CN110828696B - Bottom emission display panel, manufacturing method and optical compensation method - Google Patents

Bottom emission display panel, manufacturing method and optical compensation method Download PDF

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Publication number
CN110828696B
CN110828696B CN201911134606.3A CN201911134606A CN110828696B CN 110828696 B CN110828696 B CN 110828696B CN 201911134606 A CN201911134606 A CN 201911134606A CN 110828696 B CN110828696 B CN 110828696B
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layer
substrate
light
cathode
pixel
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CN110828696A (en
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秦云科
王雷
丁小梁
李扬冰
王文娟
赵方圆
张震
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/86Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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Abstract

The invention discloses a bottom emission display panel, a manufacturing method and an optical compensation method, wherein the bottom emission display panel comprises the following components: the array substrate and the sensor substrate are attached and aligned, wherein the array substrate comprises a first substrate, a pixel circuit, a plurality of pixel units and a light shielding layer, the pixel circuit is located on the first substrate, the pixel units are driven by the pixel circuit to emit light, the light shielding layer corresponds to the pixel units, the pixel units comprise anodes, light emitting layers and cathodes, and a plurality of first openings are formed in the cathodes; the light shielding layer is arranged on the light emitting side of the pixel unit, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate, so that light entering the first opening is shielded; the sensor substrate comprises a plurality of sensors, and the sensors sense the light transmitted by the first openings and emitted by the pixel units. According to the embodiment of the invention, the interference light can be eliminated through the light shielding layer.

Description

Bottom emission display panel, manufacturing method and optical compensation method
Technical Field
The invention relates to the technical field of display, in particular to a bottom emission display panel, a manufacturing method and an optical compensation method.
Background
At present, the actual brightness and the theoretical brightness of the light-emitting pixel unit of the bottom emission display panel are different, sensors such as a photosensitive sensor are generally used for directly detecting the actual brightness of the light-emitting pixel unit in the prior art, and the actual brightness of the light-emitting pixel unit is compensated and corrected through a driving circuit system and an algorithm according to the difference between the actual brightness and the theoretical brightness, so that a new solution idea is provided for solving the problem of image sticking (Mura).
In the prior art, the cathode of the light-emitting pixel unit of the bottom emission display panel is usually thinned or opened, and the photosensor senses the actual brightness of the light-emitting pixel unit through the light-transmitting cathode, however, in practical application, internal light interference and external light interference are easily caused, which causes a great problem in the effect of optical compensation.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the present invention provides a bottom emission display panel including an array substrate and a sensor substrate aligned in a bonding manner, wherein the array substrate and the sensor substrate are aligned in a bonding manner
The array substrate comprises a first substrate, a pixel circuit on the first substrate, a plurality of pixel units driven by the pixel circuit to emit light, and a light shielding layer corresponding to the pixel units,
the pixel unit comprises an anode, a light-emitting layer and a cathode, wherein a plurality of first openings are formed in the cathode;
the light shielding layer is arranged on the light emitting side of the pixel unit, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate, so that light entering the first opening is shielded;
the sensor substrate comprises a plurality of sensors, and the sensors sense the light transmitted by the first openings and emitted by the pixel units.
Further, in the above-mentioned case,
the pixel circuit includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, source and drain electrodes, and a planarization layer;
the light shielding layer is formed on the gate insulating layer and is arranged on the same layer as the gate;
or
The light shielding layer is formed on the interlayer insulating layer and is arranged on the same layer as the source electrode and the drain electrode; or
The light shielding layer is formed on the planarization layer;
or alternatively
The array substrate further comprises a shading metal which is formed on the first substrate and used for shading external light for the pixel circuit, and the shading layer is formed on the first substrate and arranged on the same layer with the shading metal.
Further, in the above-mentioned case,
the center of the orthographic projection of the first opening on the first substrate is coincided with the center of the orthographic projection of the pixel unit on the first substrate;
and/or
The center of the orthographic projection of the light shielding layer on the first substrate is coincided with the center of the orthographic projection of the first opening of the corresponding pixel unit on the first substrate.
In a further aspect of the present invention,
the cathode comprises a first cathode layer and a second cathode layer, wherein
The first cathode layer is made of a transparent conductive material and is positioned on one side of the light-emitting layer, which is far away from the first substrate;
the second cathode layer is made of light-tight material and is located on one side, far away from the first substrate, of the first cathode layer, and the second cathode layer comprises the first openings.
Further, the second cathode layer is made of a light-tight conductive material.
Further, in the above-mentioned case,
the array substrate further comprises an auxiliary layer positioned between the array substrate and the sensor substrate, wherein the auxiliary layer is one of an adhesive layer, a vacuum layer and a gas environment layer.
Further, in the above-mentioned case,
the auxiliary layer is a vacuum layer or a gas environment layer, and the bottom emission display panel further comprises spherical particles or columnar particles positioned in the vacuum layer or the gas environment layer;
and/or
The auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate;
and/or
The auxiliary layer further comprises an optical film layer, wherein
The optical film layer comprises collimating structures, or
The optical film layer comprises a polarizer which is vertical to the optical axis of the emergent ray of the pixel unit.
