CN110827692B - Mother board for manufacturing display panel - Google Patents
Mother board for manufacturing display panel Download PDFInfo
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- CN110827692B CN110827692B CN201911189549.9A CN201911189549A CN110827692B CN 110827692 B CN110827692 B CN 110827692B CN 201911189549 A CN201911189549 A CN 201911189549A CN 110827692 B CN110827692 B CN 110827692B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
- H05F3/025—Floors or floor coverings specially adapted for discharging static charges
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Abstract
The invention provides a mother board for manufacturing display panels, which belongs to the technical field of display, wherein a plurality of display panels are arrayed on the mother board; each display panel comprises a display area and a non-display area, wherein the non-display area comprises a binding area and at least one signal input pad arranged in the binding area; the display panels are uniformly distributed on the mother board and divided into at least two rows, at least one static electricity discharge wire is arranged between the display panel positioned in the non-first row and the display panel in the upper row adjacent to the display panel, and a grounded static electricity lead-out structure is arranged in a binding region of the display panel in the non-first row, which is close to the display panel in the upper row; one end of each static electricity discharge wire is electrically connected with the signal input liner, and the other end of each static electricity discharge wire is electrically connected with the static electricity export structure. The mother board for manufacturing the display panel can lead static electricity generated in the manufacturing process of the display panel out in time, avoid the phenomenon that the display panel is damaged due to electrostatic damage, and improve the yield of products.
Description
Technical Field
The invention relates to the technical field of display, in particular to a motherboard for manufacturing a display panel.
Background
The conventional display panel is manufactured by cutting a mother board of the display panel, and in order to effectively utilize the mother board, a plurality of display panels are generally arranged on the mother board in a close manner.
In the preparation process (processes such as cutting and testing) of the display panel, a large amount of static electricity is generated on the display panel, especially in the binding region of the display panel, the binding region is provided with a plurality of signal input pads and intensive signal wiring, so the binding region is also a region with serious static electricity accumulation, and static electricity damage can be caused to the display panel if the static electricity accumulated in the binding region cannot be led out. In the prior art, an electrostatic discharge device is generally arranged between each signal input pad and is short-circuited, so that the potentials between the signal input pads are equal, and the static electricity on the signal input pads can be led out.
However, at present, the display panel is increasingly pursuing a narrow frame, so that the space of the binding region of the display panel for arranging the electrostatic discharge devices is narrow, and moreover, the gaps between the display panels densely arranged on the motherboard are also small, so that the electrostatic discharge devices cannot be arranged, and the static electricity in the binding region cannot be released, thereby causing electrostatic damage to the display panel and affecting the yield of the product.
Disclosure of Invention
The embodiment of the invention provides a mother board for manufacturing a display panel, which can lead static electricity generated in the manufacturing process of the display panel to be led out of the display panel in time, avoid the phenomenon that the display panel is damaged due to static electricity damage caused by static electricity accumulation in the display panel and improve the yield of products.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
the embodiment of the invention provides a motherboard for manufacturing a display panel, wherein a plurality of display panels are arrayed on the motherboard; each display panel comprises a display area and a non-display area, wherein the non-display area comprises a binding area and at least one signal input pad arranged in the binding area; the display panels are uniformly distributed and divided into at least two rows on the motherboard, wherein at least one static electricity discharge wire is arranged between the display panel positioned in the non-first row and the display panel in the upper row adjacent to the display panel, and a grounded static electricity lead-out structure is arranged in a binding region of the display panel positioned in the non-first row, which is close to the display panel in the upper row; one end of each static electricity discharge wire is electrically connected with the signal input pad, and the other end of each static electricity discharge wire is electrically connected with the static electricity export structure.
Further, the static electricity leading-out structure is a grounding conductor arranged in the non-display area.
Furthermore, the grounding conductor comprises a first section, a second section and a third section which are positioned on two sides of the first section; the first section is transversely arranged at one end of the non-display area far away from the binding area and is used for being electrically connected with one end of the electrostatic discharge wire.
Furthermore, the grounding lead is an ELVSS signal line.
