CN111856255A - Computer chip packaging test equipment - Google Patents
Computer chip packaging test equipment Download PDFInfo
- Publication number
- CN111856255A CN111856255A CN202010918124.3A CN202010918124A CN111856255A CN 111856255 A CN111856255 A CN 111856255A CN 202010918124 A CN202010918124 A CN 202010918124A CN 111856255 A CN111856255 A CN 111856255A
- Authority
- CN
- China
- Prior art keywords
- plate
- fixedly connected
- frame plate
- ejection
- detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a computer chip packaging test device which comprises a flat plate, supporting legs, a connecting rod, a left fixing frame plate, a right fixing frame plate, a screw rod, a servo motor, a nut, a guide sliding block, a guide groove, a detection bedplate, a U-shaped frame plate, a lifting cylinder, an extrusion plate, a detector, a connecting block, a current probe, a fixing side plate, an ejection electric push rod, an ejection block, a connecting strip, a roller, a sliding groove, an embedding groove, a detection plate, an ejection groove, a positioning guide hole and a positioning rod. The chip testing device has the advantages that a plurality of chips can be placed at one time, the chips sequentially pass through the bottom of the testing mechanism, the testing mechanism is lifted through the lifting cylinder, so that batch testing is realized, meanwhile, the chip replacing position is arranged outside the testing position, the hands of workers are prevented from extending into the testing position, accidental driving of the lifting cylinder can be avoided, pressure injury and clamping injury are avoided, and safety is improved.
Description
Technical Field
The invention relates to a chip packaging test device, in particular to a computer chip packaging test device.
Background
The computer chip is a thin sheet made of silicon material and has a size of only half of a fingernail. A chip is connected by hundreds of microcircuits, and the microcircuits for generating pulse current are distributed on the chip.
Computer chip package test generally adopts current probe and detector to test, generally has the testboard and is used for placing the chip, is provided with elevating system for the lift of current probe and detector is close to the chip, realizes the test, and the test back is got through the manual work and is put the chip, and the chip probably is difficult for taking out, gets the position simultaneously and is in the test department, probably the accident is hindered to appear pressing from both sides. Therefore, a computer chip package testing apparatus is proposed to address the above problems.
Disclosure of Invention
A computer chip packaging test device comprises a flat plate and a U-shaped frame plate fixedly installed on one side of the top of the flat plate, wherein a transverse driving mechanism is arranged on the top of the flat plate, and a detection platen is installed on the top of the transverse driving mechanism; the top of the detection bedplate is provided with a plurality of embedding grooves distributed at equal intervals along the length direction, a detection plate is placed in the embedding grooves, the bottom of the detection bedplate is provided with a plurality of ejecting grooves distributed at equal intervals along the length direction, the ejecting grooves are communicated with the embedding grooves, the bottoms of two sides of the detection plate are fixedly connected with positioning rods, and the positioning rods are in clearance fit connection with positioning guide holes formed in the bottom of the detection bedplate; the top fixedly connected with lift cylinder of U type frame plate, the output bottom fixedly connected with accredited testing organization of lift cylinder, dull and stereotyped one side fixed mounting has ejection mechanism.
Furthermore, the four corners of the bottom of the flat plate are fixedly connected with supporting legs, and connecting rods are fixedly connected between the supporting legs.
Further, the transverse driving mechanism comprises a left fixing frame plate, a right fixing frame plate, a screw, a servo motor, a nut and a guide sliding block, the left fixing frame plate and the right fixing frame plate are respectively and fixedly connected to two sides of the top of the flat plate, one side of the left fixing frame plate is fixedly connected with the servo motor, the screw is rotatably connected between the left fixing frame plate and the right fixing frame plate, the screw is in threaded connection with the nut, the bottom of the nut is fixedly connected with the guide sliding block, a guide groove is formed in the surface of the flat plate, the guide groove is connected with the guide sliding block in a sliding mode, and the top of the nut is fixedly connected with the detection platen.
