CN110955090B - Display panel, manufacturing method of display panel and display device - Google Patents

Display panel, manufacturing method of display panel and display device Download PDF

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Publication number
CN110955090B
CN110955090B CN201911329511.7A CN201911329511A CN110955090B CN 110955090 B CN110955090 B CN 110955090B CN 201911329511 A CN201911329511 A CN 201911329511A CN 110955090 B CN110955090 B CN 110955090B
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layer
display panel
substrate
base plate
substrate base
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CN110955090A (en
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李树磊
谢昌翰
朱小研
康昭
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133357—Planarisation layers

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

The invention relates to the technical field of liquid crystal display, and discloses a display panel, a manufacturing method of the display panel and a display device, wherein the display panel comprises a substrate, a device layer and a bending part positioned on one side of the substrate, the bending part comprises a metal wiring layer and a protective layer, one end of the bending part is connected with the surface of the substrate provided with the device layer, the other end of the bending part is bent to the surface of one side of the substrate departing from the device layer, one end of the metal wiring layer is electrically connected with a data wire leading-out end of the device layer, the other end of the metal wiring layer is positioned on one side of the substrate departing from the device layer, and a bonding pad area used for being welded with a driving chip is formed; in the bending area of the bending part, the metal wiring layer is positioned on the inner side of the protective layer. The display device comprises the display panel. The display panel, the manufacturing method of the display panel and the display device solve the problem that PR glue at the junction of PI and Glass is thick in accumulation and remains after exposure to cause short circuit of metal wiring in the process of preparing the display panel in the prior art.

Description

Display panel, manufacturing method of display panel and display device
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
The screen occupation ratio (i.e. the relative ratio of the screen to the area of the front panel of the mobile phone) is a parameter for easily obtaining visual good feeling on the appearance design of the mobile phone, and is an important competitive comparison index for products of various mobile phone manufacturers.
At present, the main way of increasing the screen occupation ratio is to reduce the binding area of the display panel, specifically, as shown in fig. 1, a flexible PI (Polyimide) bendable area is connected to one side of the display panel, a metal routing 20 is prepared on a flexible PI10, and binding is performed below the display panel through the flexible PI bendable area, so as to improve the problem that the screen occupation ratio is reduced when binding is performed on the side surface of the display panel.
However, as shown in fig. 2 and fig. 3, in the above manufacturing process, a PR (Photo Resist) 30 is deposited thickly at the interface between PI and Glass, and after exposure, the PR 30 remains, which causes a short circuit of the metal trace 20.
Disclosure of Invention
The invention provides a display panel, a manufacturing method of the display panel and a display device, which are used for solving the problems that PR glue at the junction of PI and Glass is thick in accumulation and the PR glue is remained after exposure to cause short circuit of metal wires in the process of preparing the display panel in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a display panel, comprising:
a substrate base plate;
a device layer formed on one side of the substrate base plate;
the bending part is positioned on one side of the substrate base plate and comprises a metal wiring layer and a protective layer, wherein one end of the bending part is connected with the surface of the substrate base plate, which is provided with the device layer, while the other end is bent to the surface of one side of the substrate base plate, which is far away from the device layer; in the bending area of the bending part, the metal routing layer is positioned on the inner side of the protective layer.
According to the display panel provided by the invention, the metal routing layer is positioned on the inner side of the protective layer in the bending area of the bending part, so that the problem of short circuit of metal routing caused by thick PR glue accumulation at the junction of PI and Glass and residual PR glue after exposure can be fundamentally avoided while the high screen ratio of the display panel is ensured, and the yield of the display panel is effectively improved.
In addition, the metal wiring layer is positioned on the inner side of the protective layer, so that the stress borne by the metal wiring during bending can be reduced, and the yield of the display panel is further improved.
Preferably, the device layer includes a planarization layer, and one end of the planarization layer close to the bending portion is connected to the protection layer.
Preferably, at least one anchoring groove is formed at one end of the protection layer connected with the substrate base plate, and a first anchoring portion for filling the anchoring groove is formed at a position of the planarization layer corresponding to the anchoring groove.
Preferably, along the extending direction of the bending part, the size of one end of the anchoring groove far away from the device layer is larger than that of one end close to the device layer.
Preferably, an insulating layer is formed on one side of the planarization layer, which is away from the substrate, and a second anchoring portion for filling the anchoring groove is formed at a position of the insulating layer, which corresponds to the anchoring groove.
