CN110864193B

CN110864193B - Method for manufacturing thin vacuum heat insulation sheet

Info

Publication number: CN110864193B
Application number: CN201810983597.4A
Authority: CN
Inventors: 陈振贤
Original assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Current assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Priority date: 2018-08-27
Filing date: 2018-08-27
Publication date: 2021-02-12
Anticipated expiration: 2038-08-27
Also published as: CN110864193A; WO2020042974A1

Abstract

A thin vacuum heat insulation sheet and a manufacturing method thereof are provided, which comprises a first sheet structure, a second sheet structure and a soldering material. The first sheet structure has a first surface with solderability. The second sheet structure has a second surface with solderability. The solder material is annularly welded on the first surface and the second surface, and the first sheet structure and the second sheet structure are hermetically jointed by the solder material and form an interstitial space. Wherein the air pressure in the gap space is in a negative pressure state less than one atmosphere. The thin vacuum heat insulation sheet can effectively reduce heat conduction and heat convection between two surfaces of the heat insulation sheet so as to achieve the function of effectively resisting heat insulation. Because the thicknesses of the first sheet-shaped structure, the second sheet-shaped structure and the annular soldering tin material are accurately controlled and the sealing welding is formed in the vacuum environment, the thin vacuum heat insulation sheet with the thickness less than 1mm can be formed and is suitable for various heat insulation application requirements of light and thin electronic and communication products.

Description

Method for manufacturing thin vacuum heat insulation sheet

Technical Field

The invention provides a vacuum heat insulation sheet and a manufacturing method thereof, in particular to a thin vacuum heat insulation sheet and a manufacturing method thereof.

Background

The development trend of electronic and handheld communication devices is continuously towards thinning and high functionality, and demands on the operation speed and functions of a Microprocessor (Microprocessor) in the device are also increasing. The microprocessor is a core component of electronic and communication products, and is easy to generate heat under high-speed operation to become a main heating element of an electronic device, and if the heat cannot be dissipated instantly, a local processing Hot Spot (Hot Spot) is generated. Without a good thermal management scheme and a heat dissipation system, the microprocessor is often overheated and cannot perform its intended function, which may even affect the lifetime and reliability of the whole electronic device system. Therefore, electronic products need excellent heat dissipation design, and especially ultra-thin electronic devices such as smart phones (smartphones) and Tablet PCs (Tablet PCs) need excellent heat dissipation capability. An effective solution for Heat dissipation and Heat dissipation in the Hot Spot (Hot Spot) of electronic and communication products is to contact one side of a graphite sheet (graphite sheet) or a flat Micro Heat Pipe (flat Heat Pipe) or a Vapor Chamber (Vapor Chamber) with a Heat source and the other side with a housing of the electronic device.

However, because some electronic or communication products, such as smart phones, are very thin and light, the thickness space between the microprocessor and the chassis hub for accommodating the heat dissipation elements is often less than 1 mm. Therefore, the other side of the heat dissipating element in the heat source region is directly contacted with the cylindrical enclosure, and the high temperature generated by the hot spot is easily and directly conducted to the cylindrical enclosure, resulting in the excessive hot spot temperature on the cylindrical enclosure. Therefore, in order to avoid the hub temperature being too high, it is necessary to dispose a layer of insulation sheet between the hub of the hot spot region and the partial region of the heat dissipation element to prevent the conduction of the insulator heat flow. Meanwhile, a heat-insulating sheet is also needed to properly isolate the heat-generating components on the circuit board from other electronic or optoelectronic components that are sensitive to heat. Therefore, a solution to the problem of how to efficiently insulate heat in a limited thickness and space at a local position of a device is needed in a thin, small, light, and small electronic and communication device.

Disclosure of Invention

The invention provides a thin vacuum heat insulation sheet and a manufacturing method thereof. The structure and the manufacturing method of the thin vacuum heat insulation sheet can effectively solve the problem that the common heat insulation material is difficult to have the heat insulation effect in the space with limited thickness, and particularly the application scene that the heat insulation thickness space is required to be less than 1 mm.

The present invention provides a thin vacuum heat insulation sheet, which comprises a first sheet structure, a second sheet structure and a solder material. The first sheet structure has a first surface with solderability. The second sheet structure has a second surface with solderability. The solder material is annularly welded on the first surface and the second surface, and the first sheet structure and the second sheet structure are hermetically jointed by the solder material and form an interstitial space. Wherein the air pressure in the gap space is in a negative pressure state less than one atmosphere.