Further, the polarizer is one of a linear polarizer, a circular polarizer, or a combined polarizer of the linear polarizer and the circular polarizer.
Further, the pixel defining layer of the pixel unit is made of black resin materials.
Further, in the above-mentioned case,
the sensor comprises one or more of a photosensitive sensor, an infrared sensor, an acoustic wave sensor and a temperature sensor;
and/or
The sensor substrate further comprises a second substrate, a driving circuit positioned on the second substrate, and an organic insulating layer positioned on the driving circuit, wherein the organic insulating layer is made of black resin materials.
A second embodiment of the present invention provides a method for manufacturing a bottom emission display panel according to the first embodiment, including:
forming an array substrate, wherein the array substrate comprises a pixel circuit formed on a first substrate, a pixel unit driven by the pixel circuit and a light shielding layer arranged on the light emitting side of the pixel unit and corresponding to the pixel units, the pixel unit comprises an anode, a light emitting layer and a cathode, a plurality of first openings are arranged on the cathode, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first openings on the first substrate;
forming a sensor substrate including a plurality of sensors;
and the array substrate and the sensor substrate are bonded and aligned.
Further, in the above-mentioned case,
the forming an array substrate, the array substrate including a pixel circuit formed on a first substrate, a pixel unit driven by the pixel circuit, and a light-shielding layer disposed on a light-emitting side of the pixel unit and corresponding to the plurality of pixel units, further includes:
forming a pixel circuit including an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, source and drain electrodes, and a planarization layer on a first substrate, wherein
Forming a light shielding layer on the gate insulating layer and on the same layer as the gate electrode;
or
Forming a light shielding layer on the interlayer insulating layer, wherein the light shielding layer is arranged on the same layer as the source electrode and the drain electrode;
or
Forming a light-shielding layer on the planarization layer;
or
Forming a light shielding layer and a light shielding metal for shielding external light for the pixel circuit on a first substrate, wherein the light shielding layer and the light shielding metal are arranged on the same layer, and the pixel circuit is formed on the first substrate, the light shielding layer and the light shielding metal;
forming a pixel unit on the pixel circuit, including
Forming an anode electrode on the pixel circuit;
forming a pixel defining layer on the anode;
forming a light emitting layer in a region surrounded by the pixel defining layer;
forming a cathode on the pixel defining layer and the light emitting layer, wherein the cathode comprises a plurality of first openings corresponding to the light shielding layer;
or
A first cathode layer formed on the pixel defining layer and the light emitting layer, the first cathode layer being a transparent conductive material;
a second light-opaque cathode layer formed on the first cathode layer, the second cathode layer including a plurality of first openings corresponding to the light-shielding layer; and forming an encapsulation layer for encapsulating the first substrate, the pixel circuit and the pixel unit on the cathode to form an array substrate.
In a further aspect of the present invention,
the laminating counterpoint of array substrate and sensor substrate further includes:
forming an auxiliary layer for attaching the array substrate and a sensor substrate on the array substrate, wherein,
the auxiliary layer comprises an adhesive layer;
or
The auxiliary layer comprises either a vacuum layer or a gas environment layer, and the vacuum layer or the gas environment layer comprises spherical particles or columnar particles;
and/or
The auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate;
and/or
The auxiliary layer further includes an optical film layer comprising:
a collimating structure;
or alternatively
And the polaroid is perpendicular to the optical axis of the emergent light of the pixel unit.
A third embodiment of the present invention provides an optical compensation method using the bottom emission display panel of the first embodiment, including:
the pixel circuit of the array substrate drives a plurality of pixel units to emit light, each pixel unit comprises an anode, a light-emitting layer and a cathode, and a plurality of first openings are formed in the cathode;
the array substrate shields light entering the first opening through a light shielding layer which is arranged on the light emitting side of the pixel units and corresponds to the pixel units, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate;
the plurality of sensors of the sensor substrate sense the light transmitted by the first opening and emitted by the pixel unit.
The invention has the following beneficial effects:
aiming at the existing problems, the invention provides the bottom emission display panel, the manufacturing method and the optical compensation method, the interference light entering the sensor is eliminated through the light shielding layer arranged on the light emitting side of the pixel unit, and the optical compensation efficiency of the bottom emission display panel is effectively improved, so that the display effect of the bottom emission display panel is improved, and the bottom emission display panel has wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view showing a structure of a bottom emission display panel in the related art;
FIG. 2 is a schematic structural diagram of a bottom emission display panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an array substrate according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a bottom emission display panel according to another embodiment of the present invention;
FIG. 5 is a schematic view of a bottom emission display panel according to still another embodiment of the present invention;
fig. 6 is a schematic structural view illustrating a bottom emission display panel according to still another embodiment of the present invention;
FIG. 7 is a flow chart of a method of fabricating a bottom emission display panel according to an embodiment of the present invention;
fig. 8 is a flowchart illustrating an optical compensation method for a bottom emission display panel according to an embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the present invention, the present invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
In the prior art, as shown in fig. 1, a bottom emission display panel includes a lower substrate 1, a pixel circuit 2, a pixel unit 3, a sensor 4 and an upper substrate 5, wherein the pixel circuit 2 drives the pixel unit 3 to emit light, and the sensor 4 senses light emitted from a cathode of the pixel unit 3, so as to compare the sensed actual brightness with a preset theoretical brightness and perform compensation correction on the pixel unit 3. However, the realization of the cathode light transmission by thinning or perforating the cathode easily causes two disadvantages:
first, light emitted by the light-emitting pixel unit on the light-emitting side is totally reflected in a small amount at the interface between the lower substrate and the air, as shown in fig. 2, when the exit angle of the light emitted by the pixel unit is greater than θ 1 and smaller than θ 2, total reflection is emitted at the lower substrate, the reflected light is emitted from the transparent cathode through the transparent anode and the light-emitting layer, and the totally reflected light is received by the sensor for sensing actual brightness to form internal light interference; secondly, because the cathode has certain light transmission property, external environment light is emitted from the lower substrate and is also emitted from the light transmission cathode through the anode and the light emitting layer, so that the external environment light enters the sensor through the cathode to form external light interference.