Preferably, the color filter substrate is bonded with the insulating layer frame sealing adhesive, and the anchoring groove is filled with the frame sealing adhesive and the part corresponding to the anchoring groove.
Preferably, the substrate comprises a first buffer portion arranged side by side with the substrate base plate, and the first buffer portion is located in an area surrounded by the bending portion and used for supporting the bending portion.
Preferably, a second buffer portion is arranged between one end of the bending portion, which is far away from the substrate base plate, and the substrate base plate.
Preferably, the second buffer portion includes a support base plate and a buffer body, and the buffer body is located between the support base plate and the substrate base plate.
The invention also provides a display device, which is provided with any one of the display panels provided in the technical scheme, and at least can achieve the beneficial effects that the display panel can achieve:
the problem of short circuit of the metal wiring caused by PR glue residue after exposure due to the fact that PR glue at the junction of the PI and the Glass is thick in accumulation is avoided, meanwhile, stress borne by the metal wiring when the metal wiring is bent can be reduced, and therefore yield of the display panel is effectively improved.
The invention also provides a method for manufacturing any one of the display panels provided in the above technical solutions, which includes:
preparing a device layer and a bent part on the surface of one side of a substrate, wherein the bent part comprises a metal wiring layer and a protective layer positioned on one side of the metal wiring layer, which is far away from the substrate, one end of the metal wiring layer is electrically connected with a data wire leading-out end of the device layer, and a bonding pad area for welding with a driving chip is formed at the other end of the metal wiring layer;
forming a hollow part at the part of the substrate base plate corresponding to the bending part;
and bending the bending part towards one side of the substrate base plate departing from the device layer along the hollow part so as to bend the other end of the metal routing layer to one side surface of the substrate base plate departing from the device layer.
Preferably, the device layer includes a planarization layer, and the preparing of the device layer and the bending part on the surface of one side of the substrate includes:
preparing a protective layer on one side of the metal wiring layer, which is far away from the substrate base plate, wherein the end part of the protective layer, which is connected with the substrate base plate, is provided with at least one anchoring groove;
and forming the planarization layer on the substrate, wherein a first anchor portion filled in the anchor groove is formed at a portion of the planarization layer corresponding to the anchor groove.
Preferably, the device layer includes an insulating layer, and after the planarization layer is formed on the substrate base plate, the device layer includes:
and preparing the insulating layer on one side of the planarization layer, which is far away from the substrate, wherein a second anchoring part filled in the anchoring groove is formed at the part of the insulating layer, which corresponds to the anchoring groove.
Preferably, after preparing the insulating layer on the side of the planarization layer away from the substrate, the method includes:
and bonding the color film substrate and the insulating layer through frame sealing glue, wherein the anchoring groove is filled with the frame sealing glue and the part corresponding to the anchoring groove.
Drawings
FIG. 1 is a partial schematic view of a prior art display panel;
FIG. 2 is a schematic diagram of the display panel shown in FIG. 1 after being coated with a photoresist;
FIG. 3 is a partial top view of the display panel shown in FIG. 2 after exposure;
fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating a process of manufacturing a display panel according to a method of manufacturing a display panel according to an embodiment of the present invention;
fig. 8 to fig. 24 are schematic diagrams of the display panel in corresponding steps when the display panel is manufactured according to the manufacturing method of the display panel provided by the embodiment of the invention.
Icon: 10-flexible PI; 20-metal routing; 30-PR glue; 1-a substrate base plate; 2-a metal routing layer; 3-a protective layer; 31-an anchoring groove; 4-a driving chip; 5-a planarization layer; 6-an insulating layer; 7-sealing the frame glue; 8-a first buffer; 91-supporting a substrate; 92-a buffer; 100-a release layer; 200-a light-shielding layer; 300-a buffer layer; 400-an active layer; 500-a gate insulating layer; 600-a gate; 700-an interlayer dielectric layer; 800-source electrode; 900-drain electrode; 901-common electrode; 902-pixel electrode.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 4, the display panel provided in this embodiment includes:
a base substrate 1;
a device layer formed on one side of the substrate base plate 1;
the device comprises a bending part, wherein the bending part is located on one side of a substrate base plate 1 and comprises a metal wiring layer 2 and a protective layer 3, one end of the bending part is connected with the surface of the substrate base plate 1, the other end of the bending part is bent to the surface of one side, away from the device layer, of the substrate base plate 1, one end of the metal wiring layer 2 is electrically connected with a data wire leading-out end of the device layer, the other end of the metal wiring layer is located on one side, away from the device layer, of the substrate base plate 1, and a pad area used for being welded with a driving chip 4 is formed. In the bending region of the bend, the metal wiring layer 2 is located inside the protective layer 3.
