CN113471261B - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN113471261B CN113471261B CN202110721149.9A CN202110721149A CN113471261B CN 113471261 B CN113471261 B CN 113471261B CN 202110721149 A CN202110721149 A CN 202110721149A CN 113471261 B CN113471261 B CN 113471261B
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- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 215
- 239000002131 composite material Substances 0.000 claims abstract description 77
- 239000002346 layers by function Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 8
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 61
- 229910052740 iodine Inorganic materials 0.000 claims description 61
- 239000011630 iodine Substances 0.000 claims description 61
- 239000012790 adhesive layer Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 35
- 239000011241 protective layer Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 abstract description 13
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- 230000008022 sublimation Effects 0.000 description 10
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- 230000003287 optical effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
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- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
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- 230000001678 irradiating effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000036541 health Effects 0.000 description 1
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- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a preparation method of a display panel and the display panel, which relate to the technical field of display panels and are used for solving the technical problem that the driving performance of a thin film transistor is easily affected in the preparation process of the existing display module, and the preparation method of the display panel comprises the following steps: providing a display substrate; the display substrate comprises a screen body and a composite layer; a light hole is formed in the composite layer; forming a light shielding layer at the light holes; exposing and aligning one side of the composite layer far away from the screen body, and forming a functional layer on the composite layer; and removing the shading layer. The preparation method of the display panel can avoid exposure alignment from affecting the thin film transistor and ensure the display effect of the display panel.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a preparation method of a display panel and the display panel.
Background
The OLED screen has self-luminous characteristics and a thinner structure, and currently, the under-OLED-screen fingerprint identification (FOD, finger on Dispaly) mainly adopts an optical scheme. The fingerprint identification scheme under the optical screen needs to open FOD holes in the fingerprint identification area of the composite adhesive tape so that the fingerprint identification sensor can transmit optical signals.
At present, the display module needs to be attached with the flexible circuit board, the insulating adhesive tape and the FOD protection film in the preparation process, and exposure alignment is usually needed to be carried out on the display module, and the flexible circuit board, the insulating adhesive tape and the FOD protection film are attached after alignment is completed. However, the driving performance of the thin film transistor (Thin Film Transistor, TFT for short) is easily affected in the manufacturing process of the present display module, and the display effect of the screen is reduced.
Disclosure of Invention
In view of the above problems, embodiments of the present invention provide a method for manufacturing a display panel and a display panel, which can avoid exposure alignment affecting a thin film transistor and ensure a display effect of the display panel.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
a first aspect of an embodiment of the present invention provides a method for manufacturing a display panel, including:
providing a display substrate; the display substrate comprises a screen body and a composite layer.
And a light hole is formed in the composite layer.
And forming a shading layer at the light holes.
And exposing and aligning one side of the composite layer far away from the screen body, and forming a functional layer on the composite layer.
And removing the shading layer.
According to the preparation method of the display panel, the light holes are formed in the composite layer, so that the under-screen fingerprint identification device can conveniently conduct fingerprint identification through the light holes, and the light shielding layer is formed at the light holes, so that the light shielding layer can conveniently block strong light in subsequent procedures, the influence of strong light on the driving performance of the thin film transistor is avoided, and the display effect of the display panel is guaranteed. Through exposure counterpoint, make functional layer and composite bed can accurately counterpoint to laminate the functional layer, after exposure counterpoint is accomplished, get rid of the shading layer, make the light trap can the printing opacity, prevent to influence fingerprint identification device's normal use.
In one possible implementation, the light shielding layer is an iodine layer.
Thus, on one hand, the purple-black iodine layer can be used for blocking strong light, and on the other hand, the iodine layer is convenient to remove.
In one possible implementation manner, the step of removing the light shielding layer includes: heating sublimates the iodine layer.
Therefore, the characteristic of low sublimation temperature of the iodine layer can be utilized to sublimate the iodine layer at a lower temperature, on one hand, the iodine layer can be removed nondestructively, mechanical and chemical methods are avoided, abrasion to other structural layers is avoided, on the other hand, the heating temperature is lower, and the influence of high temperature on the performance of the screen body can be avoided.
In one possible implementation manner, the composite layer includes an adhesive layer, a buffer layer, a heat insulating layer and a reflective layer which are sequentially stacked, and the adhesive layer is located on one side, close to the screen, of the buffer layer.