In order to eliminate the above interference, as shown in fig. 2, an embodiment of the present invention provides a bottom emission display panel, which includes a sensor substrate 10 and an array substrate 20 that are attached and aligned, where the array substrate 20 includes a first substrate 21, a pixel circuit 22 located on the first substrate 21, a plurality of pixel units driven by the pixel circuit 22 to emit light, and a light shielding layer 23 corresponding to the plurality of pixel units, where the pixel units include an anode 24, a light emitting layer 25, and a cathode 26, and the cathode 26 is provided with a plurality of first openings 27; the light shielding layer 23 is disposed on the light emitting side of the pixel unit and used for shielding interference light, and an orthographic projection of the light shielding layer 23 on the first substrate 21 covers an orthographic projection of the first opening 27 on the first substrate 21; the sensor substrate 10 includes a second substrate 11, a driving circuit 12 on the second substrate, and a plurality of sensors 13 driven by the driving circuit, wherein the sensors 13 sense light emitted from the pixel units through the first openings 27.
In one embodiment, as shown in fig. 1, the pixel units of the array substrate 20 emit light, most of the light is emitted through the first substrate 21, a small part of the light is emitted through the first openings 27 disposed at the cathode of the pixel units, and the sensor on the sensor substrate 10 senses the light emitted from the first openings 27. The light emitting device of the pixel unit is an active light emitting device, such as a self-light emitting device of an Organic Light Emitting Diode (OLED) or a quantum dot light emitting diode (QLED).
The light emitted from the light-emitting side of the pixel unit is totally reflected on the surface of the first substrate 21 when the angle of the light emitted from the first substrate 21 is larger than theta 1 and smaller than theta 2. The light shielding layer 23 corresponding to each pixel unit on the array substrate shields and absorbs the reflected light, so that the reflected light is prevented from passing through the transparent anode 24 and the light emitting layer 25 and entering the sensor through the first opening 27 on the cathode 26, and the interference of the total reflected light to the sensor is effectively eliminated.
It should be noted that, in this embodiment, θ 1 is about 40 ° and θ 2 is about 70 °, and those skilled in the art should understand that the thickness of each film layer and the refractive index of each film layer in the display panel both affect the size of the total reflection angle, and those skilled in the art should determine the angle of total reflection according to the actual application, so as to obtain the angle of the light of the total reflection light entering the first opening as a design criterion, which is not described herein again.
Similarly, external ambient light enters the first substrate 21 and is shielded and absorbed by the light shielding layer 23 corresponding to each pixel unit on the array substrate, so that the external ambient light is prevented from entering the sensor through the transparent anode 24 and the light emitting layer 25 via the first opening 27 on the cathode 26, and the interference of the external ambient light to the sensor is effectively eliminated.
Meanwhile, considering the aperture ratio of the bottom emission display panel, the light shielding layer is to shield both the light entering the first opening and to ensure the aperture ratio of the display panel, so that the orthographic projection of the light shielding layer on the first substrate 21 covers the orthographic projection of the first opening 27 on the first substrate 21, that is, the area of the light shielding layer covers the area of the first opening to ensure the light entering the first opening is shielded.
Therefore, in this embodiment, the light incident into the first opening is effectively shielded and absorbed by the light shielding layer disposed on the array substrate, so that interference of incident light to the sensor is avoided, and the sensor is ensured to sense actual brightness of light emitted from the display unit, so that the actual brightness and the preset theoretical brightness are compared and the pixel unit is compensated and corrected, thereby effectively improving precision and efficiency of optical compensation, and improving display effect of the display panel.
In the present embodiment, the pixel circuit 22 is formed on the first substrate 21, and includes an active layer 22, a gate insulating layer 224, a gate electrode 225, an interlayer insulating layer 226, source and drain electrodes 227, and a planarization layer 228 in this order.
In view of the manufacturing process of the bottom emission display panel, in an alternative embodiment, as shown in fig. 3, the light shielding layer 232 is formed on the gate insulating layer 224 of the pixel circuit, and is disposed at the same layer as the gate electrode 225.
In this embodiment, the light-shielding layer and the gate electrode are formed in the same process step, and the material of the light-shielding layer is the same as that of the gate electrode.