The display panel that this embodiment provided is in the bending region of kink, and metal routing layer 2 is located the inboard of protective layer 3, when guaranteeing the high screen ratio of display panel, can avoid from the root because PI glues with Glass juncture PR and piles up thickly, and PR is glued to remain after the exposure, leads to the problem of metal wiring short circuit, effectively improves display panel's yield.
In addition, the metal wiring layer 2 is located on the inner side of the protective layer 3, so that stress borne by the metal wiring during bending can be reduced, and the yield of the display panel is further improved.
Specifically, when the device layers are provided, the device layers may include a source/drain electrode layer, a gate layer, an active layer 400, a planarization layer 5, an insulating layer 6, and the like.
Specifically, when the protective layer 3 is provided, the protective layer 3 may be a flexible PI layer.
In a specific technical solution, the device layer includes a planarization layer 5 (PLN layer), and one end of the planarization layer 5 near the bending portion is connected to the protection layer 3.
The protective layer 3 is connected with the display area of the display panel in a multiple way, and the connection firmness is stronger.
Further, as shown in fig. 5, at least one anchor groove is formed at one end of the protection layer connected to the base substrate, and a first anchor portion for filling the anchor groove is formed at a portion of the planarization layer corresponding to the anchor groove.
The connection region of protective layer and device layer is non-display area, account for than in order to improve display panel's screen, reach the technical effect that the full face screen displayed, non-display area should be as little as possible, the protective layer sets up the anchor groove, the position that planarization layer and anchor groove correspond sets up the first anchor portion that is used for filling in the anchor inslot, can reduce the connection region on protective layer and device layer as far as possible in, reduce the possibility that protective layer and device layer break away from.
Specifically, when the protective layer 3 is provided, a plurality of anchor grooves 31 may be formed at one end of the protective layer 3 connected to the base substrate 1, for example: two, three, four or five, etc.
In order to further increase the anchoring force of the protection layer 3 and the display area, in a specific solution, along the extending direction of the bending portion, the size of the end of the anchoring groove 31 far away from the device layer is larger than the size of the end near the device layer. For example: the anchoring groove 31 is T-shaped or dovetail-shaped.
Referring to fig. 6, an insulating layer is formed on a side of the planarization layer away from the substrate, and in order to further increase the anchoring force between the protection layer 3 and the device layer, a second anchoring portion for filling the anchoring groove may be formed at a portion of the insulating layer corresponding to the anchoring groove.
In a specific technical scheme, the display panel comprises a color film substrate, the color film substrate is bonded with the insulating layer frame sealing adhesive, and the anchoring groove is filled with the frame sealing adhesive and the part corresponding to the anchoring groove.
On the basis that the planarization layer 5 and the insulating layer 6 are filled in the anchoring groove 31, one end of the frame sealing glue 7 close to the protective layer 3 is filled in the anchoring groove 31, so that the anchoring force between the protective layer 3 and the display area can be further increased, and the risk that the protective layer 3 is separated from the device layer in the bending and Bonding processes is reduced.
The display panel may further include a first buffer portion 8 disposed side by side with the substrate base plate 1, and the first buffer portion 8 is located in an area surrounded by the bending portion and supports the bending portion to improve stability of the bending portion.
A second buffer portion may be disposed between one end of the bent portion away from the substrate base plate 1 and the substrate base plate 1, specifically, the second buffer portion may include a supporting base plate 91 and a buffer body 92, and the buffer body 92 is located between the supporting base plate 91 and the substrate base plate 1.
This embodiment still provides a display device, is provided with any one kind of display panel that provides among the above-mentioned technical scheme, can reach the beneficial effect that above-mentioned display panel can reach at least:
the problem that PR glue is remained after exposure to cause short circuit of the metal wiring due to the fact that PR glue at the junction of the PI and the Glass is thick in a stacked mode is avoided, meanwhile, stress borne by the metal wiring when the metal wiring is bent can be reduced, and therefore the yield of the display panel is effectively improved.
