CN110868799A - Transparent COF design method - Google Patents

Abstract

The invention provides a design method of a transparent COF (chip on film), and relates to the technical field of COFs. According to the design method of the transparent COF, the transparent COF consists of a transparent PI layer and a copper foil layer; wherein the transparent COF comprises the following preparation steps: s1, preparing a transparent PI layer, and inspecting the used transparent PI layer to determine that the transparent PI layer is not damaged; s2, forming a main copper foil layer on one side of the transparent PI layer by chemical deposition copper plating to obtain a transparent COF; and S3, detecting the prepared transparent COF, and determining whether the various performances of the transparent COF are qualified. The transparent COF formed by the transparent PI layer and the copper foil layer can clearly see the internal circuit condition, the checking accuracy of the COF internal circuit is improved, the leakage detection problem is greatly reduced, the product quality is improved, and meanwhile, unprecedented visual perception and brand-new experience can be brought to a user.

Description

Transparent COF design method

Technical Field

The invention relates to the technical field of COF (chip on film), in particular to a design method of a transparent COF.

Background

COF is commonly called as chip on film, which is a soft chip on film packaging technology for fixing an Integrated Circuit (IC) on a flexible circuit board, and combines a chip with a flexible substrate circuit by using a soft additional circuit board as a packaging chip carrier, or a soft additional circuit board without packaging the chip by single finger, and comprises tape-on-tape packaging production (TAB substrate, the manufacturing process is called as TCP), a soft board connection chip assembly and soft IC carrier packaging.

The conventional COF structure is composed of a PI layer and a copper foil layer, the PI layer of the COF is not transparent because the metal layer is not transparent, the PI layer of the COF is not transparent, the inspection of the internal circuit of the COF is seriously influenced by the non-transparent PI material, the internal circuit of the COF cannot be seen through microscopic examination and human examination when the quality appearance of the PI layer is inspected, and thus, the poor leakage inspection of the batch circuits is caused, and the product quality is seriously influenced.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a design method of a transparent COF (chip on film), which solves the problems that the circuits in the COF cannot be seen through microscopic examination and human inspection when an opaque PI layer is subjected to quality appearance inspection, so that batch circuits are poor and missed to be inspected, and the product quality is seriously influenced.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: a design method of a transparent COF (chip on film) comprises a transparent PI layer and a copper foil layer;

the transparent COF comprises the following preparation steps:

s1, preparing a transparent PI layer, and inspecting the used transparent PI layer to determine that the transparent PI layer is not damaged;

s2, forming a main copper foil layer on one side of the transparent PI layer by chemical deposition copper plating to obtain a transparent COF;

and S3, detecting the prepared transparent COF, and determining whether the various performances of the transparent COF are qualified.

Preferably, the thickness of the transparent PI layer is 5 μm to 100 μm.

Preferably, the thickness of the copper foil layer is 3 to 30 μm.

(III) advantageous effects

The invention provides a design method of a transparent COF. The method has the following beneficial effects:

1. the transparent COF formed by the transparent PI layer and the copper foil layer can clearly see the internal circuit condition, the checking accuracy of the COF internal circuit is improved, the leakage detection problem is greatly reduced, and the product quality is improved.

2. The transparent PI layer improves the checking function of the COF internal circuit, has the functions of high flexibility, light weight, high impact resistance, high heat-resistant stability, corrosion resistance, insulativity and the like, and can bring unprecedented visual perception and brand-new experience to users.

Drawings

FIG. 1 is a schematic view of the structure of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

as shown in fig. 1, an embodiment of the invention provides a method for designing a transparent COF, where the transparent COF is composed of a transparent PI layer and a copper foil layer;

wherein the transparent COF comprises the following preparation steps:

s1, preparing a transparent PI layer, and inspecting the used transparent PI layer to determine that the transparent PI layer is not damaged, wherein the thickness of the transparent PI layer is 5-100 μm;

s2, forming a main copper foil layer on one side of the transparent PI layer by chemical deposition copper plating, wherein the thickness of the copper foil layer is 3-30 μm, and then obtaining the transparent COF;

and S3, detecting the prepared transparent COF, and determining whether the various performances of the transparent COF are qualified.

The transparent COF formed by the transparent PI layer and the copper foil layer can clearly see the internal circuit condition, so that the accuracy of the circuit inspection in the COF is improved, the problem of missed inspection is greatly reduced, and the product quality is improved; the transparent PI layer improves the checking function of the COF internal circuit, has the functions of high flexibility, light weight, high impact resistance, high heat-resistant stability, corrosion resistance, insulativity and the like, and can bring unprecedented visual perception and brand-new experience to users.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (3)

1. A method for designing a transparent COF, comprising: the transparent COF consists of a transparent PI layer and a copper foil layer;

the transparent COF comprises the following preparation steps:

s1, preparing a transparent PI layer, and inspecting the used transparent PI layer to determine that the transparent PI layer is not damaged;

s2, forming a main copper foil layer on one side of the transparent PI layer by chemical deposition copper plating to obtain a transparent COF;

and S3, detecting the prepared transparent COF, and determining whether the various performances of the transparent COF are qualified.

2. A transparent COF design process according to claim 1, wherein: the thickness of the transparent PI layer is 5-100 mu m.

3. A transparent COF design process according to claim 1, wherein: the thickness of the copper foil layer is 3-30 μm.

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