Wherein the first sheet structure and the second sheet structure are made of metal. Furthermore, the material of the first sheet structure and the second sheet structure is copper.

The thickness of the thin vacuum heat insulation sheet is less than 1mm, and the height of the gap space is less than 0.5 mm.

The first surface of the first sheet structure is provided with a solder mask layer, and the soldering material is soldered on the edge of the solder mask layer of the first surface.

The thin vacuum heat insulation sheet further comprises a support column formed in the gap space, and two ends of the support column are respectively connected with the first sheet structure and the second sheet structure.

The invention also provides a method for manufacturing the thin vacuum heat insulation sheet, which comprises the following steps: a first fixture platform with a first groove and a second fixture platform with a second groove are provided. And adsorbing a first sheet structure in the first groove and adsorbing a second sheet structure in the second groove. A solder material is annularly laid on a first surface of the first sheet structure. And overlapping the second jig platform and the first jig platform to enable the position of the first sheet structure to be highly corresponding to the position of the second sheet structure at intervals, wherein a soldering material is arranged between the first sheet structure and the second sheet structure. Placing the second jig platform and the first jig platform which are overlapped into a cavity. The first smelting tool platform and the second smelting tool platform as well as the first sheet structure and the second sheet structure are vacuumized and heated, the soldering tin material is melted in a vacuum state, and the first sheet structure and the second sheet structure are welded in an airtight mode, so that a vacuum gap space is formed among the first sheet structure, the second sheet structure and the annular soldering tin material.

In one embodiment, in the step of providing a first jig platform having a first groove and a second jig platform having a second groove, the second jig platform further has a positioning post; in the step of laminating the second fixture platform and the first fixture platform, the height of the interval between the first sheet structure and the second sheet structure is determined by the height of the positioning column.

In another embodiment, in the step of providing the first jig platform having the first groove and the second jig platform having the second groove, the first jig platform having the first groove and the plurality of third grooves and the second jig platform having the second groove and the positioning column are further provided.

Then, the method for manufacturing the thin vacuum heat insulation sheet further comprises the following steps: and placing at least three solder balls in the third groove, wherein the solder balls are the same as the solder material in material and melting point, and the height of the solder balls is higher than that of the positioning columns.

In the step of laminating the second jig platform and the first jig platform, before the solder material and the solder ball are not dissolved, the height of the interval between the first sheet structure and the second sheet structure is determined by the height supported by the solder ball; and in the step of heating the first and second jig platforms, the first and second sheet structures in the cavity and vacuumizing, the solder material and the solder ball are melted, and due to the action of gravity, the second jig platform and the second sheet structure sink and approach the first jig platform and the first sheet structure, and the height of the molten annular solder material in the interval between the first and second sheet structures is determined by the height of the positioning column.

The method for manufacturing the thin vacuum heat insulation sheet further comprises the following steps: the first fixture platform and the second fixture platform are cooled to solidify the solder material, and the height of the solder gap between the first sheet structure and the second sheet structure is determined by the height of the positioning post.

Furthermore, in the step of annularly laying the solder material on the first surface of the first sheet structure, a solder wire is annularly placed on the first surface, a solder paste is annularly extruded on the first surface, or an annular solder paste is printed on the first surface.

In conclusion, the thin vacuum heat insulation sheet of the invention can effectively reduce the thermal resistance and isolate the heat conduction and the heat convection between two surfaces of the heat insulation sheet. Meanwhile, due to the thin sheet structure and the hollow characteristic, the heat insulation plate has the advantage of extremely light weight and is suitable for light and thin electronic products and various thin heat insulation requirements. In addition, since the sheet-shaped vacuum structure is not easy to manufacture, the conventional technology can not manufacture the vacuum heat insulation sheet with the thickness less than 1mm, and the invention also provides a manufacturing method of the thin vacuum heat insulation sheet. In the manufacturing method, the tool platform with adsorption capacity is used for stabilizing the thin two-sheet structure, so that the laying of the soldering tin material and the welding of the two-sheet structure are facilitated. The sheet structure and the solder material are heated in a vacuum environment, and a vacuum gap space is naturally formed when the solder material is melted to airtightly weld the sheet structure. Therefore, the ultrathin vacuum heat insulation sheet with the thickness less than 1mm can be manufactured and is suitable for being applied to light and thin electronic devices.