In the step of forming the light holes in the composite layer, the method comprises the following steps: and the buffer layer, the heat insulation layer and the light reflection layer are provided with the light holes.
Like this, the adhesive linkage can bond composite bed and screen body, and the buffer layer can cushion external force to the impact of screen body, avoids external force to damage the screen body, and the insulating layer can isolate heat, prevents the performance of heat influence screen body, and the reflection of light layer can reflect the light that the screen body sent, reinforcing luminance.
In one possible implementation manner, the step of forming a light shielding layer at the light holes includes: in the light holes, a shading layer is formed on the surface of the bonding layer, which is far away from one side of the screen body.
Thus, the light shielding layer can be formed on the bonding layer, and the light shielding layer is fixed by the bonding force of the bonding layer, so that the light shielding layer is more stable in the light holes.
In one possible implementation, the thickness of the iodine layer ranges from 50 to 150 μm.
Therefore, on one hand, the thickness of the iodine layer can be ensured to shield most of strong light, and on the other hand, the iodine layer is prevented from being too thick, so that the iodine layer can be removed in subsequent procedures.
In one possible implementation, in the step of heating to sublimate the iodine layer, a heating temperature is greater than 45 ℃ and less than 80 ℃.
Therefore, the iodine layer can be sublimated into iodine vapor in the environment with the temperature of more than 45 ℃, so that the purpose of removing the shading layer is achieved, and the screen body is prevented from being damaged.
In one possible implementation, the functional layer includes a flexible circuit board, an insulating adhesive layer, and a protective layer that are sequentially stacked.
The step of exposing and aligning the side, far away from the screen body, of the composite layer and forming a functional layer on the composite layer comprises the following steps:
and performing first exposure alignment on one side of the composite layer far away from the screen body.
And attaching the flexible circuit board to one side of the composite layer far away from the screen body.
And performing second exposure alignment on one side of the flexible circuit board far away from the screen body.
And attaching the insulating adhesive layer to the flexible circuit board.
And performing third exposure alignment on one side of the insulating adhesive layer far away from the screen body to finish the alignment of the protective layer.
Thus, the flexible circuit board and the insulating adhesive layer can be precisely attached to the composite layer, and the alignment work of the protective layer is completed.
In one possible implementation manner, the step of performing third exposure alignment on the side, away from the screen, of the insulating adhesive layer, after completing the alignment step of the protective layer, and after the step of heating and sublimating the iodine layer, includes: and attaching the protective layer to the insulating adhesive layer.
Therefore, after the iodine vapor completely flows out, the protective layer can be attached to avoid the existence of the iodine vapor in the display panel.
A second aspect of the embodiments of the present invention provides a display panel manufactured by the above method.
According to the display panel provided by the embodiment of the invention, the light holes are formed in the composite layer, so that the under-screen fingerprint identification device can conveniently conduct fingerprint identification through the light holes, and the light shielding layer is formed at the light holes, so that the light shielding layer can conveniently block strong light in subsequent procedures, the influence of strong light on the driving performance of the thin film transistor is avoided, and the display effect of the display panel is ensured. Through exposure counterpoint, make functional layer and composite bed can accurately counterpoint to laminate the functional layer, after exposure counterpoint is accomplished, get rid of the shading layer, make the light trap can the printing opacity, prevent to influence fingerprint identification device's normal use.
The construction of the present invention and other objects and advantages thereof will be more readily understood from the description of the preferred embodiment taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 2 is a flowchart of performing exposure alignment on a display panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a screen body according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure of a composite layer before opening according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a composite layer with holes according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a composite layer bonded to a release film according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a composite layer and a screen after bonding according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a composite layer according to an embodiment of the present invention after depositing an iodine layer;
fig. 9 is a schematic structural diagram of a composite layer after alignment of a protective layer according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a display panel after sublimation of an iodine layer according to an embodiment of the present invention.
Reference numerals illustrate:
100-a display panel;
10-a screen body;
11-cover plate;
12-an optical adhesive layer;
13-a polarizer;
14-a light emitting layer;
15-supporting the membrane layer;
20-a composite layer;
21-an adhesive layer;
22-a buffer layer;
23-a heat insulation layer;
24-a light reflecting layer;
25-release film;
26-PET plate;
27-shading adhesive tape;
30-light holes;
40-a light shielding layer;
50-a functional layer;
51-a flexible circuit board;
52-an insulating adhesive layer;
53-protective layer.