Further, the static electricity derivation structure further comprises a grounding conductive layer; a notch is formed in one end, far away from the binding area, of the display panel, and the grounding conductive layer is located in the notch; one end of each electrostatic discharge wire is electrically connected with the signal input pad, and the other end of each electrostatic discharge wire is electrically connected with the grounding conductive layer.
Further, the static electricity derivation structure further comprises a grounding conductive layer; a notch is formed in one end, far away from the binding area, of the display panel, and the grounding conductive layer is located in the notch; one end of the electrostatic discharge wire is electrically connected with the signal input pad, the other end of the electrostatic discharge wire is electrically connected with the grounding conductive layer, and part of the electrostatic discharge wire is electrically connected with the grounding wire.
Furthermore, a common conductive wire is arranged between the two adjacent rows of the display panels, and the common conductive wire is electrically connected with each of the electrostatic discharge wires.
Further, the electrostatic discharge trace is a metal wire or a conductive non-metal wire.
Furthermore, a first cutting line is arranged on the motherboard and transversely arranged between two adjacent rows of display panels; the extending direction of the first cutting line is vertical to the direction of the electrostatic discharge routing line.
Furthermore, a detection terminal and a grounding terminal are arranged on the motherboard; the detection terminals are electrically connected with the display panels and used for detecting the display panels; the grounding terminal is positioned at one side of the display panel at the last row and is arranged close to the binding area of the display panel at the last row; and the grounding terminal is electrically connected with the signal input pad of the last row of display panel through the electrostatic discharge wire.
Compared with the prior art, the mother board for manufacturing the display panel provided by the embodiment of the invention has the following advantages;
the mother board for manufacturing the display panel comprises a plurality of display panels uniformly distributed on the mother board, wherein the display panels are at least distributed in two rows on the mother board, and each display panel comprises a binding area and a plurality of signal input pads arranged in the binding area; the display panel of the non-first row is internally provided with a grounded static electricity leading-out structure, a static electricity releasing wire is arranged between the display panel of the non-first row and the display panel of the previous row adjacent to the display panel of the non-first row, one end of the static electricity releasing wire is electrically connected with the signal input liner, the other end of the static electricity releasing wire is electrically connected with the static electricity leading-out structure, and accumulated static electricity in the display panel of the previous row can be transmitted to the static electricity leading-out structure of the display panel of the next row through the static electricity releasing wire and is led out of the display panel.
Compared with the prior art, the mother board for manufacturing the display panel provided by the embodiment can be suitable for manufacturing the display panel with a narrow frame, and a plurality of display panels can be densely arranged on the mother board; meanwhile, the static electricity in the display panel can be led out in time, and the damage to the display panel caused by the static electricity damage is avoided. The mother board for manufacturing the display panel provided by the embodiment can improve the manufacturing efficiency and the yield.
In addition to the technical problems solved by the present invention, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems solved by the mother board for manufacturing a display panel according to the present invention, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description of the present invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly described below, it is obvious that the drawings in the following description are only a part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic distribution diagram of a display panel on a motherboard according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a ground lead according to an embodiment of the present invention;
fig. 3 is a schematic connection diagram of an esd trace and a ground wire according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a grounding conductive layer according to an embodiment of the present invention;
fig. 5 is a schematic connection diagram of an esd trace and a ground conductive layer according to an embodiment of the invention;
fig. 6 is a schematic layout diagram of a ground terminal and a common conductive line according to an embodiment of the present invention.
Description of reference numerals:
10-a display panel;
11-a binding region;
12-signal input pads;
13-a ground conductor;
14-a ground conductive layer;
20-electrostatic discharge routing;
30-a common electrically conductive line;
40-a ground terminal;
100-a motherboard;
131-a first section;
132-a second segment;
133-third stage.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
As shown in fig. 1, in a mother board 100 for manufacturing a display panel according to an embodiment of the present invention, a plurality of display panels 10 are arranged in an array on the mother board 100; each display panel 10 includes a display area and a non-display area, the non-display area including a bonding area 11 and at least one signal input pad 12 disposed in the bonding area 11; the display panels 10 are uniformly distributed on the motherboard 100 into at least two rows, wherein at least one static electricity discharge wire 20 is arranged between the display panel 10 in the non-first row and the display panel 10 in the upper row adjacent to the display panel 10, and the bonding area 11 of the display panel 10 in the non-first row, which is close to the display panel 10 in the upper row, is provided with a grounded static electricity lead-out structure; one end of each esd trace 20 is electrically connected to the signal input pad 12, and the other end is electrically connected to the esd structure.