Similarly, in another alternative embodiment, as shown in fig. 3, the light-shielding layer 233 is formed on the interlayer insulating layer 226 of the pixel circuit, and is disposed at the same level as the source and drain electrodes 227. Namely, the light shielding layer and the source electrode and the drain electrode are formed in the same process step, and the material of the light shielding layer is the same as that of the source electrode and the drain electrode.
Similarly, in another alternative embodiment, the light-shielding layer 234 is formed on the planarization layer 228 of the pixel circuit. That is, the light-shielding layer 234 is formed in the next process step after the planarization layer is formed, and the material of the light-shielding layer 234 is a material having light-shielding property and light-absorbing property, and may be a metal material or another material.
In another optional embodiment, the array substrate further includes a light shielding metal 221 formed on the first substrate 21 for shielding external light for the pixel circuit, and the light shielding layer 231 is disposed on the same layer as the light shielding metal 221. Namely, the light shielding layer and the light shielding metal are formed in the same process step, and the material of the light shielding layer is the same as that of the light shielding metal.
It should be noted that, the setting position of the light shielding layer is not limited in the present application, and those skilled in the art should set the specific position and the specific size of the light shielding layer according to the actual application requirement, so as to satisfy the design criterion of the first opening for shielding the total reflection light and the external ambient light from entering the cathode, which is not described herein again.
In order to further improve the sensing accuracy of the sensor, in an alternative embodiment, the center of the orthographic projection of the first opening on the first substrate coincides with the center of the orthographic projection of the pixel unit on the first substrate.
In this embodiment, as shown in fig. 2, taking the first opening as a circular hole for example, the center of the first opening corresponds to the midpoint of the pixel unit, that is, the center of the first opening 27 is disposed on the optical axis of the outgoing light of the pixel unit, at this time, the outgoing light from the first opening is more uniform, and the actual brightness of the pixel unit can be represented.
In another optional embodiment, to further improve the aperture ratio of the bottom emission display panel, the diameter of the first opening is in inverse proportion to the aperture ratio of the bottom emission display panel, and the diameter of the light shielding layer is in inverse proportion to the aperture ratio of the bottom emission display panel.
In this embodiment, in the case of ensuring that the sensor can sense the actual brightness of the pixel unit, the smaller the diameter of the first opening is, the smaller the loss of the light emitted by the pixel unit in the first opening is, and the smaller the diameter of the required light shielding layer is; meanwhile, the smaller the diameter of the light shielding layer is, the smaller the shielding of the light emitted from the light emitting side of the pixel unit is, and the larger the aperture opening ratio of the display panel is.
In another optional embodiment, the center of the orthographic projection of the light shielding layer on the first substrate coincides with the center of the orthographic projection of the corresponding first opening of the pixel unit on the first substrate.
In this embodiment, the first opening and the light-shielding layer are also exemplified as circular patterns, and in order to improve the blocking efficiency of the light-shielding layer for the light entering the first opening, as shown in fig. 2, the light-shielding layer and the first opening are concentric circles, that is, the center of the light-shielding layer 23 and the center of the first opening are both on the optical axis of the outgoing light of the pixel unit, in other words, the first opening and the light-shielding layer are aligned, and at this time, the light-shielding layer 23 can block the light entering the first opening with the highest efficiency.
It should be noted that, in the present application, the shapes of the first opening and the light shielding layer are not limited, and may be circular, rectangular, or other shapes, and those skilled in the art should select the shapes of the first opening and the light shielding layer according to practical application requirements, for example, the shapes of the first opening and the light shielding layer are designed according to the shape of the light emitting pixel, so as to satisfy the requirement of the light transmission function of the first opening, the light shielding function of the light shielding layer, and the aperture ratio of the display panel as design criteria, which is not described herein again.
To further ensure that the display luminescence performance of the bottom emission display panel is not affected, in an alternative embodiment, as shown in fig. 3, the cathode includes a first cathode layer 261 and a second cathode layer 262, where the first cathode layer 261 is a transparent conductive material and is located on the side of the luminescent layer 25 away from the first substrate 21; the second cathode layer 262 is made of an opaque material and is located on a side of the first cathode layer 261 far away from the first substrate 21, and the second cathode layer 262 includes the plurality of first openings 27.
In this embodiment, the cathode has a double-layer structure, the first cathode layer 261 is a transparent conductive material, and the light emitting layer emits light when a voltage is applied to the first cathode layer and the anode; the second cathode layer is made of opaque material, so that on one hand, the consumption of light energy emitted by the pixel unit on the cathode layer can be reduced, and on the other hand, the voltage loaded on the light emitting layer cannot be influenced by arranging the first opening on the second cathode layer.
On the basis of the above embodiments, in an alternative embodiment, the second cathode layer is made of a light-tight conductive material.
In this embodiment, the second cathode layer is made of a metal material, such as aluminum, which can reduce the resistance of the cathode and thus reduce the loss of the applied voltage; on the other hand, the consumption of the light energy emitted by the pixel unit at the cathode layer can be further reduced through the reflection property of the metal material.