Detailed Description
In the preparation process of the display module, in order to prevent light from penetrating through the FOD hole and irradiating the screen body, a shading tape is usually arranged at the FOD hole, however, in the related art, before the flexible circuit board (Flexible Printed Circuit, abbreviated as FPC) is attached, the protective film on the composite tape needs to be torn off, and the shading tape on the protective film is also torn off. Then, exposure alignment is performed, and after alignment is completed, FPC and the like are attached. When exposure is aligned, the FOD holes are easy to transmit light, so that the screen body corresponding to the FOD holes is directly exposed under alignment strong light, an irradiated area and an unirradiated area exist on the screen body, and due to strong light irradiation, the carrier mobility of the thin film transistor in the irradiated area is different from that of the thin film transistor in the unirradiated area, so that the driving performance of the thin film transistors in the two areas is different, the luminous brightness of the two areas is different, an obvious boundary exists on the screen body, and the display effect of the display panel is reduced.
According to the technical problems, the embodiment of the invention provides the preparation method of the display panel and the display panel, the light holes are formed in the composite layer, so that the fingerprint identification device under the screen can conveniently conduct fingerprint identification through the light holes, and the light shielding layer is formed at the light holes, so that the light shielding layer can conveniently block strong light in subsequent procedures, the driving performance of the thin film transistor is prevented from being influenced by strong light, and the display effect of the display panel is ensured. Through exposure counterpoint, make functional layer and composite bed can accurately counterpoint to laminate the functional layer, after exposure counterpoint is accomplished, get rid of the shading layer, make the light trap can the printing opacity, prevent to influence fingerprint identification device's normal use.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the invention. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "coupled" should be interpreted broadly, as for example, whether fixedly coupled, indirectly coupled through intermediaries, in communication with each other, or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Fig. 2 is a flowchart of exposure alignment of a display panel according to an embodiment of the invention. Fig. 3 is a schematic structural diagram of a screen body according to an embodiment of the present invention. Fig. 4 is a schematic structural diagram of a composite layer before opening according to an embodiment of the present invention. Fig. 5 is a schematic structural diagram of a composite layer after being perforated according to an embodiment of the present invention. Fig. 6 is a schematic structural diagram of a composite layer bonded to a release film according to an embodiment of the present invention. Fig. 7 is a schematic structural diagram of a laminated composite layer and a screen body according to an embodiment of the present invention. Fig. 8 is a schematic structural diagram of a composite layer after depositing an iodine layer according to an embodiment of the present invention. Fig. 9 is a schematic structural diagram of the composite layer after the alignment of the protective layer according to the embodiment of the present invention. Fig. 10 is a schematic structural diagram of a display panel after sublimation of an iodine layer according to an embodiment of the present invention.
Referring to fig. 1 to 10, a first aspect of the embodiment of the present invention provides a method for manufacturing a display panel, where, as shown in fig. 1, the method for manufacturing a display panel includes:
s1: providing a display substrate; the display substrate includes a screen body 10 and a composite layer 20.
It should be noted that, the screen body 10 and the composite layer 20 provided herein may be a screen body 10 and a composite layer 20 that are attached to each other, or may be a separate screen body 10 and a composite layer 20, as shown in fig. 3 and fig. 4, in this embodiment of the present invention, a separate and unattached screen body 10 and composite layer 20 are provided in this step, and since the composite layer 20 needs to be perforated in the subsequent process, the screen body 10 and the composite layer 20 are not attached in this step, which is beneficial to reduce the difficulty of subsequent perforation. It will be appreciated that, in the case where the process may be implemented, the light holes 30 may be formed after the screen body 10 is attached to the composite layer 20.
It should be noted that, as shown in fig. 3, the screen body 10 includes a supporting film layer 15, a light-emitting layer 14, a polarizer 13, an optical adhesive layer 12, and a cover plate 11, which are sequentially stacked, where the light-emitting layer 14 is used for emitting light, and the supporting film layer 15 supports the light-emitting layer 14. The polarizer 13 includes: the polarizer 13 may reduce reflection of external light and improve contrast of the screen 10 by a PVA (Polyvinyl Alcohol ) layer in the middle and TAC (TriacetylCellulose) layers on both sides of the PVA layer. The optical adhesive layer 12 may bond the polarizer 13 and the cover plate 11, and the cover plate 11 may be a glass cover plate or a flexible cover plate.
