CN110825151A - High-Side acquisition mode circuit device based on low-voltage current acquisition chip - Google Patents
High-Side acquisition mode circuit device based on low-voltage current acquisition chip Download PDFInfo
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- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
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Abstract
The invention discloses a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, which comprises a power supply input end, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit and a load circuit, wherein the current acquisition circuit is connected with the power supply input end; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit. The invention can realize the effect of normally working in a high-side acquisition mode without adopting an acquisition chip with the same working voltage as a power supply by using the floating ground and the output control circuit, and saves the circuit cost.
Description
Technical Field
The invention relates to the technical field of circuits, in particular to a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip.
Background
The current collection principle in the prior art is almost the same, and the current collection principle adopts a mode of connecting a current sampling resistor in series in a circuit, and a current collection chip collects weak voltage drops at two ends of the resistor and amplifies the weak voltage drops, so that the quantity related to the current is obtained.
However, in the process of research and practice of the prior art, the inventor of the present invention finds that if the collecting resistor is placed at a low-side, the potential difference between the grounds in the system is often caused by the series connection of the resistor, which causes defects such as ground loop and poor signal quality; if a high-side acquisition mode is adopted, the voltage at two ends of the sampling resistor is close to the power supply voltage, and a current acquisition chip with the same working voltage as the power supply needs to be adopted, so that the current acquisition chip with a higher specification needs to be replaced, the cost is increased sharply, certain limitation exists, and the efficiency of current acquisition work is influenced. Therefore, a circuit device capable of normally operating in a high-side acquisition mode without using an acquisition chip having the same operating voltage as the power supply is needed.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, so that the High-Side acquisition mode circuit device can normally operate in the High-Side acquisition mode without using an acquisition chip with the same working voltage as a power supply.
In order to solve the above problems, an embodiment of the present invention provides a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, which includes a power supply input terminal, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit, and a load circuit; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit.
Further, the current acquisition circuit comprises a first resistor and a current acquisition chip;
the first end of the first resistor is connected with the power supply input end, the second end of the first resistor is connected with the operational amplification negative end pin of the current acquisition chip, the operational amplification positive end pin of the current acquisition chip is respectively connected with the first end of the first resistor and the power supply input end, the power supply input pin of the current acquisition chip is connected with the power supply input end, the grounding pin and the reference voltage pin of the current acquisition chip are respectively connected with the second input end of the floating power supply circuit, and the output pin of the current acquisition chip is connected with the second input end of the current limiting circuit.
Further, the floating power circuit comprises a first voltage stabilizing diode, a first capacitor and a second resistor;
the cathode of the first voltage-stabilizing diode is respectively connected with the power supply input end and the first end of the first capacitor, the anode of the first voltage-stabilizing diode is respectively connected with the second end of the first capacitor and the first end of the second resistor, and the second end of the second resistor is grounded.
Further, the anode of the first voltage stabilizing diode is also connected with the reference voltage pin and the grounding pin of the current collecting chip respectively.
Furthermore, the current limiting circuit comprises a third resistor, a fourth resistor, a first triode and an MOS tube grid control circuit unit;
the first end of the third resistor is connected with the output end of the floating power circuit, the second end of the third resistor is respectively connected with the first end of the fourth resistor and the base electrode of the first triode, the first end of the fourth resistor is also connected with the base electrode of the first triode, the second end of the fourth resistor is connected with the emitting electrode of the first triode, and the collector electrode of the first triode is connected with the input end of the MOS tube grid control circuit unit.
Furthermore, the second end of the fourth resistor is further connected to the power supply input terminal and the output pin of the current collection chip, and the emitter of the first triode is further connected to the power supply input terminal and the output pin of the current collection chip.
Further, the MOS transistor gate control circuit unit includes a fifth resistor, a sixth resistor, a second triode, a seventh resistor, an eighth resistor, and a third triode;
the first end of fifth resistance is connected the collecting electrode of first triode, the second end of fifth resistance is connected respectively the first end of sixth resistance with the base of second triode, the first end of sixth resistance still is connected with the base of second triode, the second end of sixth resistance with the projecting pole of second triode is connected and ground connection, the collecting electrode of second triode with the first end of seventh resistance is connected, the second end of seventh resistance is connected respectively the first end of eighth resistance with the base of third triode, the first end of eighth resistance still with the base of third triode is connected, the second end of eighth resistance is connected the projecting pole of third triode, the base of third triode is connected the input of on-off control circuit.