The present embodiment further provides a method for manufacturing any one of the display panels provided in the above technical solutions, including:
preparing a device layer and a bent part on the surface of one side of the substrate, wherein the bent part comprises a metal wiring layer and a protective layer positioned on one side of the metal wiring layer, which is far away from the substrate, one end of the metal wiring layer is electrically connected with a data wire leading-out end of the device layer, and a bonding pad area for welding with a driving chip is formed at the other end of the metal wiring layer;
forming a hollow part at the part of the substrate base plate corresponding to the bending part;
and bending the bending part to one side of the substrate base plate departing from the device layer along the hollow part so as to bend the other end of the metal routing layer to one side surface of the substrate base plate departing from the device layer.
The display panel manufactured by the manufacturing method is in the bending area of the bending part, the metal wiring layer 2 is located on the inner side of the protective layer 3, the high screen ratio of the display panel is guaranteed, meanwhile, the problem that metal wiring is short-circuited due to the fact that PR glue at the junction of the PI and the Glass is thick in accumulation and the PR glue is left after exposure is fundamentally avoided, and the yield of the display panel is effectively improved.
In addition, the metal wiring layer 2 is located on the inner side of the protective layer 3, so that stress borne by the metal wiring during bending can be reduced, and the yield of the display panel is further improved.
Optionally, the device layer includes a planarization layer, and the device layer and the bending portion are prepared on a surface of one side of the substrate, including:
preparing a protective layer on one side of the metal wiring layer, which is far away from the substrate, wherein the end part of the protective layer, which is connected with the substrate, is provided with at least one anchoring groove;
a planarization layer is formed on the base substrate, wherein a first anchor portion filled in the anchor groove is formed at a portion of the planarization layer corresponding to the anchor groove.
Optionally, the device layer includes an insulating layer, and after forming the planarization layer on the substrate, the device layer includes:
and preparing an insulating layer on one side of the planarization layer, which is far away from the substrate, wherein a second anchoring part filled in the anchoring groove is formed at the part of the insulating layer, which corresponds to the anchoring groove.
Optionally, after preparing the insulating layer on the side of the planarization layer away from the substrate, the method includes:
and the color film substrate and the insulating layer are bonded through the frame sealing glue, wherein the anchoring groove is filled with the frame sealing glue and the part corresponding to the anchoring groove.
As shown in fig. 7, in a specific technical solution, the manufacturing method includes the following steps:
step S01, as shown in FIG. 8, preparing a patterned peeling layer 100 on one side surface of the substrate base plate 1 so as to facilitate the subsequent protective layer 3 side peeling;
step S02, as shown in fig. 9, preparing a light-shielding layer 200 on a surface of one side of the substrate 1 for protecting the TFT device structure; wherein, the light-shielding layer 200 and the peeling layer 100 are located on the surface of the same side of the substrate 1;
step S03, as shown in fig. 10, preparing a buffer layer 300 on a side of the light-shielding layer 200 away from the substrate base plate 1;
step S04, as shown in fig. 11, preparing an active layer 400 on a side of the buffer layer 300 away from the substrate 1, where the material of the active layer 400 may be monocrystalline silicon (a-Si), polycrystalline silicon (p-Si), or an Oxide thereof (Oxide);
step S05, as shown in fig. 12, preparing a gate insulating layer 500 on a side of the active layer 400 away from the buffer layer 300;
step S06, as shown in fig. 13, preparing a gate electrode on a side of the gate insulating layer 500 away from the active layer 400;
step S07, as shown in fig. 14, preparing an interlayer dielectric layer 700 (ILD layer) on a side of the gate 600 away from the gate insulating layer 500;
step S08, as shown in fig. 15, dry etching is performed on the ILD layer to prepare a source 800, a drain 900 and a metal trace;
step S09, as shown in fig. 16, a patterned flexible PI layer is prepared on one side of the metal trace away from the substrate 1;
s10, etching the edge of the flexible PI layer to form an anchoring groove 31;
step S11, as shown in fig. 17, preparing a PLN layer, and preparing a patterned common electrode 901 (Com electrode) above the PLN layer; wherein the PLN layer fills the anchor groove 31;
step S12, as shown in fig. 18, preparing an insulating layer 6, and preparing a patterned Pixel electrode 902 (Pixel electrode) after etching; wherein, the insulating layer 6 carries on the secondary filling to the anchor groove 31;
step S13, as shown in FIG. 19, forming a cell by ODF (liquid crystal drop filling) or VIF (vacuum filling); wherein, the frame sealing glue 7 completely fills the anchoring groove 31;
step S14, as shown in fig. 20, cutting the color film substrate outside the frame sealing adhesive 7;
step S15, as shown in FIG. 21, bonding is carried out on the cut liquid crystal box;
step S16, as shown in fig. 22 and 23, locally peeling off the base substrate 1 in the peeled area by the laser peeling technology;