Further, the testing mechanism comprises an extrusion plate, a detector, a connection block and a current probe, the top middle position of the extrusion plate is fixedly connected with the lifting cylinder, the detector is fixedly connected to one side of the extrusion plate, the connection block is fixedly connected to the bottom of the extrusion plate, and the current probe is arranged at the bottom of the connection block.
Further, the edge of the flat plate is fixedly connected with connecting strips at equal intervals along the length direction, the connecting strips are rotatably connected with rollers, and the rollers are connected with sliding grooves arranged on the inner portion of the U-shaped frame plate in a sliding mode.
Furthermore, the ejection mechanism comprises a fixed side plate, an ejection electric push rod and an ejection block, the fixed side plate is fixedly connected with one side of the flat plate, the ejection electric push rod is fixedly connected to the bottom of the fixed side plate, and the output top end of the ejection electric push rod is fixedly connected with the ejection block.
The invention has the beneficial effects that: the invention provides a computer chip packaging test device convenient for taking out a chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a detection platen and a U-shaped platen according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a detection board and a detection board structure according to an embodiment of the invention.
In the figure: 1. the device comprises a flat plate, 2, supporting legs, 3, a connecting rod, 4, a left fixing frame plate, 5, a right fixing frame plate, 6, a screw rod, 7, a servo motor, 8, a nut, 9, a guide sliding block, 10, a guide groove, 11, a detection table plate, 12, a U-shaped frame plate, 13, a lifting cylinder, 14, a squeezing plate, 15, a detector, 16, a connecting block, 17, a current probe, 18, a fixing side plate, 19, an ejection electric push rod, 20, an ejection block, 21, a connecting strip, 22, a roller, 23, a sliding groove, 24, an embedding groove, 25, a detection plate, 26, an ejection groove, 27, a positioning guide hole, 28 and a positioning rod.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1-3, a computer chip package testing apparatus includes a flat plate 1 and a U-shaped frame plate 12 fixedly mounted on one side of the top of the flat plate 1, wherein a transverse driving mechanism is arranged on the top of the flat plate 1, and a detection platen 11 is mounted on the top of the transverse driving mechanism;
the top of the detection bedplate 11 is provided with a plurality of embedding grooves 24 which are distributed at equal intervals along the length direction, a detection plate 25 is placed in the embedding grooves 24, the bottom of the detection bedplate 11 is provided with a plurality of ejection grooves 26 which are distributed at equal intervals along the length direction, the ejection grooves 26 are communicated with the embedding grooves 24, the bottoms of two sides of the detection plate 25 are fixedly connected with positioning rods 28, and the positioning rods 28 are in clearance fit connection with positioning guide holes 27 formed in the bottom of the detection bedplate 11;
the top fixedly connected with lift cylinder 13 of U type frame plate 12, the output bottom fixedly connected with accredited testing organization of lift cylinder 13, one side fixed mounting of dull and stereotyped 1 has ejection mechanism.
The four corners of the bottom of the flat plate 1 are fixedly connected with supporting legs 2, and connecting rods 3 are fixedly connected between the supporting legs 2 and used for supporting and fixing the bottom; the transverse driving mechanism comprises a left fixed frame plate 4, a right fixed frame plate 5, a screw 6, a servo motor 7, a nut 8 and a guide slider 9, the left fixed frame plate 4 and the right fixed frame plate 5 are respectively and fixedly connected to two sides of the top of the flat plate 1, one side of the left fixed frame plate 4 is fixedly connected with the servo motor 7, the screw 6 is rotatably connected between the left fixed frame plate 4 and the right fixed frame plate 5, the screw 6 is in threaded connection with the nut 8, the bottom of the nut 8 is fixedly connected with the guide slider 9, a guide groove 10 is formed in the surface of the flat plate 1, the guide groove 10 is in sliding connection with the guide slider 9, the top of the nut 8 is fixedly connected with a detection bedplate 11 and is used for transverse driving and left-right movement; the testing mechanism comprises a squeezing plate 14, a detector 15, a connecting block 16 and a current probe 17, the middle position of the top of the squeezing plate 14 is fixedly connected with a lifting cylinder 13, the detector 15 is fixedly connected to one side of the squeezing plate 14, the connecting block 16 is fixedly connected to the bottom of the squeezing plate 14, and the current probe 17 is arranged at the bottom of the connecting block 16 and used for testing through the current probe 17; the edge of the flat plate 1 is fixedly connected with connecting strips 21 at equal intervals along the length direction, the connecting strips 21 are rotatably connected with rollers 22, and the rollers 22 are slidably connected with sliding grooves 23 formed in the U-shaped frame plates 12 and used for guiding to bear weight; the ejection mechanism comprises a fixed side plate 18, an ejection electric push rod 19 and an ejection block 20, the fixed side plate 18 is fixedly connected with one side of the flat plate 1, the ejection electric push rod 19 is fixedly connected to the bottom of the fixed side plate 18, and the ejection block 20 is fixedly connected to the output top end of the ejection electric push rod 19 and used for ejecting the chip and separated from the embedding groove 24, so that the chip can be taken out conveniently.