Specifically, referring to fig. 1, the motherboard 100 includes a plurality of display panels 10, the display panels 10 are arranged on the motherboard 100 in an array, the display panels 10 may be divided into at least two rows and distributed on the motherboard 100, a gap may be reserved between the display panels 10 in two adjacent rows, in order to arrange the display panels 10 on the motherboard 100 as much as possible, the gap between the two adjacent rows is small, and even no gap is left; in the present embodiment, in order to facilitate cutting the motherboard 100 to obtain the display panels 10, a certain gap exists between the display panels 10 at the top, the bottom, the left, and the right. As shown in fig. 1, the column direction of the display panels 10 in multiple rows is a first direction, which may be the length direction of the motherboard 100, and may be the up-down direction for the display panels 10 between adjacent rows; the row direction of the plurality of rows of display panels 10 is the second direction, the second direction may be defined as the width direction of the motherboard 100, and the adjacent two display panels 10 between the same row may be the left-right direction, and the above definitions of the first direction and the second direction are for convenience of description of the present application and are not limited to the present application.
For example, in the present embodiment, three rows of display panels 10 are disposed on the motherboard 100, which are respectively a first row of display panels, a second row of display panels, and a third row of display panels, wherein the display panels 10 in each row correspond to each other. Each display panel 10 includes a display region and a non-display region, the non-display region is located at the periphery of the display region, and the non-display region is generally used for arranging signal input terminals, signal traces, power lines, and the like, and is used for driving the display units located in the display region to emit light. A binding region 11 is arranged on the lower frame of the non-display region close to the IC driving end, and a plurality of signal input pads 12 and dense signal routing connected with the signal input pads 12 are arranged in the binding region 11; the signal input pad 12 is a signal input terminal disposed in the bonding area, and can be used as a signal input channel of the display panel to be tested. For example, the signal input pad may be a gold finger structure, a signal pin, etc. disposed in the bonding area; one end of the signal input pad 12 can be connected with each signal wire in the display panel; when the display panel needs to be detected, the other end of the signal input pad 12 is in signal connection with a detection device located outside the display panel. Since a plurality of signal input pads are provided in the bonding area of the display panel, the static electricity discharge device cannot be disposed in the remaining space of the bonding area 11 of the display panel 10, and the static electricity accumulated in the bonding area 11 cannot be discharged in time.
For this reason, the non-leading display panel 10 in the present embodiment has a grounded static electricity leading structure, which may be a grounded large-area metal layer or a metal line, or the like. An electrostatic discharge trace 20 is disposed between the display panel 10 adjacent to the non-leading row display panel 10 and the non-leading row display panel 10, and the electrostatic discharge trace 20 is used as an electrostatic discharge path and can be used for guiding out the static electricity accumulated in the bonding region 11 in the display panel 10. One end of the esd trace 20 is electrically connected to the signal input pad 12, and each signal input pad 12 is connected to one esd trace 20, and the other end of the esd trace 20 is electrically connected to the esd lead-out structure disposed in the next row of the display panel 10, and the esd lead-out structure has a large layout area and is grounded, so that the esd in the previous row of the display panel 10 can be timely led out.
As shown in fig. 1, a second row of display panels is selected as a non-first row of display panels 10, the first row of display panels is a previous row of display panels 10 adjacent to the non-first row of display panels 10, it can be known that the non-display area of the second row of display panels close to the bonding area 11 of the first row of display panels is provided with an electrostatic discharge structure, and a plurality of electrostatic discharge traces 20 are provided between the first row of display panels and the second row of display panels, and the number of the electrostatic discharge traces is consistent with the number of the signal input pads 12 of the first row of display panels; one end of the static electricity discharging wire 20 is connected to the signal input pad 12 of the first row of display panel, and the other end is connected to the static electricity leading-out structure of the second row of display panel, so that the static electricity in the first row of display panel can be transmitted to the static electricity leading-out structure in the second row of display panel through the static electricity discharging wire 20, and the static electricity leading-out structure is grounded and can lead the static electricity out of the display panel 10.