step S17, setting the buffer 92 and the first buffer 8, and then bending the region where the flexible PI layer is located by the peeling region, so that the free end of the flexible PI layer is bent to the surface of the substrate 1 away from the light shielding layer 200, thereby obtaining the display panel shown in fig. 24. In this case, the second buffer portion includes the buffer body 92 and the base substrate 1 on the side of the peeling region.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (13)

1. A method for manufacturing a display panel is characterized by comprising the following steps:
preparing a device layer and a bent part on the surface of one side of a substrate, wherein the bent part comprises a metal wiring layer and a protective layer positioned on one side of the metal wiring layer, which is far away from the substrate, one end of the metal wiring layer is electrically connected with a data wire leading-out end of the device layer, and a bonding pad area for welding with a driving chip is formed at the other end of the metal wiring layer;
forming a hollow part at the part of the substrate base plate corresponding to the bending part;
bending the bent part to one side of the substrate base plate, which is far away from the device layer, along the hollow part so that the other end of the metal routing layer is bent to one side surface of the substrate base plate, which is far away from the device layer;
the device layer includes the planarization layer, device layer and kink are prepared to one side surface at the substrate base plate, include:
preparing a protective layer on one side of the metal wiring layer, which is far away from the substrate base plate, wherein the end part of the protective layer, which is connected with the substrate base plate, is provided with at least one anchoring groove;
and forming the planarization layer on the substrate, wherein a first anchor portion filled in the anchor groove is formed at a portion of the planarization layer corresponding to the anchor groove.
2. The method of claim 1, wherein the device layer comprises an insulating layer, and wherein the step of forming the planarization layer on the substrate comprises:
and preparing the insulating layer on one side of the planarization layer, which is far away from the substrate, wherein a second anchoring part filled in the anchoring groove is formed at the part of the insulating layer, which corresponds to the anchoring groove.
3. The method according to claim 2, wherein the step of preparing the insulating layer on the side of the planarization layer facing away from the substrate base plate comprises:
and bonding the color film substrate and the insulating layer through frame sealing glue, wherein the anchoring groove is filled with the frame sealing glue and the part corresponding to the anchoring groove.
4. A display panel produced by the method for producing a display panel according to any one of claims 1 to 3, comprising:
a substrate base plate, a first substrate base plate,
a device layer formed on one side of the substrate base plate;
the bending part is positioned on one side of the substrate base plate and comprises a metal wiring layer and a protective layer, wherein one end of the bending part is connected with the surface of the substrate base plate, which is provided with the device layer, while the other end is bent to the surface of one side of the substrate base plate, which is far away from the device layer; the protective layer is connected with the device layer; in the bending area of the bending part, the metal routing layer is positioned on the inner side of the protective layer.
5. The display panel according to claim 4, wherein the device layer comprises a planarization layer, and one end of the planarization layer close to the bending portion is connected to the protection layer.
6. The display panel according to claim 5, wherein at least one anchor groove is formed at an end of the protective layer connected to the base substrate, and a first anchor portion for filling the anchor groove is formed at a portion of the planarization layer corresponding to the anchor groove.
7. The display panel according to claim 6, wherein a dimension of an end of the anchor groove away from the device layer is larger than a dimension of an end close to the device layer along an extending direction of the bending portion.
8. The display panel according to claim 6, wherein an insulating layer is formed on a side of the planarization layer facing away from the substrate base, and a second anchor portion for filling the anchor groove is formed at a portion of the insulating layer corresponding to the anchor groove.
9. The display panel according to claim 8, comprising a color film substrate, wherein the color film substrate is bonded to the insulating layer frame sealing adhesive, and the anchoring groove is filled with the frame sealing adhesive and a portion corresponding to the anchoring groove.
10. The display panel according to any one of claims 4 to 9, comprising a first buffer portion disposed side by side with the substrate base, wherein the first buffer portion is located in an area surrounded by the bending portion for supporting the bending portion.
11. The display panel according to any one of claims 4 to 9, wherein a second buffer portion is disposed between an end of the bending portion away from the substrate base and the substrate base.
12. The display panel according to claim 11, wherein the second buffer portion includes a support base plate and a buffer body, and the buffer body is located between the support base plate and the substrate base plate.
13. A display device characterized in that the display panel according to any one of claims 4 to 12 is provided.
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