Drawings

FIG. 1A: the thin vacuum insulation panel of the present invention is schematically illustrated.

FIG. 1B: a schematic cross-sectional view of the thin vacuum insulation panel corresponding to fig. 1A is shown.

FIG. 1C: a cross-sectional view of the thin vacuum insulation panel along C-C corresponding to fig. 1B is shown.

FIG. 1D: a cross-sectional view along D-D of the thin vacuum insulation panel corresponding to fig. 1B is shown.

FIG. 2A: there is shown a cross-sectional view of a thin vacuum insulation panel in another embodiment of the present invention.

FIG. 2B: a cross-sectional view of the thin vacuum insulation panel corresponding to fig. 2A is shown.

Fig. 3A to 3F: there is shown a top view of a thin vacuum insulation panel in various embodiments of the present invention.

FIG. 4A: a top view of the first sheet structure in another embodiment of the present invention is shown.

FIG. 4B: a cross-sectional view of the first sheet structure corresponding to fig. 4A is shown.

FIG. 4C: a sectional view of a thin vacuum insulation panel formed using the first sheet structure of fig. 4A is shown.

FIG. 5: the steps of the method for manufacturing a thin vacuum insulation panel according to the present invention are illustrated in the flow chart.

FIG. 6A: the top views of the first and second tool platforms of the present invention are shown.

FIG. 6B is a schematic cross-sectional view of the first fixture platform shown in FIG. 6A.

FIG. 6C is a schematic cross-sectional view illustrating the first sheet structure being adsorbed by the first fixture platform shown in FIG. 6B.

FIG. 6D is a schematic view showing the first and second jig platforms being stacked.

FIG. 6E is a schematic view showing the first and second jig platforms being placed in the cavity.

FIG. 7 is a schematic view showing the first and second jig platforms being stacked together in another embodiment.

FIG. 8A is a schematic view showing a first tool platform and a second tool platform being stacked together in yet another embodiment.

Fig. 8B is a schematic view showing the first and second jig platforms heated and stacked in fig. 8A.

Detailed Description

In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described and illustrated with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitations are intended to the scope of the invention or its corresponding embodiments, particularly in terms of the specific methods, devices, conditions, materials, and so forth.

In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In addition, the indefinite articles "a", "an" and "an" preceding an apparatus or element of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the apparatus or element. Thus, "a" or "an" should be read to include one or at least one, and the singular form of a device or element also includes the plural form unless the number clearly indicates the singular form.

Please refer to fig. 1A to 1D. FIG. 1A is a schematic view of a thin vacuum insulation panel according to the present invention. FIG. 1B is a schematic cross-sectional view of the thin vacuum insulation panel corresponding to FIG. 1A. FIG. 1C is a cross-sectional view of the thin vacuum insulation panel along line C-C, corresponding to FIG. 1B. FIG. 1D is a cross-sectional view of the thin vacuum insulation panel along D-D, corresponding to FIG. 1B. The present invention provides a thin vacuum heat insulation sheet 1, which comprises a first sheet structure 11, a second sheet structure 12 and a solder material 10. The first sheet structure 11 has a first surface 110 with solderability. The second sheet structure 12 has a second surface 120 with solderability. The solder material 10 is annularly soldered to the first surface 110 and the second surface 120, and the first sheet structure 11 and the second sheet structure 12 are hermetically joined by the solder material 10 and form an interstitial space 15. The air pressure in the gap space 15 is a negative pressure state less than one atmosphere. It should be noted that the first sheet structure 11 and the second sheet structure are not absolutely above and below each other after forming.

In the prior art, a material with a low thermal conductivity is usually used as the material of the thermal insulation layer sheet, so as to achieve the thermal insulation effect. However, the heat insulating material is not ideal in the application requirement of the thickness less than 1 mm. The materials of the prior art thermal barrier layer sheet are difficult to meet the requirements of light and thin electronic products. The solder material 10 has a thermal conductivity of about 60W/mk, and can be formed into a material with a lower thermal conductivity according to different alloy mixing ratios, which is much lower than other kinds of metals, such as copper (401W/mk), aluminum (237W/nk), and other commonly used heat dissipation metal materials. In the present invention, the first sheet structure 11 and the second sheet structure 12 are bonded only by a small area of the solder material 10, reducing heat conduction, and the vacuum state between the first sheet structure 11 and the second sheet structure 12 also reduces heat convection. Therefore, the thin vacuum insulation panel 1 with a hollow and vacuum structure can effectively reduce the heat energy from the first sheet structure 11 to the second sheet structure 12. Meanwhile, due to the thin sheet structure and the hollow characteristic, the invention has the advantage of extremely light weight and is suitable for light and thin electronic products and various thin heat insulation requirements.

Wherein the first sheet structure 11 and the second sheet structure 12 are made of metal. Furthermore, the material of the first sheet structure 11 and the second sheet structure 12 is copper. At this time, the heat conduction efficiency in the first sheet structure 11 is excellent, and the heat conduction efficiency in the second sheet structure 12 is also excellent. Therefore, the heat energy is preferentially conducted to the second end of the X or Y axis of the first sheet structure 11 or the second sheet structure 12 along the first end of the X or Y axis of the first sheet structure 11 or the second sheet structure 12, so that the first end can contact the heat source and the second end can be designed as a heat dissipation area. The hollow vacuum region formed between the Z-axes of the first sheet structure 11 and the second sheet structure 12 has extremely high thermal resistance and effectively impedes thermal conduction.

Please refer to fig. 3A to fig. 3F. Fig. 3A to 3F are top views of thin vacuum insulation panels according to various embodiments of the present invention. In various embodiments, the thin vacuum insulation panel 1 may be designed in the shape as shown in fig. 3A to 3F. However, since the present invention is formed by abutting two sheet structures with corresponding shapes, the shapes can be changed very flexibly, and thus the present invention is not limited to the shapes shown in fig. 3A to 3F. The thin vacuum insulation panels 1 with different shapes can be designed in different electronic devices.

Please refer to fig. 1A to fig. 1D. Because the thinner the thickness of the body of the current smart phone, the thickness of some smart phones is even lower than 5 mm. The thickness of the space reserved for the radiating element is less than 1mm after deducting the display panel, the battery, the circuit board, the casing and the like. Because the CPU heating element of the mobile phone is almost tightly attached to the cylindrical housing back cover, the temperature of the back cover rises along with the temperature rise of the CPU. The user holds the mobile phone back cover with hands and feels uncomfortable. Once the temperature of the back cover exceeds a certain value, the CPU is forced to reduce the frequency to achieve the purpose of cooling, and therefore the due functions of the mobile phone are sacrificed. In order to solve the problem, the mobile phone is designed to use a heat pipe or a temperature-equalizing plate to dissipate heat, and the application of the vacuum heat-insulating sheet can solve the problem of overheating of the back cover of the mobile phone at the hot spot. However, the vacuum insulation sheet must be very thin to meet the design requirements of the smart phone. In one embodiment of the present invention, the thickness H of the thin vacuum insulation panel 1 is less than 1mm, the thicknesses of the first sheet structure 11 and the second sheet structure 12 are respectively less than 0.3mm, and the height H of the gap space 15 is less than 0.5 mm. In another preferred embodiment, based on the structure and the manufacturing method of the thin vacuum insulation panel of the present invention, the thickness H of the thin vacuum insulation panel 1 can be less than 0.1mm, the thicknesses of the first sheet structure 11 and the second sheet structure 12 can be respectively less than 0.03mm, and the height H of the gap space 15 can be less than 0.05 mm.

Please refer to fig. 2A and fig. 2B. FIG. 2A is a cross-sectional view of a thin vacuum insulation panel according to another embodiment of the present invention, which is viewed from the same perspective as FIG. 1C. Fig. 2B is a cross-sectional view of the thin vacuum insulation panel corresponding to fig. 2A, which is viewed from the same perspective as fig. 1D. Since the first sheet structure 11 and the second sheet structure 12 are very light and thin and are easily recessed due to external force, the thin vacuum insulation panel 1 further includes a supporting column 14 formed in the gap space 15, and two ends of the supporting column 14 are respectively connected to the first sheet structure 11 and the second sheet structure 12. At least one end of the support column 14 is fixed to the first sheet structure 11 or the second sheet structure 12. The supporting posts 14 can be fixed to the first sheet structure 11 or the second sheet structure 12 by soldering or integrally forming. When one end of the support post 14 is secured to the first sheet structure 11, the other end may be secured to, in contact with, or attached to the second sheet structure 12, or vice versa. The supporting posts 14 may be made of a material with a low thermal conductivity, which is lower than the thermal conductivity of the first sheet structure 11 and the second sheet structure 12, so as to reduce the conduction of heat energy between the first sheet structure 11 and the second sheet structure 12. In a preferred embodiment, the support posts 14 are made of the same material as the solder material 10. In addition, the supporting pillars 14 may be elongated to form a wall shape, or a plurality of supporting pillars 14 may be disposed in the gap spaces 15 to increase the structural strength of the entire thin vacuum insulation panel.

By the design of the supporting columns 14, the first sheet-like structure 11 and the second sheet-like structure 12 are not easy to dent, and the thin vacuum heat insulation sheet 1 can maintain the shape; further, it is avoided that the thin vacuum insulation panel 1 loses the effect of the vacuum layer due to deformation.

Please refer to fig. 4A to 4C. FIG. 4A is a top view of a first sheet structure according to another embodiment of the present invention. FIG. 4B is a cross-sectional view of the first sheet structure corresponding to FIG. 4A. Fig. 4C is a sectional view showing a thin vacuum insulation panel formed using the first sheet structure of fig. 4A. In the step of manufacturing the thin vacuum insulation panel 1, the solder material 10 is first placed on the first surface 110 of the first sheet structure 11. Generally, it is difficult to accurately and evenly lay down the solder material 10 on the annular region of the first surface 110 in a heated and molten state. In the present invention, the first surface 110 of the first laminar structure 11 has a Solder resist layer 113(Solder Mask) in a ring shape, and Solder material is placed on the ring-shaped region 116 at the edge of the ring-shaped Solder resist layer 113. The solder resist layer 113 blocks the solder material 10 on the annular region 116 so that the solder material 10 is not easily displaced during the Reflow process (Reflow). Next, the second sheet structure 12 is attached to the solder material 10, and the first sheet structure 11, the second sheet structure 12 and the solder material 10 are heated together, so that the solder material 10 is melted and reflowed along the annular region 116 at the edge of the annular solder resist layer 113. The cooled solder material 10 is naturally laid and soldered precisely on the predetermined annular area 116 without overflowing into the annular solder resist layer 113.

Please refer to fig. 1C, fig. 1D, fig. 5, and fig. 6A to fig. 6E. FIG. 5 is a flow chart showing the steps of the method for manufacturing a thin vacuum insulation panel according to the present invention. Fig. 6A is a top view of the first and second jig platforms according to the present invention. Fig. 6B is a schematic cross-sectional view of the first tool platform of fig. 6A. Fig. 6C is a schematic cross-sectional view illustrating the first sheet structure adsorbed by the first fixture platform of fig. 6B. FIG. 6D is a schematic view showing the first and second jig platforms being stacked. FIG. 6E is a schematic view showing the first and second tool platforms being placed in the cavity. The invention provides a method for manufacturing a thin vacuum heat insulation sheet 1, which comprises the following steps.

A first fixture platform 3 having a first groove 31 and a second fixture platform 4 having a second groove 42 are provided, as shown in fig. 6A and 6B. In fig. 6B, the first jig stage 3 has an air suction passage 35 and a plurality of communication pipes 36. The suction passage 35 communicates with the outside to suck the suction passage 35 into a negative pressure, and the communication pipe 36 communicates with the suction passage 35 and the bottom of the first recess 31. The shape of the first groove 31 and the first sheet structure 11 are substantially the same in principle, but the ratio of the depth of the first groove 31 to the thickness of the first sheet structure 11 varies according to different embodiments. Then, a first sheet structure 11 is absorbed in the first groove 31, and a second sheet structure 12 is absorbed in the second groove 42. When the first sheet structure 11 is fittingly placed in the first recess 31, as shown in fig. 6C, and the suction channel 35 is in a negative pressure state, the first sheet structure 11 is absorbed in the first recess 31 by the communicating tube 36. Therefore, the very thin and easy-to-bend first sheet structure 11 will be smoothly attached to the first groove 31, which is beneficial to the subsequent manufacturing process. The second fixture platform 4 has a similar structure and function to the first fixture platform 3, and is not described herein again.

In fig. 6C, the solder material 10 is annularly laid on the first surface 110 of the first sheet structure 11. The manner of laying in this step can be understood by also referring to the annular solder material 10 in fig. 1C. Then, the second fixture platform 4 is stacked on the first fixture platform 3, as shown in fig. 6D, so that the position of the second sheet-like structure 12 corresponds to the position of the first sheet-like structure 11 with a certain height therebetween. The drawing of the suction passage 35 and the communicating tube 36 is omitted after fig. 6D. The solder material 10 is located between the first sheet structure 11 and the second sheet structure 12, and in one embodiment, the height between the first sheet structure 11 and the second sheet structure 12 is the height of the solder material 10. Then, the second jig platform 4 and the first jig platform 3 which are overlapped are placed into a cavity 5, as shown in fig. 6E. The chamber 5 is evacuated and the interior of the chamber 5 is heated, and the solder material 10 is melted in a vacuum state and the first sheet structure 11 and the second sheet structure 12 are hermetically welded, so that a vacuum gap space 15 is formed between the first sheet structure 11, the second sheet structure 12 and the annular solder material 10. Finally, the first fixture platform 3 and the second fixture platform 4 are taken out from the cavity 5, and then the first sheet structure 11, the second sheet structure 12 and the solder material 10 are taken out from between the first fixture platform 3 and the second fixture platform 4, so as to form the thin vacuum heat insulation sheet 1 shown in fig. 1D, thereby solving the problem that the conventional thin heat insulation sheet cannot be vacuumized.

In addition, in the step of annularly disposing the solder material 10 on the first surface 110 of the first sheet structure 11, a solder wire is annularly disposed on the first surface 110, a solder paste is annularly extruded on the first surface 110, or an annular solder paste is printed on the first surface 110.

Please refer to fig. 5 and fig. 7. Fig. 7 is a schematic diagram illustrating the first jig platform 3 and the second jig platform 4 being stacked in another embodiment. When the thickness of the first sheet-like structure 11 and the second sheet-like structure 12 is close to the depth of the first groove 31 and the second groove 42, the second fixture platform 4 and the first fixture platform 3 are heated, and the extruded molten solder material 10 is flattened to affect the formation of the gap space. Therefore, in one embodiment, in the step of providing the first jig platform 3 having the first groove 31 and the second jig platform 4 having the second groove 42, the second jig platform 4 further has a positioning post 48; in the step of laminating the second jig platform 4 and the first jig platform 3, the height of the gap is determined by the height of the positioning column 48; the higher the height of the positioning posts, the higher the spacing between the first sheet structure 11 and the second sheet structure 12. By means of the positioning posts 48, a certain height is formed between the first fixture platform 3 and the second fixture platform 4, so that the solder material 10 in a molten state is fixed at the height, and the solder material 10 forms the height of the gap space 15 after cooling.

Please refer to fig. 5, 8A and 8B. FIG. 8A is a schematic diagram illustrating a first tool platform and a second tool platform being stacked together in yet another embodiment. Fig. 8B is a schematic view of the first and second jig platforms heated and stacked in fig. 8A. The solder material 10 generally contains organic solvent, flux or surfactant; these components evaporate when heated, reducing the volume of the solder material 10 and thus the height of the interstitial space 15. In order to make the height of the gap space meet the expectation, in another embodiment, in the step of providing the first jig platform 3 having the first groove 31 and the second jig platform 4 having the second groove 42, the first jig platform 3 having the first groove 31 and the plurality of third grooves 33, and the second jig platform 4 having the second groove 42 and a positioning column 48 are further provided.

Then, the method for manufacturing the thin vacuum heat insulation sheet further comprises the following steps: at least three solder balls 6 are placed in the third recesses 33, and the solder balls 6 have a material and a melting point substantially the same as those of the solder material 10. The solder ball 6 protrudes higher than the positioning post 48, as shown in fig. 8A. At this time, in the step of laminating the second jig platform 4 and the first jig platform 3, the height of the gap between the first sheet-like structure 11 and the second sheet-like structure 12 is determined by the height of the solder ball 6. The higher the height of the solder ball 6, the higher the height of the first sheet structure 11 from the second sheet structure 12.