It can be understood that, if the third row of display panels is selected as the non-first row of display panels 10, the display panel 10 adjacent to the third row of display panels may be the second row of display panels, and the bonding area 11 in the third row of display panels near the second row of display panels is provided with the static electricity discharge structure, one end of the static electricity discharge trace 20 may be connected to the static electricity discharge structure of the third row of display panels, and the other end thereof may be connected to the signal input pad 12 of the second row of display panels, so as to discharge the static electricity in the bonding area 11 of the second row of display panels. By analogy, the static electricity of the display panel 10 in the previous row can be transmitted to the static electricity leading-out structure of the display panel 10 in the next row and led out; the display panel 10 in the last row has a large space, and an electrostatic discharge device or an electrostatic discharge trace 20 may be disposed to conduct static electricity.
In the mother board 100 for manufacturing a display panel according to this embodiment, the static electricity discharge trace 20 is disposed between the display panels 10 in the adjacent rows, and the grounded static electricity discharge structure is disposed in the display panel 10 in the non-first row, one end of the static electricity discharge trace 20 is electrically connected to the static electricity discharge structure, and the other end of the static electricity discharge trace is electrically connected to the signal input pad 12 in the bonding region 11 of the previous row of display panels 10, so that the static electricity discharge of the previous row of display panels 10 can be discharged from the display panel 10.
Compared with the prior art, the motherboard 100 for manufacturing the display panel provided by the embodiment can be suitable for manufacturing the display panel 10 with a narrow frame, and a plurality of display panels 10 can be densely arranged on the motherboard 100; meanwhile, the static electricity in the display panel 10 can be led out in time, and the damage to the display panel 10 caused by the static electricity damage is avoided. The mother board for manufacturing the display panel provided by the embodiment can improve the manufacturing efficiency and the yield.
Different structures of static electricity discharge structures may be disposed in the display panel 10 according to the structure or shape of the display panel 10, and the different structures of static electricity discharge structures will be described with reference to fig. 2 and 3.
As shown in fig. 2 and 3, the static electricity discharge structure in an embodiment of the present invention is a ground wire 13 disposed in the non-display area. Specifically, the non-display area of the non-first row display panel 10 is provided with a large area of metal layer to form the ground line 13, that is, the ground line 13 has a certain width, which can improve the static electricity guiding capability of the ground line 13. The ground wires 13 are disposed in the bonding area 11 near the upper row of the display panel 10 for electrically connecting with the esd traces 20. For example, the second row of display panels corresponds to the first row of display panels one to one, and the ground wires 13 in the second row of display panels are close to the bonding areas 11 of the first row of display panels. The static electricity discharging traces 20 from the bonding areas 11 of the second row of display panels are all connected to the ground wires 13, so that the accumulated static electricity in the bonding areas 11 of the first row of display panels can be led out to the ground wires 13 of the second row of display panels and led out of the display panel 10.
Further, the ground wire 13 provided in this embodiment includes a first segment 131, and a second segment 132 and a third segment 133 located at two sides of the first segment 131; the binding region 11 is disposed near one end of the display panel 10 where the driving IC is located, the first segment 131 is disposed opposite to the binding region 11, and the first segment 131 is transversely disposed along one end of the display panel 10, and the length direction thereof is parallel to the second direction; the first segment 131 is used for electrically connecting with the esd traces 20 led out from the first row of display panels. In addition, the second segment 132 and the third segment 133 are respectively located at two ends of the first segment 131 and respectively connected to two ends of the first segment 131, and the second segment 132 and the third segment 133 extend in the non-display area of the display panel 10 along the first direction; it can be seen that one end of the second segment 132 and the third segment 133 is connected to the first segment 131, and the other end of the second segment 132 and the third segment 133 can extend toward the binding region 11, so as to increase the conducting area of the ground wire 13 in the display panel 10, so as to improve the electrostatic conducting capability thereof, and accelerate the electrostatic discharge from the display panel 10.