S2: and a light hole is formed in the composite layer. By providing the light holes 30 on the composite layer 20, the fingerprint identification device is convenient for fingerprint identification through the light holes 30 under the screen. The structure of the composite layer 20 with the light holes 30 is shown in fig. 5, and the size and shape of the light holes 30 may be selected according to the requirements of the under-screen fingerprint recognition device, which is not limited herein.
It should be noted that, since the composite layer 20 needs to be transported and transferred after being perforated, and the next process is performed, the release film 25 is attached to the plane at two sides of the composite layer 20 to protect the composite layer 20, and a PET (polyethylene terephthalate ) plate is placed in the light hole 30, the PET plate 26 can support the wall of the light hole 30, so as to prevent the shape of the light hole 30 from being affected during the transportation, and in addition, a black shading tape 27 is further provided at the position of the release film 25 away from the light hole 30.
Before the composite layer 20 is attached to the screen body 10, the release film 25 on the side of the composite layer 20 close to the screen body 10 needs to be removed, and in order to attach the functional layer 50, the release film 25 and the light shielding tape 27 on the side of the composite layer 20 far from the screen body 10 need to be removed, and meanwhile, the PET plate 26 in the light hole 30 needs to be removed. The structure of the laminated composite layer 20 and the panel 10 is shown in fig. 7.
S3: a light shielding layer is formed at the light transmitting hole. The light shielding layer 40 may be black ink, black resin or other light shielding materials, and by forming the light shielding layer 40 at the light holes 30, the light shielding layer 40 is convenient to block strong light in subsequent processes, so that the strong light is prevented from affecting the driving performance of the thin film transistor, and the display effect of the display panel 100 is ensured.
S4: and exposing and aligning one side of the composite layer far away from the screen body, and forming a functional layer on the composite layer. The alignment error can be reduced through exposure alignment, and the alignment accuracy is improved.
S5: and removing the shading layer. After the light shielding layer 40 is removed by a physical or chemical method, the light holes 30 can transmit light, so that the normal use of the fingerprint identification device is prevented from being influenced.
In one possible implementation, the light shielding layer 40 is an iodine layer. The structure of the composite layer 20 after deposition of the iodine layer is shown in fig. 8, and the iodine layer may be formed by a spray coating process. By depositing the iodine layer, on one hand, the purple-black iodine layer can be utilized to block strong light, and on the other hand, the subsequent process can be convenient for removing the iodine layer.
In one possible implementation manner, the step of removing the light shielding layer specifically includes: the sublimated iodine layer is heated. The iodine can be sublimated from a solid state to a gaseous state directly, and the sublimation temperature of the iodine is lower, so that the iodine layer can be sublimated at a lower temperature, on one hand, the iodine layer can be removed in a nondestructive manner, the physical and chemical methods are avoided, other structural layers are not affected, abrasion to other structural layers is avoided, on the other hand, the heating temperature is lower, and the high temperature is prevented from affecting the performance of the screen body 10.
In one possible implementation, as shown in fig. 7, the composite layer 20 includes an adhesive layer 21, a buffer layer 22, a heat insulating layer 23, and a light reflecting layer 24 that are sequentially stacked, where the adhesive layer 21 is located on a side of the buffer layer 22 near the screen 10. Specifically, the adhesive layer 21 includes an optical adhesive, the buffer layer 22 includes foam, the heat insulating layer 23 includes polyimide, the light reflecting layer 24 includes copper foil, and the light reflecting layer 24 may be aluminum or copper alloy. Like this, the adhesive linkage 21 can bond composite layer 20 and screen body 10, and buffer layer 22 can cushion external force to the impact of screen body 10, avoids external force to damage screen body 10, and insulating layer 23 can insulate heat, prevents that heat from influencing the performance of screen body 10, and reflection of light layer 24 can reflect the light that screen body 10 sent, reinforcing luminance.
Specifically, when the light holes 30 are formed in the composite layer 20, as shown in fig. 5, the light holes 30 may be formed only in the buffer layer 22, the heat insulating layer 23, and the light reflecting layer 24. Since the adhesive layer 21 is an optical adhesive and has high light transmittance, the light transmittance of the light holes 30 is not affected by only forming the holes in the buffer layer 22, the heat insulating layer 23 and the light reflecting layer 24.
