CN110922611B - MXene hydrogel with high strength, conductivity and high and low temperature resistance as well as preparation method and application thereof - Google Patents

MXene hydrogel with high strength, conductivity and high and low temperature resistance as well as preparation method and application thereof Download PDF

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CN110922611B
CN110922611B CN201911180759.1A CN201911180759A CN110922611B CN 110922611 B CN110922611 B CN 110922611B CN 201911180759 A CN201911180759 A CN 201911180759A CN 110922611 B CN110922611 B CN 110922611B
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water
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mxene
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CN110922611A (en
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汤龙程
喻志冉
张国栋
张建旺
郭坤宇
赵丽
龚丽秀
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Hangzhou Normal University
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
    • C08J3/075—Macromolecular gels
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52—Amides or imides
    • C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/56—Acrylamide; Methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/24—Homopolymers or copolymers of amides or imides
    • C08J2333/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2405/00—Characterised by the use of polysaccharides or of their derivatives not provided for in groups C08J2401/00 or C08J2403/00
    • C08J2405/08—Chitin; Chondroitin sulfate; Hyaluronic acid; Derivatives thereof

Abstract

The invention discloses MXene hydrogel with high strength, conductivity and high and low temperature resistance, and a preparation method and application thereof. The hydrogel disclosed by the invention takes deionized water and a water-retaining agent with a volume ratio of 1: 0.75-1.25 as solvents, and is composed of the following components in proportion: the total mass of the acrylamide and the acrylic acid is 20-30% of the total mass of the solvent, the mass ratio of the acrylamide to the acrylic acid is 1.5-8: 1, the mass of the chitosan is 1-3% of the total mass of the solvent, the mass of the MXene is 0.2-0.8% of the total mass of the acrylamide and the acrylic acid, and the mass of the SiH serving as a silicon cross-linking agentXThe mass of the initiator is 1-3 percent of the total mass of the solvent, the mass of the initiator is 0.01-0.1 percent of the total mass of the solvent, and the mass of the acetic acid is 1-3 percent of the total mass of the solvent. The hydrogel disclosed by the invention is good in morphology and mechanical property, has super-strong compressive strength, good conductivity, viscosity and high and low temperature resistance, and can be used as a strain sensor to be applied to complex environments.

Description

MXene hydrogel with high strength, conductivity and high and low temperature resistance as well as preparation method and application thereof
Technical Field
The invention relates to the field of hydrogel materials, in particular to MXene hydrogel with high strength, conductivity and high and low temperature resistance, a preparation method thereof and application thereof in a strain sensor.
Background
The hydrogel is a soft wet material with a three-dimensional cross-linked network, and can be widely applied to the fields of wearable flexible devices, soft robots, biomedicine, tissue engineering, intelligent actuators, biosensors and the like. To meet these applications, hydrogels are required to have not only excellent mechanical and electrical properties but also to maintain their properties in a complex environment. However, the conventional hydrogel is often complex in preparation process, is difficult to have high and low temperature resistance under the condition of relatively high water content, cannot keep the characteristics of softness and humidity continuously due to serious water loss at high temperature, easy icing at low temperature and the like, and is difficult to continuously output a conductive signal for sensor equipment.
There are some reports on the preparation of high and low temperature resistant hydrogels. For example, a preparation method of low temperature resistant self-healing hydrogel and application thereof (CN 110054856A) and a preparation method of heat/low temperature resistant tough-bonded hydrogel electrolyte (CN 110117370A), but all of them have the defects of complicated preparation process, high-temperature heating requirement, long preparation period, narrow high and low temperature resistant range and the like.
The patent specification with the publication number of CN 109535449A discloses a preparation method of a high-toughness high-temperature-resistant and low-temperature-resistant chitosan-based hydrogel, which is prepared by taking chitosan as a raw material, heating and dissolving the chitosan by adopting a glycerol/water composite solvent containing aluminum chloride or ferric chloride, and then adding acrylamide, acrylic acid, a cross-linking agent and an initiator into a chitosan solution, wherein the temperature resistance range is-24-60 ℃, but the preparation process of the system is complex and time-consuming, does not have good conductivity and viscosity, and cannot be suitable for the application of a high-sensitivity sensor.