It is understood that the ground wire 13 may be an ELVSS signal wire disposed in the display panel 10, or the ground wire 13 is disposed in a metal layer of the display panel 10, and the ELVSS signal wire is preferably used as the ground wire 13 in this embodiment, and the ELVSS signal wire is a signal wire that is necessary for the display panel 10, so that the ELVSS signal wire is reasonably used as the ground wire 13, and the manufacturing process of the ground wire 13 is not required to be increased, thereby saving the cost.
As shown in fig. 4 and fig. 5, the static electricity discharge structure according to another embodiment of the present invention further includes a ground conductive layer 14, a gap is disposed at one end of the display panel 10 away from the binding region 11, and the ground conductive layer 14 is located in the gap; one end of each esd trace 20 is electrically connected to the signal input pad 12, and the other end is electrically connected to the grounding conductive layer 14.
Specifically, a gap is formed in one end of the non-display area of the non-first row display panel 10, which is opposite to the binding area 11, that is, a gap with a size similar to that of the gap exists between the second row display panel and the first row display panel, and a large-area metal layer is arranged in the gap to serve as an electric connection conductive layer, so that static electricity in the binding area 11 of the first row display panel 10 is led to the ground wire 13 layer and led out of the display panel 10. The bonding area 11 of the display panel in the first row is provided with a plurality of signal input pads 12, and each signal input pad 12 is correspondingly connected with one electrostatic discharge trace 20. One end of the esd trace 20 is electrically connected to the signal input pad 12, and the other end of the esd trace 20 is electrically connected to the grounding conductive layer 14 in the gap of the second row of the display panel, so that the static electricity in the first row of the display panel can be transmitted to the grounding conductive layer 14 through the esd trace 20, and the static electricity can be led out of the display panel 10.
On the basis of the above embodiment, in order to accelerate the conduction of the static electricity in the first row of display panels out of the display panel 10, the static electricity conduction area of the second row of display panels may be increased; the static electricity leading-out area can be increased by adopting the following scheme: one end of the esd trace 20 close to the first row of the display panel is electrically connected to each signal input pad 12, and the other end of the esd trace 20 is electrically connected to the grounding conductive layer 14 and the grounding conductive line 13 in the gap, respectively. That is, one end of the esd trace 20 close to the second row of the display panel is connected to the grounding conductive layer 14, and the rest of the esd trace can be electrically connected to the grounding conductive line 13.
As shown in fig. 6, on the basis of the first and second embodiments, in order to further improve the electrostatic discharge capability between the display panels 10, a common conductive line 30 is disposed between the display panels 10 in two adjacent rows, and the common conductive line 30 is electrically connected to each of the electrostatic discharge traces 20. Specifically, the common conductive line 30 is disposed in the gap between the first row of display panels and the second row of display panels along the second direction, and the common conductive line 30 can connect the electrostatic discharge traces 20 together, so that the static electricity in the signal input pads 12 in the first row of display panels can be uniformly distributed to the static electricity discharge structures in the second row of display panels, thereby accelerating the rapid discharge of the static electricity in the first row of display panels.
In addition, the motherboard 100 is provided with a first cutting line at a gap between two rows of the display panels 10, and the first cutting line is arranged in the second direction of the motherboard 100 and is perpendicular to the extending direction of the electrostatic discharge trace 20. When the motherboard 100 is cut, the electrostatic discharge traces 20 between the first row of display panels and the second row of display panels may be cut off, so that the signal input pads 12 are independent from each other, and it is ensured that the signal input pads 12 can work independently when the potentials are different. It can be understood that the motherboard 100 is further provided with a second cutting line, the second cutting line is arranged along a second direction, and the second cutting line is respectively located at two sides of each row of display panels, and the second cutting line is perpendicular to the first cutting line.
On the basis of the above embodiments, the electrostatic discharge trace 20 may select a metal line or a conductive non-metal line, where the conductive non-metal line may be made of low-temperature polysilicon material or conductive ceramic, and the metal line may be made of copper. In the present embodiment, the conductive non-metal wire is preferably used as the esd trace 20, which has good stability and is not prone to chemical corrosion when exposed to air, so as to improve the reliability of the display panel 10. The bonding area 11 of the display panel 10 in the last row on the motherboard 100 has a larger gap with the edge of the motherboard 100, the display panel 10 in the last row has a larger space for disposing the esd device, and the esd in the bonding area 11 of the display panel 10 in the last row can also be preferably led out by using the esd trace 20.