Further, the switch control circuit comprises a ninth resistor, a tenth resistor and a first field effect transistor, wherein the first field effect transistor is a P-channel field effect transistor;
the first end of the ninth resistor is connected with the source electrode of the first field effect transistor, the second end of the ninth resistor is respectively connected with the first end of the tenth resistor and the grid electrode of the first field effect transistor, the grid electrode of the first field effect transistor is also connected with the second end of the tenth resistor, the drain electrode of the first field effect transistor is connected with the input end of the load circuit, and the second end of the tenth resistor is grounded.
Further, the source electrode of the first field effect transistor is also connected with the second end of the first resistor, the second end of the eighth resistor and the emitter electrode of the third triode respectively.
Further, the load circuit comprises an eleventh resistor, a first end of the eleventh resistor is connected to the drain of the first field effect transistor, and a second end of the eleventh resistor is grounded.
The implementation of the invention has the following beneficial effects:
the invention provides a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, which comprises a power supply input end, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit and a load circuit, wherein the current acquisition circuit is connected with the power supply input end; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit. The invention can realize the effect of normally working in a high-side acquisition mode without adopting an acquisition chip with the same working voltage as a power supply by virtue of the floating ground and the output control circuit, can reduce the cost by using the low-voltage current acquisition operational amplifier, and improves the applicability of the current acquisition circuit.
The embodiment of the invention has the following beneficial effects:
the embodiment of the invention provides a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, which comprises a power supply input end, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit and a load circuit, wherein the power supply input end is connected with the current acquisition circuit; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit. The invention can realize the effect of normally working in a high-side acquisition mode without adopting an acquisition chip with the same working voltage as a power supply by virtue of the floating ground and the output control circuit, can reduce the cost by using the low-voltage current acquisition operational amplifier, and improves the applicability of the current acquisition circuit.
Drawings
Fig. 1 is a schematic structural diagram of a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip according to an embodiment of the present invention;
fig. 2 is a schematic circuit connection diagram of a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1-2.
As shown in fig. 1, an embodiment of the present invention provides a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip, which includes a power supply input terminal, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit, and a load circuit; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit.
Referring to fig. 2, a schematic circuit connection diagram of a High-Side acquisition mode circuit device based on a low-voltage current acquisition chip according to an embodiment of the present invention is provided.
In a preferred embodiment, the current collecting circuit comprises a first resistor R1 and a current collecting chip U1;
the first end of first resistance R1 with the power supply input end is connected, the second end of first resistance R1 with the operational amplification negative terminal pin of current acquisition chip U1, the operational amplification positive terminal pin of current acquisition chip U1 is connected respectively the first end of first resistance R1 with the power supply input end, the power supply input pin of current acquisition chip U1 is connected the power supply input end, the ground pin and the reference voltage pin of current acquisition chip U1 are connected respectively the second input end of floating power supply circuit, the output pin of current acquisition chip U1 is connected the second input end of current limiting circuit.
In a preferred embodiment, the floating power circuit comprises a first zener diode Z2, a first capacitor C1, and a second resistor R12;
the cathode of the first zener diode Z2 is connected to the power supply input terminal and the first end of the first capacitor C1, respectively, the anode of the first zener diode Z2 is connected to the second end of the first capacitor C1 and the first end of the second resistor R12, respectively, and the second end of the second resistor R12 is grounded.
In a preferred embodiment, the anodes of the first zener diode Z2 are further connected to the reference voltage pin and the ground pin of the current collecting chip U1, respectively.
Specifically, the system power supply is 48V, and the R5 load is supplied through the series connection of R1 and the series connection of Q1. Wherein the series R1 is used for current sensing and the series Q1 is used for switching control of the power supply. The operational amplification positive terminal and the operational amplification negative terminal of the current detection IC U1 are respectively connected with two ends of the resistor R1 and are used for collecting voltage signals at two ends of the resistor R1. The zener diode Z2 is connected in parallel with the capacitor C1 and then in series with the resistor R12, thereby stabilizing the voltage across Z2 near its clamp voltage. The 3 pins of the current detection operational amplifier U1, namely the power supply input pin, are connected with the system power supply voltage of 48V, and the 2 pins of the U1, namely the reference ground, are connected with the point P1, so that the working voltage of the current detection operational amplifier is close to the clamping voltage of the Zener diode Z2 and is lower than the system voltage of 48V.