MXene is a rapidly developed two-dimensional transition metal carbide/carbonitride, has hydrophilicity and high conductivity, and has wide application prospect in the aspects of electrochemical energy storage devices and the like. Recently, Zhang et al reportedContains MXene (Ti)3C2Tx) The hydrogel composite material of (a) is superior to conventional hydrogels in terms of strain sensors (sci. adv.2018; 4: eaat0098) applied as MXene paste on pristine crystalline clay, with excellent tensile strain sensitivity. But the material is poor in mechanical property due to lack of a network supporting mechanism, almost has no compressive strength, and does not have high and low temperature resistance, so that the practical application of the material is limited. Liao et al (Adv Funct Mater,2019,1904057) achieved low temperature resistance by immersing MXene hydrogels in ethylene glycol solutions, replacing part of the water molecules. However, the hydrogel does not have high temperature resistance, and the strain range of poor mechanical properties is only about 350%. Therefore, development of a simple process for preparing a hydrogel material with excellent mechanical and electrical conductivity properties, and meeting the requirements of high-temperature and low-temperature complex environments remains a challenging task.
Disclosure of Invention
Aiming at the defects in the field, the invention provides the MXene hydrogel with high strength, conductivity and high and low temperature resistance, overcomes the defect that the traditional hydrogel cannot resist high and low temperatures, can resist the temperature ranging from-40 ℃ to 100 ℃, does not need photo-thermal initiation, can rapidly gel at room temperature, and has excellent mechanical property and conductivity.
An MXene hydrogel with high strength, electric conductivity and high and low temperature resistance is prepared from water, water-retaining agent, acrylamide, acrylic acid, chitosan, MXene and SiH as silicon cross-linking agentXAn initiator and acetic acid;
the volume ratio of the water to the water-retaining agent is 1: 0.75-1.25;
the total mass of the acrylamide and the acrylic acid is 20-30% of the total mass of the water and the water-retaining agent, and the mass ratio of the acrylamide to the acrylic acid is 1.5-8: 1;
the mass of the chitosan is 1 to 3 percent of the total mass of the water and the water-retaining agent;
the weight of the MXene is 0.2-0.8% of the total weight of the acrylamide and the acrylic acid;
the silicon cross-linker SiHXThe mass is 1 to 3 percent of the total mass of the water and the water-retaining agent;
the mass of the initiator is 0.01-0.1% of the total mass of the water and the water-retaining agent;
the mass of the acetic acid is 1-3% of the total mass of the water and the water-retaining agent.
The hydrogel is formed by a polyacrylamide/polyacrylic acid and chitosan triple network and MXene filler in a water/water-retaining agent system. The hydrogel has high strength and toughness, and each raw material component is absent and should be in the proportion range. Firstly, initiating acrylamide/acrylic acid double monomers by an initiator to obtain a long polyacrylamide/polyacrylic acid polymer chain, then reacting and interweaving amino groups of chitosan and polyacrylamide with carboxyl groups of polyacrylic acid to form a network, and finally wrapping MXene sheets in the three-network system by the dehydration action of a cross-linking agent and the strong hydrogen bond action between hydroxyl groups to obtain the high-strength conductive high-low temperature resistant MXene hydrogel.
The volume ratio of the water to the water-retaining agent is too large, namely, the water content is too high, so that the temperature resistance of the obtained hydrogel is poor, the volume ratio is too small, namely, the glycerol content is too high, so that the solubility is poor, and the mechanical property of the obtained hydrogel is influenced, and most preferably, the volume ratio of the water to the water-retaining agent is 1:1.
The inventor has found through a great deal of experimental research that the ratio of the total mass of acrylamide and acrylic acid to the total mass of water and the water-retaining agent, and the mass ratio between acrylamide and acrylic acid all affect the mechanical properties of the obtained hydrogel. When the total mass of the acrylamide and the acrylic acid is 25% of the total mass of the water and the water-retaining agent, and the mass ratio of the acrylamide to the acrylic acid is 4:1, the mechanical property of the obtained hydrogel is the most excellent.