When the electric elements in the invention are used, the electric elements are externally connected with a power supply and a control switch, when the whole equipment is used, firstly, chips are put in all the embedding grooves 24 to wait for testing, a worker is positioned at the ejection mechanism to carry out start-up testing, the servo motor 7 drives the screw rod 6 to rotate so as to provide driving for the nut 8, the nut 8 leads the detection bedplate 11 to move rightwards through the guiding action of the guide slider 9 and the guide groove 10, the chips are aligned with the testing mechanism, the servo motor 7 stops working, the lifting cylinder 13 extends, so that the testing mechanism descends and approaches the chips to carry out testing, after the testing, the lifting cylinder 13 contracts, the testing mechanism ascends, the servo motor 7 works again, the tested chips move to the top of the ejection mechanism, the next chip to be tested moves to the top of the testing mechanism, and the testing mechanism carries out testing again, the electric push rod 19 in the ejection mechanism is ejected to extend, the ejection block 20 penetrates through the ejection groove 26 to push the detection plate 25 and the chip to move upwards, the chip is separated from the embedding groove 24, the chip after testing can be conveniently taken out manually, the chip to be tested is replaced after the chip is taken out, then the electric push rod 19 is ejected to contract, the detection plate 25 is placed in the embedding groove 24 again, and the testing of all the chips on the detection bedplate 11 is completed through the operation;
after the test, the detection platen 11 is moved to the right side of the U-shaped frame plate 12, the chip is replaced again in the embedding groove 24, the servo motor 7 drives the detection platen 11 to move leftwards, the detection platen is moved to the starting position again, and the test is carried out again.
The invention has the advantages that:
whole computer chip package test equipment has horizontal actuating mechanism and can provide the drive for detecting platen 11, and the position of placing that has a plurality of chip tests on detecting platen 11, thereby once can lay a plurality of chips, a plurality of chips pass through from the accredited testing organization bottom in proper order, accredited testing organization goes up and down through lift cylinder 13, thereby realize the batchization test, the position setting of changing the chip simultaneously is in the outside of test position, avoid staff's hand to stretch into test position, can avoid lift cylinder 13's unexpected drive, cause the crushing wound, the clamp wound, the security has been improved.
After the chip is tested, the transverse driving mechanism drives the detection platen 11 to move to the top of the ejection mechanism, the ejection mechanism penetrates through the ejection groove 26 to push the detection plate 25 to move upwards, the chip can be pushed out from the embedding groove 24, and the chip can be conveniently taken out and replaced after the test.
