A (en) | 2020-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111856255A (en) | Computer chip packaging test equipment | |
| CN110977051B (en) | Electroplating anti-mixing method and anti-mixing mark processing device for semiconductor packaging product | |
| CN105618918A (en) | Automatic membrane spot welding machine | |
| CN211360908U (en) | Anti-mixing mark processing device for electroplating of semiconductor packaging product | |
| CA2772842A1 (en) | Precisely locating and address confirming method | |
| CN205765906U (en) | A kind of bidirectional keyboard pressing machine | |
| CN208811492U (en) | A kind of pre- material stock automatic tapping machine | |
| CN207844360U (en) | A kind of L-shaped slide unit | |
| CN110975659A (en) | Automatic liquid preparation method for liquid medicine | |
| CN113399313A (en) | Voltage internal resistance test machine | |
| CN216686558U (en) | Automatic stacking equipment of punching machine | |
| CN203526653U (en) | Full-automatic malleable cast iron pipe fitting end-flattening machine | |
| CN111578882B (en) | Universal sealing gasket testing equipment | |
| CN203497789U (en) | Chip feeding machine | |
| CN210938011U (en) | Automatic tooth depth measuring and screw locking double-station integrated machine | |
| CN203664210U (en) | Soft board test device | |
| CN207824298U (en) | A kind of mounting plate | |
| CN207238854U (en) | A kind of mechanical processing vertical lathe | |
| CN210634839U (en) | Tray centering device | |
| CN207533908U (en) | A kind of three axis may be programmed automatic riveter | |
| CN110966971A (en) | Heavy truck hub shell size detection machine | |
| CN220617489U (en) | Device for magnet feeding jig | |
| CN215447663U (en) | High-efficient counterpoint detection tool | |
| CN209379476U (en) | A kind of 18 mouthfuls of matrix form sorters | |
| CN214140484U (en) | Chip transfer station feeding and discharging mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |