CN110838632B - 电连接器组件及其限位件 - Google Patents

电连接器组件及其限位件 Download PDF

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CN110838632B
CN110838632B CN201810939097.0A CN201810939097A CN110838632B CN 110838632 B CN110838632 B CN 110838632B CN 201810939097 A CN201810939097 A CN 201810939097A CN 110838632 B CN110838632 B CN 110838632B
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electrical connector
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CN110838632A (zh
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邬恒康
彭付金
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Foxconn Kunshan Computer Connector Co Ltd
Hongteng Precision Technology Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hongteng Precision Technology Co Ltd
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract

一种电连接器组件及其限位件，用于电性连接一芯片模块与一电路板，所述电连接器组件包括电连接器及安装在所述电连接器上方的散热器；所述电连接器包括固持有导电端子的座体及框设在所述座体旁侧的固定座，所述芯片模块放置于所述座体上以与所述导电端子达成电性连接，所述固定座的两组对角设有向上延伸的定位柱，所述散热器包括与所述定位柱配合固定的弹性件，所述定位柱装设有一限位件，所述弹性件包括配合定位柱的螺母及套设在所述螺母并抵压在散热器的弹簧，所述限位件包括固定在固定座的固定部及自固定部向上延伸的可卡扣至散热器的限位部，籍此，提升散热器弹性的同时，调节散热器与芯片模块之间的相互作用力。

Description

电连接器组件及其限位件
【技术领域】
本发明有关一种电连接器组件及其限位件，尤其涉及一种安装于电路板上，用于连接所述电路板与一芯片模块的电连接器组件及其限位件。
【背景技术】
中国实用新型专利第CN2523023Y号揭示了一种电连接器组件，包括主板、连接器、芯片、散热器、背板、四个螺栓及四个螺母，该主板上设有多个定位孔，该散热器对应于该主板的定位孔设有多个定位孔，该背板上对应于该主板的定位孔设有多个定位孔，这些螺栓穿设在该背板、主板及散热器的定位孔中，并与这些螺母配合而将芯片、背板、主板、连接器及散热器固定在一起。螺栓和螺母在锁紧的时将散热器直接抵压在芯片上以压紧并定位芯片，使芯片和连接器中的端子接触；但在这个过程中很可能会使散热器对芯片产生过大的压力，造成芯片的损坏，也可能导致固持在电连接器中的端子由于过度受压而发生变形。
因此，确有必要提供一种改进的电连接器组件，以克服上述缺陷。
【发明内容】
本发明的目的在于提供一种电连接器组件，该电连接器组件可缓冲散热器与芯片之间的作用力，起到保护芯片和电连接器端子的作用。
本发明的目的通过以下技术方案来实现：一种电连接器组件，用于电性连接一芯片模块与一电路板，所述电连接器组件包括电连接器及安装在所述电连接器上方的散热器；所述电连接器包括固持有导电端子的座体及框设在所述座体旁侧的固定座，所述芯片模块放置于所述座体上以与所述导电端子达成电性连接，所述固定座的两组对角设有向上延伸的定位柱，所述散热器包括与所述定位柱配合固定的弹性件，所述定位柱装设有一限位件，所述弹性件包括配合定位柱的螺母及套设在所述螺母并抵压在散热器的弹簧，所述限位件包括固定在固定座的固定部及自固定部向上延伸的可卡扣至散热器的限位部。
进一步的，所述限位件的固定部设有一贯穿其上下表面的固持孔，所述固持孔卡设至所述定位柱的底端，所述限位件的限位部包括自所述固定部向上弯折延伸的竖直部及自所述竖直部凸伸的勾部，所述勾部抓固至所述散热器。
进一步的，所述竖直部的顶端设有手持部，所述手持部位于所述勾部的斜上方。
进一步的，所述固持孔远离所述竖直部一侧的径向尺寸大于靠近所述竖直部的一侧的径向尺寸。
进一步的，所述弹性件呈两组对称设置并分别位于所述散热器的两组对角与所述定位柱一一对应。
进一步的，所述散热器设有底板部及自底板部向上延伸设置的主体部，所述主体部呈现十字型，所述底板部设有四个位于四角的两两对称的角部，每一角部均设有一第一通孔，所述弹性件固设于所述第一通孔，当所述散热器安装至所述电连接器上方并紧固其中一个弹性件时，位于该弹性件斜对角的限位件可勾设至所述角部的上表面以限制所述散热器向上翘起。
进一步的，所述电连接器组件包括分别位于所述电路板两个相对表面的基板及支撑板，所述电连接器安装于所述基板上方，所述基板上安装有若干围设至所述电连接器***的固定所述固定座的固定柱。
进一步的，所述固定座大致呈矩形设置，所述固定座设有若干上下贯穿的第二通孔，所述第二通孔配合固定至所述固定柱，所述固定座设有四个定位柱，所述定位柱的顶部设有螺旋部以与所述螺母配合固定。
为实现本发明，还可以采用如下技术方案：一种限位件，用以辅助组装散热器于收容有芯片模块的电连接器上，所述限位件包括固定部及自固定部向上延伸的限位部，所述固定部呈平板状并设有一贯穿其上下表面的固持孔，所述限位部包括自所述固定部向上弯折延伸的竖直部及自所述竖直部凸伸的勾部。
进一步的，所述电连接器包括固持有导电端子的座体及框设在所述座体旁侧的固定座，所述限位件的固持孔固持至所述固定座，所述勾部可勾设至所述散热器以限制所述散热器向上翘起。
与现有技术相比，本发明具有如下有益效果：本发明中的固定座的四角与所述散热器通过弹性件弹性配合，并另设一个安装于所述固定座上的限位件以限制散热器过度转动而损坏电连接器，以此，在保证散热器被稳固锁紧的同时不会使散热器对芯片模块产生过大的压力，有利于保护芯片模块，也可避免固持在电连接器中的端子由于过度受压而发生变形。
【附图说明】
图1是组装有芯片模块的本发明电连接器组件安装于电路板上的立体图。
图2是图1的部分分解图。
图3是图2进一步的部分分解图。
图4是图3另一角度的部分分解图。
图5是图1的侧视图。
图6是沿图1中A-A线的剖视图。
如下具体实施方式将结合上述附图进一步说明本发明。
【主要元件符号说明】
电连接器组件 100 电路板 200
芯片模块 300 基板 1
固定柱 11 电连接器 2
座体 21 横边 22
长边 23 散热器 3
底板部 31 角部 311
第一通孔 312 主体部 32
固定座 4 定位柱 41
螺旋部 411 第二通孔 42
支撑板 5 限位件 6
固定部 61 固持孔 611
限位部 62 竖直部 621
勾部 622 手持部 623
弹性件 7 螺母 71
弹簧 72
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
请参阅图1至图6所示，本发明电连接器组件100安装于一电路板200用以电性连接一芯片模块300与所述电路板200，所述芯片模块300安装于所述电连接器组件100中。所述电连接器组件100包括分别位于所述电路板200两个相对表面的基板1及支撑板5、安装至基板1上的电连接器2及安装在所述电连接器2上方的散热器3，所述电连接器2包括固持有导电端子(未图示)的座体21及框设在所述座体21旁侧的固定座4，所述芯片模块300放置于所述座体21上以与所述导电端子达成电性连接。
请参阅图1至图3，所述基板1上安装有若干围设至所述电连接器2***的固定所述固定座4的固定柱11，本实施方式中设有六个固定柱11，所述基板1定义有纵长方向及横向，所述电连接器2对应设有横边22及连接两横边22的长边23，所述两横边22***均设有两个位于端部外的所述固定柱11，所述长边23的***设有一个位于其中部外侧的固定柱11。
所述散热器3设有底板部31及自底板部31向上延伸设置的主体部32，所述主体部32呈现十字型，所述底板部31设有四个位于四角的两两对称的角部311，每一角部311均设有一第一通孔312，所述固定座4大致呈矩形设置，所述固定座4设有位于两组对角并向上延伸的四个定位柱41及与所述六个固定柱11配合固定的第二通孔42，所述定位柱41的顶部设有螺旋部411，所述定位柱41装设有一限位件6。
请结合图4至图6，所述散热器3包括与所述固定座4配合固定的弹性件7，所述弹性件7固设于所述第一通孔312，所述弹性件7包括配合定位柱41的螺母71及套设在所述螺母71并抵压在散热器3的弹簧72，所述定位柱41的顶部的螺旋部411与所述螺母71配合固定，当所述散热器3安装至所述电连接器2上方并紧固其中一个弹性件7时，位于该弹性件7斜对角的限位件6可勾设至所述角部311的上表面以限制所述散热器3向上翘起，所述弹性件7呈两组对称设置并分别位于所述散热器3的两组对角与所述定位柱41一一对应。
所述限位件6用于卡扣所述散热器3至所述电连接器2的上方，具体的，所述限位件6包括固定在固定座4的固定部61及自固定部61向上延伸的可卡扣至散热器3的限位部62，所述固定部61呈平板状并设有一贯穿其上下表面的固持孔611，所述固持孔611卡设至所述定位柱41的底端，所述限位部62包括自所述固定部61向上弯折延伸的竖直部621及自所述竖直部621凸伸的勾部622，所述勾部622抓固至所述散热器3，所述竖直部621的顶端设有手持部623，所述手持部623位于所述勾部622的斜上方，所述固持孔611远离所述竖直部621一侧的径向尺寸大于靠近所述竖直部621的一侧的径向尺寸。
继续参阅图1至图6，本发明电连接器组件100的组装步骤如下：首先，将所述固定座4框设至所述固定柱11，并将所述限位件6的固定部61夹持至所述定位柱41上使得所述固持孔611紧紧夹持至所述定位柱41上；然后，再将所述芯片模块300放置在所述座体21上；接着将所述散热器3向下放置到所述芯片模块300上方，具体的，所述散热器3对位至所述定位柱41上，拧所述其中一个弹性件7的螺母71，往下拧的过程中，位于其相对侧的散热器3的一端会向上翘起，此时，所述勾部622会勾住所述散热器3的角部311，使得所述散热器3不会翘至太高而损坏所述芯片模块300，进而拧紧另外两个弹性件7可将所述散热器3锁紧，以此可实现本电连接器组件100的组装。
籍此，本发明中的固定座4的四个定位柱41位于四个角落并与所述散热器3通过一一对应的弹性件7弹性配合，并另设一个安装于所述固定座4上的限位件6以限制散热器3过度转动而损坏电连接器2，以此，可提升所述散热器3弹性，在保证散热器3被稳固锁紧的同时不会使散热器3对芯片模块300产生过大的压力，有利于保护芯片模块300，也可避免固持在电连接器2中的端子由于过度受压而发生变形。
以上所述仅为本发明的部分实施方式，不是全部的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化，均为本发明的权利要求所涵盖。

Claims (10)

1.一种电连接器组件，用于电性连接一芯片模块与一电路板，所述电连接器组件包括电连接器及安装在所述电连接器上方的散热器；所述电连接器包括固持有导电端子的座体及框设在所述座体旁侧的固定座，所述芯片模块放置于所述座体上以与所述导电端子达成电性连接，其特征在于：所述固定座的两组对角设有向上延伸的定位柱，所述散热器包括与所述定位柱配合固定的弹性件，所述定位柱装设有一限位件，所述弹性件包括配合定位柱的螺母及套设在所述螺母并抵压在散热器的弹簧，所述限位件包括固定在固定座的固定部及自固定部向上延伸的可卡扣至散热器的限位部，所述散热器设有底板部，所述底板部设有四个位于四角的两两对称的角部，当所述散热器安装至所述电连接器上方并紧固其中一个弹性件时，位于该弹性件斜对角的限位件可勾设至所述角部的上表面以限制所述散热器向上翘起。
2.如权利要求1所述的电连接器组件，其特征在于：所述限位件的固定部设有一贯穿其上下表面的固持孔，所述固持孔卡设至所述定位柱的底端，所述限位件的限位部包括自所述固定部向上弯折延伸的竖直部及自所述竖直部凸伸的勾部，所述勾部抓固至所述散热器。
3.如权利要求2所述的电连接器组件，其特征在于：所述竖直部的顶端设有手持部，所述手持部位于所述勾部的斜上方。
4.如权利要求2所述的电连接器组件，其特征在于：所述固持孔远离所述竖直部一侧的径向尺寸大于靠近所述竖直部的一侧的径向尺寸。
5.如权利要求2所述的电连接器组件，其特征在于：所述弹性件呈两组对称设置并分别位于所述散热器的两组对角与所述定位柱一一对应。
6.如权利要求1所述的电连接器组件，其特征在于：所述散热器还包括自所述底板部向上延伸设置的主体部，所述主体部呈现十字型，每一所述角部均设有一第一通孔，所述弹性件设于所述第一通孔。
7.如权利要求1所述的电连接器组件，其特征在于：所述电连接器组件包括分别位于所述电路板两个相对表面的基板及支撑板，所述电连接器安装于所述基板上方，所述基板上安装有若干围设至所述电连接器***的固定所述固定座的固定柱。
8.如权利要求7所述的电连接器组件，其特征在于：所述固定座大致呈矩形设置，所述固定座设有若干上下贯穿的第二通孔，所述第二通孔配合固定至所述固定柱，所述固定座设有四个定位柱，所述定位柱的顶部设有螺旋部以与所述螺母配合固定。
9.一种用于如权利要求1-8任一项所述的电连接器组件的限位件，用以辅助组装散热器于收容有芯片模块的电连接器上，其特征在于：所述限位件包括固定部及自固定部向上延伸的限位部，所述固定部呈平板状并设有一贯穿其上下表面的固持孔，所述限位部包括自所述固定部向上弯折延伸的竖直部及自所述竖直部凸伸的勾部，所述竖直部的顶端设有手持部，所述手持部位于所述勾部的斜上方。
10.如权利要求9所述的限位件，其特征在于：所述电连接器包括固持有导电端子的座体及框设在所述座体旁侧的固定座，所述限位件的固持孔固持至所述固定座，所述勾部可勾设至所述散热器以限制所述散热器向上翘起。
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107577285B (zh) * 2017-07-05 2022-01-14 超聚变数字技术有限公司 一种处理器固定结构、组件及计算机设备
TWM606322U (zh) * 2019-04-12 2021-01-11 英屬開曼群島商鴻騰精密科技股份有限公司 晶片連接器組合及其預載支撐結構
CN111817046B (zh) * 2019-04-12 2024-02-20 富顶精密组件（深圳）有限公司 电连接器组件
CN112086800A (zh) 2019-06-12 2020-12-15 富顶精密组件（深圳）有限公司 电连接器组合及其扣持装置与扣持件
CN113708126B (zh) * 2021-07-14 2024-02-02 浪潮商用机器有限公司 一种cpu连接座防脱保护盖板
EP4195893A1 (en) * 2021-12-07 2023-06-14 Infineon Technologies AG Housing for a power semiconductor module arrangement
CN114158185B (zh) * 2022-02-10 2022-05-06 宁波均联智行科技股份有限公司 一种车机
US11991864B2 (en) * 2022-03-16 2024-05-21 Google Llc Load vectoring heat sink