In a preferred embodiment, the current limiting circuit comprises a third resistor R10, a fourth resistor R8, a first triode Q3 and a MOS transistor gate control circuit unit;
the first end of the third resistor R10 is connected to the output end of the floating power circuit, the second end of the third resistor R10 is connected to the first end of the fourth resistor R8 and the base of the first triode Q3, the first end of the fourth resistor R8 is also connected to the base of the first triode Q3, the second end of the fourth resistor R8 is connected to the emitter of the first triode Q3, and the collector of the first triode Q3 is connected to the input end of the MOS gate control circuit unit.
In a preferred embodiment, the second terminal of the fourth resistor R8 is further connected to the power supply input terminal and the output pin of the current collecting chip U1, respectively, and the emitter of the first transistor Q3 is further connected to the power supply input terminal and the output pin of the current collecting chip U1, respectively.
In a preferred embodiment, the MOS gate control circuit unit includes a fifth resistor R11, a sixth resistor R13, a second transistor Q4, a seventh resistor R6, an eighth resistor R2, and a third transistor Q2;
a first end of the fifth resistor R11 is connected to the collector of the first transistor Q3, a second end of the fifth resistor R11 is connected to a first end of the sixth resistor R13 and the base of the second transistor Q4, the first end of the sixth resistor R13 is also connected with the base of the second triode Q4, the second end of the sixth resistor R14 is connected with the emitter of the second triode Q4 and grounded, the collector of the second transistor Q4 is connected to the first terminal of the seventh resistor R6, the second terminal of the seventh resistor R6 is connected to the first terminal of the eighth resistor R2 and the base of the third transistor Q2, the first end of the eighth resistor R2 is further connected to the base of the third transistor Q2, the second end of the eighth resistor R2 is connected to the emitter of the third transistor Q2, and the base of the third transistor Q2 is connected to the input end of the switch control circuit.
In a preferred embodiment, the switch control circuit comprises a ninth resistor R3, a tenth resistor R7 and a first field effect transistor Q1, wherein the first field effect transistor Q1 is a P-channel field effect transistor;
a first end of the ninth resistor R3 is connected to the source of the first fet Q1, a second end of the ninth resistor R3 is connected to the first end of the tenth resistor R7 and the gate of the first fet Q1, respectively, the gate of the first fet Q1 is further connected to a second end of the tenth resistor R7, the drain of the first fet Q1 is connected to the input of the load circuit, and the second end of the tenth resistor R7 is grounded.
Specifically, a resistor R8 is connected in parallel with an emitter junction of a PNP triode Q3, then the emitter junctions of the R8 and the Q3 which are connected in parallel are connected in series with a resistor R10, when a voltage difference value between P2 and P1 reaches a set value, the triode Q3 is connected with the resistor R11 and the resistor R13 in series, one end of the R11 is connected with a collector of the Q3, and the emitter junction of the Q4 is connected in parallel with the R13, so that after the Q3 is connected, the Q4 can be connected. The resistor R2 is connected in series with the resistor R6, two ends of the resistor R2 are respectively connected with the system power supply 48V and the collector of the NPN triode Q4, and the resistor R2 is connected in parallel with the emitter of the triode Q2, so that after the Q4 triode is conducted, the Q2 PNP triode can enter a cut-off state. The resistor R3 is connected with the resistor R7 in series, meanwhile, the two ends of R3 are connected with the S and G of the PMOS, when the triode Q2 is conducted, the voltage of the two ends of R3 is within 0.3V, the PMOS is cut off, and therefore power supply to the load is cut off.
In a preferred embodiment, the source of the first fet Q1 is further connected to the second terminal of the first resistor R1, the second terminal of the eighth resistor R2, and the emitter of the third transistor Q2, respectively.
In a preferred embodiment, the load circuit includes an eleventh resistor R5, a first end of the eleventh resistor R5 is connected to the drain of the first fet Q1, and a second end of the eleventh resistor R5 is grounded.
