CN109036636A - The conductive silver paste of high temperature printed circuit - Google Patents
The conductive silver paste of high temperature printed circuit Download PDFInfo
- Publication number
- CN109036636A CN109036636A CN201811057631.1A CN201811057631A CN109036636A CN 109036636 A CN109036636 A CN 109036636A CN 201811057631 A CN201811057631 A CN 201811057631A CN 109036636 A CN109036636 A CN 109036636A
- Authority
- CN
- China
- Prior art keywords
- parts
- conductive silver
- printed circuit
- high temperature
- silver paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to the technical field of silver paste more particularly to a kind of conductive silver pastes of high temperature printed circuit.The conductive silver paste of this high temperature printed circuit includes the component of following mass parts: 55 ~ 70 parts of conductive silver powder, 3 ~ 6 parts of macromolecule resin, 14-19 parts of thermoplasticity polyimide resin, 0.1~2 part of dispersing agent, and 0.5~5 part of organic carrier.It is unique that the present invention designs, and rationally, preparation is convenient for composition, with excellent electric conductivity, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the workability, hardness, diffusivity of coating, while environmental pollution is small.
Description
Technical field
The present invention relates to a kind of silver paste more particularly to a kind of conductive silver pastes of high temperature printed circuit.
Background technique
Electrocondution slurry is as a kind of functional print material because its good physical property obtains extensively in electronics and IT products
Application, as electronic product develops to lighter, thinner, functional more powerful and more environmentally friendly direction, to its performance it is also proposed that
Higher requirement.Wherein low temperature Halogen conductive silver paste is widely used in film because of its excellent electric conductivity, thermal conductivity and practicability
Switch, capacitance electrode, touch screen etc..Low-temperature conductive silver paste be using conductive silver powder as conductive filler, with polymeric resin,
Solvent, curing agent, auxiliary agent etc. are agitated, disperse and manufactured uniform sizing material.After conductive silver paste is coated on substrate, in low temperature ring
(generally below 160 DEG C) are dried under border, after solvent release, resin and curing agent step-reaction, solidification ultimately form densification
Conductive film layer.
In electronics industry, in order to meet high intensity, the high-mechanical property demand of product, after low-temperature conductive silver paste solidification
Conductive film layer generally has mechanical requirement (film hardness, film layer and substrate adhesive force etc.).Conductive silver powder is metal-powder, firmly
Spend relatively high, but the hardness of the high polymers such as resin is then general poor.And when by improve in a manner of silver powder loading meet it is high hard
When degree demand, the resin of relatively small amount cannot abundant, effective coated silver, cause silver powder absorption in surface layer loosely to occur falling off existing
As.
Summary of the invention
Present invention seek to address that drawbacks described above, provides a kind of conductive silver paste of high temperature printed circuit.
In order to overcome defect present in background technique, the technical solution adopted by the present invention to solve the technical problems is:
The conductive silver paste of this high temperature printed circuit includes the component of following mass parts: 55 ~ 70 parts of conductive silver powder, macromolecule resin 3 ~ 6
Part, 14-19 parts of thermoplasticity polyimide resin, 0.1~2 part of dispersing agent, 0.5~5 part of organic carrier.
According to another embodiment of the invention, further comprise 70 parts of conductive silver powder, 6 parts of macromolecule resin, heat it is plastic
Property 19 parts of polyimide resin, 2 parts of dispersing agent, 5 parts of organic carrier.
According to another embodiment of the invention, further comprise 55 parts of conductive silver powder, 3 parts of macromolecule resin, heat it is plastic
Property 14 parts of polyimide resin, 0.1 part of dispersing agent, 0.5 part of organic carrier.
According to another embodiment of the invention, further comprise 60 parts of conductive silver powder, 5 parts of macromolecule resin, heat it is plastic
Property 15 parts of polyimide resin, 1 part of dispersing agent, 3 parts of organic carrier.
The beneficial effects of the present invention are: the present invention designs uniqueness, rationally, preparation is convenient for composition, with excellent electric conductivity
Can, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the Yi Jia of coating
Work, hardness, diffusivity, while environmental pollution is small.
Specific embodiment
The conductive silver paste of this high temperature printed circuit includes the component of following mass parts: 55 ~ 70 parts of conductive silver powder, macromolecule
3 ~ 6 parts of resin, 14-19 parts of thermoplasticity polyimide resin, 0.1~2 part of dispersing agent, 0.5~5 part of organic carrier.
Embodiment
70 parts of conductive silver powder, 6 parts of macromolecule resin, 19 parts of thermoplasticity polyimide resin, 2 parts of dispersing agent, have airborne
5 parts of body.
Embodiment
55 parts of conductive silver powder, 3 parts of macromolecule resin, 14 parts of thermoplasticity polyimide resin, 0.1 part of dispersing agent, it is organic
0.5 part of carrier.
Embodiment
60 parts of conductive silver powder, 5 parts of macromolecule resin, 15 parts of thermoplasticity polyimide resin, 1 part of dispersing agent, have airborne
3 parts of body.
The beneficial effects of the present invention are: the present invention designs uniqueness, rationally, preparation is convenient for composition, with excellent electric conductivity
Can, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the Yi Jia of coating
Work, hardness, diffusivity, while environmental pollution is small.
Claims (4)
1. a kind of conductive silver paste of high temperature printed circuit, it is characterised in that: the component including following mass parts: conductive silver powder 55 ~
70 parts, 3 ~ 6 parts of macromolecule resin, 14-19 parts of thermoplasticity polyimide resin, 0.1~2 part of dispersing agent, organic carrier 0.5~
5 parts.
2. the conductive silver paste of high temperature printed circuit as described in claim 1, it is characterised in that: 70 parts of conductive silver powder, macromolecule
6 parts of resin, 19 parts of thermoplasticity polyimide resin, 2 parts of dispersing agent, 5 parts of organic carrier.
3. the conductive silver paste of high temperature printed circuit as described in claim 1, it is characterised in that: 55 parts of conductive silver powder, macromolecule
3 parts of resin, 14 parts of thermoplasticity polyimide resin, 0.1 part of dispersing agent, 0.5 part of organic carrier.
4. the conductive silver paste of high temperature printed circuit as described in claim 1, it is characterised in that: 60 parts of conductive silver powder, macromolecule
5 parts of resin, 15 parts of thermoplasticity polyimide resin, 1 part of dispersing agent, 3 parts of organic carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811057631.1A CN109036636A (en) | 2018-09-11 | 2018-09-11 | The conductive silver paste of high temperature printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811057631.1A CN109036636A (en) | 2018-09-11 | 2018-09-11 | The conductive silver paste of high temperature printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109036636A true CN109036636A (en) | 2018-12-18 |
Family
ID=64621111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811057631.1A Withdrawn CN109036636A (en) | 2018-09-11 | 2018-09-11 | The conductive silver paste of high temperature printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109036636A (en) |
-
2018
- 2018-09-11 CN CN201811057631.1A patent/CN109036636A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181218 |
|
| WW01 | Invention patent application withdrawn after publication |