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106898A (zh) * 1993-11-15 1995-08-16 热合金有限公司 带有绝缘套扣的弹簧夹装置
US5651688A (en) * 1995-12-20 1997-07-29 Lin; Chuen-Sheng Apparatus for mounting CPU heat dissipator
CN1229279A (zh) * 1998-03-13 1999-09-22 鸿海精密工业股份有限公司 扣合装置
CN2523023Y (zh) * 2002-02-01 2002-11-27 富士康(昆山)电脑接插件有限公司 散热装置组合
CN2681329Y (zh) * 2003-12-19 2005-02-23 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN1618127A (zh) * 2002-01-10 2005-05-18 蒂科电子公司 安装无盖半导体器件的方法和设备
CN1874663A (zh) * 2005-06-03 2006-12-06 索斯科公司 系留台肩螺母组件
CN2919529Y (zh) * 2006-06-23 2007-07-04 安天德百电股份有限公司 中央处理器散热模组的脚座
JP2017037979A (ja) * 2015-08-11 2017-02-16 三菱電機株式会社 半導体装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648893A (en) * 1993-07-30 1997-07-15 Sun Microsystems, Inc. Upgradable multi-chip module
US5999402A (en) * 1997-10-28 1999-12-07 Dell Usa, L.P. Heat sink fastener retention apparatus and method for computer systems
TW484794U (en) * 2000-12-27 2002-04-21 Hon Hai Prec Ind Co Ltd Heat sink
US6829143B2 (en) * 2002-09-20 2004-12-07 Intel Corporation Heatsink retention apparatus
CN2681217Y (zh) * 2004-01-14 2005-02-23 鸿富锦精密工业（深圳）有限公司 散热器扣合装置
US7193853B2 (en) * 2005-02-04 2007-03-20 Quanta Computer Inc. Heat sink protecting retention module
TWI255692B (en) * 2005-02-25 2006-05-21 Asia Vital Components Co Ltd Flexible fixing device of cooling module
CN2916926Y (zh) * 2005-09-22 2007-06-27 泰安电脑科技（上海）有限公司 散热器的固定片
CN101068456B (zh) * 2006-05-05 2010-05-26 富准精密工业(深圳)有限公司 散热装置
CN101472440B (zh) * 2007-12-27 2011-05-11 富准精密工业(深圳)有限公司 散热装置
CN101998796A (zh) * 2009-08-11 2011-03-30 富准精密工业(深圳)有限公司 扣具、应用该扣具的散热装置和电子装置
CN102830767A (zh) * 2011-06-14 2012-12-19 鸿富锦精密工业（深圳）有限公司 风扇固定装置
CN103167778A (zh) * 2011-12-16 2013-06-19 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN202854685U (zh) * 2012-08-06 2013-04-03 安徽理工大学 动面板垂直调节型笔记本散热器
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
TWI517783B (zh) * 2013-06-19 2016-01-11 英業達股份有限公司 固定組件
JP2015225940A (ja) * 2014-05-28 2015-12-14 パナソニックＩｐマネジメント株式会社 半導体装置
CN106195860B (zh) * 2016-08-29 2019-02-05 福建鸿博光电科技有限公司 一种led车灯的调光装置和led车灯
US10103086B2 (en) * 2016-12-16 2018-10-16 Ablecom Technology Inc. Fixing frame for heat sink
CN107577285B (zh) * 2017-07-05 2022-01-14 超聚变数字技术有限公司 一种处理器固定结构、组件及计算机设备
CN207459230U (zh) 2017-10-16 2018-06-05 富顶精密组件（深圳）有限公司 电连接器组件
US11291115B2 (en) * 2018-03-30 2022-03-29 Intel Corporation Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106898A (zh) * 1993-11-15 1995-08-16 热合金有限公司 带有绝缘套扣的弹簧夹装置
US5651688A (en) * 1995-12-20 1997-07-29 Lin; Chuen-Sheng Apparatus for mounting CPU heat dissipator
CN1229279A (zh) * 1998-03-13 1999-09-22 鸿海精密工业股份有限公司 扣合装置
CN1618127A (zh) * 2002-01-10 2005-05-18 蒂科电子公司 安装无盖半导体器件的方法和设备
CN2523023Y (zh) * 2002-02-01 2002-11-27 富士康(昆山)电脑接插件有限公司 散热装置组合
CN2681329Y (zh) * 2003-12-19 2005-02-23 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN1874663A (zh) * 2005-06-03 2006-12-06 索斯科公司 系留台肩螺母组件
CN2919529Y (zh) * 2006-06-23 2007-07-04 安天德百电股份有限公司 中央处理器散热模组的脚座
JP2017037979A (ja) * 2015-08-11 2017-02-16 三菱電機株式会社 半導体装置

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