The mass ratio of chitosan affects the mechanical properties of the obtained hydrogel. Preferably, the mass of the chitosan is 2% of the total mass of the water and the water-retaining agent, and the best mechanical effect cannot be achieved by too low or too high mass.
In addition, the inventor researches and discovers that the proportional relation between the MXene mass and the total mass of the acrylamide and the acrylic acid has important influence on the initiating effect, the effect of room-temperature initiation cannot be achieved when the proportion is too low, and implosion is easily caused when the proportion is too high. Preferably, the mass of the MXene is 0.4-0.6% of the total mass of the acrylamide and the acrylic acid.
The too high content of the initiator results in too short gelling time to facilitate the molding work such as pouring into a mold, and preferably, the mass of the initiator is 0.06% of the total mass of the water and the water-retaining agent.
The mass of the acetic acid is 2 percent of the total mass of the water and the water-retaining agent.
The inventors have found that the plasticity of the hydrogel obtained can be influenced by adjusting the viscosity of chitosan, and preferably, the viscosity of chitosan is 100 to 200mpa.s, the solubility of chitosan at the viscosity is good, and the plasticity of the shape of the hydrogel prepared is strong.
Preferably, the silicon cross-linking agent is SiHXObtained by hydrolytic condensation of KH560 and KH570 according to the molar ratio of 1: 0.8-2. The inventor finds out through a large number of experiments that the mechanical property of the obtained hydrogel is the most excellent by using the silicon cross-linking agent prepared according to the components and the proportion.
The water-retaining agent is glycerol.
Preferably, the MXene is obtained by MAX raw material (Ti)3AlC2) Etching by HF solution to obtain the product;
the etching temperature is 30-40 ℃, and the etching time is 72-84 h.
The MAX raw material is Ti3AlC2。
The initiator is ammonium persulfate.
The invention also provides a preparation method of the MXene hydrogel with high strength, conductivity and high and low temperature resistance, which comprises the following steps:
(1) uniformly mixing water, a water-retaining agent, acrylamide, acrylic acid, chitosan, MXene and acetic acid according to a ratio;
(2) adding SiH serving as a silicon cross-linking agent into the mixed liquid obtained in the step (1) according to the proportionXAfter being mixed uniformly, the initiator is added according to the proportion and mixed uniformly;
(3) and (3) pouring the mixed solution obtained in the step (2) into a mold, purging with nitrogen for 10-20 s, sealing, and standing at room temperature for 5-10 min to obtain the high-strength conductive high-low temperature resistant MXene hydrogel.
The MXene hydrogel with high strength, conductivity and high and low temperature resistance is prepared by adding MXene solution into acrylamide (AAm)/acrylic acid (AAc) double monomers, adding a certain proportion of water-retaining agent, adding Chitosan (CS), initiating polymerization by using initiator ammonium persulfate, and promoting crosslinking by using silicon crosslinking agent.
The formation principle of the hydrogel is that firstly, monomer acrylamide (AAm)/acrylic acid (AAc) is initiated by an initiator to form a long macromolecular chain, then amino groups of chitosan and polyacrylamide react with carboxyl groups of polyacrylic acid to form a network, and finally, MXene sheets are wrapped in a three-network system through the dehydration effect of a silicon cross-linking agent and the strong hydrogen bond effect between hydroxyl groups.
Preferably, in the step (1), MXene is added in the form of an MXene aqueous solution with the concentration of 5-30 mg/mL;
in the step (2), the initiator is added in the form of ammonium persulfate aqueous solution with the concentration of 0.01-0.1 mg/mL.
The invention also provides application of the MXene hydrogel with high strength, conductivity and high and low temperature resistance in the field of strain sensors.
Preferably, the application temperature range is-20 to 80 ℃, and the using effect is optimal under the condition.
Compared with the prior art, the invention has the main advantages that:
1. the hydrogel disclosed by the invention is excellent in mechanical property, has a wider strain range, can reach 900% at most, and has the strength of 2.94MPa when being compressed by 90%.
2. The hydrogel disclosed by the invention has good conductivity and viscosity and a wide strain range, and can be used for manufacturing a strain sensor.