It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A computer chip package test device, characterized by: the device comprises a flat plate (1) and a U-shaped frame plate (12) fixedly arranged on one side of the top of the flat plate (1), wherein a transverse driving mechanism is arranged on the top of the flat plate (1), and a detection bedplate (11) is arranged on the top of the transverse driving mechanism;
the top of the detection bedplate (11) is provided with a plurality of embedding grooves (24) which are distributed at equal intervals along the length direction, a detection plate (25) is placed in the embedding grooves (24), the bottom of the detection bedplate (11) is provided with a plurality of ejecting grooves (26) which are distributed at equal intervals along the length direction, the ejecting grooves (26) are communicated with the embedding grooves (24), the bottoms of two sides of the detection plate (25) are fixedly connected with positioning rods (28), and the positioning rods (28) are in clearance fit connection with positioning guide holes (27) formed in the bottom of the detection bedplate (11);
the top fixedly connected with lift cylinder (13) of U type frame plate (12), the output bottom fixedly connected with accredited testing organization of lift cylinder (13), one side fixed mounting of dull and stereotyped (1) has ejection mechanism.
2. The computer chip package testing device of claim 1, wherein: the bottom four corners of the flat plate (1) are fixedly connected with supporting legs (2), and connecting rods (3) are fixedly connected between the supporting legs (2).
3. The computer chip package testing device of claim 1, wherein: horizontal actuating mechanism includes left fixed frame plate (4), right fixed frame plate (5), screw rod (6), servo motor (7), nut (8) and direction slider (9), left side fixed frame plate (4) and right fixed frame plate (5) are fixed connection respectively in the top both sides of dull and stereotyped (1), one side and servo motor (7) fixed connection of left side fixed frame plate (4), screw rod (6) rotate to be connected between left fixed frame plate (4) and right fixed frame plate (5), screw rod (6) threaded connection has nut (8), the bottom fixedly connected with direction slider (9) of nut (8), guide way (10) have been seted up on the surface of dull and stereotyped (1), guide way (10) and direction slider (9) sliding connection, nut (8) top and detection platen (11) fixed connection.
4. The computer chip package testing device of claim 1, wherein: the testing mechanism comprises an extrusion plate (14), a detector (15), a connection block (16) and a current probe (17), wherein the top middle position of the extrusion plate (14) is fixedly connected with a lifting cylinder (13), the detector (15) is fixedly connected to one side of the extrusion plate (14), the connection block (16) is fixedly connected to the bottom of the extrusion plate (14), and the current probe (17) is arranged at the bottom of the connection block (16).
5. The computer chip package testing device of claim 1, wherein: the utility model discloses a dull and stereotyped frame plate, including dull and stereotyped (1), the border department of dull and stereotyped (1) is along length direction equidistant fixedly connected with connecting strip (21), connecting strip (21) are rotated and are connected with gyro wheel (22), gyro wheel (22) and offer spout (23) sliding connection on U type frame plate (12) are inside.
6. The computer chip package testing device of claim 1, wherein: the ejection mechanism comprises a fixed side plate (18), an ejection electric push rod (19) and an ejection block (20), the fixed side plate (18) is fixedly connected with one side of the flat plate (1), the ejection electric push rod (19) is fixedly connected to the bottom of the fixed side plate (18), and the output top end of the ejection electric push rod (19) is fixedly connected with the ejection block (20).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010918124.3A CN111856255A (en) | 2020-09-03 | 2020-09-03 | Computer chip packaging test equipment |
| PCT/CN2020/130685 WO2022048039A1 (en) | 2020-09-03 | 2020-11-21 | Computer chip encapsulation test device |