In one possible implementation, in the step of forming a light shielding layer at the light transmitting holes, as shown in fig. 8, a light shielding layer 40 (iodine layer) is formed on the surface of the adhesive layer 21 on the side away from the screen body 10 in the light transmitting holes 30. In this way, the iodine layer can be formed on the adhesive layer 21, and the iodine layer can be fixed by the adhesive force of the adhesive layer 21, so that the iodine layer is more stable in the light transmitting holes 30.
In one possible implementation, the thickness of the iodine layer ranges from 50 μm to 150 μm, wherein the thickness of the iodine layer may be 50 μm, 60 μm, 80 μm, 120 μm or 150 μm, when the thickness of the iodine layer is less than 50 μm, the iodine layer is too thin, the strong light blocking capability is limited, and when the thickness of the iodine layer is greater than 150 μm, the iodine layer is too thick, so that on one hand, the iodine layer is inconvenient to clean later, and on the other hand, excessive iodine vapor is easily generated after sublimation of the iodine layer, which is harmful to human health.
In one possible implementation, in the step of heating the sublimated iodine layer, the heating temperature is greater than 45 ℃ and less than 80 ℃. Since the minimum temperature of sublimation of iodine is 45 ℃, the iodine layer can be sublimated into iodine vapor in an environment of more than 45 ℃, thereby achieving the purpose of removing the light shielding layer 40, and in addition, the heating temperature is less than 80 ℃ so as to avoid the influence of overhigh temperature on the performance of the screen body 10.
It should be noted that the rate of sublimation of iodine is related to the heating temperature, and the higher the heating temperature is, the faster the rate of sublimation of iodine is, and the user can select the heating temperature according to the actual situation without affecting the performance of other structural layers.
In one possible implementation, as shown in fig. 9, the functional layer 50 includes a flexible circuit board 51, an insulating adhesive layer 52, and a protective layer 53 that are sequentially stacked, wherein the protective layer 53 is used to protect the light holes 30.
Specifically, as shown in fig. 2, in the step of exposing and aligning the side of the composite layer away from the screen body and forming the functional layer on the composite layer, the method includes:
s31: and performing first exposure alignment on one side of the composite layer far away from the screen body.
It should be noted that this step is aimed at completing the alignment of the flexible circuit board 51 with the screen 10.
S32: and attaching the flexible circuit board to one side of the composite layer far away from the screen body.
S33: and performing second exposure alignment on one side of the flexible circuit board far away from the screen body.
The purpose of this step is to align the insulating adhesive layer 52 with the panel 10.
S34: and attaching the insulating adhesive layer to the flexible circuit board.
S35: and performing third exposure alignment on one side of the insulating adhesive layer far away from the screen body to complete alignment of the protective layer. As shown in fig. 9, after the alignment of the protective layer 53 is completed, a certain gap is provided between the insulating adhesive layer 52, and the gap may be 5 to 10mm. Specifically, the protective layer 53 may be adsorbed by an adsorption device, so that a gap is formed between the protective layer 53 and the insulating adhesive layer 52, and the purpose of the gap is to allow iodine vapor to flow out.
The above steps can precisely attach the flexible circuit board 51 and the insulating adhesive layer 52 to the composite layer 20 and improve the alignment accuracy of the protective layer 53.
In one possible implementation manner, after the step of performing third exposure alignment on the side, far from the screen body, of the insulating adhesive layer and completing the alignment of the protective layer, and after the step of heating the sublimated iodine layer, it is further required to attach the protective layer 53 to the insulating adhesive layer 52, and in specific attachment, the insulating adhesive layer 52 has a colloid thereon, so that the protective layer 53 can be directly attached to the insulating adhesive layer 52.
It should be noted that the attaching process of the protective layer 53 may be performed in a closed heating furnace, the heating furnace may be ventilated, after the alignment of the protective layer 53 is completed, the alignment light source is turned off, the heating furnace is heated to the sublimation temperature of iodine, after the sublimation of iodine is completed, the protective layer 53 is attached after the iodine vapor is ventilated and discharged. In this way, the presence of iodine vapor in the display panel 100 can be avoided.
A second aspect of the embodiments of the present invention provides a display panel manufactured by the above method.
As shown in fig. 10, the display panel 100 includes a screen body 10, a composite layer 20, a flexible circuit board 51, an insulating adhesive layer 52 and a protective layer 53 that are stacked, where a fingerprint module may be disposed on a side of the insulating adhesive layer 52 away from the screen body 10, and the fingerprint module may be an under-screen fingerprint recognition device.