3. The hydrogel disclosed by the invention has good high and low temperature resistance, can resist the temperature ranging from-40 ℃ to 100 ℃, and can be suitable for complex environments.
4. The preparation method is simple in preparation process, free of photo-thermal initiation, capable of rapidly gelling at room temperature (5-10 min), and low in energy consumption.
Drawings
FIG. 1 is a photograph showing a physical stretching of the MXene hydrogel having high strength, conductivity and high temperature resistance prepared in example 1;
FIG. 2 is a graph of the compressive stress strain of the high strength electrically conductive and high temperature resistant MXene hydrogel prepared in example 1;
FIG. 3 is a graph comparing the high and low temperature resistance of the high strength electrically conductive and high and low temperature resistant MXene hydrogel (GH) prepared in example 1 with that of the non-high and low temperature resistant hydrogel (WH) prepared in comparative example 1;
FIG. 4 is a graph comparing the high and low temperature conductivity properties of the high strength electrically conductive and high and low temperature resistant MXene hydrogel (GH) prepared in example 1 with the non-high and low temperature resistant hydrogel (WH) prepared in comparative example 1;
FIG. 5 is a photograph demonstrating the viscosity of the high strength electrically conductive and high temperature resistant MXene hydrogel prepared in example 1;
FIG. 6 is a schematic diagram of the application of the MXene hydrogel with high strength, conductivity and high temperature resistance prepared in example 1 in a finger sensor;
figure 7 is a photograph of an imploded MXene hydrogel blend prepared in comparative example 2.
Detailed Description
The invention is further described with reference to the following drawings and specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The following examples are conducted under conditions not specified, usually according to conventional conditions, or according to conditions recommended by the manufacturer.
The viscosity of chitosan used in the following examples is 100 to 200mPa.s, and the silicon crosslinking agent SiHXObtained by hydrolysis and condensation of KH560 and KH570 according to the molar ratio of 1: 0.8-2, wherein the initiator is ammonium persulfate, the water-retaining agent is glycerol, and MXene is obtained by MAX raw material (Ti3AlC2) Etching by using HF solution at the temperature of 30-40 ℃ for 72-84 h.
Comparative example 1
Deionized water is used as a solvent, and the components are added according to the following proportion: acrylamide monomer accounting for 20 percent of the total mass of the solvent, acrylic acid monomer accounting for 5 percent of the total mass of the solvent and shellThe mass of the glycan is 2 percent of the total mass of the solvent, the mass of MXene is 0.1 percent of the total mass of the solvent, and a silicon cross-linking agent SiHXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing the mold, and standing for 10min to obtain the MXene-based non-high and low temperature resistant hydrogel (WH).
Example 1
Deionized water and glycerol in a volume ratio of 1:1 are taken as solvents, and the components are added according to the following proportion: 20 percent of acrylamide monomer, 5 percent of acrylic acid monomer, 2 percent of chitosan, 0.1 percent of MXene and SiH as silicon cross-linking agentXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel (GW) with high strength, conductivity and high and low temperature resistance.
The MXene hydrogel with high strength, conductivity and high and low temperature resistance prepared in this example is shown in FIG. 1, and it can be seen that the hydrogel has good stretchable performance and large strain range, which is more than 800%.
The mechanical property test results are shown in fig. 2, and the stress of the hydrogel prepared in this example can reach 2.94Mpa when the hydrogel is compressed by 90%.
High and low temperature resistance test of hydrogel as shown in fig. 3 and 4, the hydrogel (GW) prepared in this example was still twisted and stretchable after being left at-20 ℃ or 80 ℃ for one day and had good conductivity, compared to the non-high and low temperature resistant hydrogel (WH) of the comparative example.
Hydrogel viscosity test As shown in FIG. 5, the MXene hydrogel with high strength, conductivity and high and low temperature resistance prepared in this example has good viscosity and can stick up a 500g weight.
Application example
As shown in fig. 6, the high strength conductive and high temperature resistant MXene hydrogel of example 1 was applied in a finger sensor. The high and low temperature resistant conductive hydrogel prepared in the embodiment 1 has good conductivity, can present different resistance signals along with the bending and straightening of fingers, and can be used for monitoring motion signals of a human body.