Then, in the step of heating the cavity and vacuumizing, the solder material 10 and the solder balls 6 are melted and collapsed, due to the gravity, the second jig platform 4 and the second sheet structure 12 are close to the first jig platform 3 and the first sheet structure 11, and the height of the space between the first sheet structure 11 and the second sheet structure 12 is gradually reduced until the second jig platform 4 and the first jig platform 3 stop being close to each other due to the positioning posts. At this time, the soldering height of the ring-shaped soldering material 10 in the molten state is equal to the height of the positioning post, and the first sheet structure 11, the second sheet structure 12 and the soldering material 10 are soldered to each other by reflow. The method for manufacturing the thin vacuum heat insulation sheet further comprises the following steps: the first tool platform 3 and the second tool platform 4 are cooled in a vacuum state to solidify the solder material 10, and after cooling, a solder joint is formed, and a vacuum gap space 15 is formed at the same time, at this time, the soldering height of the solder material 10 in a ring shape in a molten state in the interval between the first sheet structure 11 and the second sheet structure 12 is determined by the height of the positioning post. Thereby, the height of the vacuum gap space 15 of the thin vacuum insulation panel can be precisely controlled at a desired height.

In another embodiment, the positioning posts 48 determining the final soldering height of the annular solder material 10 may be arranged on the first fixture platform 3. In yet another embodiment, the final bonding height of the annular solder material 10 is determined by placing at least three solder balls 6 having a melting point higher than the solder material 10. The height of the solder ball 6 with higher melting point is the height of the second fixture platform 4 after the cavity 5 is vacuumized and heated, and is also the height of the hollow gap space 15 of the thin vacuum heat insulation sheet 1.

In summary, the thin vacuum heat insulation sheet of the present invention can effectively isolate the heat conduction and the heat convection between two surfaces of the heat insulation sheet. Meanwhile, due to the thin sheet structure and the hollow characteristic, the heat insulation plate has the advantage of extremely light weight and is suitable for light and thin electronic products and various thin heat insulation requirements. In addition, the invention also provides a method for manufacturing the thin vacuum heat insulation sheet, because the ultra-thin sheet vacuum structure is difficult to manufacture and the height of the gap space of the vacuum is difficult to control accurately. In the manufacturing method, a jig platform with adsorption capacity is used to stabilize the sheet structure. The sheet structure and the solder material are heated in a vacuum environment, and a vacuum gap space is naturally formed when the solder material is melted to airtightly weld the sheet structure. Therefore, the thin vacuum heat insulation sheet can be manufactured and is suitable for being applied to light and thin electronic devices.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A method for manufacturing a thin vacuum heat insulation sheet comprises the following steps:

providing a first jig platform with a first groove and a plurality of third grooves and a second jig platform with a second groove and a positioning column;

adsorbing a first sheet structure in the first groove and adsorbing a second sheet structure in the second groove;

annularly laying a soldering tin material on a first surface of the first sheet-like structure;

placing at least three solder balls in the third groove, wherein the solder balls are the same as the solder material in material and melting point, and the protruding height of the solder balls is higher than that of the positioning columns;

stacking the second fixture platform and the first fixture platform to make the position of the first sheet structure corresponding to the position of the second sheet structure at a certain interval height, wherein the height is determined by the height supported by the solder balls, and the annular solder material is arranged between the first sheet structure and the second sheet structure;

placing the second jig platform and the first jig platform which are overlapped into a cavity; and

vacuumizing and heating the cavity, melting the soldering tin material and the soldering tin ball under the vacuum state, enabling the second jig platform and the second sheet structure to be close to the first jig platform and the first sheet structure, determining the welding height of the annular soldering tin material in the molten state in the interval between the first sheet structure and the second sheet structure according to the height of the positioning column, and hermetically welding the first sheet structure and the second sheet structure to form a vacuum gap space among the first sheet structure, the second sheet structure and the annular soldering tin material.

2. The method of claim 1, wherein in the step of providing the first fixture platform with the first groove and the second fixture platform with the second groove, the second fixture platform further comprises a positioning post; in the step of stacking the second fixture platform and the first fixture platform, the height of the space is determined by the height of the positioning column.

3. The method of claim 1, further comprising the step of:

and cooling the first jig platform and the second jig platform in the cavity in a vacuum state to solidify the soldering material, wherein the height of the welded interval between the first sheet-shaped structure and the second sheet-shaped structure is determined by the height of the positioning column.

4. The method as claimed in claim 1, wherein the step of annularly disposing the solder material on the first surface of the first sheet structure comprises annularly disposing a solder wire on the first surface, annularly extruding a solder paste on the first surface, or printing an annular solder paste on the first surface.