| ZA2022/04798A ZA202204798B (en) | 2020-09-03 | 2022-04-29 | Computer chip packaging test apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010918124.3A CN111856255A (en) | 2020-09-03 | 2020-09-03 | Computer chip packaging test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111856255A true CN111856255A (en) | 2020-10-30 |
Family
ID=72967540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010918124.3A Withdrawn CN111856255A (en) | 2020-09-03 | 2020-09-03 | Computer chip packaging test equipment |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN111856255A (en) |
| WO (1) | WO2022048039A1 (en) |
| ZA (1) | ZA202204798B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295988A (en) * | 2021-07-28 | 2021-08-24 | 江苏澳芯微电子有限公司 | Computer chip packaging test equipment |
| CN113376092A (en) * | 2021-06-10 | 2021-09-10 | 深圳市卓晶微智能机器人科技有限公司 | Packaging detection equipment for semiconductor wafer after being pasted on substrate |
| WO2022048039A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾宾斯信息技术有限公司 | Computer chip encapsulation test device |
| CN114217205A (en) * | 2021-11-29 | 2022-03-22 | 徐州领测半导体科技有限公司 | Full-automatic test equipment for packaged semiconductor chip |
| CN114593888A (en) * | 2022-03-25 | 2022-06-07 | 德凯宜特（昆山）检测有限公司 | Chip packaging durability test method and device |
| CN115980555A (en) * | 2023-03-20 | 2023-04-18 | 无锡祺芯半导体科技有限公司 | Intelligent chip packaging test equipment |
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| CN114937617B (en) * | 2022-05-23 | 2023-09-08 | 无锡昌德微电子股份有限公司 | Testing arrangement is used in production of MOS chip |
| CN115078785B (en) * | 2022-06-30 | 2023-07-11 | 深圳市瑞亿科技电子有限公司 | PCBA processing is with electron complete machine testing arrangement |
| CN115267512B (en) * | 2022-08-22 | 2023-06-27 | 深圳市睿智科精密科技有限公司 | Detection device and detection method for chip package |
| CN115561060A (en) * | 2022-09-02 | 2023-01-03 | 嘉兴市扬佳科技合伙企业(有限合伙) | Test equipment of spacer for semiconductor packaging |
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| CN117560485B (en) * | 2024-01-12 | 2024-04-05 | 广东诺正电子股份有限公司 | Digital television set top box interface detection equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07248349A (en) * | 1994-03-10 | 1995-09-26 | Sakurai Seisakusho:Kk | Support device for board to be inspected in electric continuity inspection machine |
| CN209868381U (en) * | 2019-04-13 | 2019-12-31 | 深圳市荣测捷科技有限公司 | Movable test clamp jig |
| CN110456253B (en) * | 2019-08-12 | 2021-07-27 | 安徽龙芯微科技有限公司 | Chip processing device integrating testing and sorting functions |
| CN211180088U (en) * | 2019-08-16 | 2020-08-04 | 广东华测检测机器人股份有限公司 | FPC test jig convenient to go up unloading |
| CN211348357U (en) * | 2019-12-07 | 2020-08-25 | 昆山佳奇利电子科技有限公司 | Test fixture rack with slide rail structure |
| CN111856255A (en) * | 2020-09-03 | 2020-10-30 | 苏州艾宾斯信息技术有限公司 | Computer chip packaging test equipment |
-
2020
- 2020-09-03 CN CN202010918124.3A patent/CN111856255A/en not_active Withdrawn
- 2020-11-21 WO PCT/CN2020/130685 patent/WO2022048039A1/en active Application Filing
-
2022
- 2022-04-29 ZA ZA2022/04798A patent/ZA202204798B/en unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022048039A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾宾斯信息技术有限公司 | Computer chip encapsulation test device |
| CN113376092A (en) * | 2021-06-10 | 2021-09-10 | 深圳市卓晶微智能机器人科技有限公司 | Packaging detection equipment for semiconductor wafer after being pasted on substrate |
| CN113295988A (en) * | 2021-07-28 | 2021-08-24 | 江苏澳芯微电子有限公司 | Computer chip packaging test equipment |
| CN114217205A (en) * | 2021-11-29 | 2022-03-22 | 徐州领测半导体科技有限公司 | Full-automatic test equipment for packaged semiconductor chip |
| CN114593888A (en) * | 2022-03-25 | 2022-06-07 | 德凯宜特（昆山）检测有限公司 | Chip packaging durability test method and device |
| CN114593888B (en) * | 2022-03-25 | 2023-02-10 | 德凯宜特（昆山）检测有限公司 | Chip packaging durability test method and test device |
| CN115980555A (en) * | 2023-03-20 | 2023-04-18 | 无锡祺芯半导体科技有限公司 | Intelligent chip packaging test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022048039A1 (en) | 2022-03-10 |
| ZA202204798B (en) | 2022-07-27 |
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