It should be noted that the foregoing embodiments are only used for illustrating specific embodiments of the present application, and the cathode structure of the present application is not limited, and in order to satisfy the display effect of the bottom emission display panel, the cathode may be configured as a double-layer structure or a multi-layer structure in the foregoing embodiments, which are within the protection scope of the present application and are not described herein again.
In an alternative embodiment, as shown in fig. 3, the pixel defining layer of the pixel unit is a black resin material.
In this embodiment, the pixel defining layer is made of a black resin material, so that on one hand, the filtering effect on external ambient light is enhanced, and on the other hand, the pixel defining layer can be used as a light shielding layer of a driving circuit in the sensor substrate, thereby preventing a thin film transistor of the driving circuit from being interfered by external light.
In an alternative embodiment, the sensor is one or more of a light sensitive sensor, an infrared sensor, an acoustic wave sensor, or a temperature sensor.
In this embodiment, the corresponding functions are realized by different sensors disposed on the sensor substrate, for example, the light intensity of the light emitted from the pixel unit is sensed by the photosensitive sensor according to the light transmitted through the first opening; detecting the temperature of the bottom emission display panel through a temperature sensor and carrying out early warning according to the detected temperature, or correcting the precision of the photosensitive sensor according to the detected temperature; receiving an instruction transmitted by an external infrared signal through an infrared sensor; the sound control is realized by receiving an instruction of audio signal transmission through the sound wave sensor, for example, receiving an instruction of ultrasonic signal transmission through the ultrasonic wave sensor, and recognizing a voice signal through the sound wave sensor.
In an optional embodiment, the sensor substrate further includes an organic insulating layer on the driving circuit, and the organic insulating layer is a black resin material.
In this embodiment, the sensor substrate includes a second substrate, a driving circuit on the second substrate, an organic insulating layer on the driving circuit, and a plurality of sensors driven by the driving circuit, where the organic insulating layer serves as a light shielding layer of the driving circuit in the sensor substrate, so as to prevent thin film transistors of the driving circuit from being interfered by external light.
In order to further improve the optical compensation accuracy of the bottom emission display panel, in an alternative embodiment, as shown in fig. 4, the bottom emission display panel further includes an auxiliary layer 30 located between the array substrate 20 and the sensor substrate 10, wherein the auxiliary layer 30 is one of an adhesive layer, a vacuum layer or a gas atmosphere layer.
In this embodiment, the auxiliary layer 30 is located between the array substrate 20 and the sensor substrate 10, and the auxiliary layer 30 is an adhesive layer for adhering the array substrate 20 and the sensor substrate 10 and blocking the interference light entering the sensor substrate; the auxiliary layer 30 is an adhesive layer vacuum layer or a gas atmosphere layer for protecting the display panel from damage and blocking interference light entering the sensor substrate under the pressure of the external atmospheric pressure.
Specifically, as shown in fig. 4, although the light shielding layer 23 blocks the total internal reflection light and the interference light of the external ambient light entering the first opening, there is still a portion of the interference light incident on the sensor substrate through the transparent anode, the light emitting layer, the light transmissive cathode and the encapsulation layer 28, and thus the interference light is blocked by the auxiliary layer disposed between the array substrate 20 and the sensor substrate 10, thereby further improving the optical compensation accuracy of the bottom emission display panel.
In an optional embodiment, the auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate. That is, the bottom emission display panel is prevented from being deformed or damaged by the external atmospheric pressure by the support structure.
In an alternative embodiment, as shown in fig. 5, the auxiliary layer 30 is a vacuum layer or a gas environment layer, and the bottom emission display panel further includes spherical particles or columnar particles 33 in the vacuum layer 32 or the gas environment layer 32.
In this embodiment, the array substrate 20 and the sensor substrate 10 are attached by the frame sealing adhesive 31, and a vacuum layer is formed in the middle, or a specific gas and a supporting columnar particle 33 are filled in the middle, so as to prevent the bottom emission display panel from being deformed or damaged under the action of the external atmospheric pressure. Similarly, the array substrate 20 and the sensor substrate 10 may be supported by spherical particles, which will not be described in detail herein.
In an alternative embodiment, as shown in fig. 6, the auxiliary layer further comprises an optical film layer 34 with collimating structures 35.
In this embodiment, the auxiliary layer is an opaque optical film layer 34, the optical film layer is configured to limit light rays with a large angle from passing through, when a light receiving angle θ 3 of the optical film layer is small, total reflection light rays can be blocked, so as to effectively filter interference light rays entering the auxiliary layer, meanwhile, in order to facilitate sensing of actual brightness of light rays emitted by the pixel unit by the sensor, the optical film layer 34 includes a light-transmitting collimating structure 35, light rays emitted from the first opening pass through the collimating structure and enter the sensor of the sensor substrate, the sensor senses actual brightness of the display unit, and performs compensation correction on the pixel unit by comparing the actual brightness with theoretical brightness, so as to effectively improve optical compensation accuracy of the bottom emission display panel.
In another optional embodiment, the auxiliary layer further includes an optical film layer having a polarizer, and the optical film layer is perpendicular to the optical axis of the emergent light of the pixel unit.