It should be noted that the display panel 100 may be applied to a display device, and the display device may be a mobile or fixed terminal having the display panel 100, such as a mobile phone, a television, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a personal digital assistant (personal digital assistant, PDA), a virtual reality device, and the like.
In the display panel 100 provided by the embodiment of the invention, the light shielding layer 40 is formed at the light hole 30 before exposure alignment, so that the light shielding layer 40 blocks strong light from irradiating the screen body 10 in the exposure alignment stage, thereby avoiding the influence of strong light on the driving performance of the thin film transistor and ensuring the display effect of the display panel 100. In addition, after exposure alignment is completed, the light shielding layer 40 is removed, so that the light holes 30 can transmit light, and normal use of the fingerprint identification device is prevented from being affected.
In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, the meaning of "a plurality" is two or more, unless specifically stated otherwise.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims of this application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of operation in sequences other than those illustrated or described herein, for example. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. A method for manufacturing a display panel, comprising:
providing a display substrate; the display substrate comprises a screen body and a composite layer;
a light hole is formed in the composite layer;
forming a light shielding layer at the light holes;
exposing and aligning one side of the composite layer far away from the screen body, and forming a functional layer on the composite layer;
and removing the shading layer.
2. The method of claim 1, wherein the light shielding layer is an iodine layer.
3. The method of manufacturing a display panel according to claim 2, wherein the step of removing the light shielding layer comprises: heating sublimates the iodine layer.
4. The method for manufacturing a display panel according to any one of claims 1 to 3, wherein the composite layer comprises an adhesive layer, a buffer layer, a heat insulating layer and a light reflecting layer which are laminated in this order, and the adhesive layer is located at one side of the buffer layer close to the screen body;
in the step of forming the light holes in the composite layer, the method comprises the following steps: and the buffer layer, the heat insulation layer and the light reflection layer are provided with the light holes.
5. The method of claim 4, wherein the step of forming a light shielding layer at the light holes comprises: in the light holes, a shading layer is formed on the surface of the bonding layer, which is far away from one side of the screen body.
6. A method of manufacturing a display panel according to claim 2 or 3, wherein the thickness of the iodine layer is in the range of 50-150 μm.
7. The method of manufacturing a display panel according to claim 3, wherein in the step of heating and sublimating the iodine layer, a heating temperature is greater than 45 ℃ and less than 80 ℃.
8. The method for manufacturing a display panel according to claim 3, wherein the functional layer comprises a flexible circuit board, an insulating adhesive layer, and a protective layer which are laminated in this order;
the step of exposing and aligning the side, far away from the screen body, of the composite layer and forming a functional layer on the composite layer comprises the following steps:
performing first exposure alignment on one side of the composite layer far away from the screen body;
attaching the flexible circuit board to one side of the composite layer far away from the screen body;
performing second exposure alignment on one side, far away from the screen body, of the flexible circuit board;
attaching the insulating adhesive layer to the flexible circuit board;
and performing third exposure alignment on one side of the insulating adhesive layer far away from the screen body to finish the alignment of the protective layer.
9. The method of claim 8, wherein the performing a third exposure alignment on the insulating adhesive layer on a side away from the screen body, after completing the alignment of the protective layer, and after heating to sublimate the iodine layer, comprises: and attaching the protective layer to the insulating adhesive layer.
10. A display panel manufactured according to the manufacturing method of the display panel according to any one of claims 1 to 9.
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| CN110400824A (en) * | 2018-04-24 | 2019-11-01 | 三星显示有限公司 | Show equipment |
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| CN111402739A (en) * | 2020-03-31 | 2020-07-10 | 云谷（固安）科技有限公司 | Display module and preparation method thereof |
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| KR20190026476A (en) * | 2017-09-05 | 2019-03-13 | 엘지디스플레이 주식회사 | Display device including fingerpring identification sensor |
| CN110400824A (en) * | 2018-04-24 | 2019-11-01 | 三星显示有限公司 | Show equipment |
| CN108983487A (en) * | 2018-08-31 | 2018-12-11 | 厦门天马微电子有限公司 | A kind of liquid crystal display panel and display device |
| CN110828696A (en) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | Bottom emission display panel, manufacturing method and optical compensation method |
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