CN110828027A - Printing conductive silver paste - Google Patents
Printing conductive silver paste Download PDFInfo
- Publication number
- CN110828027A CN110828027A CN201911209829.1A CN201911209829A CN110828027A CN 110828027 A CN110828027 A CN 110828027A CN 201911209829 A CN201911209829 A CN 201911209829A CN 110828027 A CN110828027 A CN 110828027A
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- CN
- China
- Prior art keywords
- parts
- resin
- silver powder
- silver paste
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Abstract
The invention relates to the technical field of printing, in particular to a printing conductive silver paste, which comprises the following components in parts by mass: 20-35 parts of spherical silver powder, 15-25 parts of epoxy modified polyester resin, 20-25 parts of flake silver powder, 8-12 parts of thermoplastic polyimide resin, 10-13 parts of epoxy resin and 3-6 parts of high polymer resin. After the formula is adopted, the conductive coating is unique in design, reasonable in composition, convenient to prepare, excellent in conductivity and good in adhesion with a base material, improves the conductivity and mechanical properties of the coating, ensures the adhesion, processability, hardness and diffusivity of the coating, and has little pollution to the environment.
Description
Technical Field
The invention relates to the technical field of printing, in particular to a printing conductive silver paste.
Background
The conductive paste is widely applied to electronic information products due to good physical properties of the conductive paste, and higher requirements are put forward on the performance of the conductive paste along with the development of lighter, thinner, more powerful functionality and more environment-friendly electronic products. The low-temperature halogen-free conductive silver paste is widely applied to aspects such as film switches, capacitance electrodes, touch screens and the like due to excellent electrical conductivity, thermal conductivity and practicability. The low-temperature conductive silver paste is uniform paste prepared by stirring and dispersing conductive silver powder serving as a conductive filler, high polymer resin, a solvent, a curing agent, an auxiliary agent and the like. After the conductive silver paste is coated on a base material, the base material is dried in a low-temperature environment (generally lower than 160 ℃), and after the solvent is released, the resin and the curing agent gradually react and cure to finally form a compact conductive film layer.
In the electronic industry, in order to meet the requirements of high strength and high mechanical properties of products, the conductive film layer of the low-temperature conductive silver paste after curing generally has mechanical requirements (film layer hardness, film layer and substrate adhesion, and the like). The conductive silver powder is metal powder and has relatively high hardness, but the hardness of high polymers such as resin is generally poor. When the high hardness requirement is met by increasing the filling amount of the silver powder, the silver powder cannot be fully and effectively coated by a relatively small amount of resin, so that the silver powder on the surface layer is not firmly adsorbed and falls off.
The chinese invention patent CN 109036636 a discloses a conductive silver paste for high temperature printed circuit, which comprises the following components in parts by mass: 55-70 parts of conductive silver powder, 3-6 parts of high polymer resin, 14-19 parts of thermoplastic polyimide resin, 0.1-2 parts of dispersant and 0.5-5 parts of organic carrier.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a printing conductive silver paste.
In order to solve the technical problem, the printed conductive silver paste comprises the following components in parts by mass: 20-35 parts of spherical silver powder, 15-25 parts of epoxy modified polyester resin, 20-25 parts of flake silver powder, 8-12 parts of thermoplastic polyimide resin, 10-13 parts of epoxy resin and 3-6 parts of high polymer resin.
Preferably, the coating comprises the following components in parts by mass: 20 parts of spherical silver powder, 15 parts of epoxy modified polyester resin, 20 parts of flake silver powder, 8 parts of thermoplastic polyimide resin, 10 parts of epoxy resin and 3 parts of high polymer resin.
Preferably, the coating comprises the following components in parts by mass: 35 parts of spherical silver powder, 25 parts of epoxy modified polyester resin, 25 parts of flake silver powder, 12 parts of thermoplastic polyimide resin, 13 parts of epoxy resin and 6 parts of high polymer resin.
Preferably, the coating comprises the following components in parts by mass: 25 parts of spherical silver powder, 20 parts of epoxy modified polyester resin, 22 parts of flake silver powder, 11 parts of thermoplastic polyimide resin, 12 parts of epoxy resin and 5 parts of high polymer resin.
After the formula is adopted, the conductive coating is unique in design, reasonable in composition, convenient to prepare, excellent in conductivity and good in adhesion with a base material, improves the conductivity and mechanical properties of the coating, ensures the adhesion, processability, hardness and diffusivity of the coating, and has little pollution to the environment.
Detailed Description
The first implementation mode comprises the following steps:
printing conductive silver paste, which comprises the following components in parts by mass: 20 parts of spherical silver powder, 15 parts of epoxy modified polyester resin, 20 parts of flake silver powder, 8 parts of thermoplastic polyimide resin, 10 parts of epoxy resin and 3 parts of high polymer resin.
The second embodiment:
printing conductive silver paste, which comprises the following components in parts by mass: 35 parts of spherical silver powder, 25 parts of epoxy modified polyester resin, 25 parts of flake silver powder, 12 parts of thermoplastic polyimide resin, 13 parts of epoxy resin and 6 parts of high polymer resin.
The third embodiment is as follows:
printing conductive silver paste, which comprises the following components in parts by mass: 25 parts of spherical silver powder, 20 parts of epoxy modified polyester resin, 22 parts of flake silver powder, 11 parts of thermoplastic polyimide resin, 12 parts of epoxy resin and 5 parts of high polymer resin.
It should be noted that the above summary and the detailed description are intended to demonstrate the practical application of the technical solutions provided by the present invention, and should not be construed as limiting the scope of the present invention. Various modifications, equivalent substitutions, or improvements may be made by those skilled in the art within the spirit and principles of the invention. The scope of the invention is to be determined by the appended claims.
Claims (4)
1. The printed conductive silver paste is characterized by comprising the following components in parts by mass: 20-35 parts of spherical silver powder, 15-25 parts of epoxy modified polyester resin, 20-25 parts of flake silver powder, 8-12 parts of thermoplastic polyimide resin, 10-13 parts of epoxy resin and 3-6 parts of high polymer resin.
2. The printed conductive silver paste of claim 1, comprising in parts by mass: 20 parts of spherical silver powder, 15 parts of epoxy modified polyester resin, 20 parts of flake silver powder, 8 parts of thermoplastic polyimide resin, 10 parts of epoxy resin and 3 parts of high polymer resin.
3. The printed conductive silver paste of claim 1, comprising in parts by mass: 35 parts of spherical silver powder, 25 parts of epoxy modified polyester resin, 25 parts of flake silver powder, 12 parts of thermoplastic polyimide resin, 13 parts of epoxy resin and 6 parts of high polymer resin.
4. The printed conductive silver paste of claim 1, comprising in parts by mass: 25 parts of spherical silver powder, 20 parts of epoxy modified polyester resin, 22 parts of flake silver powder, 11 parts of thermoplastic polyimide resin, 12 parts of epoxy resin and 5 parts of high polymer resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911209829.1A CN110828027A (en) | 2019-12-02 | 2019-12-02 | Printing conductive silver paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911209829.1A CN110828027A (en) | 2019-12-02 | 2019-12-02 | Printing conductive silver paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110828027A true CN110828027A (en) | 2020-02-21 |
Family
ID=69541926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911209829.1A Withdrawn CN110828027A (en) | 2019-12-02 | 2019-12-02 | Printing conductive silver paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110828027A (en) |
-
2019
- 2019-12-02 CN CN201911209829.1A patent/CN110828027A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200221 |