In this embodiment, a polarizer is disposed in the optical film layer, and the polarizer is perpendicular to the optical axis of the pixel unit, so as to effectively filter out interference light entering the sensor substrate. In this example, the appropriate optical film is made using different types of polarizers or combinations of polarizers, such as one of linear polarizers, circular polarizers, or a combination of linear and circular polarizers. It should be noted that those skilled in the art should select an appropriate polarizer and a type of polarizer according to practical application requirements, so as to be able to filter out the interference light as a design criterion, and details thereof are not repeated herein.
Corresponding to the bottom emission display panel provided in the foregoing embodiment, an embodiment of the present application further provides a method for manufacturing the bottom emission display panel, as shown in fig. 7, including: forming an array substrate, wherein the array substrate comprises a pixel circuit formed on a first substrate, a pixel unit driven by the pixel circuit and a light shielding layer arranged on the light emitting side of the pixel unit and corresponding to the pixel units, the pixel unit comprises an anode, a light emitting layer and a cathode, a plurality of first openings are arranged on the cathode, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first openings on the first substrate; forming a sensor substrate including a plurality of sensors; the array substrate and the sensor substrate are attached and aligned.
In this embodiment, first, the array substrate and the sensor substrate are manufactured respectively, specifically:
first, a pixel circuit, a pixel unit driven by the pixel circuit is formed on a first substrate to form an array substrate, wherein:
the method comprises the steps that a pixel circuit is formed on a first substrate and comprises a thin film transistor for driving a pixel unit and a light shielding layer which is arranged on the light emitting side of the pixel unit and corresponds to the pixel units, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of a first opening on the first substrate.
In an alternative embodiment, a light-shielding layer disposed on the same layer as the gate electrode is formed on the gate insulating layer of the thin film transistor of the pixel circuit. Namely, the light shielding layer is simultaneously manufactured in the step of manufacturing the grid electrode, so that the manufacturing steps are effectively simplified.
Similarly, in another alternative embodiment, a light-shielding layer disposed on the same layer as the source and drain electrodes is formed on the interlayer insulating layer of the thin film transistor of the pixel circuit. Namely, the light shielding layer is simultaneously manufactured in the step of manufacturing the source electrode and the drain electrode, so that the manufacturing steps are effectively simplified.
In another alternative embodiment, a light-shielding layer is formed on a planarization layer of a thin film transistor of the pixel circuit. Namely, the light shielding layer is manufactured after the planarization layer is manufactured.
In another alternative embodiment, a light-shielding layer and a light-shielding metal for shielding external light for the pixel circuit are formed on the first substrate, and the light-shielding layer and the light-shielding metal are disposed in the same layer. Namely, the light shielding layer is simultaneously manufactured in the step of manufacturing the light shielding metal, so that the manufacturing steps are effectively simplified.
And a second step of forming a pixel unit on the pixel circuit, the pixel unit including an anode, a pixel defining layer, a light emitting layer, and a cathode, the cathode including a plurality of first openings for transmitting light emitted from the pixel unit.
The method specifically comprises the following steps: forming an anode on the pixel circuit, forming a pixel defining layer on the anode, forming a light-emitting layer in a region surrounded by the pixel defining layer, forming a cathode on the pixel defining layer and the light-emitting layer, and forming an encapsulation layer encapsulating the first substrate, the pixel circuit and the pixel unit on the cathode.
In an optional embodiment, the cathode includes a plurality of first openings, and the plurality of first openings correspond to the light shielding layer one to one. That is, the cathode is provided with an opening such that the light emitted from the pixel unit can be transmitted through the first opening for the sensor to sense.
In another alternative embodiment, the cathode includes a first cathode layer formed on the pixel defining layer and the light emitting layer, the first cathode layer being a transparent conductive material; and the second cathode layer is formed on the first cathode layer and is opaque, and the second cathode layer comprises a plurality of first openings which are in one-to-one correspondence with the light shielding layer. I.e. the light emitting properties of the display panel are further improved by the double or multi-layered cathode.
Second, a driving circuit, a plurality of sensors driven by the driving circuit are formed on a second substrate to form a sensor substrate.
Specifically, a driving circuit including a thin film transistor driving the sensor, an organic insulating layer formed to shield the thin film transistor from light, and a plurality of sensors formed on the driving circuit are formed on the second substrate.
And thirdly, the array substrate and the sensor substrate are attached and aligned, and the sensor corresponds to the first opening. The pixel units of the array substrate and the sensors of the sensor substrate are aligned according to pixels and then are bonded.
In an optional embodiment, the method specifically includes: and forming an auxiliary layer for attaching on the array substrate, wherein the auxiliary layer comprises an adhesive layer, a vacuum layer or a gas environment layer for adhering the array substrate and the sensor substrate. I.e., an adhesive layer, vacuum layer or other environmental layer, is used to adhere or secure the array substrate and the sensor substrate.
In an alternative embodiment, when the auxiliary layer comprises a vacuum layer or a gas environment layer, the vacuum layer or the gas environment layer comprises spherical particles or columnar particles. The bottom emission display panel is attached to the vacuum layer in a frame sealing glue mode, and the array substrate and the sensor substrate are supported by spherical particles or columnar particles so as to prevent the bottom emission display panel from deforming or being damaged under the action of external atmospheric pressure.