It should be noted that, in the embodiment of the present invention, a current collection chip U1(INA199) lower than the power supply voltage is used, a zener diode Z2, a capacitor C1 and a resistor R12 are used to generate a power supply floating on the ground of the system, and the power supply is supplied to U1, so that the current collection chip can normally operate at a specification lower than 48V of the system power supply voltage, and operate in a high-side collection mode, and sample a resistor whose common mode voltage is close to the power supply. At the moment, the Zener diode of Z2 works in a breakdown state, the voltage across C1 is stabilized at 18V (depending on the model of the Zener diode), therefore, the reference ground of the current acquisition chip U1 is actually P1, therefore, the voltage across the sampling resistor is only about 18V, and the working condition of U1 is met, but the voltage reference of the output of U1 is also P1 which is about 30V higher than the system GND, and the output voltage can not be directly used for the system of which the back end is referenced to the system GND. In addition, by means of the triode Q3, the triode Q3 is not opened until the output voltage P2 reaches a certain value relative to P1, so that the control voltage of the floating system is correctly transmitted to the MOS tube grid control circuit consisting of the circuits Q4 and Q2, the on-off of the system switch MOS tube Q1 is controlled, and the current limiting effect is achieved.
The specific steps of the current limiting working process are as follows:
when the load is normal (power voltage 48V), a certain current flows through the R1, the current is amplified by the current detection operational amplifier U1, when the current flowing through the R1 is small, the current is amplified by the U1 and then outputs a certain voltage at the 6 pin, and when the voltage is divided by the resistor R8 and the resistor R10 and then is less than the Q3 BE junction on voltage, the Q3 is not opened, so the Q4 is kept off, no current flows through the R2 and the R6, the Q2 is also kept off, the PMOS transistor Q1 is turned on under the divided voltage of the R3 and the R7, and the system supplies power normally.
When the load is abnormal, R1 flows greatly, the output voltage is large after the current detection operational amplifier U1 amplifies, the voltage drop on R8 is large after the voltage division of R8 and R10, so that Q3 is conducted, Q4 and Q2 are also conducted successively after Q3 is conducted, the voltage of a Q2 CE junction is low after the conduction and is lower than the grid opening voltage of PMOS Q1, therefore, Q1 is closed, and the circuit is protected.
The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip comprises a power supply input end, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit and a load circuit. According to the invention, the floating power supply is formed by the Zener diode Z2, the capacitor C1 and the resistor R12 and supplies power to the current acquisition chip, so that the reference ground of the current acquisition chip is P1, the voltage of two ends of the resistor relative to the voltage of P1 does not exceed the specification of the chip, and the output voltage of the current acquisition chip can be conducted after reaching a certain condition through the PNP triode Q3, so that other circuits are correctly controlled to work, the effect of normally working in a high-side acquisition mode without adopting the acquisition chip with the same working voltage as the power supply is realized, the cost can be reduced by using the low-voltage current acquisition operational amplifier, and the applicability of the current acquisition circuit is improved.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the modules may be a logical division, and in actual implementation, there may be another division, for example, multiple modules or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The foregoing is directed to the preferred embodiment of the present invention, and it is understood that various changes and modifications may be made by one skilled in the art without departing from the spirit of the invention, and it is intended that such changes and modifications be considered as within the scope of the invention.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like.
Claims (10)
1. A High-Side acquisition mode circuit device based on a low-voltage current acquisition chip is characterized by comprising a power supply input end, a current acquisition circuit, a floating power circuit, a current limiting circuit, a switch control circuit and a load circuit; the power supply input end is respectively connected with the input end of the current acquisition circuit, the first input end of the current limiting circuit and the first input end of the switch control circuit; the output end of the current acquisition circuit is respectively connected with the input end of the floating power supply circuit and the second input end of the current limiting circuit, the output end of the floating power supply circuit is connected with the third input end of the current limiting circuit, the output end of the current limiting circuit is connected with the second input end of the switch control circuit, and the output end of the switch control circuit is connected with the input end of the load circuit.
2. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 1, wherein the current acquisition circuit comprises a first resistor and a current acquisition chip;
the first end of the first resistor is connected with the power supply input end, the second end of the first resistor is connected with the operational amplification negative end pin of the current acquisition chip, the operational amplification positive end pin of the current acquisition chip is respectively connected with the first end of the first resistor and the power supply input end, the power supply input pin of the current acquisition chip is connected with the power supply input end, the grounding pin and the reference voltage pin of the current acquisition chip are respectively connected with the second input end of the floating power supply circuit, and the output pin of the current acquisition chip is connected with the second input end of the current limiting circuit.
3. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 1, wherein the floating power circuit comprises a first voltage-stabilizing diode, a first capacitor and a second resistor;
the cathode of the first voltage-stabilizing diode is respectively connected with the power supply input end and the first end of the first capacitor, the anode of the first voltage-stabilizing diode is respectively connected with the second end of the first capacitor and the first end of the second resistor, and the second end of the second resistor is grounded.
4. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 3, wherein the anodes of the first voltage stabilizing diodes are further connected to the reference voltage pin and the ground pin of the current acquisition chip, respectively.
5. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 1, wherein the current limiting circuit comprises a third resistor, a fourth resistor, a first triode and a MOS tube gate control circuit unit;
the first end of the third resistor is connected with the output end of the floating power circuit, the second end of the third resistor is respectively connected with the first end of the fourth resistor and the base electrode of the first triode, the first end of the fourth resistor is also connected with the base electrode of the first triode, the second end of the fourth resistor is connected with the emitting electrode of the first triode, and the collector electrode of the first triode is connected with the input end of the MOS tube grid control circuit unit.
6. The low-voltage current collection chip-based High-Side collection mode circuit device according to claim 5, wherein a second end of the fourth resistor is further connected to the power supply input terminal and an output pin of the current collection chip, respectively, and an emitter of the first triode is further connected to the power supply input terminal and the output pin of the current collection chip, respectively.
7. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 5, wherein the MOS transistor gate control circuit unit comprises a fifth resistor, a sixth resistor, a second triode, a seventh resistor, an eighth resistor and a third triode;
the first end of fifth resistance is connected the collecting electrode of first triode, the second end of fifth resistance is connected respectively the first end of sixth resistance with the base of second triode, the first end of sixth resistance still is connected with the base of second triode, the second end of sixth resistance with the projecting pole of second triode is connected and ground connection, the collecting electrode of second triode with the first end of seventh resistance is connected, the second end of seventh resistance is connected respectively the first end of eighth resistance with the base of third triode, the first end of eighth resistance still with the base of third triode is connected, the second end of eighth resistance is connected the projecting pole of third triode, the base of third triode is connected the input of on-off control circuit.
8. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 1, wherein the switch control circuit comprises a ninth resistor, a tenth resistor and a first field effect transistor, and the first field effect transistor is a P-channel field effect transistor;
the first end of the ninth resistor is connected with the source electrode of the first field effect transistor, the second end of the ninth resistor is respectively connected with the first end of the tenth resistor and the grid electrode of the first field effect transistor, the grid electrode of the first field effect transistor is also connected with the second end of the tenth resistor, the drain electrode of the first field effect transistor is connected with the input end of the load circuit, and the second end of the tenth resistor is grounded.
9. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip according to claim 8 or the previous claim, wherein the source of the first field effect transistor is further connected to the second end of the first resistor, the second end of the eighth resistor, and the emitter of the third triode, respectively.
10. The High-Side acquisition mode circuit device based on the low-voltage current acquisition chip as claimed in claim 1, wherein the load circuit comprises an eleventh resistor, a first end of the eleventh resistor is connected to the drain of the first field effect transistor, and a second end of the eleventh resistor is grounded.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911178095.5A CN110825151A (en) | 2019-11-26 | 2019-11-26 | High-Side acquisition mode circuit device based on low-voltage current acquisition chip |
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| CN201911178095.5A CN110825151A (en) | 2019-11-26 | 2019-11-26 | High-Side acquisition mode circuit device based on low-voltage current acquisition chip |
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| CN110825151A true CN110825151A (en) | 2020-02-21 |
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| CN201911178095.5A Pending CN110825151A (en) | 2019-11-26 | 2019-11-26 | High-Side acquisition mode circuit device based on low-voltage current acquisition chip |
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| CN112636740A (en) * | 2020-12-28 | 2021-04-09 | 潍柴动力股份有限公司 | Signal input mode control circuit and method |
| CN113219233A (en) * | 2021-04-30 | 2021-08-06 | 石家庄宇飞电子有限公司 | Voltage expansion circuit for high-side current sampling |
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| CN113219233A (en) * | 2021-04-30 | 2021-08-06 | 石家庄宇飞电子有限公司 | Voltage expansion circuit for high-side current sampling |
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