The motherboard 100 is provided with a ground terminal 40 and a detection terminal on a side close to the last row of display panels 10, and the ground terminal 40 is used for electrically connecting with the signal input pads 12 in the bonding area 11 of the last row of display panels 10, so as to lead out static electricity of the last row of display panels 10. The detection terminals are electrically connected with the display panels 10 and used for detecting the display panels 10; it may be preferable to dispose the ground terminal 40 and the sensing terminal near the binding region 11 of the display panel 10 positioned in the last row.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A mother board for manufacturing display panels is characterized in that a plurality of display panels are arrayed on the mother board;
each display panel comprises a display area and a non-display area, wherein the non-display area comprises a binding area and at least one signal input pad arranged in the binding area;
the display panels are uniformly distributed and divided into at least two rows on the motherboard, wherein at least one static electricity discharge wire is arranged between the display panel positioned in the non-first row and the display panel in the upper row adjacent to the display panel, and a grounded static electricity lead-out structure is arranged in a binding region of the display panel positioned in the non-first row, which is close to the display panel in the upper row;
one end of each static electricity discharge wire is electrically connected with the signal input pad, and the other end of each static electricity discharge wire is electrically connected with the static electricity export structure;
the static electricity leading-out structure is a grounding wire arranged in the non-display area;
the grounding conductor comprises a first section, a second section and a third section, wherein the second section and the third section are positioned on two sides of the first section;
the first section is transversely arranged at one end of the non-display area far away from the binding area and is used for being electrically connected with one end of the electrostatic discharge wire;
the grounding lead is an ELVSS signal line;
a common conductive wire is arranged between the display panels of two adjacent rows and is electrically connected with each electrostatic discharge wire.
2. The mother substrate for fabricating a display panel according to claim 1, wherein the static electricity discharge structure further comprises a ground conductive layer;
a notch is formed in one end, far away from the binding area, of the display panel, and the grounding conductive layer is located in the notch;
one end of each electrostatic discharge wire is electrically connected with the signal input pad, and the other end of each electrostatic discharge wire is electrically connected with the grounding conductive layer.
3. The mother substrate for fabricating a display panel according to claim 1,
the static electricity leading-out structure further comprises a grounding conductive layer; a notch is formed in one end, far away from the binding area, of the display panel, and the grounding conductive layer is located in the notch;
one end of the electrostatic discharge wire is electrically connected with the signal input pad, the other end of the electrostatic discharge wire is electrically connected with the grounding conductive layer, and part of the electrostatic discharge wire is electrically connected with the grounding wire.
4. The motherboard for manufacturing a display panel according to claim 1, wherein the ESD traces are metal wires or conductive non-metal wires.
5. The mother board for manufacturing display panels according to claim 1, wherein the mother board is provided with a first cutting line, and the first cutting line is transversely arranged between two adjacent rows of display panels;
the extending direction of the first cutting line is vertical to the direction of the electrostatic discharge routing line.
6. The mother board for manufacturing a display panel according to claim 1, wherein the mother board is provided with a detection terminal and a ground terminal;
the detection terminals are electrically connected with the display panels and used for detecting the display panels;
the grounding terminal is positioned at one side of the display panel at the last row and is arranged close to the binding area of the display panel at the last row; and the grounding terminal is electrically connected with the signal input pad of the last row of display panel through the electrostatic discharge wire.
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| CN201911189549.9A CN110827692B (en) | 2019-11-28 | 2019-11-28 | Mother board for manufacturing display panel |
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| CN201911189549.9A CN110827692B (en) | 2019-11-28 | 2019-11-28 | Mother board for manufacturing display panel |
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| CN110827692B true CN110827692B (en) | 2022-02-01 |
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|---|---|---|---|---|
| CN111208684B (en) * | 2020-03-06 | 2023-05-23 | 京东方科技集团股份有限公司 | Chip module and display device |
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