In an alternative embodiment, the auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate. That is, the bottom emission display panel is prevented from being deformed or damaged by the external atmospheric pressure by the support structure.
In an alternative embodiment, the auxiliary layer further comprises an optical film layer having collimating structures. Interference light of the large angle that gets into the auxiliary layer through the filtering of adiactinic optics rete promptly, the sensor of light transmission to the sensor base plate that passes through penetrating in the collimation structure that sets up on the optics rete will first trompil simultaneously to the sensor sensing the actual luminance of the light of display element outgoing.
In another optional embodiment, the auxiliary layer further includes an optical film layer having a polarizer, and the optical film layer is perpendicular to the optical axis of the emergent light of the pixel unit. The interference light entering the sensor substrate is filtered by a polaroid perpendicular to the optical axis of the pixel unit, wherein the polaroid is one of a linear polaroid, a circular polaroid or a combined polaroid of the linear polaroid and the circular polaroid.
Based on the bottom emission display panel in the foregoing embodiments, an embodiment of the present application further provides an optical compensation method using the bottom emission display panel, and since the optical compensation method provided in the embodiment of the present application corresponds to the bottom emission display panels provided in the foregoing several embodiments, the foregoing embodiment is also applicable to the optical compensation method provided in the embodiment, and detailed description is not repeated in this embodiment.
As shown in fig. 8, an embodiment of the present application further provides an optical compensation method using the bottom emission display panel, including: the pixel circuit of the array substrate drives a plurality of pixel units to emit light, each pixel unit comprises an anode, a light-emitting layer and a cathode, and a plurality of first openings are formed in the cathode; the array substrate shields light entering the first opening through a light shielding layer which is arranged on the light emitting side of the pixel units and corresponds to the pixel units, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate; the plurality of sensors of the sensor substrate sense the light transmitted by the first opening and emitted by the pixel unit.
In this embodiment, the light incident into the first opening is effectively shielded and absorbed by the light shielding layer arranged on the array substrate, so that the interference of the incident light to the sensor is avoided, the actual brightness of the light emitted by the display unit can be sensed by the sensor, the actual brightness can be compared with the preset theoretical brightness according to the actual brightness, and the compensation correction is performed on the pixel unit, so that the precision and the efficiency of optical compensation are effectively improved, and the display effect of the display panel is improved.
It is to be noted that the terms "formed on (8230)", "disposed on (8230)", "formed on (8230)") and "disposed on (8230)", as used herein, may mean that one layer is directly formed or disposed on another layer, or that one layer is indirectly formed or disposed on another layer, that is, another layer is present between two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of a photoresist, exposure, development, etching, stripping of the photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, component, or the like using one mask.
Aiming at the existing problems, the invention provides the bottom emission display panel, the manufacturing method and the optical compensation method, the interference light is eliminated through the light shielding layer arranged on the light emitting side of the pixel unit, the optical compensation efficiency of the bottom emission display panel is effectively improved, the display effect of the bottom emission display panel is improved, and the bottom emission display panel has wide application prospect.
It should be understood that the above-described embodiments of the present invention are examples for clearly illustrating the invention, and are not to be construed as limiting the embodiments of the present invention, and it will be obvious to those skilled in the art that various changes and modifications can be made on the basis of the above description, and it is not intended to exhaust all embodiments, and obvious changes and modifications can be made on the basis of the technical solutions of the present invention.

Claims (10)

1. A bottom emission display panel comprises an array substrate and a sensor substrate, wherein the array substrate and the sensor substrate are bonded and aligned, and the sensor substrate is provided with a plurality of alignment holes
The array substrate comprises a first substrate, a pixel circuit on the first substrate, a plurality of pixel units driven by the pixel circuit to emit light, and a light shielding layer corresponding to the pixel units,
the pixel unit comprises an anode, a light emitting layer and a cathode, wherein a plurality of first openings are formed in the cathode, and the center of the orthographic projection of the first openings on the first substrate coincides with the center of the orthographic projection of the pixel unit on the first substrate; the cathode comprises a first cathode layer and a second cathode layer, wherein the first cathode layer is made of a transparent conductive material and is positioned on one side of the light-emitting layer, which is far away from the first substrate; the second cathode layer is made of light-tight material and is positioned on one side, away from the first substrate, of the first cathode layer, and the second cathode layer comprises the plurality of first openings;
the light shielding layer is arranged on the light emitting side of the pixel unit, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate, so that light entering the first opening is shielded;
the sensor substrate comprises a plurality of sensors, and the sensors sense the light transmitted by the first openings and emitted by the pixel units.
2. The bottom emission display panel according to claim 1,
the pixel circuit includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, source and drain electrodes, and a planarization layer;
the light shielding layer is formed on the gate insulating layer and is arranged on the same layer as the gate;
or alternatively
The light shielding layer is formed on the interlayer insulating layer and is arranged on the same layer as the source electrode and the drain electrode;
or
The light shielding layer is formed on the planarization layer;
or
The array substrate further comprises a shading metal which is formed on the first substrate and used for shading external light for the pixel circuit, and the shading layer is formed on the first substrate and arranged on the same layer with the shading metal.