Comparative example 2
Deionized water and glycerol in a volume ratio of 1:1 are taken as solvents, and the components are added according to the following proportion: 20 percent of acrylamide monomer, 5 percent of acrylic acid monomer, 2 percent of chitosan, 0.3 percent of MXene and SiH as silicon cross-linking agentXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to discharge air, sealing, and standing for 10min to obtain an implosion MXene hydrogel mixture, wherein the mechanical properties of the MXene hydrogel mixture are extremely poor as shown in FIG. 7, which illustrates the importance of MXene addition amount control.
Comparative example 3
Deionized water and glycerol in a volume ratio of 1:1 are taken as solvents, and the components are added according to the following proportion: 5 percent of acrylamide monomer, 20 percent of acrylic acid monomer, 2 percent of chitosan, 0.1 percent of MXene and SiH as silicon cross-linking agentsXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. Pouring the obtained mixed solution into a mould, blowing nitrogen to exhaust air, and sealing, wherein MXene hydrogel can not be obtained even if the mixed solution is treated in an oven at 50 ℃ for 24 hours, and only a semi-gelatinous substance with viscous property is obtained, which illustrates the importance of controlling the mass ratio of acrylamide to acrylic acid.
Example 2
Deionized water and glycerol with the volume ratio of 1:0.9 are taken as solvents, and the components are added according to the following proportion: 16 percent of acrylamide monomer, 9 percent of acrylic acid monomer, 1.2 percent of chitosan, 0.1 percent of MXene and SiH as silicon cross-linking agentXQuality ofAccounting for 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate accounting for 0.06 percent of the total mass of the solvent, and the mass of the acetic acid accounting for 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Example 3
Deionized water and glycerol with the volume ratio of 1:0.8 are taken as solvents, and the components are added according to the following proportion: the mass of acrylamide monomer is 18 percent of the total mass of the solvent, the mass of acrylic acid monomer is 7 percent of the total mass of the solvent, the mass of chitosan is 1.8 percent of the total mass of the solvent, the mass of MXene is 0.15 percent of the total mass of the solvent, and SiH serving as a silicon cross-linking agentXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Example 4
Deionized water and glycerol with the volume ratio of 1:1.25 are taken as solvents, and the components are added according to the following proportion: the mass of acrylamide monomer is 21 percent of the total mass of the solvent, the mass of acrylic acid monomer is 6 percent of the total mass of the solvent, the mass of chitosan is 2.4 percent of the total mass of the solvent, the mass of MXene is 0.18 percent of the total mass of the solvent, and SiH serving as a silicon cross-linking agentXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Example 5
Deionized water and glycerol with the volume ratio of 1:0.75 are taken as solvents, and the components are added according to the following proportion: acrylamide monomer accounting for 17 percent of the total mass of the solvent, acrylic acid monomer accounting for 8 percent of the total mass of the solvent, chitosan accounting for 2.8 percent of the total mass of the solvent, MXene accounting for 0.2 percent of the total mass of the solvent, and silicon crosslinking agent SiHXThe mass of the initiator is 1 percent of the total mass of the solvent, and the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solventThe mass of acetic acid is 2% of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Example 6
Deionized water and glycerol with the volume ratio of 1:1.15 are taken as solvents, and the components are added according to the following proportion: the mass of acrylamide monomer is 22 percent of the total mass of the solvent, the mass of acrylic acid monomer is 3 percent of the total mass of the solvent, the mass of chitosan is 2 percent of the total mass of the solvent, the mass of MXene is 0.06 percent of the total mass of the solvent, and a silicon crosslinking agent SiHXThe mass of the initiator ammonium persulfate is 1.5 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Example 7
Deionized water and glycerol with the volume ratio of 1:0.85 are taken as solvents, and the components are added according to the following proportion: the mass of acrylamide monomer is 20 percent of the total mass of the solvent, the mass of acrylic acid monomer is 5 percent of the total mass of the solvent, the mass of chitosan is 1 percent of the total mass of the solvent, the mass of MXene is 0.09 percent of the total mass of the solvent, and a silicon crosslinking agent SiHXThe mass of the initiator ammonium persulfate is 2 percent of the total mass of the solvent, the mass of the initiator ammonium persulfate is 0.06 percent of the total mass of the solvent, and the mass of the acetic acid is 2 percent of the total mass of the solvent. And pouring the obtained mixed solution into a mold, blowing nitrogen to exhaust air, sealing, and standing for 10min to obtain the MXene hydrogel with high strength, conductivity and high and low temperature resistance.