3. The bottom emission display panel according to claim 1,
the center of the orthographic projection of the light shielding layer on the first substrate coincides with the center of the orthographic projection of the first opening of the corresponding pixel unit on the first substrate.
4. The bottom emission display panel according to claim 1, further comprising an auxiliary layer between the array substrate and the sensor substrate, the auxiliary layer being one of an adhesive layer, a vacuum layer and a gas atmosphere layer.
5. The bottom emission display panel according to claim 4,
the auxiliary layer is a vacuum layer or a gas environment layer, and the bottom emission display panel further comprises spherical particles or columnar particles positioned in the vacuum layer or the gas environment layer;
and/or
The auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate;
and/or
The auxiliary layer further comprises an optical film layer, wherein
The optical film layer comprises collimating structures, or
The optical film layer comprises a polaroid which is vertical to the optical axis of the emergent ray of the pixel unit.
6. The bottom-emitting display panel according to claim 1,
the sensor comprises one or more of a photosensitive sensor, an infrared sensor, an acoustic wave sensor and a temperature sensor;
and/or
The sensor substrate further comprises a second substrate, a driving circuit positioned on the second substrate, and an organic insulating layer positioned on the driving circuit, wherein the organic insulating layer is made of black resin materials.
7. A method of fabricating a bottom emission display panel according to any one of claims 1 to 6, comprising:
forming an array substrate, wherein the array substrate comprises a pixel circuit formed on a first substrate, a pixel unit driven by the pixel circuit and a light shielding layer arranged on the light emergent side of the pixel unit and corresponding to the pixel units, the pixel unit comprises an anode, a light emitting layer and a cathode, a plurality of first openings are arranged on the cathode, the center of the orthographic projection of the first openings on the first substrate is coincident with the center of the orthographic projection of the pixel units on the first substrate, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first openings on the first substrate;
forming a sensor substrate including a plurality of sensors;
and the array substrate and the sensor substrate are bonded and aligned.
8. The method of manufacturing according to claim 7,
the forming of the array substrate, the array substrate including a pixel circuit formed on a first substrate, a pixel unit driven by the pixel circuit, and a light shielding layer provided on a light exit side of the pixel unit and corresponding to the plurality of pixel units, further includes:
forming a pixel circuit including an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, source and drain electrodes, and a planarization layer on a first substrate, wherein
Forming a light shielding layer arranged on the same layer as the grid electrode on the grid insulating layer;
or alternatively
Forming a light-shielding layer on the interlayer insulating layer, wherein the light-shielding layer is arranged on the same layer as the source electrode and the drain electrode;
or
Forming a light-shielding layer on the planarization layer;
or alternatively
Forming a light shielding layer and shading metal for shielding external light for the pixel circuit on a first substrate, wherein the light shielding layer and the shading metal are arranged on the same layer, and the pixel circuit is formed on the first substrate, the light shielding layer and the shading metal;
forming a pixel unit on the pixel circuit, including
Forming an anode electrode on the pixel circuit;
forming a pixel defining layer on the anode;
forming a light-emitting layer in a region surrounded by the pixel defining layer;
forming a cathode on the pixel defining layer and the light emitting layer, wherein the cathode includes
A plurality of first openings corresponding to the light-shielding layer;
or
A first cathode layer formed on the pixel defining layer and the light emitting layer, the first cathode layer being a transparent conductive material;
a second light-opaque cathode layer formed on the first cathode layer, the second cathode layer including a plurality of first openings corresponding to the light-shielding layer;
and forming an encapsulation layer for encapsulating the first substrate, the pixel circuit and the pixel unit on the cathode to form an array substrate.
9. The manufacturing method of claim 7 or 8, wherein the attaching and aligning of the array substrate and the sensor substrate further comprises:
forming an auxiliary layer for attaching the array substrate and a sensor substrate on the array substrate, wherein,
the auxiliary layer comprises an adhesive layer;
or alternatively
The auxiliary layer comprises either a vacuum layer or a gas environment layer, and the vacuum layer or the gas environment layer comprises spherical particles or columnar particles;
and/or
The auxiliary layer further comprises a support structure for supporting the array substrate and the sensor substrate;
and/or
The auxiliary layer further includes an optical film layer comprising:
a collimating structure;
or
And the polaroid is perpendicular to the optical axis of the emergent light of the pixel unit.
10. An optical compensation method using the bottom emission display panel of any one of claims 1 to 6, comprising:
the pixel circuit of the array substrate drives a plurality of pixel units to emit light, each pixel unit comprises an anode, a light emitting layer and a cathode, a plurality of first openings are formed in the cathode, and the centers of orthographic projections of the first openings on the first substrate coincide with the centers of orthographic projections of the pixel units on the first substrate;
the array substrate shields light entering the first opening through a light shielding layer which is arranged on the light emitting side of the pixel units and corresponds to the pixel units, and the orthographic projection of the light shielding layer on the first substrate covers the orthographic projection of the first opening on the first substrate;
the plurality of sensors of the sensor substrate sense the light transmitted by the first opening and emitted by the pixel unit.
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