Furthermore, it should be understood that various changes and modifications can be made by one skilled in the art after reading the above description of the present invention, and equivalents also fall within the scope of the invention as defined by the appended claims.

Claims (9)

1. The MXene hydrogel with high strength, conductivity and high and low temperature resistance is characterized by comprising water, a water-retaining agent, acrylamide, acrylic acid, chitosan, MXene and a silicon cross-linking agent SiHXInitiator and acetic acid as raw materials；
The volume ratio of the water to the water-retaining agent is 1: 0.75-1.25;
the total mass of the acrylamide and the acrylic acid is 20-30% of the total mass of the water and the water-retaining agent, and the mass ratio of the acrylamide to the acrylic acid is 1.5-8: 1;
the mass of the chitosan is 1 to 3 percent of the total mass of the water and the water-retaining agent;
the weight of the MXene is 0.2-0.8% of the total weight of the acrylamide and the acrylic acid;
the silicon cross-linker SiHXThe mass is 1 to 3 percent of the total mass of the water and the water-retaining agent;
the mass of the initiator is 0.01-0.1% of the total mass of the water and the water-retaining agent;
the mass of the acetic acid is 1 to 3 percent of the total mass of the water and the water-retaining agent;
the water-retaining agent is glycerol;
the silicon cross-linking agent SiHXObtained by hydrolytic condensation of KH560 and KH570 according to the molar ratio of 1: 0.8-2.
2. The MXene hydrogel having high strength, conductivity and high temperature and low temperature resistance of claim 1, wherein the volume ratio of water to water retaining agent is 1:1.
3. The MXene hydrogel having high strength, conductivity and high temperature and low temperature resistance of claim 1, wherein the total mass of acrylamide and acrylic acid is 25% of the total mass of the water and water retaining agent, and the mass ratio of acrylamide and acrylic acid is 4: 1.
4. The MXene hydrogel having high strength, conductivity and high temperature resistance according to claim 1, wherein the MXene mass is 0.4-0.6% of the total mass of acrylamide and acrylic acid.
5. The MXene hydrogel having high strength and high and low temperature resistance according to claim 1, wherein the viscosity of chitosan is 100-200 mPa.s.
6. The MXene hydrogel having high strength, conductivity and high temperature resistance according to claim 1, wherein the MXene is obtained by etching MAX raw material with HF solution;
the etching temperature is 30-40 ℃, and the etching time is 72-84 h.
7. The method for preparing the MXene hydrogel with high strength, conductivity and high and low temperature resistance according to any one of claims 1 to 6, comprising the steps of:
(1) uniformly mixing water, a water-retaining agent, acrylamide, acrylic acid, chitosan, MXene and acetic acid according to a ratio;
(2) adding SiH serving as a silicon cross-linking agent into the mixed liquid obtained in the step (1) according to the proportionXAfter being mixed uniformly, the initiator is added according to the proportion and mixed uniformly;
(3) and (3) pouring the mixed solution obtained in the step (2) into a mold, purging with nitrogen for 10-20 s, sealing, and standing at room temperature for 5-10 min to obtain the high-strength conductive high-low temperature resistant MXene hydrogel.
8. The method for preparing the MXene hydrogel with high strength, conductivity and high and low temperature resistance according to claim 7, wherein in the step (1), the MXene is added in the form of MXene aqueous solution with concentration of 5-30 mg/mL;
in the step (2), the initiator is added in the form of ammonium persulfate aqueous solution with the concentration of 0.01-0.1 mg/mL.
9. The use of the MXene hydrogel with high strength, conductivity and high temperature resistance according to any one of claims 1-6 in the field of strain sensor.
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